CN112359406A - Novel electrolytic copper foil additive process - Google Patents
Novel electrolytic copper foil additive process Download PDFInfo
- Publication number
- CN112359406A CN112359406A CN202011221275.XA CN202011221275A CN112359406A CN 112359406 A CN112359406 A CN 112359406A CN 202011221275 A CN202011221275 A CN 202011221275A CN 112359406 A CN112359406 A CN 112359406A
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- CN
- China
- Prior art keywords
- additive
- liquid level
- solution tank
- copper foil
- electrolytic copper
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- 239000000654 additive Substances 0.000 title claims abstract description 102
- 230000000996 additive effect Effects 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 239000011889 copper foil Substances 0.000 title claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 239000003792 electrolyte Substances 0.000 claims description 11
- 230000002411 adverse Effects 0.000 abstract description 3
- 230000000630 rising effect Effects 0.000 abstract description 3
- 230000001932 seasonal effect Effects 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The invention discloses a novel electrolytic copper foil additive process, wherein an outlet pipeline of an additive solution tank is connected with an inlet pipeline of a metering pump, an outlet pipeline of the metering pump is connected with an electrolytic bath of a production system, and a pressure liquid level meter of the additive solution tank is connected with a liquid level alarm; the electrolytic copper foil additive process comprises the following steps: step 1: preparing an additive solution with a predetermined concentration in an additive solution tank; step 2: starting an additive adding metering pump to ensure that the additive can be normally added into a production system; and step 3: after the alarm is started due to the liquid level of the additive solution tank being reduced, the additive solution tank can be switched. The method solves the adverse factors of system liquid level rising, process parameter fluctuation, additive concentration change and the like caused by the traditional additive adding process. The concentration of the additive can be flexibly adjusted according to seasonal changes and actual production conditions.
Description
Technical Field
The invention relates to the technical field of copper foil additives, in particular to a novel electrolytic copper foil additive process. Can improve the stability of the production system and reduce the defective products caused by the unstable addition of the additive.
Background
The additive is an important process in the production of the electrolytic copper foil, and the performance of the electrolytic copper foil is determined by the shape and structure of copper crystal grains in the electrodeposition process of the electrolytic copper foil. In order to produce an electrolytic copper foil excellent in appearance quality and in internal properties, various technical conditions of the production process must be strictly controlled. Such as: current density, electrolyte temperature, electrolyte cleanliness, and additives. Additives are one of the most important controlling factors. The continuous and stable addition of a proper amount of additives is an effective measure for obtaining the electrolytic copper foil with uniform copper crystal size, good appearance quality and excellent internal performance.
The additive process is characterized in that the weighed additive is added into quantitative high-purity water according to requirements, the additive aqueous solution is formed by fully stirring and dissolving the additive at normal temperature and then adjusting the temperature to the standard requirement, and the additive aqueous solution is quantitatively added into a production system by using a metering pump. After the traditional additive process is added into a production system, the total volume of the solution is increased, and the external appearance and the internal performance of the electrolytic copper foil are abnormal to different degrees due to the influence on the parameters of the electrolyte and the stability of the concentration of the additive. And after the additive solution tank is switched, residual additives in the tank body can not be used and only can flow into a water treatment system, so that waste is caused and the water treatment pressure is increased.
Disclosure of Invention
The invention aims to provide a novel electrolytic copper foil additive process to solve the problems in the background technology. The method can ensure that the additives are stably added, reduce the influence on a process system, improve the quality of the copper foil, reduce the residual amount in the copper foil during the inversion of the additives, improve the utilization rate of the additive solution and save the production cost.
In order to achieve the purpose, the invention provides the following technical scheme: a novel electrolytic copper foil additive process comprises an additive solution tank, a metering pump, a production system electrolyte tank, an additive solution tank pressure liquid level meter, a liquid level alarm and a radar liquid level meter, wherein an outlet pipeline of the additive solution tank is connected with an inlet pipeline of the metering pump, an outlet pipeline of the metering pump is connected with the production system electrolyte tank, and the additive solution tank pressure liquid level meter is connected with the liquid level alarm;
the electrolytic copper foil additive process comprises the following steps:
step 1: preparing an additive solution with a predetermined concentration in an additive solution tank;
step 2: starting an additive adding metering pump to ensure that the additive can be normally added into a production system;
and step 3: after the alarm is started due to the liquid level of the additive solution tank being reduced, the additive solution tank can be switched.
A radar liquid level meter is used to ensure that the liquid level change condition of the system is accurate and controllable;
measuring the liquid level change condition of the additive solution tank by using a pressure liquid level meter;
the height of an outlet pipeline of the additive solution tank is reduced, and the internal liquid amount is minimized when the additive solution tank is switched;
the liquid level alarm gives an alarm when the liquid level is too low, and can prevent the liquid level from being too low and ensure that the additive is continuously and stably added;
and adjusting the configured concentration of the additive in real time according to the season and the liquid level change condition of the production system.
Preferably, the radar level gauge is a high precision radar level gauge.
Preferably, the radar liquid level meter monitors the liquid level condition of the electrolyte tank of the production system in real time.
Preferably, the additive solution tanks are provided in at least two groups.
Advantageous effects
The invention provides a novel electrolytic copper foil additive process, which has the following beneficial effects:
the method solves the adverse factors of system liquid level rising, process parameter fluctuation, additive concentration change and the like caused by the traditional additive adding process. The concentration of the additive can be flexibly adjusted according to seasonal changes and actual conditions of production, the operation is convenient, the practicability is strong, and obvious effects are achieved.
The liquid level alarm is added, so that the continuous and stable addition of the additive is ensured, the emptying of the additive solution tank caused by manual operation errors is reduced, the waste of the additive during switching can be reduced, the pressure of water treatment is reduced, and the cost is saved.
Drawings
Fig. 1 is a schematic view of a component connection structure of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a novel electrolytic copper foil additive process comprises an additive solution tank, a metering pump, a production system electrolyte tank, an additive solution tank pressure liquid level meter, a liquid level alarm and a radar liquid level meter, wherein an outlet pipeline of the additive solution tank is connected with an inlet pipeline of the metering pump, an outlet pipeline of the metering pump is connected with the production system electrolyte tank, and the additive solution tank pressure liquid level meter is connected with the liquid level alarm;
the electrolytic copper foil additive process comprises the following steps:
step 1: preparing an additive solution with a predetermined concentration in an additive solution tank;
step 2: starting an additive adding metering pump to ensure that the additive can be normally added into a production system;
and step 3: after the alarm is started due to the liquid level of the additive solution tank being reduced, the additive solution tank can be switched.
A radar liquid level meter is used to ensure that the liquid level change condition of the system is accurate and controllable;
measuring the liquid level change condition of the additive solution tank by using a pressure liquid level meter;
the height of an outlet pipeline of the additive solution tank is reduced, and the internal liquid amount is minimized when the additive solution tank is switched;
the liquid level alarm gives an alarm when the liquid level is too low, and can prevent the liquid level from being too low and ensure that the additive is continuously and stably added;
and adjusting the configured concentration of the additive in real time according to the season and the liquid level change condition of the production system.
Further, the radar level gauge is a high precision radar level gauge.
Further, the radar liquid level meter monitors the liquid level condition of an electrolyte tank of the production system in real time.
Further, the additive solution tanks are arranged in at least two groups.
The method solves the adverse factors of system liquid level rising, process parameter fluctuation, additive concentration change and the like caused by the traditional additive adding process. The concentration of the additive can be flexibly adjusted according to seasonal changes and actual conditions of production, the operation is convenient, the practicability is strong, and obvious effects are achieved.
The liquid level alarm is added, so that the continuous and stable addition of the additive is ensured, the emptying of the additive solution tank caused by manual operation errors is reduced, the waste of the additive during switching can be reduced, the pressure of water treatment is reduced, and the cost is saved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A novel electrolytic copper foil additive process is characterized in that:
the device comprises an additive solution tank, a metering pump, a production system electrolyte tank, an additive solution tank pressure liquid level meter, a liquid level alarm and a radar liquid level meter, wherein an outlet pipeline of the additive solution tank is connected with an inlet pipeline of the metering pump;
the electrolytic copper foil additive process comprises the following steps:
step 1: preparing an additive solution with a predetermined concentration in an additive solution tank;
step 2: starting an additive adding metering pump to ensure that the additive can be normally added into a production system;
and step 3: after the alarm is started due to the liquid level of the additive solution tank being reduced, the additive solution tank can be switched.
2. The novel electrolytic copper foil additive process according to claim 1, wherein: the radar level gauge is a high-precision radar level gauge.
3. The novel electrolytic copper foil additive process according to claim 1, wherein: the radar liquid level meter monitors the liquid level condition of an electrolyte tank of the production system in real time.
4. The novel electrolytic copper foil additive process according to claim 1, wherein: the change of the liquid level of the additive solution tank is measured by using a pressure liquid level meter.
5. The novel electrolytic copper foil additive process according to claim 1, wherein: the liquid level alarm gives an alarm when the liquid level is too low.
6. The novel electrolytic copper foil additive process according to claim 1, wherein: the additive solution tanks are arranged in at least two groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011221275.XA CN112359406A (en) | 2020-11-05 | 2020-11-05 | Novel electrolytic copper foil additive process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011221275.XA CN112359406A (en) | 2020-11-05 | 2020-11-05 | Novel electrolytic copper foil additive process |
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| Publication Number | Publication Date |
|---|---|
| CN112359406A true CN112359406A (en) | 2021-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011221275.XA Pending CN112359406A (en) | 2020-11-05 | 2020-11-05 | Novel electrolytic copper foil additive process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113209898A (en) * | 2021-06-04 | 2021-08-06 | 陕西汉和新材料科技有限公司 | Prevent extravagant copper foil additive and add device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107354489A (en) * | 2017-08-30 | 2017-11-17 | 铜陵有色金属集团股份有限公司金冠铜业分公司 | The automatic blending of copper electrolysis additive, charging system |
| CN210394551U (en) * | 2019-08-20 | 2020-04-24 | 梅州市威利邦电子科技有限公司 | Electrolytic copper foil additive adding structure |
| CN210596311U (en) * | 2019-04-15 | 2020-05-22 | 九江德福科技股份有限公司 | Electrolytic copper foil additive adding system |
| CN210826396U (en) * | 2020-04-15 | 2020-06-23 | 甘肃德福新材料有限公司 | Additive self-correcting adding device for electrolytic copper foil |
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2020
- 2020-11-05 CN CN202011221275.XA patent/CN112359406A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107354489A (en) * | 2017-08-30 | 2017-11-17 | 铜陵有色金属集团股份有限公司金冠铜业分公司 | The automatic blending of copper electrolysis additive, charging system |
| CN210596311U (en) * | 2019-04-15 | 2020-05-22 | 九江德福科技股份有限公司 | Electrolytic copper foil additive adding system |
| CN210394551U (en) * | 2019-08-20 | 2020-04-24 | 梅州市威利邦电子科技有限公司 | Electrolytic copper foil additive adding structure |
| CN210826396U (en) * | 2020-04-15 | 2020-06-23 | 甘肃德福新材料有限公司 | Additive self-correcting adding device for electrolytic copper foil |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113209898A (en) * | 2021-06-04 | 2021-08-06 | 陕西汉和新材料科技有限公司 | Prevent extravagant copper foil additive and add device |
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Application publication date: 20210212 |