CN112378850A - Detection device and detection method for bonding strength of bimetallic plate - Google Patents
Detection device and detection method for bonding strength of bimetallic plate Download PDFInfo
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- CN112378850A CN112378850A CN202011432134.2A CN202011432134A CN112378850A CN 112378850 A CN112378850 A CN 112378850A CN 202011432134 A CN202011432134 A CN 202011432134A CN 112378850 A CN112378850 A CN 112378850A
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Abstract
The invention provides a detection device for the bonding strength of a bimetallic plate, which comprises: the device comprises an intermediate ball die carrier, a sample clamping assembly and a cutter, wherein the intermediate ball die carrier comprises an upper die plate and a lower die plate which are horizontally arranged, the upper die plate and the lower die plate are movably connected through a movable connecting piece, the upper die plate can move up and down relatively, a positioning fixing block is arranged on the upper end surface of the lower die plate, the sample clamping assembly is arranged on the positioning fixing block, the sample clamping assembly is used for clamping a sample, a cutter fixing block is arranged on the lower end surface of the upper die plate, the cutter is arranged on the cutter fixing block, and the cutter is used for shearing the sample; the detection device is suitable for detecting the bimetal bonding strength of the steel backing layer with the thickness of more than or equal to 2mm and the copper alloy layer with the thickness of more than or equal to 0.5mm, is simple to operate and implement, reduces the influence of other external interference factors, has good test result repeatability, and is more accurate and reliable in measured data.
Description
Technical Field
The invention relates to the field of bimetallic plate performance testing, in particular to a detection device and a detection method for the bonding strength of a bimetallic plate bonding interface.
Background
The composite material is compounded by two or more layers of metals with different properties, and has wide application prospect in the fields of aerospace, petrochemical industry, metallurgy, automobiles, shipbuilding, electric power, medical and health, environmental protection, nuclear energy, household appliances and the like because the composite material has excellent comprehensive characteristics which are not possessed by the original single material.
The indexes for measuring the quality of the metal composite plate are many, common indexes include shear strength, bonding strength, combination degree, yield strength, tensile strength and the like, wherein the shear strength can best indicate the interface bonding strength of the metal composite plate, so the use frequency is highest, the test method and the shear test equipment for the shear strength of the metal laminated composite plate have relevant regulations in GB/T6396-2008, and GB/T6396-2008 divides metal composite plate products into two categories according to the regulations for shear tests: the total thickness of the composite board is less than or equal to 10mm and the total thickness is more than 10mm, when the total thickness of the composite board is thinner (the total thickness is less than or equal to 10mm specified in the standard), the base body can be bent and deformed under the action of pressure, the testing precision is influenced, even the shear strength value can not be measured completely, at the moment, the shear strength is tested by adopting a pulling and shearing mode specified in the national standard GB/T6396-2008, but the method is only suitable for the condition that the composite layer is relatively thicker, when the composite layer is thinner, the weakest part of the composite layer is easy to bend and break in the pulling and shearing process, the testing precision is influenced, even the test fails, other detection methods exist in the industry, and some additional influence factors exist, such as
The invention provides a detection sample, wherein a vertical strip represents one metal substrate, such as a steel backing layer, a small bulge at the middle part represents an adhesion metal layer (such as a copper alloy layer), the adhesion metal layer at the periphery of the adhesion metal layer is machined and removed, the detection sample is complex to machine, most of the area of a metal can be milled, the milling depth and the milling depth can influence the final test result, and the influence of friction force inevitably exists between the sample and a tool, so that the detection device and the detection method for the bonding strength of the bimetallic plate can solve the problems.
Disclosure of Invention
In order to solve the defects of the prior art, the invention aims to provide a detection device and a detection method for the bonding strength of a bonding interface of a bimetal plate, which can quickly and accurately measure the bonding strength of the bimetal plate, and take a steel backing layer and a copper alloy bimetal material as an example, the detection device is suitable for detecting the bonding strength of the bimetal plate with the thickness of a steel backing layer being more than or equal to 2mm and the thickness of a copper alloy layer being more than or equal to 0.5mm, is simple to operate, reduces the influence of external interference factors, and has more accurate measured data.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows.
A bimetal plate bonding strength detection device comprises: the device comprises an intermediate ball die carrier, a sample clamping assembly and a cutter, wherein the intermediate ball die carrier comprises an upper template and a lower template which are horizontally arranged, the upper template and the lower template are movably connected through a movable connecting piece, and the upper template can move up and down relatively;
the upper end surface of the lower template is provided with a positioning fixing block, the sample clamping assembly is arranged on the positioning fixing block, and the sample clamping assembly is used for clamping a sample;
the lower terminal surface of cope match-plate pattern be provided with the cutter fixed block and the cutter is installed on the cutter fixed block, the cutter is used for cuting the sample.
As a further improvement of the invention, the movable connecting piece comprises a guide post vertically and fixedly arranged between the upper template and the lower template and a guide post and guide sleeve vertically and fixedly arranged on the upper template, and the upper template is movably sleeved on the guide post through the guide post and guide sleeve; the upper die plate can keep small friction resistance and high movement precision to move up and down relatively under the action of the guide pillar and the guide sleeve;
the movable connecting pieces are provided with two groups and are respectively positioned at two ends of the upper template.
As a further improvement of the invention, the lower template is provided with a plurality of first threaded holes, the positioning fixing block is provided with a plurality of first counter bores correspondingly matched with the first threaded holes, and the positioning fixing block is fixedly arranged on the upper end surface of the lower template in a bolt connection manner through the matching of the first counter bores and the first threaded holes;
the positioning fixing block is provided with a positioning through hole for accommodating the sample clamping assembly, the front end face of the positioning through hole and the movable connecting piece are positioned on the same horizontal straight line, and the rear end face of the positioning fixing block is provided with a third threaded hole communicated with the positioning through hole;
the sample clamping assembly is fixedly arranged in the positioning through hole in a pressing mode through the matching of the third threaded hole and the screw; the fixture has the advantages that the fixture is pressed tightly by the screws through the third threaded holes formed in the rear end face of the positioning fixing block, the front end face of the sample clamping assembly is firmly attached to the front end face of the positioning through hole of the positioning fixing block all the time, no shaking is generated, no unbalance loading force is generated when the cutter is pressed down, and accordingly the test result is not influenced.
As a further improvement of the invention, the sample clamping assembly comprises an upper chuck, a lower chuck and a fine adjustment component, wherein the upper end surface of the upper chuck is provided with a plurality of upper through holes, the lower end surface of the upper chuck is provided with an upper semicircular groove, and the upper semicircular groove penetrates through the rear end surface of the upper chuck;
the upper end surface of the lower chuck is provided with a plurality of second threaded holes correspondingly matched with the upper through holes, and the upper chuck and the lower chuck are fixedly connected in a bolt connection mode through the matching of the upper through holes and the second threaded holes;
the upper end surface of the lower chuck is provided with a clamping groove, the joint of the rear end surface of the lower chuck and the bottom of the clamping groove is provided with a lower semicircular groove, and when the upper chuck is fixedly connected with the lower chuck, the upper semicircular groove and the lower semicircular groove are coaxially arranged;
the rear end face of the lower chuck is provided with two lower threaded holes.
As a further improvement of the invention, the fine adjustment component comprises a boosting sheet, a holder and a micrometer, wherein the front surface of the holder is of a triangle structure, three connecting through holes are formed in the holder, the triangle structure is formed between the three connecting through holes, the two connecting through holes positioned below are matched with the two lower threaded holes arranged on the rear end surface of the lower chuck in a one-to-one correspondence manner, the holder is fixedly arranged on the lower chuck in a bolt mounting manner by matching the two lower threaded holes with the connecting through holes, the connecting through hole positioned above is used for fixing the micrometer, and when the holder is arranged on the lower chuck, the connecting through hole positioned above and the upper half circular groove are coaxially arranged;
the boosting sheet is arranged in the clamping groove and is positioned behind the sample.
As a further improvement of the invention, the upper end surface of the upper template is provided with a plurality of upper threaded holes, the cutter fixing block is provided with a plurality of second counter bores correspondingly matched with the upper threaded holes, and the cutter fixing block is fixedly arranged on the lower end surface of the upper template in a bolt connection manner through the matching of the second counter bores and the upper threaded holes;
and a step-shaped fixing hole matched with the cutter is formed in the middle of the end face of the cutter fixing block.
A detection method of a bimetal plate bonding strength detection device comprises the following steps:
s1: measuring the thickness of the copper alloy layer of the sample to be measured, and calculating the thickness as B;
s2: preparing a sample to be detected into a sample with a standard sample size;
s3: placing the sample in a clamping groove of a lower chuck, enabling a copper alloy layer to face outwards, adjusting a micrometer, enabling an extending end of the micrometer to push a boosting sheet to move forwards until the surface of the copper alloy layer of the sample is flush with the lower chuck by the boosting sheet, recording the numerical value of the micrometer at the moment, screwing the micrometer out for a length of B according to the thickness B of the copper alloy layer, enabling the joint surface of the copper alloy layer and a steel backing layer to be just level with the lower chuck at the moment, and tightening a bolt to enable the upper chuck to be fastened with the lower chuck to clamp the sample;
s4: fixedly installing an upper template of the middle ball mould frame at the lower pressing end of a precision pressure testing machine, and placing a lower template on a working platform of the precision pressure testing machine;
s5: placing the sample clamping assembly with the sample in the positioning through hole of the positioning fixing block, and screwing down the screw on the positioning fixing block to enable the sample clamping assembly to be firmly attached to the positioning through hole of the positioning fixing block all the time;
s6: adjusting the plane of the cutter to be parallel to the upper chuck and the lower chuck, keeping a small gap, and screwing down the cutter fixing block to clamp the cutter tightly;
s7: starting a precision pressure tester, pressing a cutter down, shearing a sample, reading the maximum pressure F when the sample is sheared, and calculating a formula according to the bonding strength: obtaining the bonding strength P of the bimetallic plate, wherein L in the formula represents the width of the standard sample, and H represents the thickness of the standard sample;
s8: and (4) repeating 2-3 groups of samples, and calculating the average value, wherein the average value is the bonding strength of the bimetallic plate.
As a further improvement of the invention, the expansion precision of the micrometer is 0.01 mm;
the sample is placed in a clamping groove of the lower chuck, and the thickness of the sample is higher than the depth of the clamping groove; the clamping device has the advantages that the upper clamping head and the lower clamping head can clamp a sample conveniently when being fastened;
the length of the boosting sheet is correspondingly adjusted according to the length of the sample, and the thickness of the boosting sheet is smaller than the depth of the clamping groove of the lower chuck; the significance is that the boosting sheet can move in the clamping groove conveniently.
As a further improvement of the invention, the diameter of the upper semicircular groove arranged on the upper chuck is larger than the diameter of the extension rod of the micrometer, the depth of the upper semicircular groove is larger than the maximum stroke of the extension rod of the micrometer, the diameter of the lower semicircular groove arranged on the lower chuck is larger than the diameter of the extension rod of the micrometer, and the depth of the lower semicircular groove is larger than the maximum stroke of the extension rod of the micrometer.
As a further improvement of the invention, the cutter comprises a cutter upper end and a cutter long end, the cutter upper end is of a disc structure, the cutter long end is of a round rod structure, the cutter upper end and the cutter long end are coaxially arranged, and the cutter is symmetrically flattened from the directions of two round axes to form two planes.
Compared with the prior art, the invention has the beneficial effects that:
1. the method is suitable for detecting the bimetal bonding strength of the steel backing layer with the thickness of more than or equal to 2mm and the copper alloy layer with the thickness of more than or equal to 0.5mm, is simple to operate and implement, reduces the influence of other external interference factors as far as possible, has good test result repeatability, and is more accurate and reliable in measured data;
2. the upper and lower templates are movably connected through the guide post and guide sleeve, and the upper template can keep small friction resistance and high movement precision to move up and down relatively under the action of the guide post and guide sleeve;
3. the sample clamping assembly is pressed tightly through a third threaded hole formed in the rear end face of the positioning fixing block by using a screw, so that the front end face of the sample clamping assembly is firmly attached to the front end face of the positioning through hole of the positioning fixing block all the time, no shaking is generated, no unbalance loading force is generated when the cutter is pressed down, and the test result is not influenced;
4. the thickness of the sample is higher than the depth of the clamping groove, so that the sample can be conveniently clamped when the upper clamping head and the lower clamping head are fastened; the thickness of the boosting sheet is smaller than the depth of the clamping groove of the lower clamping head, so that the boosting sheet can move in the clamping groove conveniently.
Drawings
FIG. 1 is a schematic structural diagram of a detecting device according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a detecting device according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of an intermediate ball bearing frame;
FIG. 4 is a schematic view of the structure of the sample holding assembly;
FIG. 5 is a schematic cross-sectional view of a sample clamping assembly;
FIG. 6 is a schematic structural view of the upper chuck;
FIG. 7 is a schematic structural view of the lower chuck;
FIG. 8 is a schematic view of a sample;
FIG. 9 is a schematic view of a boost tab;
FIG. 10 is a schematic view of the construction of the micrometer holder;
FIG. 11 is a schematic structural view of a positioning fixing block;
FIG. 12 is a schematic structural view of a cutter fixing block;
fig. 13 is a schematic view of the structure of the cutter.
The reference numbers in the figures are:
1. an intermediate ball die carrier; 11. mounting a template; 111. an upper threaded hole; 12. a lower template; 121. a first threaded hole; 13. a guide pillar and a guide sleeve;
2. a sample clamping assembly; 21. an upper chuck; 211. an upper through hole; 212. an upper semicircular groove; 22. a lower chuck; 221. a second threaded hole; 222. a clamping groove; 223. a lower semicircular groove; 23. a micrometer; 24. a boosting sheet; 25. a holder;
3. positioning a fixed block; 31. a first counterbore; 32. positioning the through hole; 321. a front end face; 33. a third threaded hole;
4. a cutter fixing block; 41. a fixing hole; 42. a second counterbore;
5. a cutter; 51. a tool long end; 52. the upper end of the cutter;
6. a sample; 61. a steel backing layer; 62. a copper alloy layer.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the specific embodiments illustrated.
As shown in fig. 1 to 13, a device for detecting the bonding strength of a bimetal plate comprises: middle ball die carrier 1, sample centre gripping subassembly 2, cutter 5, middle ball die carrier 1 include the cope match-plate pattern 11 that the level set up and be located cope match-plate pattern 11 under lower bolster 12, be provided with swing joint between cope match-plate pattern 11 and the lower bolster 12 and carry out swing joint through swing joint between the two to relative motion about the vertical direction can be followed to cope match-plate pattern 11, the up end of lower bolster 12 be provided with location fixed block 3 and sample centre gripping subassembly 2 and install on location fixed block 3, sample centre gripping subassembly 2 is used for carrying out the centre gripping to sample 6, the lower terminal surface of cope match-plate pattern 11 be provided with cutter fixed block 4 and cutter 5 and install on cutter fixed block 4, cutter 5 is used for cuting sample 6.
Specifically, the movable connecting pieces comprise guide posts vertically and fixedly arranged between the upper template 11 and the lower template 12 and guide post guide sleeves 13 vertically and fixedly arranged on the upper template 11, the upper template 11 is movably sleeved on the guide posts through the guide post guide sleeves 13, and the movable connecting pieces are provided with two groups and are respectively positioned at two ends of the upper template 11; the upper die plate 11 can keep small friction resistance and high movement precision to move up and down relatively under the action of the guide pillar guide sleeve 13.
As shown in fig. 3 and 11, the lower die plate 12 is provided with a plurality of first threaded holes 121, the positioning fixing block 3 is provided with a plurality of first counter bores 31 correspondingly matched with the first threaded holes 121, and the positioning fixing block 3 is fixedly mounted on the upper end surface of the lower die plate 12 in a bolt connection manner through the matching of the first counter bores 31 and the first threaded holes 121.
The positioning fixing block 3 is provided with a positioning through hole 32 penetrating through the thickness of the positioning fixing block, the front end face 321 of the positioning through hole 32 and the guide posts of the two groups of movable connecting pieces are positioned on the same horizontal straight line, and the rear end face of the positioning fixing block 3 is provided with a third threaded hole 33 communicated with the positioning through hole 32.
The whole sample clamping assembly 2 is of a rectangular structure, the sample clamping assembly 2 is placed in the positioning through hole 32, and the sample clamping assembly 2 is fixedly installed in the positioning through hole 32 in a pressing mode through the matching of the third threaded hole 33 and the screw; the meaning lies in, compresses tightly sample centre gripping subassembly 2 through setting up in the third screw hole 33 of the rear end face of location fixed block 3 with the screw, makes the preceding terminal surface of sample centre gripping subassembly 2 paste the jail with the preceding terminal surface 321 of the positioning hole 32 of location fixed block 3 all the time, does not produce any and rocks, guarantees that sample centre gripping subassembly 2 does not change for the position of cutter 5, does not produce unbalance loading power when guaranteeing cutter 5 to push down to do not influence the test result.
As shown in fig. 4 to 10, the sample clamping assembly 2 includes an upper clamping head 21, a lower clamping head 22 and a fine adjustment component, the upper clamping head 21 is a rectangular structure as a whole, the upper end surface of the upper clamping head 21 is provided with a plurality of upper through holes 211, the lower end surface of the upper clamping head 21 is provided with an upper semicircular groove 212, and the upper semicircular groove 212 penetrates through the rear end surface of the upper clamping head 21.
The whole lower chuck 22 is of a rectangular structure, the upper end face of the lower chuck 22 is provided with a plurality of second threaded holes 221 correspondingly matched with the upper through holes 211, and the upper chuck 21 and the lower chuck 22 are fixedly connected in a bolt connection mode through the matching of the upper through holes 211 and the second threaded holes 221.
The upper end surface of the lower chuck 22 is provided with a clamping groove 222, a lower semicircular groove 223 is arranged at the joint of the rear end surface of the lower chuck 22 and the groove bottom of the clamping groove 222, and when the upper chuck 21 is fixedly connected with the lower chuck 22, the upper semicircular groove 212 and the lower semicircular groove 223 are coaxially arranged.
The rear end surface of the lower chuck 22 is provided with two lower threaded holes.
The fine-tuning part include boosting piece 24, holder 25, micrometer 23, holder 25 the front be the triangle structure, the side is L type structure, be the triangle structure between three connect the through-hole and the three connect the through-hole seted up on holder 25, two connect the through-hole that are located the below with set up in chuck 22 rear end face two down screw hole one-to-one matching down, and holder 25 through two down screw hole and connect the through-hole cooperation with bolt installation mode fixed mounting under on chuck 22, the connect the through-hole that is located the top is used for fixed micrometer 23, and when holder 25 installed under chuck 22 on, be coaxial arrangement between the connect the through-hole that is located the top and the first semicircle groove 212.
The boosting sheet 24 is in a rectangular sheet structure, the boosting sheet 24 is arranged in the clamping groove 222, and the boosting sheet 24 is positioned behind the sample 6; taking the sample 6 comprising the steel backing layer 61 and the copper alloy layer 62 as an example, placing the sample 6 in the clamping groove 222 of the lower chuck 22, with the copper alloy layer 62 facing outward, adjusting the micrometer 23 to enable the extending end of the micrometer 23 to push the booster sheet 24 to move forward until the surface of the copper alloy layer 62 of the sample 6 is flush with the front end face of the lower chuck 22 by the booster sheet 24, recording the value of the micrometer 23 at the moment, screwing out the micrometer 23 by the thickness B of the copper alloy layer, enabling the combining surface of the copper alloy layer 62 and the steel backing layer 61 to be just flush with the front end face of the lower chuck 22 at the moment, tightening the bolt to fasten the upper chuck 21 and the lower chuck 22, clamping the sample 6, and paying attention to ensure that the front end face of the upper chuck 21 is flush with the front end face of the lower chuck 22, so far, finishing clamping the sample 6.
Preferably, the micrometer 23 has a precision of 0.01mm in extension and retraction.
Preferably, the test sample 6 is placed in the clamping groove 222 of the lower clamping head 22, and the thickness of the test sample 6 is larger than the depth of the clamping groove 222, so that the test sample 6 can be conveniently clamped when the upper clamping head 21 is fastened with the lower clamping head 22.
Preferably, the length of the boosting sheet 24 is adjusted according to the length of the test sample 6, and the thickness of the boosting sheet 24 is smaller than the depth of the lower chuck clamping groove 222, so that the boosting sheet 24 can move in the clamping groove 222.
Preferably, the diameter of the upper semicircular groove 212 formed in the upper chuck 21 is larger than the diameter of the extension bar of the micrometer 25, the depth of the upper semicircular groove 212 is larger than the maximum stroke of the extension bar of the micrometer 25, the diameter of the lower semicircular groove 223 formed in the lower chuck 22 is larger than the diameter of the extension bar of the micrometer 25, and the depth of the lower semicircular groove 223 is larger than the maximum stroke of the extension bar of the micrometer 25.
As shown in fig. 12 to 13, the upper end surface of the upper die plate 11 is provided with a plurality of upper threaded holes 111, the cutter fixing block 4 is of a disc-shaped structure, the cutter fixing block 4 is provided with a plurality of second countersunk holes 42 correspondingly matched with the upper threaded holes 111, and the cutter fixing block 4 is fixedly mounted on the lower end surface of the upper die plate 11 in a bolt connection manner through the matching of the second countersunk holes 42 and the upper threaded holes 111.
And a step section fixing hole 41 matched with the cutter 5 is formed in the middle of the end face of the cutter fixing block 4.
The whole cutter 5 be T type structure, cutter 5 is including being the cutter upper end 52 of disc structure and being the long end 51 of cutter of round bar structure, be coaxial arrangement and cutter 5 from two circular axis orientations symmetry shakeouts and form two planes between cutter upper end 52 and the long end 51 of cutter.
A method for detecting the bonding strength of a bimetallic plate comprises the following steps:
s1: measuring the thickness of the copper alloy layer of the sample to be measured, and calculating the thickness as B;
s2: preparing a sample to be detected into a sample 6 with a standard sample size;
s3: placing the sample 6 in a clamping groove 222 of the lower chuck 22, enabling the copper alloy layer 62 to face outwards, adjusting the micrometer 23, enabling the extending end of the micrometer 23 to push the boosting sheet 24 to move forwards until the boosting sheet 24 enables the surface of the copper alloy layer 62 of the sample 6 to be flush with the front end face of the lower chuck 22, recording the numerical value of the micrometer 23 at the moment, screwing the micrometer 23 out for a length of B according to the thickness B of the copper alloy layer, enabling the joint surface of the copper alloy layer 62 and the steel backing layer 61 to be just flush with the front end face of the lower chuck 22 at the moment, screwing the bolt to enable the upper chuck 21 and the lower chuck 22 to be fastened, and clamping the sample 6;
s4: an upper template 11 of the middle ball mould frame 1 is fixedly arranged at the lower pressing end of a precision pressure testing machine, and a lower template 12 is arranged on a working platform of the precision pressure testing machine;
s5: placing the sample clamping assembly 2 with the sample 6 in the positioning through hole 32 of the positioning fixing block 3, and screwing down the screw on the rear end face of the positioning fixing block 3 to ensure that the front end face of the sample clamping assembly 2 is firmly attached to the front end face 321 of the positioning through hole 32 of the positioning fixing block 3 all the time;
s6: adjusting the plane of the cutter 5 to be parallel to the front end surfaces of the upper chuck and the lower chuck, keeping a small gap, and screwing the cutter fixing block 4 to clamp the cutter 5;
s7: starting a precision pressure tester, pressing down the cutter 5, shearing the sample 6, reading the maximum pressure F when the sample 6 is sheared, and calculating according to the bonding strength: obtaining the bonding strength P of the bimetallic plate, wherein L in the formula represents the width of the standard sample, and H represents the thickness of the standard sample;
s8: and (4) repeating 2-3 groups of samples, and calculating the average value, wherein the average value is the bonding strength of the bimetallic plate.
The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a detection apparatus for bimetallic strip bonding strength which characterized in that, it includes: the device comprises an intermediate ball die carrier, a sample clamping assembly and a cutter, wherein the intermediate ball die carrier comprises an upper template and a lower template which are horizontally arranged, the upper template and the lower template are movably connected through a movable connecting piece, and the upper template can move up and down relatively along the movable connecting piece;
the upper end surface of the lower template is provided with a positioning fixing block for mounting a sample clamping assembly, and the sample clamping assembly is used for clamping a sample;
the lower end face of the upper template is provided with a cutter fixing block for mounting a cutter, and the cutter is used for shearing a sample.
2. The device for detecting the bonding strength of the bimetal plate as claimed in claim 1, wherein the movable connecting member comprises a guide post vertically and fixedly arranged between the upper die plate and the lower die plate and a guide post and guide sleeve vertically and fixedly arranged on the upper die plate, and the upper die plate is movably sleeved on the guide post through the guide post and guide sleeve.
3. The device for detecting the bonding strength of the bimetallic strip as claimed in claim 1, wherein the lower template is provided with a first threaded hole, the positioning fixing block is provided with a first counter bore correspondingly matched with the first threaded hole, and the positioning fixing block is fixedly mounted on the upper end surface of the lower template in a bolt connection manner through the matching of the first counter bore and the first threaded hole;
a positioning through hole for accommodating the sample clamping assembly is formed in the positioning fixing block, and one hole wall of the positioning through hole and the movable connecting piece are located on the same horizontal straight line;
the lateral wall of the positioning fixing block is provided with a third threaded hole communicated with the positioning through hole, and the sample clamping assembly is fixedly arranged in the positioning through hole in a pressing mode through the cooperation of the third threaded hole and the screw.
4. The device for detecting the bonding strength of the bimetallic strip as claimed in claim 3, wherein the sample clamping assembly comprises an upper chuck, a lower chuck and a fine adjustment component, wherein an upper through hole is vertically formed in the middle of the upper chuck, an upper semicircular groove is formed in the lower end surface of the upper chuck, and one end of the upper semicircular groove penetrates through the side wall of the upper chuck;
the upper end surface of the lower chuck is provided with a second threaded hole correspondingly matched with the upper through hole, and the upper chuck and the lower chuck are fixedly connected in a bolt connection mode through the matching of the upper through hole and the second threaded hole;
the upper end surface of the lower chuck is provided with a clamping groove, one end of the bottom of the clamping groove is provided with a lower semicircular groove, and when the upper chuck is fixedly connected with the lower chuck, the upper semicircular groove and the lower semicircular groove are coaxially arranged;
two lower threaded holes are formed in the side wall of the lower chuck.
5. The device for detecting the bonding strength of the bimetallic plate according to claim 4, wherein the fine adjustment component comprises a boosting sheet, a holder and a micrometer, the front surface of the holder is of a triangle structure, three connecting through holes are formed in the holder, the three connecting through holes are of the triangle structure, the two connecting through holes positioned below are matched with the two lower threaded holes arranged on the lower chuck in a one-to-one correspondence manner, the holder is fixedly arranged on the lower chuck in a bolt mounting manner through the matching of the two lower threaded holes and the connecting through holes, the connecting through hole positioned above is used for fixing the micrometer, and when the holder is arranged on the lower chuck, the connecting through holes positioned above and the upper semicircular groove are coaxially arranged;
the boosting sheet is arranged in the clamping groove.
6. The device for detecting the bonding strength of the bimetallic strip as in claim 5, wherein the upper end surface of the upper template is provided with an upper threaded hole, the tool fixing block is provided with a second counter bore correspondingly matched with the upper threaded hole, and the tool fixing block is fixedly mounted on the lower end surface of the upper template in a bolt connection manner through the matching of the second counter bore and the upper threaded hole;
and a step-shaped fixing hole matched with the cutter is formed in the middle of the end face of the cutter fixing block.
7. A method for testing a bonding strength of a bimetal strip as defined in any one of claims 1 to 6, comprising the steps of:
s1: measuring the thickness of the copper alloy layer of the sample to be measured, and calculating the thickness as B;
s2: preparing a sample to be detected into a sample with a standard sample size;
s3: placing the sample in a clamping groove of a lower chuck, enabling a copper alloy layer to face outwards, adjusting a micrometer, enabling an extending end of the micrometer to push a boosting sheet to move forwards until the surface of the copper alloy layer of the sample is flush with the lower chuck by the boosting sheet, recording the numerical value of the micrometer at the moment, screwing the micrometer out for a length of B according to the thickness B of the copper alloy layer, enabling the joint surface of the copper alloy layer and a steel backing layer to be just level with the lower chuck at the moment, and tightening a bolt to enable the upper chuck to be fastened with the lower chuck to clamp the sample;
s4: fixedly installing an upper template of the middle ball mould frame at the lower pressing end of a precision pressure testing machine, and placing a lower template on a working platform of the precision pressure testing machine;
s5: placing the sample clamping assembly with the sample in the positioning through hole of the positioning fixing block, and screwing down the screw on the positioning fixing block to enable the sample clamping assembly to be firmly attached to the positioning through hole of the positioning fixing block all the time;
s6: adjusting the plane of the cutter to be parallel to the upper chuck and the lower chuck, keeping a small gap, and screwing down the cutter fixing block to clamp the cutter tightly;
s7: starting a precision pressure tester, pressing a cutter down, shearing a sample, reading the maximum pressure F when the sample is sheared, and calculating a formula according to the bonding strength: obtaining the bonding strength P of the bimetallic plate, wherein L in the formula represents the width of the standard sample, and H represents the thickness of the standard sample;
s8: and (4) repeating 2-3 groups of samples, and calculating the average value, wherein the average value is the bonding strength of the bimetallic plate.
8. The detection method of the bimetal plate bonding strength detection device according to claim 7, wherein the micrometer has a telescoping precision of 0.01 mm;
the sample is placed in a clamping groove of the lower chuck, and the thickness of the sample is higher than the depth of the clamping groove;
the length of the boosting sheet is correspondingly adjusted according to the length of the sample, and the thickness of the boosting sheet is smaller than the depth of the clamping groove of the lower clamping head.
9. The detection method of the bimetal plate bonding strength detection device according to claim 7, wherein the diameter of the upper semicircular groove arranged on the upper chuck is larger than the diameter of the extension rod of the micrometer, the depth of the upper semicircular groove is larger than the maximum stroke of the extension rod of the micrometer, the diameter of the lower semicircular groove arranged on the lower chuck is larger than the diameter of the extension rod of the micrometer, and the depth of the lower semicircular groove is larger than the maximum stroke of the extension rod of the micrometer.
10. The method as claimed in claim 7, wherein the cutter comprises a cutter upper end and a cutter long end, the cutter upper end is in a disc structure, the cutter long end is in a round bar structure, the cutter upper end and the cutter long end are coaxially arranged, and the cutter is symmetrically flattened from the two round axes to form two planes.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113664053A (en) * | 2021-08-13 | 2021-11-19 | 太原理工大学 | Nondestructive testing device, system and method for interface bonding rate of bimetal corrugated composite plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113664053A (en) * | 2021-08-13 | 2021-11-19 | 太原理工大学 | Nondestructive testing device, system and method for interface bonding rate of bimetal corrugated composite plate |
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