CN112381851A - Defect labeling method and device - Google Patents
Defect labeling method and device Download PDFInfo
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- CN112381851A CN112381851A CN202011261128.5A CN202011261128A CN112381851A CN 112381851 A CN112381851 A CN 112381851A CN 202011261128 A CN202011261128 A CN 202011261128A CN 112381851 A CN112381851 A CN 112381851A
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- G06T7/187—Segmentation; Edge detection involving region growing; involving region merging; involving connected component labelling
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Abstract
The invention provides a defect labeling method and a defect labeling device, wherein the method comprises the following steps: acquiring a product image, and acquiring a defect type and a defect coordinate in the product image; acquiring a defect area according to the defect type and the defect coordinate; when the defect coordinates are not completely within the defect region, the defect region is modified so that the defect is completely within the defect region. The defect marking method can meet different marking requirements of product defects, increases marking diversity, increases drawing fault tolerance rate and reduces marking time by changing the defect area.
Description
Technical Field
The invention relates to the technical field of defect marking, in particular to a defect marking method, a defect marking device and computer equipment.
Background
The existing defect labeling method can only realize a one-to-one defect labeling method and a defect type labeling mode, and when a defect label has a problem, the defect label needs to be deleted and labeled again, so that the labeling time is increased, and the labeling efficiency is reduced.
Disclosure of Invention
The invention provides a defect labeling method for solving the technical problems, which can meet different labeling requirements of product defects, increase the diversity of labeling, increase the drawing fault tolerance rate and reduce the labeling time by changing the defect area.
The technical scheme adopted by the invention is as follows:
a defect labeling method, comprising the steps of: acquiring a product image, and acquiring a defect type and a defect coordinate in the product image; acquiring a defect area according to the defect type and the defect coordinate; when the defect coordinates are not completely within the defect region, modifying the defect region so that the defect is completely within the defect region.
According to an embodiment of the present invention, acquiring a defect region according to the defect type and the defect coordinates includes: determining a marking mode according to the defect type; acquiring a marking element according to the marking mode and the defect coordinate; and connecting the marking elements to obtain the defect area.
According to an embodiment of the present invention, when the defect coordinates are not completely within the defect region, modifying the defect region so that the defect is completely within the defect region includes: acquiring defect coordinates which are not in the defect area; and moving the marking element of the defect area corresponding to the defect coordinate, and driving the line segment connected with the marking element to move so as to enlarge the defect area.
According to an embodiment of the present invention, the labeling method includes: closed region mark and broken line mark, wherein, closed region mark includes: one or more of rectangular, circular, and polygonal.
According to an embodiment of the present invention, the defect labeling method further includes: and when the defect coordinate is completely positioned in the defect area, marking the defect area as a defect and storing the defect area.
According to an embodiment of the present invention, the defect labeling method further includes: and when the number of the defect coordinates which are not in the defect area is larger than a preset number threshold, deleting the defect area and acquiring the defect area again.
The invention has the beneficial effects that:
according to the method, the defect area is obtained according to the defect type and the defect coordinate, the defect coordinate is judged to be completely in the defect area, if the defect coordinate which is not in the defect area exists, the defect area is changed, the defect is completely in the defect area, different marking requirements of product defects can be met, the marking diversity is increased, the drawing fault tolerance rate is increased, and the marking time is shortened.
Drawings
FIG. 1 is a flowchart of a defect labeling method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of defect labeling according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of defect labeling according to another embodiment of the present invention;
FIG. 4 is a schematic diagram of defect labeling according to another embodiment of the present invention;
fig. 5 is a block diagram illustrating a defect labeling apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a flowchart of a defect labeling method according to an embodiment of the present invention.
As shown in fig. 1, the defect labeling method according to the embodiment of the present invention may include the following steps:
and S1, acquiring the product image, and acquiring the defect type and the defect coordinate in the product image.
Specifically, a product image needing to be marked with a defect is obtained, and the type of the defect is obtained, wherein the defect comprises: air bubbles, scratches, black spots, etc. And establishing a coordinate system according to the size of the product image, for example, establishing the coordinate system by using the upper left corner of the product image as a coordinate origin. The coordinates of the position where the defect sits are obtained, for example, when the type of the defect is a scratch, the coordinates of the start point to the end point of the scratch are obtained, and the coordinates of the scratch in the middle of the start point to the end point can also be obtained.
And S2, acquiring the defect area according to the defect type and the defect coordinate.
According to one embodiment of the present invention, acquiring a defect region according to a defect type and defect coordinates includes: determining a marking mode according to the defect type; acquiring a marking element according to the marking mode and the defect coordinate; and connecting the marking elements to obtain the defect area.
In an embodiment of the present invention, the labeling method includes: closed region mark and broken line mark, wherein, closed region mark includes: one or more of rectangular, circular, and polygonal.
Specifically, a marking mode is determined according to the defect type, for example, when the defect type is a bubble, a closed area marking mode is adopted for marking the defect, and when the defect type is a scratch, a broken line marking mode is adopted for marking the defect. After the labeling manner is determined, the labeling elements are obtained according to the coordinates of the defect, for example, as shown in fig. 2 and fig. 3, all the labeling elements are connected to obtain a defect area, where fig. 2 shows a closed area labeling manner, a dotted line part in the drawing shows a defect area, and fig. 3 shows a broken line labeling manner.
The determination mode of the labeling element is as follows: and acquiring the coordinate with the maximum transverse coordinate and the maximum longitudinal coordinate in the defect coordinates, and acquiring the coordinate with the minimum transverse coordinate and the minimum longitudinal coordinate in the defect coordinates, so that the type of the defect can be roughly determined, and the defect coordinates are used as marking elements to draw a defect area.
Of course, a plurality of defect coordinates, not limited to the maximum coordinate and the minimum coordinate, may be obtained to more accurately determine the defect type. For example, when the defect type is a bubble, the bubble is approximately circular, and at this time, the farthest distance in the defect coordinates is obtained as a diameter, and a circle drawn by taking the center of the diameter as a dot is taken as a defect area.
And S3, when the defect coordinate is not completely in the defect area, modifying the defect area to make the defect completely in the defect area.
According to one embodiment of the present invention, modifying the defect area to make the defect completely within the defect area when the defect coordinates are not completely within the defect area includes: acquiring a defect coordinate which is not in a defect area; and moving the marking element of the defect area corresponding to the defect coordinate, and driving the line segment connected with the marking element to move so as to enlarge the defect area.
Further, according to an embodiment of the present invention, when the defect coordinates are completely within the defect area, the defect area is labeled as a defect and stored.
Specifically, whether the defect coordinate is completely located in the defect area is determined, for example, whether the defect coordinate is located in the defect area may be determined by comparing the sizes of the defect coordinates, and when the defect coordinate is not located in the defect area, the corresponding label element of the defect area is moved, it is noted that the label element corresponding to the defect coordinate is a label element on a line segment corresponding to the defect coordinate, for example, point a in fig. 4 is a label element corresponding to the defect coordinate of point B, and an arrow indicates the moving direction of the defect area, so that the defect is completely located in the defect area, the defect labeling is completed, and the defect label is stored.
According to one embodiment of the invention, when the number of defect coordinates which are not in the defect area is larger than a preset number threshold, the defect area is deleted, and the defect area is obtained again. The preset quantity threshold value can be calibrated according to actual conditions.
That is, when most of the defect is not within the defect area, the current defect area is deleted and the defect area is redrawn according to the defect type and the defect coordinates.
In conclusion, the defect labeling method of the invention acquires the product image and acquires the defect type and the defect coordinate in the product image; acquiring a defect area according to the defect type and the defect coordinate; when the defect coordinates are not completely within the defect region, the defect region is modified so that the defect is completely within the defect region. The defect marking method can meet different marking requirements of product defects, increases marking diversity, increases drawing fault tolerance rate and reduces marking time by changing the defect area.
Corresponding to the defect labeling method of the above embodiment, the invention further provides a defect labeling device.
Fig. 5 is a block diagram illustrating a defect labeling apparatus according to an embodiment of the present invention.
As shown in fig. 5, the defect labeling apparatus according to an embodiment of the present invention may include: a first acquisition module 10, a second acquisition module 20 and a modification module 30.
The first obtaining module 10 is configured to obtain a product image, and obtain a defect type and a defect coordinate in the product image. The second obtaining module 20 is configured to obtain a defect area according to the defect type and the defect coordinates. The modifying module 30 is configured to modify the defect area to make the defect completely within the defect area when the defect coordinates are not completely within the defect area.
According to an embodiment of the present invention, the second obtaining module 20 obtains the defect area according to the defect type and the defect coordinate, and is specifically configured to determine a labeling mode according to the defect type; acquiring a marking element according to the marking mode and the defect coordinate; and connecting the marking elements to obtain the defect area.
According to an embodiment of the present invention, when the defect coordinate is not completely located in the defect area, the modifying module 30 modifies the defect area to make the defect completely located in the defect area, specifically, to obtain the defect coordinate not located in the defect area; and moving the marking element of the defect area corresponding to the defect coordinate, and driving the line segment connected with the marking element to move so as to enlarge the defect area.
According to one embodiment of the invention, the labeling mode comprises the following steps: closed region mark and broken line mark, wherein, closed region mark includes: one or more of rectangular, circular, and polygonal.
According to an embodiment of the present invention, the defect labeling apparatus further includes: and the storage module 40 is used for marking the defect area as a defect and storing the defect area when the defect coordinate is completely in the defect area.
According to an embodiment of the present invention, the second obtaining module 20 is further configured to, when the number of the defect coordinates that are not located in the defect area is greater than a preset number threshold, delete the defect area, and obtain the defect area again.
It should be noted that details that are not disclosed in the defect labeling apparatus according to the embodiment of the present invention refer to details disclosed in the defect labeling method according to the embodiment of the present invention, and are not repeated herein.
According to the defect labeling device, a first obtaining module is used for obtaining a product image and obtaining the defect type and the defect coordinate in the product image; the second acquisition module acquires a defect area according to the defect type and the defect coordinate; and the modification module modifies the defect area when the defect coordinate is not completely in the defect area so that the defect is completely in the defect area. From this, the device can satisfy the different mark demands of product defect, increases the diversification of mark to through changing defective area, increased the fault-tolerant rate of drawing, reduced the mark time.
The invention further provides a computer device corresponding to the embodiment.
The computer device according to the embodiment of the present invention includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and when the processor executes the computer program, the defect labeling method according to the above-described embodiment of the present invention may be implemented.
According to the computer device of the embodiment of the invention, when the processor executes the computer program stored on the memory, the product image is firstly obtained, and the defect type and the defect coordinate in the product image are obtained; acquiring a defect area according to the defect type and the defect coordinate; when the defect coordinates are not completely within the defect region, the defect region is modified so that the defect is completely within the defect region. The defect marking method can meet different marking requirements of product defects, increases marking diversity, increases drawing fault tolerance rate and reduces marking time by changing the defect area.
The invention also provides a non-transitory computer readable storage medium corresponding to the above embodiment.
A non-transitory computer-readable storage medium of an embodiment of the present invention has a computer program stored thereon, and when the computer program is executed by a processor, the non-transitory computer-readable storage medium can implement the defect labeling method according to the above-described embodiment of the present invention.
According to the non-transitory computer-readable storage medium of an embodiment of the present invention, when a processor executes a computer program stored thereon, a product image is first acquired, and a defect type and a defect coordinate in the product image are acquired; acquiring a defect area according to the defect type and the defect coordinate; when the defect coordinates are not completely within the defect region, the defect region is modified so that the defect is completely within the defect region. The defect marking method can meet different marking requirements of product defects, increases marking diversity, increases drawing fault tolerance rate and reduces marking time by changing the defect area.
In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. The meaning of "plurality" is two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and alternate implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.
The logic and/or steps represented in the flowcharts or otherwise described herein, e.g., an ordered listing of executable instructions that can be considered to implement logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.
In addition, functional units in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.
The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc. Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (10)
1. A defect labeling method, comprising the steps of:
acquiring a product image, and acquiring a defect type and a defect coordinate in the product image;
acquiring a defect area according to the defect type and the defect coordinate;
when the defect coordinates are not completely within the defect region, modifying the defect region so that the defect is completely within the defect region.
2. The method of claim 1, wherein obtaining the defect region according to the defect type and the defect coordinates comprises:
determining a marking mode according to the defect type;
acquiring a marking element according to the marking mode and the defect coordinate;
and connecting the marking elements to obtain the defect area.
3. The method of claim 2, wherein when the defect coordinates are not completely within the defect region, modifying the defect region such that the defect is completely within the defect region comprises:
acquiring defect coordinates which are not in the defect area;
and moving the marking element of the defect area corresponding to the defect coordinate, and driving the line segment connected with the marking element to move so as to enlarge the defect area.
4. The defect labeling method of claim 2, wherein the labeling manner comprises: closed region mark and broken line mark, wherein, closed region mark includes: one or more of rectangular, circular, and polygonal.
5. The defect labeling method of claim 1, further comprising:
and when the defect coordinate is completely positioned in the defect area, marking the defect area as a defect and storing the defect area.
6. The defect labeling method of claim 1, further comprising:
and when the number of the defect coordinates which are not in the defect area is larger than a preset number threshold, deleting the defect area and acquiring the defect area again.
7. A defect labeling apparatus, comprising:
the first acquisition module is used for acquiring a product image and acquiring the defect type and the defect coordinate in the product image;
the second acquisition module is used for acquiring a defect area according to the defect type and the defect coordinate;
and the changing module is used for changing the defect area when the defect coordinate is not completely in the defect area so as to enable the defect to be completely in the defect area.
8. The defect labeling apparatus of claim 7, wherein said second obtaining module obtains a defect region according to said defect type and said defect coordinates, in particular,
determining a marking mode according to the defect type;
acquiring a marking element according to the marking mode and the defect coordinate;
and connecting the marking elements to obtain the defect area.
9. The defect labeling apparatus of claim 8, wherein the modification module is specifically configured to,
acquiring defect coordinates which are not in the defect area;
and moving the marking element of the defect area corresponding to the defect coordinate, and driving the line segment connected with the marking element to move so as to enlarge the defect area.
10. Computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor, when executing the program, implements the defect labeling method according to any of claims 1-6.
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| CN202011261128.5A CN112381851A (en) | 2020-11-12 | 2020-11-12 | Defect labeling method and device |
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| CN202011261128.5A CN112381851A (en) | 2020-11-12 | 2020-11-12 | Defect labeling method and device |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109191430A (en) * | 2018-07-27 | 2019-01-11 | 江苏理工学院 | A kind of plain color cloth defect inspection method based on Laws texture in conjunction with single classification SVM |
| CN111451886A (en) * | 2020-04-24 | 2020-07-28 | 中车南京浦镇车辆有限公司 | Online planning method for polishing track of robot in putty defect area of rail car body |
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- 2020-11-12 CN CN202011261128.5A patent/CN112381851A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109191430A (en) * | 2018-07-27 | 2019-01-11 | 江苏理工学院 | A kind of plain color cloth defect inspection method based on Laws texture in conjunction with single classification SVM |
| CN111451886A (en) * | 2020-04-24 | 2020-07-28 | 中车南京浦镇车辆有限公司 | Online planning method for polishing track of robot in putty defect area of rail car body |
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Application publication date: 20210219 |