CN112352414B

CN112352414B - Electronic device and portable communication device

Info

Publication number: CN112352414B
Application number: CN202080003642.0A
Authority: CN
Inventors: 全承吉; 金男祐; 洪城范; 文敬训; 李润范
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2019-05-14
Filing date: 2020-05-04
Publication date: 2023-05-23
Anticipated expiration: 2040-05-04
Also published as: KR20200131731A; KR20200131775A; CN112352414A

Abstract

An electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The support member includes: a conductive first portion forming a side appearance of the electronic device; a second portion adjacent the array antenna, the front cover, and the conductive first portion and having at least one opening filled with a non-conductive material; and a third portion comprising a non-conductive material and disposed adjacent the array antenna, the back cover, and the conductive first portion. The conductive first portion is exposed to the exterior of the electronic device, and the second and third portions are hidden by the front and rear covers. The beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.

Description

Electronic device and portable communication device

Technical Field

The present disclosure relates to antennas and electronic devices including the same.

Background

With the development of wireless communication technology, electronic devices (e.g., communication electronic devices) are commonly used in daily life, thereby exponentially increasing the use of content. Due to this rapid increase in the use of content, network capacity is reaching its limits. After commercialization of the 4 th generation (4G) communication system, in order to meet the increasing wireless data traffic demand, a communication system (e.g., 5 th generation (5G) or pre-5G communication system or New Radio (NR)) that transmits and/or receives signals using frequencies of a high frequency (e.g., millimeter wave (mmWave)) band (e.g., 3GHz to 300GHz band) is being studied.

Disclosure of Invention

Technical problem

Next generation wireless communication technologies are currently developed to allow signal transmission/reception using frequencies in the range of 3GHz to 100GHz, to overcome high free space loss caused by frequency characteristics, to realize an effective mounting structure for increasing antenna gain, and to realize a related new antenna module. The antenna module may include an array type antenna module in which various numbers of antenna elements (e.g., conductive patches) are arranged at regular intervals. These antenna elements may be provided in the electronic device to form a beam pattern (beam pattern) in one direction, for example, from an internal space of the electronic device toward a front surface, a rear surface, or a side surface of the electronic device.

The electronic device may include a conductive portion (e.g., a metal member) disposed on at least a portion of the housing to enhance rigidity and create a beautiful appearance, and a non-conductive portion (e.g., a polymer member) coupled to the conductive portion. However, when the conductive portion is placed near an antenna module provided inside the electronic device, the radiation performance and radiation sensitivity of the antenna module may be deteriorated.

The non-conductive portion may be insert injected into the conductive portion or structurally combined with the conductive portion to form a single housing. Further, in order to prevent the conductive portion and the non-conductive portion from being separated due to an external impact, a boundary region between the conductive portion and the non-conductive portion may have a coupling structure composed of at least one protrusion and at least one recess for receiving the at least one protrusion. The portion of the housing facing by the antenna module forming the beam pattern in a specific direction from the internal space of the electronic device may be formed as a non-conductive portion. Accordingly, a boundary region between the conductive portion and the non-conductive portion may be placed near the antenna module, and a concave portion of the conductive portion generated by the joint structure composed of the protrusion and the recess may also be placed near the antenna module.

Unfortunately, the recess may cause excitation current, so that the antenna module may face degradation of radiation performance and radiation sensitivity.

The above information is presented merely as background information and is helpful in understanding the present disclosure. As to whether any of the above may apply as prior art to the present disclosure, there is no determination or assertion.

Technical proposal

Aspects of the present disclosure will solve at least the problems and/or disadvantages described above and will provide at least the advantages described below. Accordingly, aspects of the present disclosure are to provide an apparatus and method for an antenna and an electronic device including the same.

Another aspect of the present disclosure is to provide an apparatus and method for an electronic device capable of preventing degradation of radiation performance of an antenna through structural modification of a housing.

Another aspect of the present disclosure is to provide an apparatus and method for an electronic device capable of preventing a case from being damaged due to an external impact and also preventing degradation of antenna performance.

Additional aspects will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the presented embodiments.

According to aspects of the present disclosure, an electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The front cover and the rear cover form part of the external appearance of the electronic device. The array antenna includes a plurality of antenna elements disposed between a front cover and a rear cover. The support member is disposed between the front cover and the rear cover and is configured to support a display of the electronic device and extend to a side surface of the electronic device to at least partially form a side appearance of the electronic device. The support member includes: a conductive first portion forming a side appearance of the electronic device; a second portion adjacent the array antenna, the front cover, and the conductive first portion and having at least one opening filled with a non-conductive material; and a third portion formed of a non-conductive material and adjacent to the array antenna, the back cover, and the conductive first portion. The first portion is exposed to the outside of the electronic device, and the second and third portions are hidden by the front cover and the rear cover so as not to be exposed to the outside. The beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.

According to another aspect of the present disclosure, a portable communication device is provided. The portable communication device includes a housing, a display, and an antenna module. The housing includes a first member forming a front of the portable communication device, a second member forming a rear of the portable communication device, and a third member forming a side of the portable communication device. The third member includes a conductive member having an opening formed therein, and a non-conductive member filled in the opening. One surface of the conductive member is exposed to the outside of the portable communication device, and the non-conductive member is disposed in the housing so as not to be exposed to the outside. The display is disposed under the first member and is visually seen from the outside through the first member. The antenna module is disposed between the display and the second member and includes an antenna and a printed circuit board. The antenna is formed on the printed circuit board such that a signal radiated from the antenna is transmitted to the outside through the non-conductive member.

Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.

Advantageous effects

As described above, the electronic device according to the embodiment of the present disclosure has the housing modified in structure for not allowing the non-conductive portion thereof to be separated from the conductive portion thereof due to external impact. This can also prevent the radiation performance of the antenna from being degraded.

Drawings

The above and other aspects, features, and advantages of certain embodiments of the present disclosure will become more apparent from the following description when taken in conjunction with the accompanying drawings in which:

fig. 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure.

Fig. 2 is a block diagram illustrating an electronic device for supporting legacy network communications and 5G network communications according to an embodiment of the present disclosure.

Fig. 3A is a perspective view illustrating a front surface of a mobile electronic device according to an embodiment of the present disclosure.

Fig. 3B is a perspective view illustrating a rear surface of the mobile electronic device shown in fig. 3A according to an embodiment of the present disclosure.

Fig. 3C is an exploded perspective view illustrating the mobile electronic device shown in fig. 3A and 3B according to an embodiment of the present disclosure.

Fig. 4A illustrates an embodiment of a structure of the third antenna module illustrated in fig. 2 and described with reference to fig. 2, according to an embodiment of the present disclosure.

Fig. 4B is a cross-sectional view taken along line Y-Y' in fig. 4A, according to an embodiment of the present disclosure.

Fig. 5 is a perspective view illustrating an antenna module according to an embodiment of the present disclosure.

Fig. 6A is an exploded perspective view illustrating an antenna module and a conductive member to be applied thereto according to an embodiment of the present disclosure.

Fig. 6B is a perspective view illustrating an antenna module and a conductive member applied thereto according to an embodiment of the present disclosure.

Fig. 7 is a cross-sectional view partially illustrating an electronic device as viewed from line A-A' in fig. 3B, according to an embodiment of the present disclosure.

Fig. 8A is a view partially illustrating an electronic device viewed from line B-B' in fig. 3B according to an embodiment of the present disclosure.

Fig. 8B is a view partially illustrating a side member having a non-conductive region surrounding an antenna module according to an embodiment of the present disclosure.

Fig. 9A and 9B are diagrams illustrating radiation patterns and gains caused by horizontal polarization of an antenna module according to various embodiments of the present disclosure.

Fig. 9C is a diagram illustrating a radiation pattern of an antenna module caused by vertical polarization according to an embodiment of the present disclosure.

Fig. 10 is a cross-sectional view partially illustrating an electronic device viewed from line C-C in fig. 3A, according to an embodiment of the present disclosure.

Fig. 11A is a perspective view partially illustrating a housing according to an embodiment of the present disclosure.

Fig. 11B is a perspective view partially illustrating a housing according to an embodiment of the present disclosure.

Fig. 12A and 12B are diagrams illustrating radiation patterns and gains caused by horizontal polarization of the antenna module of fig. 10 according to various embodiments of the present disclosure.

Fig. 13 is a cross-sectional view partially illustrating an electronic device including a conductive connection member according to an embodiment of the present disclosure.

Fig. 14A is a radiation pattern view showing horizontal polarization of an antenna module before and after movement of a conductive connection member according to an embodiment of the present disclosure.

Fig. 14B is a radiation pattern view showing vertical polarization of an antenna module before and after movement of a conductive connection member according to an embodiment of the present disclosure.

Fig. 15 is a perspective view partially illustrating an electronic device including a conductive sheet having a notch according to an embodiment of the present disclosure.

Fig. 16 is a diagram illustrating radiation patterns caused by vertical polarization and horizontal polarization of an antenna module provided in the electronic device of fig. 15 according to an embodiment of the present disclosure.

Fig. 17 is a cross-sectional view partially illustrating an electronic device according to an embodiment of the present disclosure.

Fig. 18 is a cross-sectional view partially illustrating an electronic device according to an embodiment of the present disclosure.

Fig. 19A and 19B are perspective views partially illustrating support members according to various embodiments of the present disclosure.

Fig. 20A and 20B are perspective views partially illustrating an electronic device including a conductive sheet having a groove according to various embodiments of the present disclosure.

Like reference numerals will be understood to refer to like parts, components and structures throughout the drawings.

Detailed Description

The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure defined by the claims and their equivalents. It includes various specific details to aid in the understanding, but these specific details are to be considered merely exemplary. Accordingly, one of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to written meanings, but are only used to enable the present disclosure to be clearly and consistently understood. Accordingly, it should be apparent to those skilled in the art that the following description of the various embodiments of the present disclosure is provided for illustration only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.

It will be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to a "component surface" includes reference to one or more of such surfaces.

Fig. 1 illustrates an electronic device in a network environment according to an embodiment of the present disclosure.

Referring to fig. 1, an electronic device 101 in a network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with an electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). The electronic device 101 may communicate with the electronic device 104 via a server 108. The electronic device 101 includes a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM) 196, and/or an antenna module 197. In some embodiments, at least one of the components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., fingerprint sensor, iris sensor, or illuminance sensor) may be implemented embedded in the display device 160 (e.g., display).

The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 that is connected to the processor 120, and may perform various data processing or calculations. As at least part of the data processing or calculation, the processor 120 may load commands or data received from another component (e.g., the sensor module 176 or the communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Processor 120 may include a main processor 121 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) and an auxiliary processor 123 (e.g., a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent of or in conjunction with main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specifically adapted for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

The auxiliary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) in place of the main processor 121 when the main processor 121 is in an inactive (e.g., sleep) state, or the auxiliary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). The auxiliary processor 123 (e.g., ISP or CP) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123.

The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands associated therewith. Memory 130 may include volatile memory 132 or nonvolatile memory 134, which may include one or more of internal memory 136 and external memory 138.

Program 140 may be stored as software in memory 130, and program 140 may include, for example, an Operating System (OS) 142, middleware 144, and/or applications 146.

The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

The sound output device 155 may output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. Speakers may be used for general purposes such as playing multimedia or playing a album and receivers may be used for incoming calls. The receiver may be implemented separately from the speaker or as part of the speaker.

Display device 160 may visually provide information to the outside (e.g., user) of electronic device 101. The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Display device 160 may include touch circuitry adapted to detect touches or sensor circuitry (e.g., pressure sensors) adapted to measure the strength of forces caused by touches.

The audio module 170 may convert sound into electrical signals and vice versa. The audio module 170 may obtain sound via the input device 150 or output sound via the sound output device 155 or headphones of an external electronic device (e.g., the electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101 and then generate an electrical signal or data value corresponding to the detected state. The sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

Interface 177 may support one or more specific protocols that will be used to connect electronic device 101 with an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly. The interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 178 may include a connector via which the electronic device 101 may be physically connected with an external electronic device (e.g., the electronic device 102). The connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthetic sense. The haptic module 179 may include, for example, a motor, a piezoelectric element, or an electro-stimulator.

The camera module 180 may capture an image or a moving image. The camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 188 may manage power supply to the electronic device 101. The power management module 188 may be implemented as at least part of, for example, a Power Management Integrated Circuit (PMIC).

Battery 189 may power at least one component of electronic device 101. Battery 189 may include, for example, a primary non-rechargeable battery, a rechargeable battery, or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an AP) and support direct (e.g., wired) or wireless communication. The communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 194 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may communicate with external electronic devices via a first network 198 (e.g., a short-range communication network such as bluetooth (TM), wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the internet, or a computer network (e.g., a LAN or Wide Area Network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the SIM 196.

The antenna module 197 may transmit signals or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive signals or power from the outside of the electronic device 101 (e.g., an external electronic device). The antenna module 197 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in or on a substrate, such as a Printed Circuit Board (PCB). The antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas, for example, by the communication module 190 (e.g., the wireless communication module 192). Signals or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. Another component other than the radiating element, such as a Radio Frequency Integrated Circuit (RFIC), may be additionally formed as part of the antenna module 197.

At least some of the above components may be interconnected via an inter-peripheral communication scheme (e.g., bus, general Purpose Input Output (GPIO), serial Peripheral Interface (SPI), or Mobile Industrial Processor Interface (MIPI)) and communicatively communicate signals (e.g., commands or data) therebetween.

Commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be the same type of device as the electronic device 101 or a different type of device from the electronic device 101. All or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic device 102, the external electronic device 104, or the external electronic device 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of or in addition to the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the function or service or perform another function or another service related to the request and transmit the result of the performing to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing of the result. For this purpose, cloud computing technology, distributed computing technology, or client-server computing technology, for example, may be used.

The electronic device according to the embodiment may be one of various types of electronic devices. The electronic device may include a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. However, the electronic device is not limited to any one of those described above.

The various embodiments of the disclosure and the terms used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various modifications, equivalents, or alternatives to the respective embodiments.

For the description of the drawings, like reference numerals may be used to refer to like or related elements.

A noun in the singular corresponding to a term may include one or more things unless the context clearly indicates otherwise. As used herein, each of the phrases such as "a or B", "at least one of a and B", "at least one of a or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any or all of the possible combinations of items listed with a corresponding one of the plurality of phrases.

As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to simply distinguish one element from another element and not to limit the element in other respects (e.g., importance or order). In the case where the term "operatively" or "communicatively" is used or the term "operatively" or "communicatively" is not used, if an element (e.g., a first element) is referred to as being "coupled to," "connected to," or "connected to" another element (e.g., a second element), it means that the element may be directly (e.g., wired) connected to, wirelessly connected to, or connected to the other element via a third element.

The term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an Application Specific Integrated Circuit (ASIC).

The various embodiments set forth herein may be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, under control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may invoke and execute at least one of the one or more instructions stored in the storage medium with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the at least one instruction invoked. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein the term "non-transitory" merely means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

Methods according to embodiments of the present disclosure may be included and provided in computer program products. The computer program product may be used as a product for conducting transactions between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium, such as a compact disk read only memory (CD-ROM), or may be distributed (e.g., downloaded or uploaded) online via an application store, such as a playstore (tm), or may be distributed (e.g., downloaded or uploaded) directly between two user devices, such as smartphones. At least some of the computer program product may be temporarily generated if published online, or at least some of the computer program product may be stored at least temporarily in a machine readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a forwarding server.

Each of the above-described components (e.g., modules or programs) may include a single entity or multiple entities. One or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform the one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration. Operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added.

Fig. 2 is a diagram illustrating an electronic device in a network environment including a plurality of cellular networks according to an embodiment of the present disclosure.

Referring to fig. 2, the electronic device 101 of the block diagram 200 may include a first communication processor 212, a second communication processor 214, a first RFIC 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first Radio Frequency Front End (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, an antenna 248. The electronic device 101 may include a processor 120 and a memory 130. The second network 199 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device 101 may also include at least one of the components described with reference to fig. 1, and the second network 199 may also include at least one other network. According to one embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least part of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted or included as part of the third RFIC 226.

The first communication processor 212 may establish a communication channel of a frequency band to be used for wireless communication with the first cellular network 292 and support legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or Long Term Evolution (LTE) network. The second communication processor 214 may establish a communication channel corresponding to a designated frequency band (e.g., about 6GHz to about 60 GHz) among frequency bands to be used for wireless communication with the second cellular network 294, and support 5G network communication through the established communication channel. According to various embodiments, the second cellular network 294 may be a 5G network defined in 3 GPP. In addition, according to an embodiment, the first communication processor 212 or the second communication processor 214 may establish a communication channel corresponding to another designated frequency band (e.g., about 6GHz or less) among frequency bands to be used for wireless communication with the second cellular network 294, and support 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented as a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed as a single chip or a single package with the processor 120, the auxiliary processor 123, or the communication module 190.

When transmitted, the first RFIC 222 may convert baseband signals generated by the first communication processor 212 to Radio Frequency (RF) signals of about 700MHz to about 3GHz for use in a first cellular network 292 (e.g., a legacy network). Upon receipt, an RF signal may be obtained from a first cellular network 292 (e.g., a legacy network) through an antenna (e.g., first antenna module 242) and preprocessed by an RFFE (e.g., first RFFE 232). The first RFIC 222 may convert the preprocessed RF signal to baseband signals for processing by the first communication processor 212.

When transmitted, the second RFIC 224 may convert baseband signals generated by the first communication processor 212 or the second communication processor 214 into RF signals (hereinafter referred to as 5G Sub6 RF signals) of a Sub6 band (e.g., 6GHz or less) to be used in the second cellular network 294 (e.g., a 5G network). Upon reception, a 5G Sub6 RF signal may be obtained from a second cellular network 294 (e.g., a 5G network) through an antenna (e.g., the second antenna module 244) and pre-processed by an RFFE (e.g., the second RFFE 234). The second RFIC 224 may convert the preprocessed 5g Sub6 RF signal to a baseband signal for processing by a corresponding one of the first communication processor 212 or the second communication processor 214.

The third RFIC 226 may convert baseband signals generated by the second communication processor 214 into RF signals (hereinafter referred to as 5G Above6 RF signals) of a 5G Above6 band (e.g., about 6GHz to about 60 GHz) to be used in a second cellular network 294 (e.g., a 5G network). Upon reception, a 5G Above6 RF signal may be obtained from a second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and preprocessed by a third RFFE 236. The third RFIC 226 may convert the preprocessed 5g Above6 RF signal to a baseband signal for processing by the second communications processor 214. According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226.

According to an embodiment, the electronic device 101 may include a fourth RFIC 228 separate from the third RFIC 226 or as at least part of the third RFIC 226. In this case, the fourth RFIC 228 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an Intermediate Frequency (IF) signal) of an intermediate frequency band (e.g., about 9GHz to about 11 GHz) and transmit the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal to a 5g Above6 RF signal. Upon reception, a 5G Above6 RF signal may be received from a second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and converted to an IF signal by a third RFIC 226. The fourth RFIC 228 may convert the IF signal to a baseband signal for processing by the second communications processor 214.

According to one embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as at least part of a single package or a single chip. According to one embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least portions of a single package or a single chip. According to one embodiment, at least one of the first antenna module 242 or the second antenna module 244 may be omitted or may be combined with another antenna module to process RF signals of a corresponding plurality of frequency bands.

According to one embodiment, the third RFIC 226 and antenna 248 may be disposed on the same substrate to form a third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be disposed on a first substrate (e.g., a main PCB). In this case, the third RFIC 226 is disposed in a partial area (e.g., a lower surface) of the first substrate and a separate second substrate (e.g., a sub PCB), and the antenna 248 is disposed in another partial area (e.g., an upper surface) of the first substrate and the separate second substrate, so that the third antenna module 246 may be formed. By providing the third RFIC 226 and the antenna 248 in the same substrate, the length of the transmission line between them may be reduced. This may reduce loss (e.g., attenuation) of signals in a high frequency band (e.g., about 6GHz to about 60 GHz) to be used in 5G network communications, e.g., caused by a transmission line. Accordingly, the electronic device 101 may improve the quality or speed of communication with the second cellular network 294 (e.g., a 5G network).

According to one embodiment, the antenna 248 may be formed as an antenna array that includes a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC 226 may include a plurality of phase shifters 238 corresponding to the plurality of antenna elements, for example, as part of the third RFFE 236. When transmitted, each of the plurality of phase shifters 238 may shift the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (e.g., a base station of a 5G network) through a corresponding antenna element. Upon reception, each of the plurality of phase shifters 238 may convert the phase of the 5g Above6 RF signal received from the outside through the corresponding antenna element into the same phase or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second cellular network 294 (e.g., a 5G network) may operate independently of the first cellular network 292 (e.g., a legacy network) (e.g., a standalone networking (SA)), or may operate in conjunction with the first cellular network 292 (e.g., a non-standalone Networking (NSA)). For example, a 5G network may have only an access network (e.g., a 5G Radio Access Network (RAN) or a Next Generation (NG) RAN) and no core network (e.g., a next generation core Network (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (e.g., the internet) under the control of a core network of a legacy network (e.g., an evolved packet switched core network (EPC)). Protocol information for communicating with a legacy network (e.g., LTE protocol information) or protocol information for communicating with a 5G network (e.g., new Radio (NR) protocol information) may be stored in the memory 130 for access by other components (e.g., the processor 120, the first communication processor 212, or the second communication processor 214).

Fig. 3A illustrates a perspective view showing a front surface of a mobile electronic device according to an embodiment of the present disclosure.

Fig. 3B illustrates a perspective view showing a rear surface of the mobile electronic device shown in fig. 3A according to an embodiment of the present disclosure.

Referring to fig. 3A and 3B, the mobile electronic device 300 may include a housing 310, wherein the housing 310 includes a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and a side surface 310C surrounding a space between the first surface 310A and the second surface 310B. The housing 310 may refer to a structure forming a portion of the first surface 310A, the second surface 310B, and the side surface 310C. The first surface 310A may be formed from a front plate 302 (e.g., a glass or polymer plate coated with various coatings) that is at least partially substantially transparent. The second surface 310B may be formed from a substantially opaque back plate 311. The rear plate 311 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The side surface 310C may be formed from a side frame structure (or "side member") 318 that is bonded to the front and

rear panels

302, 311 and includes metal and/or polymer. The rear plate 311 and the side frame structure 318 may be integrally formed, and may be the same material (e.g., a metal material such as aluminum).

The front plate 302 may include two first regions 310D disposed at long edges thereof, respectively, and seamlessly bent and extended from the first surface 310A toward the rear plate 311. Similarly, the rear panel 311 may include two second regions 310E disposed at long edges thereof, respectively, and seamlessly bent and extended from the second surface 310B toward the front panel 302. The front plate 302 (or the rear plate 311) may include only one of the first regions 310D (or the second regions 310E). The first region 310D or the second region 310E may be partially omitted. The side frame structure 318 may have a first thickness (or width) on a side that does not include the first region 310D or the second region 310E and may have a second thickness less than the first thickness on the other side that includes the first region 310D or the second region 310E when viewed from the side of the mobile electronic device 300.

The mobile electronic device 300 may include at least one of the following: a display 301,

audio modules

303, 307, and 314, a sensor module 304319,

camera modules

305, 312, and 313, a key input device 317, a light emitting device, and

connector holes

308 and 309. The mobile electronic device 300 may omit at least one of the above components (e.g., the key input device 317 or the light emitting device), or may also include other components.

For example, the display 301 may be exposed through a substantial portion of the front panel 302. At least a portion of the display 301 may be exposed through the front panel 302 forming a first area 310D of the first surface 310A and the side surface 310C. The outline (i.e., edges and corners) of the display 301 may have substantially the same shape as the outline of the front panel 302. The spacing between the outline of the display 301 and the outline of the front plate 302 may be substantially constant in order to expand the exposed area of the display 301.

A recess or opening may be formed in a portion of the display area of the display 301 to accommodate at least one of the audio module 314, the sensor module 304, the camera module 305, and the light emitting device. At least one of the audio module 314, the sensor module 304, the camera module 305, the fingerprint sensor (not shown), and the light emitting element may be disposed at the back of the display area of the display 301. The display 301 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and/or a digitizer for detecting a stylus. At least a portion of the

sensor modules

304 and 319 and/or at least a portion of the key input device 317 may be disposed in the first region 310D and/or the second region 310E.

The

audio modules

303, 307, and 314 may correspond to the microphone aperture 303 and the

speaker apertures

307 and 314, respectively. The microphone aperture 303 may contain therein a microphone for capturing external sound, and in this case, may contain a plurality of microphones sensing the direction of sound. Speaker holes 307 and 314 may be classified into an external speaker hole 307 and a call receiver hole 314. The microphone aperture 303 and the

speaker apertures

307 and 314 may be implemented as a single aperture, or a speaker (e.g., a piezoelectric speaker) may be provided without the

speaker apertures

307 and 314.

The

sensor modules

304 and 319 may generate electrical signals or data corresponding to internal operating states of the mobile electronic device 300 or corresponding to external environmental conditions. The

sensor modules

304 and 319 may include a first sensor module 304 (e.g., a proximity sensor) and/or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface 310A of the housing 310, and/or a third sensor module 319 (e.g., a Heart Rate Monitor (HRM) sensor) and/or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface 310B of the housing 310. The fingerprint sensor may be disposed on the second surface 310B of the housing 310 and the first surface 310A (e.g., the display 301). The electronic device 300 may also include at least one of the following sensors: gesture sensors, gyroscope sensors, barometric pressure sensors, magnetic sensors, acceleration sensors, grip sensors, color sensors, infrared (IR) sensors, biometric sensors, temperature sensors, humidity sensors, or illuminance sensors.

The

camera modules

305, 312, and 313 may include a first camera device 305 disposed on a first surface 310A of the electronic device 300, and a second camera module 312 and/or a flash 313 disposed on a second surface 310B. The camera module 305 or the camera module 312 may include one or more lenses, image sensors, and/or image signal processors. The flash 313 may include, for example, a light emitting diode or a xenon lamp. Two or more lenses (infrared camera, wide-angle and telephoto lens) and an image sensor may be disposed at one side of the electronic device 300.

The key input device 317 may be disposed on a side surface 310C of the housing 310. The mobile electronic device 300 may not include some or all of the key input devices 317 described above, and the key input devices 317 that are not included may be implemented in another form such as soft keys on the display 301. The key input device 317 may include a sensor module disposed on the second surface 310B of the housing 310.

The light emitting device may be disposed on the first surface 310A of the case 310. For example, the light emitting device may provide status information of the electronic device 300 in an optical form. The light emitting device may provide a light source associated with the operation of the camera module 305. The light emitting device may comprise, for example, a Light Emitting Diode (LED), an IR LED, or a xenon lamp.

The connector holes 308 and 309 may include a first connector hole 308 and/or a second connector hole 309, wherein the first connector hole 308 is adapted for a connector (e.g., a Universal Serial Bus (USB) connector) for transmitting and receiving power and/or data to and from an external electronic device, and the second connector hole 309 is adapted for a connector (e.g., a headset jack) for transmitting and receiving audio signals to and from the external electronic device.

Some of the

camera modules

305 and 312, some of the

sensor modules

304 and 319, or some of the sensor modules 304, or indicators may be arranged to be exposed through the display 301. For example, the camera module 305, the sensor module 304, or the indicator may be disposed in an inner space of the electronic device 300 so as to be in contact with an external environment through an opening of the display 301 perforated to the front plate 302. In another embodiment, some of the sensor modules 304 may be arranged to perform their functions in the interior space of the electronic device without being visually exposed through the front plate 302. For example, in this case, the area of the display 301 facing the sensor module may not require a perforated opening.

Fig. 3C illustrates an exploded perspective view showing the mobile electronic device shown in fig. 3A according to an embodiment of the present disclosure.

Referring to fig. 3C, the mobile electronic device 300 may include a side frame structure 310, a first support member 3211 (e.g., a bracket), a front plate 302, a display 301, an electromagnetic induction panel (not shown), a Printed Circuit Board (PCB) 340, a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear plate 311. The mobile electronic device 300 may omit at least one of the above components (e.g., the first support member 3211 or the second support member 360), or may further include another component. Some components of the electronic device 300 may be the same as or similar to those of the mobile electronic device 101 shown in fig. 1 or 2, and thus, a description thereof will be omitted below.

The first support member 3211 is disposed inside the mobile electronic device 300 and may be connected to the side frame structure 320 or integrated with the side frame structure 320. The first support member 3211 may be formed of, for example, a metallic material and/or a non-metallic (e.g., polymeric) material. The first support member 3211 may be coupled to the display 301 at one side thereof and may also be coupled to a Printed Circuit Board (PCB) 340 at the other side thereof. On PCB 340, a processor, memory, and/or interface may be mounted. The processor may include, for example, one or more of a Central Processing Unit (CPU), an Application Processor (AP), a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP).

The memory may include, for example, one or more of volatile memory and non-volatile memory.

The interface may include, for example, a High Definition Multimedia Interface (HDMI), a USB interface, a Secure Digital (SD) card interface, and/or an audio interface. The interface may electrically or physically connect the mobile electronic device 300 with an external electronic device and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector.

The battery 350 is a device for powering at least one component of the mobile electronic device 300 and may include, for example, a primary non-rechargeable battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as the PCB 340. The battery 350 may be integrally disposed within the mobile electronic device 300 and may be detachably disposed from the mobile electronic device 300.

The antenna 370 may be disposed between the rear plate 311 and the battery 350. Antenna 370 may include, for example, a Near Field Communication (NFC) antenna, a wireless charging antenna, and/or a Magnetic Security Transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device or transmit and receive power required for wireless charging. The antenna structure may be formed by a portion of the side frame structure 320 and/or the first support member 3211 or a combination of the side frame structure 320 and the first support member 3211.

Fig. 4A is a diagram illustrating a structure of a third antenna module, for example, described with reference to fig. 2, according to an embodiment of the present disclosure.

Referring to fig. 4A, view (a) is a perspective view showing the third antenna module 246 viewed from one side, and fig. 4A view (b) is a perspective view showing the third antenna module 246 viewed from the other side. Fig. 4A view (c) is a cross-sectional view showing the third antenna module 246 taken along the line X-X' of fig. 4A.

Referring to fig. 4A, in one embodiment, the third antenna module 246 may include a printed circuit board 410, an antenna array 430, an RFIC 452, and a PMIC 454. Optionally, the third antenna module 246 may also include a shielding member 490. In other embodiments, at least one of the above-described components may be omitted, or at least two of the components may be integrally formed.

The printed circuit board 410 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 410 may provide electrical connection between the printed circuit board 410 and/or various electronic components disposed externally using wiring and conductive vias formed in the conductive layer.

The antenna array 430 (e.g., 248 of fig. 2) may include a plurality of

antenna elements

432, 434, 436, or 438 arranged to form a directional beam. As shown,

antenna elements

432, 434, 436, and/or 438 may be formed on a first surface of printed circuit board 410. According to another embodiment, the antenna array 430 may be formed inside the printed circuit board 410. According to this embodiment, antenna array 430 may include multiple antenna arrays (e.g., dipole antenna arrays and/or patch antenna arrays) of the same or different shapes or types.

The RFIC 452 (e.g., the third RFIC226 of fig. 2) may be disposed in another area of the printed circuit board 410 (e.g., a second surface opposite the first surface) spaced apart from the antenna array. RFIC 452 is configured to process signals of selected frequency bands transmitted/received through antenna array 430. According to one embodiment, RFIC 452 may convert baseband signals obtained from a communication processor (not shown) to RF signals of a specified frequency band when transmitting. Upon reception, the RFIC 452 may convert RF signals received through the antenna array 430 to baseband signals and transmit the baseband signals to a communication processor.

According to another embodiment, RFIC 452 may up-convert an IF signal (e.g., about 9GHz to about 11 GHz) obtained from a medium frequency integrated circuit (IFIC) (e.g., 228 of fig. 2) into an RF signal of a selected frequency band when transmitted. Upon reception, RFIC 452 may down-convert the RF signals obtained through antenna array 430, convert the RF signals to IF signals, and transmit the IF signals to the IFIC.

The PMIC 454 may be disposed in another partial region (e.g., the second surface) of the printed circuit board 410 spaced apart from the antenna array 430. The PMIC 454 may receive voltage from a main PCB (not shown) to provide power required by various components on the antenna module (e.g., the RFIC 452).

The shielding member 490 may be disposed at a portion (e.g., a second surface) of the printed circuit board 410 to electromagnetically shield at least one of the RFIC 452 or PMIC 454. According to one embodiment, the shielding member 490 may include a shielding cage.

Although not shown, in various embodiments, the third antenna module 246 may be electrically connected to another printed circuit board (e.g., a main circuit board) through a module interface. The module interface may include a connection member, such as a coaxial cable connector, a board-to-board connector, an interposer, or a Flexible Printed Circuit Board (FPCB). The RFIC 452 and/or PMIC 454 of the antenna module may be electrically connected to the printed circuit board through a connection member.

Fig. 4B is a cross-sectional view illustrating the third antenna module 246 taken along line Y-Y' of view (a) of fig. 4A in accordance with an embodiment of the present disclosure.

Referring to fig. 4B, the printed circuit board 410 of the illustrated embodiment may include an antenna layer 411 and a network layer 413. The antenna layer 411 may include at least one dielectric layer 437-1 and an antenna element 436 and/or a feed section 425 formed on or within an outer surface of the dielectric layer. The feed portion 425 may include a feed point 427 and/or a feed line 429.

The network layer 413 may include at least one dielectric layer 437-2, at least one ground layer 433 formed on or within an outer surface of the dielectric layer, at least one conductive via 435, a transmission line 423, and/or a feed line 429.

Furthermore, in the illustrated embodiment, the RFIC 452 of view (c) of fig. 4A (e.g., the third RFIC 226 of fig. 2) may be electrically connected to the network layer 413 through, for example, the first solder bump 440-1 and the second solder bump 440-2. In other embodiments, various connection structures, such as solder or Ball Grid Array (BGA), may be used in place of the solder bumps. The RFIC 452 may be electrically connected to the antenna element 436 through the first solder bump 440-1, the transmission line 423, and the feed section 425. RFIC 452 may also be electrically connected to ground layer 433 through second solder bump 440-2 and conductive via 435. Although not shown, RFIC 452 may also be electrically connected to the above-described module interface by a feeder 429.

The antenna module 500 of fig. 5 may be at least partially similar to the third antenna module 246 of fig. 2, or may include other embodiments of antenna modules.

Referring to fig. 5, the antenna module 500 may include an antenna structure composed of a Printed Circuit Board (PCB) 590 and a plurality of

conductive patches

510, 520, 530, and 540. According to an embodiment, the antenna module 500 may include a wireless communication circuit 595 mounted on the PCB 590. According to an embodiment, the antenna structure may include a plurality of

conductive patches

510, 520, 530, and 540 disposed on a PCB 590. According to an embodiment, the antenna module 500 may include an array antenna AR1 composed of a plurality of

conductive patches

510, 520, 530, and 540. According to an embodiment, a plurality of

conductive patches

510, 520, 530 and 540 may be formed on a PCB 590. According to an embodiment, PCB 590 may have a first surface 591 facing a first direction (represented by (1)) and a second surface 592 facing a second direction (represented by (2)) opposite the first direction. According to an embodiment, the antenna module 500 may include wireless communication circuitry 595 disposed on the second surface 592 of the PCB 590. In another embodiment, the wireless communication circuit 595 may be spaced apart from the PCB 590 in an interior space of the electronic device and electrically connected to the PCB 590 through an electrical connection member, such as a Flexible PCB (FPCB). According to an embodiment, the plurality of

conductive patches

510, 520, 530, and 540 may be electrically connected to a wireless communication circuit 595. According to an embodiment, the wireless communication circuit 595 may be configured to transmit and/or receive radio frequency signals in the range of about 3GHz to 100GHz through the array antenna AR1.

According to various embodiments, the plurality of

conductive patches

510, 520, 530, and 540 may include first conductive patches 510, second conductive patches 520, third conductive patches 530, and fourth conductive patches 540 disposed on the first surface 591 of the PCB 590 at regular intervals or disposed in the PCB 590 proximate to the first surface 591. The

conductive patches

510, 520, 530, and 540 may have substantially the same configuration. Although the antenna module 500 according to the embodiment is shown and described as including the array antenna AR1 composed of four

conductive patches

510, 520, 530, and 540, this is only and should not be construed as limiting. Alternatively, the antenna module 500 may include one, two, three, five or more conductive patches as the array antenna AR1. In another embodiment, the antenna module may further include a plurality of conductive patterns (e.g., dipole antennas) disposed on the PCB 590. In this case, the conductive patterns may be arranged to form a beam pattern direction different from (e.g., perpendicular to) the beam pattern directions of the

conductive patches

510, 520, 530, and 540. Although not shown, the antenna module 500 may further include a protective member (e.g., a urethane resin) surrounding the wireless communication circuit 595 on the second surface 592 of the PCB 590 and/or a conductive coating member (e.g., an electromagnetic interference (EMI) shielding material) coated on an outer surface of the protective member to shield noise.

Referring to fig. 6A and 6B, an electronic device (e.g., electronic device 300 in fig. 3A) may include a conductive member 550 at least partially secured to an antenna module 500. According to an embodiment, the conductive member 550 may be fixed to a conductive portion (e.g., conductive portion 321 in fig. 7) of a housing (e.g., housing 310 in fig. 3A and 7) and/or to a conductive portion of a support member (e.g., first support member 3211 in fig. 7) in an interior space of an electronic device. According to an embodiment, the conductive member 550 may be in physical contact with a conductive portion (e.g., conductive portion 321 in fig. 7) of a side member (e.g., side member 320 in fig. 7), thereby enhancing the rigidity of the antenna module 500. According to an embodiment, the conductive member 550 may be formed of a metal material such as stainless steel (SUS), copper (Cu), or aluminum (Al), thereby effectively transferring high temperature emitted from the antenna module 500 to the outside.

According to various embodiments, the conductive member 550 may include a first support 551 at least partially facing the PCB 590 (e.g., facing a side surface of the PCB 590), and a second support 552 extending from the first support 551 and bent to face another portion of the PCB 590 (e.g., the second surface 592). According to an embodiment, the conductive member 550 may include at least one

extension

5511 and 5512, the at least one

extension

5511 and 5512 extending from at least one end of the first support 551 and being fixed to a conductive portion (e.g., conductive portion 321 in fig. 7) of a side member (e.g., side member 320 in fig. 7) and/or to a conductive portion of a support member (e.g., first support member 3211 in fig. 7). In an embodiment, at least one

extension

5511 and 5512 may include a pair extending in opposite directions of the conductive member 550. In another embodiment, at least one

extension

5511 and 5512 may extend from the second support 552. Accordingly, the antenna module 500 may be supported by the first and

second support portions

551 and 552 of the conductive member 550 and fixed to the conductive portion (e.g., the conductive portion 321 in fig. 7) of the side member (e.g., the side member 320 in fig. 7) and/or to the conductive portion of the support member (e.g., the first support member 3211 in fig. 7) via the at least one

extension portions

5511 and 5512 by a fastening member such as a screw.

Referring to fig. 7, the electronic device 300 may include a housing 310, the housing 310 including a front plate 302 (e.g., a front cover) facing in a first direction (e.g., a Z direction), a rear plate 311 (e.g., a rear cover) facing in a direction opposite to the front plate 302 (e.g., the Z direction), and a side member 320 surrounding an inner space 3001 between the front plate 302 and the rear plate 311. According to an embodiment, the side member 320 may include a conductive portion 321 (e.g., a metal member) at least partially disposed, and a non-conductive portion 322 (e.g., a polymer member) insert-injected into the conductive portion 321. In another embodiment, the non-conductive portion 322 may be replaced with space or any other dielectric material. In yet another embodiment, non-conductive portion 322 may be structurally combined with conductive portion 321. According to an embodiment, the side member 320 may include a support member 3211 (e.g., the first support member 3211 in fig. 3C) that extends partially into the interior space 3001. The first support member 3211 may extend from the side member 320 into the inner space 3001 or may be formed by combining with the structure of the side member 320, according to an embodiment. According to an embodiment, the first support member 3211 may extend from the conductive portion 321. According to an embodiment, the support member 3211 may support at least a portion of the antenna module 500 disposed in the inner space 3001. According to an embodiment, the first support member 3211 may be provided to support at least a portion of the display 301. According to an embodiment, the display 301 may be arranged to be externally visible through at least a portion of the front plate 302. According to an embodiment, the display 301 may comprise a flexible display.

According to various embodiments, the antenna module 500 may be disposed in the inner space 3001 of the electronic device 300 in a direction perpendicular to the front plate 302. According to an embodiment, the antenna module 500 may be mounted such that the array antenna AR1 including conductive patches (e.g.,

conductive patches

510, 520, 530, and 540 in fig. 5A) faces the side member 320. For example, the antenna module 500 may be disposed such that the first surface 591 of the PCB590 faces the side member 320, and thus forms a beam pattern in a direction (represented by (1)) in which the side member 320 faces. According to an embodiment, at least a portion of the side member 320 facing by the antenna module 500 may be formed as a non-conductive portion 322 such that a beam pattern is formed in a direction (represented by (1)) in which the side member 320 faces. According to an embodiment, the electronic device 300 may include a device substrate 340 (e.g., PCB 340 in fig. 3C) disposed in the interior space 3001. According to an embodiment, although not shown, the antenna module 500 may be electrically connected to the device substrate 340 through an electrical connection member (e.g., an FPCB connector).

Fig. 8A shows only the conductive portion 321 when the rear plate 311 is viewed from above, while the non-conductive portion 322 is substantially omitted. The non-conductive portion 322 may be filled with an insulating member such as a polymer member.

Referring to fig. 8A, the side member 320 may include a non-conductive portion 322 (e.g., a polymer member) disposed to correspond to an area where a beam pattern of the antenna module 500 is formed. According to an embodiment, the non-conductive portion 322 may be insert-injected into the conductive portion 321. According to an embodiment, a boundary region between the non-conductive portion 322 and the conductive portion 321 may be disposed near the antenna module 500. According to an embodiment, the boundary region may have a bonding structure for not allowing the conductive portion 321 and the non-conductive portion 322 to be separated from each other due to an external impact after being bonded to each other. According to an embodiment, the boundary region may be placed at a position that does not overlap with the antenna module 500 when the side member 320 is viewed from the outside. For example, the conductive portion 321 may include a concave portion 3221 concavely formed in the boundary region. According to an embodiment, the non-conductive portion 322 may be formed as a part of the side member 320 of the electronic device 300 by being filled in the concave portion 3221 through insert injection.

According to various embodiments, when the recess portion 3221 is formed deeper than a predetermined depth, it is possible to generate an excitation current by means of a current trapping phenomenon of the recess portion 3221. The excitation current may degrade the radiation performance of the antenna module 500. Accordingly, the depth and/or shape of the recess 3221 may be an important parameter in determining the radiation performance of the antenna.

According to various embodiments, when the rear plate 311 is viewed from above as in fig. 3B, the concave portion 3221 may be formed such that its inclination angle (θ) does not exceed about 60 degrees. As shown, the inclination angle (θ) is an angle formed by the start point of the concave portion 3221 (i.e., the contact point with the side member 320) with respect to a virtual line (L) formed from both ends of the PCB toward the side member 320 (i.e., in a direction perpendicular to the side member 320 as represented by (1)). Further, in the case where the inclination angle (θ) does not exceed about 60 degrees, the concave portion 3221 may be formed at a certain depth and in a certain shape. The shape of the concave portion 3221 may vary, such as a curved shape or a flat shape. In a certain embodiment, the concave portion 3221 may be formed such that the inclination angle (θ) is not more than about 60 degrees with respect to a virtual line (L) formed from both ends of the array antenna AR1 toward the side member 320. According to an embodiment, the tilt angle (θ) of the concave portion 3221 may be in a range of about 30 degrees to about 60 degrees in consideration of the beam coverage of the array antenna AR1 (for example, ±30 degrees with respect to the virtual line (L)). According to an embodiment, the concave portion 3221 may be gradually narrowed or widened along the inclination angle (θ) with respect to the virtual line (L). According to an embodiment, the inner surface of the concave portion 3221 may be a curved plane having a specific radius of curvature.

According to the embodiment, the concave portion 3221 can prevent undesired separation in the horizontal direction (indicated by (1)) between the non-conductive portion 322 and the conductive portion 321 caused by external impact. According to an embodiment, the recess portion 3221 may have at least one slit 3221a further recessed from an inner surface of the recess portion 3221. According to an embodiment, the slit 3221a may be formed in a direction substantially parallel to the rear plate 311. According to an embodiment, the slit 3221a may increase a contact area between the conductive portion 321 and the non-conductive portion 322, thereby improving a coupling force. According to the embodiment, the slit 3221a can prevent undesired separation in the vertical direction (denoted by (3)) between the non-conductive portion 322 and the conductive portion 321 caused by external impact. According to an embodiment, the radiation characteristics of the antenna module 500 may be determined depending on the shape, depth, width and/or number of the slits 3221a.

According to various embodiments, the distance (d) between the recessed portion 3221 and the PCB 590 as shown may be determined so as not to exceed one quarter (i.e., 1/4 x lambda) of the wavelength in the maximum operating frequency wavelength carrier of the antenna module.

Referring to fig. 8B, the side member 320 may include at least one non-conductive region 322a disposed around the antenna module 500 in the conductive portion 321. According to an embodiment, at least one non-conductive region 322a may be disposed near both left and right ends of the PCB 590 of the antenna module 500 when the side member 320 is viewed from the outside. According to an embodiment, at least one non-conductive region 322a may be formed to at least partially intersect the side member 320 between the PCB 590 and the recess 3221. According to an embodiment, the at least one non-conductive region 322a may be formed by injecting the same or different material as that of the non-conductive portion 322. The at least one non-conductive region 322a may prevent a dual radiation phenomenon caused by the recess 3221 when a beam is emitted from the array antenna AR 1.

Fig. 9A and 9B are graphs showing radiation patterns and gains caused by horizontal polarization (H-pol) of an antenna module according to various embodiments of the present disclosure.

Referring to fig. 9A and 9B, the horizontal polarization 902 and the gain 904 of the antenna module 500 according to the embodiment of the present disclosure exhibit relatively excellent sensitivity characteristics and the gain is improved by about 2.5dB, compared to the horizontal polarization 901 and the gain 903 of a typical antenna module in which the concave portion has a tilt angle (θ) of more than about 60 degrees. The reason is that, as described above with reference to fig. 7 and 8A, a concave portion (e.g., concave portion 3221 in fig. 8A) is formed in a conductive portion (e.g., conductive portion 321 in fig. 8A) such that its inclination angle (θ) does not exceed about 60 degrees

Fig. 9C is a diagram illustrating a radiation pattern caused by vertical polarization (V-pol) of an antenna module according to an embodiment of the present disclosure.

Referring to fig. 9C, the vertical polarization 906 of the antenna module 500 according to the embodiment of the present disclosure exhibits relatively excellent sensitivity characteristics compared to the vertical polarization 905 of a typical antenna module in which the concave portion has an inclination angle (θ) of more than about 60 degrees. The reason is that, as described above with reference to fig. 7 and 8A, a concave portion (e.g., concave portion 3221 in fig. 8A) is formed in a conductive portion (e.g., conductive portion 321 in fig. 8A) such that its inclination angle (θ) does not exceed about 60 degrees

Fig. 10 is a cross-sectional view partially illustrating an electronic device viewed from line C-C' in fig. 3A according to an embodiment of the present disclosure.

In the following description of the electronic device 300, the same components as those described above are denoted by the same reference numerals, and detailed description thereof may be omitted.

According to various embodiments, in the antenna module 500 performing radiation in a direction (represented by (1)) facing the side member 320 from the internal space 3001 of the electronic device 300, a cancellation phenomenon (or a null phenomenon) may occur due to a phase difference between a beam pattern directly radiated from the antenna module 500 and a beam pattern reflected by the first support member 3211 disposed in the vicinity. This may degrade the radiation performance of the antenna module 500. Various embodiments of the present disclosure may have a configuration for preventing performance degradation of an antenna by structural change of the side member 320.

Referring to fig. 10 and 11A, the electronic device 300 may include a housing 310, the housing 310 including a front plate 302 (e.g., a front cover), a rear plate 311 (e.g., a rear cover) facing in a direction opposite to the front plate 302, and a side member 320 surrounding an inner space 3001 between the front plate 302 and the rear plate 311. According to an embodiment, the side member 320 may have a first surface 3201 facing the front plate 302 and a second surface 3202 facing in a direction opposite to the first surface 3201. According to an embodiment, the side member 320 may include a conductive portion 321 (e.g., a metal member) at least partially disposed and a first non-conductive portion 3224 (e.g., non-conductive portion 322 in fig. 7, e.g., a polymer member) insert-injected into the conductive portion 321. According to an embodiment, the side member 320 may include a support member 3211 (e.g., the first support member 3211 in fig. 3C) that extends at least partially into the interior space 3001.

According to various embodiments, the front plate 302 may be disposed on the first surface 3201 of the side member 320. According to an embodiment, the front plate 302 may be supported by at least a portion of the side member 320 including the first support member 3211. According to an embodiment, the electronic device 300 may include a display 301 disposed between a front plate 302 and a side member 320. According to an embodiment, the display 301 may include a polarizing layer (not shown), a display panel (not shown), at least one additional layer (e.g., a buffer layer and/or an embossed layer, not shown), and/or a conductive sheet 3011, which are sequentially stacked on the rear surface of the front plate 302. According to an embodiment, the display 301 may include a conductive sheet 3011 (e.g., cu sheet) provided on a rear surface of the display panel for noise shielding.

According to various embodiments, the antenna module 500 may be disposed in the inner space 3001 of the electronic device 300 in a direction perpendicular to the front plate 302 by the conductive member 550. According to an embodiment, the antenna module 500 may be mounted such that the array antenna AR1 including conductive patches (e.g.,

conductive patches

510, 520, 530, and 540 in fig. 5A) (e.g., a plurality of antenna elements) faces the side member 320. For example, the antenna module 500 may be disposed such that the first surface 591 of the PCB 590 faces the side member 320, and thus a beam pattern may be formed in a direction (represented by (1)) in which the side member 320 of the electronic device 300 faces. According to an embodiment, at least a portion of the side member 320 facing the antenna module 500 may be a first non-conductive portion 3224, the first non-conductive portion 3224 allowing a beam pattern to be formed in a direction (denoted by (1)) in which the side member 320 faces. According to an embodiment, the electronic device 300 may include a device substrate 340 (e.g., PCB 340 in fig. 3C) disposed in the interior space 3001. According to an embodiment, although not shown, the antenna module 500 may be electrically connected to the device substrate 340 through an electrical connector (e.g., an FPCB connector).

According to various embodiments, at least a portion of the conductive portion 321 of the side member 320 may be formed in a shape for supporting the display 301 and the front plate 302 on one side of the antenna module 500. Accordingly, the conductive portion 321 of the side member 320 may at least partially influence the beam pattern radiated in the direction of the front plate 302.

According to various embodiments, the side member 320 may further include at least one second non-conductive portion 3222, the at least one second non-conductive portion 3222 being disposed at a position corresponding to the array antenna AR1 of the antenna module 500 in the direction of the front plate 302. According to an embodiment, second non-conductive portion 3222 may be insert injected into conductive portion 321 along with first non-conductive portion 3224 (e.g., non-conductive portion 322 in fig. 7). In another embodiment, the first and second

non-conductive portions

3224 and 3222 may be formed of insulating materials having different characteristics (e.g., different dielectric constants). In still another embodiment, the second non-conductive portion 3222 may be an empty space in which no insulating material is disposed. The second non-conductive portion 3222 may be formed in the first surface 3201 (e.g., a flat portion) of the side member 320 and/or a curved surface extending laterally from the first surface 3201. According to an embodiment, at least one second non-conductive portion 3222 may be disposed at a position at least partially overlapping with the array antenna AR1 when the front plate 302 is viewed from above and/or when the side member 320 is viewed from the outside. According to an embodiment, the plurality of second non-conductive portions 3222 may be disposed at positions corresponding to respective conductive patches (e.g., the first conductive patch 510, the second conductive patch 520, the third conductive patch 530, and/or the fourth conductive patch 540 in fig. 5). Accordingly, the radiation length of the beam pattern radiated from the antenna module 500 in the direction of the side member 320 increases upward through the second non-conductive portion 3222 up to the conductive sheet 3011 of the display 301. This may help reduce the cancellation phenomenon compared to an antenna module disposed near the side member 320 without the second non-conductive portion 3222.

Referring to fig. 11B, the side member 320 may include a second non-conductive portion 3223 disposed in the first surface 3201 and/or a curved surface extending laterally from the first surface 3201. According to an embodiment, the second non-conductive portion 3223 may be formed to a size at least partially overlapping with a plurality of conductive patches (e.g., the first conductive patch 510, the second conductive patch 520, the third conductive patch 530, and/or the fourth conductive patch 540 in fig. 5) of the array antenna AR1 when the front plate 302 is viewed from above and/or when the side member 320 is viewed from the outside.

Fig. 12A and 12B are diagrams illustrating radiation patterns and gains caused by horizontal polarization (H-pol) of the antenna module of fig. 10 according to various embodiments of the present disclosure.

Referring to fig. 12A and 12B, the horizontal polarization 1202 and gain 1204 of an antenna module (e.g., the antenna module 500 in fig. 10) according to an embodiment of the present disclosure exhibit relatively excellent sensitivity characteristics and high gain, as compared to the horizontal polarization 1201 and gain 1203 of a typical antenna module in which the side member has a conductive portion. The reason is that, as described above, the side member (e.g., the side member 320 in fig. 10) of the antenna module according to the embodiment may include a second non-conductive portion (e.g., the second non-conductive portion 3222 in fig. 10) that is disposed at a position at least partially overlapping with the array antenna (e.g., the array antenna AR1 in fig. 10) when the front plate (e.g., the front plate 302 in fig. 10) is viewed from above and/or when the side member is viewed from the outside.

Referring to fig. 13, when an antenna module (e.g., the antenna module 500 of fig. 10) is operated through the side member 320 including a second non-conductive portion (e.g., the second non-conductive portion 3222 of fig. 10), a beam form of vertical polarization (V-pol) may be distorted due to a conductive sheet 3011 (e.g., a Cu sheet) disposed on a rear surface of the display 301 (e.g., a display panel). In order to suppress such beam form distortion of the vertical polarization, the electronic device 300 may include at least one conductive connection member 3212 provided between the conductive portion 321 of the side member 320 and the conductive sheet 3011 according to an embodiment of the present disclosure. According to an embodiment, the conductive connecting member 3212 may be provided in physical contact with both the conductive sheet 3011 and the conductive portion 321 of the side member 320. According to an embodiment, the conductive connection member 3212 may be formed of a metal member. Accordingly, the conductive sheet 3011 electrically connected to the conductive member 321 by the conductive connection member 3212 may be regarded as at least a portion of the conductive member 321 disposed in the vicinity of the antenna module 500.

According to various embodiments, the antenna module 500 may be configured to allow independent adjustment of the vertical polarization (V-pol) without substantially changing the horizontal polarization (H-pol) by movement of the conductive connecting member 3212 between the conductive sheet 3211 and the side member 320.

Fig. 14A is a radiation pattern view showing horizontal polarization (H-pol) of an antenna module before and after movement of a conductive connection member according to an embodiment of the present disclosure.

Referring to fig. 14A, even if the conductive connecting member 3212 moves between the conductive sheet 3011 and the side member 320, the horizontal polarization 1402 after the movement may appear to be in the same position as the horizontal polarization 1401 before the movement. This means that even when the conductive connecting member 3212 moves, the horizontal polarization (H-pol) may be substantially fixed.

Fig. 14B is a radiation pattern view showing vertical polarization (V-pol) of an antenna module before and after movement of a conductive connection member according to an embodiment of the present disclosure.

As shown in fig. 13, when the conductive connecting member 3212 moves from the first position (P1) between the conductive sheet 3011 and the side member 320 to the second position (P2), vertical polarization (V-pol) may be adjusted. Referring to fig. 14B, the vertical polarization 1403 in the case where the conductive connecting member 3212 of fig. 13 is not applied, the vertical polarization 1404 before the movement of the conductive connecting member 3212 of fig. 13, and the vertical polarization 1405 after the movement are all different from each other. This may mean that independent adjustment of the vertical polarization (V-pol) is possible depending on the presence and/or movement of the conductive connecting member 3212.

Referring to fig. 15, when an antenna module (e.g., the antenna module 500 in fig. 10) is operated by the side member 320 including the second non-conductive portion 3222 and the conductive connection member 3212 as described above in fig. 13 in the electronic apparatus, sensitivity may be degraded due to the conductive sheet 3011 (e.g., cu sheet) disposed on the rear surface of the display 301. To prevent such a decrease in sensitivity, the electronic device 300 may include, for example, a recess 3012, the recess 3012 being formed in at least a portion of the conductive sheet 3011. According to an embodiment, the recess 3012 may have a region overlapping the second non-conductive region 3222 when the front plate 302 is viewed from above. According to an embodiment, in the internal space 3001 of the electronic device 300, an antenna module (e.g., the antenna module 500 of fig. 10) may form a beam pattern in the direction of the display 301 through the second non-conductive portion 3222 formed in the side member 320 and the recess 3012 formed in the conductive sheet 3011.

Fig. 16 is a diagram illustrating radiation patterns caused by vertical polarization (V-pol) and horizontal polarization (H-pol) of an antenna module (e.g., antenna module 500 in fig. 10) provided in the electronic device of fig. 15 according to an embodiment of the present disclosure.

Referring to fig. 16, in an antenna module (e.g., the antenna module 500 in fig. 10), the vertical polarization 1602 in the case where a notch region (e.g., the notch 3012 in fig. 15) is applied to a conductive sheet (e.g., the conductive sheet 3011 in fig. 15) exhibits relatively excellent sensitivity characteristics as compared to the vertical polarization 1601 in the case where a notch region is not applied. Further, the horizontal polarization 1604 in the case where the notch region is applied to the conductive sheet exhibits relatively excellent sensitivity characteristics as compared to the horizontal polarization 1603 in the case where the notch region is not applied.

According to a certain embodiment, performance degradation of the antenna module 500 may be prevented by changing the structural shape of the inner surface of the conductive portion 321 of the side member 320.

Referring to fig. 17, the electronic device 300 may include a conductive portion 321, the conductive portion 321 being provided as a portion of the side member 320 near one upper side of the antenna module 500 placed in the inner space 3001, and at least partially supporting the front plate 302 and the display 301. According to an embodiment, in the side member 320, a typical shape of the conductive portion 321, such as a first level structure (e.g., a first level eave structure) or a step structure (e.g., a two-level eave structure), is changed to increase (delay 180 degrees) or decrease a phase difference between a radio wave directly radiated to the outside from the antenna module 500 and a radio wave reflected by an inner surface of the conductive portion 321. As a result, it is possible to prevent a cancellation phenomenon (or a null phenomenon) from occurring when radio waves having different phases are concentrated around one place.

According to various embodiments, the conductive portion 321 of the side member 320 may include a structural shape for not only distorting an effective direction of a radio wave radiated from the antenna module 500 and reflected by the conductive portion 321 but also increasing a path length. According to an embodiment, conductive portion 321 may include a first flat plane 3203, a curved plane 3204 extending laterally from first flat plane 3203, and a second flat plane 3205 extending from curved plane 3204. According to an embodiment, the first flat plane 3203 and/or the second flat plane 3205 may be formed substantially perpendicular to the first surface 591 of the PCB 590. In another embodiment, the first flat plane 3203 and/or the second flat plane 3205 may be formed to have various inclination angles that allow the radio waves (E) radiated from the antenna module 500 and reflected by the conductive portion 321 to be dispersed without being concentrated around one place. In yet another embodiment, curved plane 3204 may be formed with various radii of curvature that allow radio waves (E) radiated from antenna module 500 and reflected by conductive portion 321 to disperse without gathering around a place. In yet another embodiment, the conductive portion 321 may have, at least in part, a thickness (t) that is adjusted to increase the path length of the radio wave (E) radiated from the antenna module 500.

The electronic device 600 of fig. 18 may be at least partially similar to the electronic device 101 of fig. 1, the electronic device 300 of fig. 3A, or the electronic device 300 of fig. 10, or may include other embodiments of electronic devices.

Referring to fig. 18 and 19A, the electronic device 600 may include a housing 610 (e.g., the housing 310 of fig. 10), the housing 610 including a front cover 602 (e.g., the front plate 302 of fig. 10), a rear cover 611 (e.g., the rear plate 311 of fig. 10) facing in a direction opposite to the front cover 602, and a support member 620 (e.g., the side member 320 of fig. 10) surrounding an inner space 6001 between the front cover 602 and the rear cover 611. According to an embodiment, the electronic device 600 may include a device substrate 640 (e.g., PCB 340 in fig. 3C) disposed in the interior space 6001. According to an embodiment, the support member 620 may include: a conductive first portion 621 forming a side appearance of the electronic device 600 (e.g., side surface 310c in fig. 3A); a second portion 622 adjacent to the array antenna AR1, the front cover 602 and the conductive first portion 621 and having at least one opening 6221 filled with a non-conductive material; and a third portion 623 formed of a non-conductive material and adjacent to the array antenna AR1, the rear cover 611, and the conductive first portion 621. According to an embodiment, the support member 620 may be disposed between the front cover 602 and the rear cover 611, support the display 601 of the electronic device 600, and extend toward a side surface of the electronic device 600 to at least partially form a side appearance (e.g., the side surface 310c in fig. 3A) of the electronic device 600.

According to various embodiments, the front cover 602 may be provided by at least portions of the conductive first and

second portions

621 and 622 of the support member 620. According to an embodiment, the front cover 602 may be supported by an extension portion 6211 (e.g., the first support member 3211 in fig. 10) extending from the support member 620. According to an embodiment, the electronic device 600 may comprise a display 601, which display 601 is arranged between the front cover 602 and the support member 620 to be at least partially visible from the outside through the front cover 602. According to an embodiment, the display 601 may include a polarizing layer (not shown), a display panel (not shown), at least one additional layer (e.g., a buffer layer and/or an embossed layer, not shown), and/or a conductive sheet 6011 (e.g., the conductive sheet 3011 in fig. 10) stacked in order on the rear surface of the front cover 602. According to an embodiment, the display 601 may include a conductive sheet 6011 (e.g., cu sheet) provided on a rear surface of the display panel for noise shielding.

According to various embodiments, the antenna module 500 may be disposed in the inner space 6001 of the electronic device 600 in a direction perpendicular to the front cover 602 by the conductive member 550. According to an embodiment, the antenna module 500 may be mounted such that the array antenna AR1 including conductive patches (e.g.,

conductive patches

510, 520, 530, and 540 in fig. 5A) (e.g., a plurality of antenna elements) faces the support member 620. For example, the antenna module 500 may be disposed such that the first surface 591 of the PCB 590 faces the support member 620, and thus a beam pattern may be formed in a direction (represented by (1)) in which the support member 620 of the electronic device 600 faces.

According to various embodiments, the conductive first and

second portions

621 and 622 of the support member 620 may be formed in a shape for supporting the display 601 and the front cover 602 near one upper side of the antenna module 500. According to an embodiment, the third portion 623 of the support member 620 may be formed in a shape for supporting the rear cover 611 near one lower side of the antenna module 500. According to an embodiment, the conductive first portion 621 may be at least partially exposed to the outside of the electronic device 600, and the second and

third portions

622 and 623 may be hidden from the outside by the front and

rear covers

602 and 611. According to an embodiment, the beam formed by the array antenna AR1 may radiate to the outside through the at least one opening 6221 and the third portion 623.

According to various embodiments, at least one opening 6221 formed in the second portion 622 may be filled with a non-conductive material. For example, the non-conductive material of the second portion 622 and the non-conductive material of the third portion 623 may be insert injected with the conductive first portion 621. In some embodiment, the non-conductive material of the second portion 622 and the non-conductive material of the third portion 623 may be formed of insulating materials having the same or different characteristics (e.g., different dielectric constants). In some embodiment, the non-conductive material of the second portion 622 and the non-conductive material of the third portion 623 may be connected or spaced apart from each other in the interior space of the electronic device. In a certain embodiment, the at least one opening 6221 may be an empty space in which no insulating material is disposed. According to an embodiment, the second portion 622 may include a flat portion 6201 and a curved portion 6202 extending from the flat portion 6201 to the first portion 621. According to an embodiment, the at least one opening 6221 and/or the non-conductive material filled in the at least one opening 6221 may be formed in a shape including a flat portion 6201 and/or a curved portion 6202.

According to an embodiment, at least one opening 6221 may be provided at a position at least partially overlapping with the array antenna AR1 when the front cover 602 is viewed from above and/or when the support member 620 is viewed from the outside. According to an embodiment, the plurality of openings 6221 may be disposed at locations corresponding to respective conductive patches (e.g., the first conductive patch 510, the second conductive patch 520, the third conductive patch 530, and/or the fourth conductive patch 540 in fig. 5). Accordingly, the radiation length of the beam pattern radiated from the antenna module 500 in the direction of the support member 620 (represented by (1)) increases upward through the at least one opening 6221 until the conductive sheet 6011 of the display 601. This may help to reduce the cancellation phenomenon compared to an antenna module provided by the support member 620 having no opening 6221.

Referring to fig. 19B, the support member 620 may include a single opening 6221 disposed to overlap the array antenna AR 1. According to an embodiment, the opening 6221 may be formed to a size overlapping all of the plurality of conductive patches (e.g., the first conductive patch 510, the second conductive patch 520, the third conductive patch 530, and/or the fourth conductive patch 540 in fig. 5) when the front cover 602 is viewed from above and/or when the support member 620 is viewed from outside. Although not shown, the electronic device 600 may include an electrical connection member (e.g., the electrical connection member 3212 in fig. 20A) disposed between the conductive first portion 621 and the conductive sheet 6011 as shown in fig. 13. Furthermore, the radiation characteristic of the array antenna AR1 may be adjusted depending on the positional change of the conductive connection member.

Referring to fig. 20A and 20B, when a beam pattern of the array antenna AR1 is formed through at least one opening 6221 shown in fig. 18, sensitivity may be reduced due to a conductive sheet 6011 (e.g., cu sheet) disposed on a rear surface of the display 601. To prevent such a decrease in sensitivity, the electronic device 600 may include, for example, at least one

groove

6011a or 6011b formed in at least a portion of the conductive sheet 6011. According to an embodiment, at least one

groove

6011a or 6011b may be formed at a position overlapping with at least one opening 6221 when the front cover 602 is viewed from above. For example, at least one

slot

6011a or 6011b may be one slot 6011a or two slots 6011b having a length overlapping with a plurality of antenna elements (e.g., conductive patches) of the array antenna AR 1. In a certain embodiment, the at least one slot may be a plurality of slots corresponding to the plurality of antenna elements, respectively.

According to various embodiments of the present disclosure, an electronic device (e.g., electronic device 600 in fig. 18) may include a front cover (e.g., front cover 602 in fig. 18), a rear cover (e.g., rear cover 611 in fig. 18), an array antenna (e.g., array antenna AR1 in fig. 18), and a support member (e.g., support member 620 in fig. 18). The front cover and the rear cover may form part of the external appearance of the electronic device. The array antenna may include a plurality of antenna elements disposed between the front cover and the rear cover. The support member may be disposed between the front cover and the rear cover, support a display (e.g., display 601 in fig. 18) of the electronic device, and extend to a side surface of the electronic device to at least partially form a side appearance of the electronic device. The support member may include: a conductive first portion (e.g., conductive first portion 621 in fig. 18) that forms a side appearance of the electronic device; a second portion (e.g., second portion 622 in fig. 18) adjacent the array antenna, the front cover, and the conductive first portion and having at least one opening (e.g., opening 6221 in fig. 19A) filled with a non-conductive material; and a third portion (e.g., third portion 623 in fig. 18) formed of a non-conductive material and adjacent to the array antenna, the back cover, and the conductive first portion. The first portion may be exposed to the outside of the electronic device, and the second and third portions may be hidden by the front cover and the rear cover so as not to be exposed to the outside. The beam formed by the array antenna may radiate to the outside through the at least one opening and the third portion.

According to various embodiments, a display may include: a display panel disposed between the front cover and the rear cover and overlapping the at least one opening; and a conductive sheet (e.g., conductive sheet 6011 in fig. 18) disposed on the rear surface of the display panel so as not to overlap the at least one opening.

According to various embodiments, the conductive sheet may include at least one recess (e.g., recess 3012 in fig. 15) or at least one groove (e.g., groove 6011a in fig. 20A or groove 6011B in fig. 20B) formed in a region overlapping the at least one opening.

According to various embodiments, the electronic device may further include a conductive connecting member (e.g., conductive connecting member 3212 in fig. 20A) disposed between the conductive sheet and the conductive first portion.

According to various embodiments, the conductive connecting member may include a metal member electrically connecting the conductive first portion and the conductive sheet.

According to various embodiments, the location of the electrical connection of the conductive connection member between the conductive first portion and the conductive patch may determine the radiation characteristics of the array antenna.

According to various embodiments, the conductive first and/or second portions may be disposed to face the front cover, and the conductive first and/or second portions may have a flat portion (e.g., flat portion 6201 in fig. 19A) and a curved portion (e.g., curved portion 6202 in fig. 19A) extending from the flat portion. The display panel and the conductive sheet may be disposed adjacent to at least a portion of the curved portion from the flat portion.

According to various embodiments, the at least one opening may be at least partially disposed in the flat portion and the curved portion.

According to various embodiments, the second portion and the third portion may be at least partially arranged to be connected to each other.

According to various embodiments, the non-conductive material of the second portion and the non-conductive material of the third portion may have the same or different dielectric constants.

According to various embodiments, the at least one opening may be disposed at a position corresponding to the plurality of antenna elements.

According to various embodiments, the at least one opening may be formed in a number corresponding to the antenna elements.

According to various embodiments, the plurality of antenna elements may include a plurality of conductive patches disposed on the printed circuit board at regular intervals, and the at least one opening may be formed to have a size corresponding to all of the plurality of conductive patches.

According to various embodiments of the present disclosure, a portable communication device (e.g., electronic device 600 in fig. 18) may include a housing (e.g., housing 610 in fig. 18), a display (e.g., display 601 in fig. 18), and an antenna module (e.g., antenna module 500 in fig. 18). The housing may include a first member (e.g., front cover 602 in fig. 18) forming a front of the portable communication device, a second member (e.g., rear cover 611 in fig. 18) forming a rear of the portable communication device, and a third member (e.g., support member 620 in fig. 18) forming a side of the portable communication device. The third member may include a conductive member (e.g., the conductive first portion 621 in fig. 18) having an opening (e.g., the opening 6221 in fig. 19A) formed therein, and a non-conductive member (e.g., the second portion 622 in fig. 18) filled in the opening. One surface of the conductive member may be exposed to the outside of the portable communication device, and the non-conductive member may be disposed in the case so as not to be exposed to the outside. The display may be disposed under the first member and may be visually seen from the outside through the first member. The antenna module may be disposed between the display and the second member and include an antenna (e.g., array antenna AR1 in fig. 18) and a printed circuit board (e.g., PCB 590 in fig. 18). The antenna may be formed on a printed circuit board such that a signal radiated from the antenna is transmitted to the outside through the non-conductive member.

According to various embodiments, the display may include a display panel and a conductive sheet (e.g., conductive sheet 6011 in fig. 18) disposed on a rear surface of the display panel so as not to overlap the opening.

According to various embodiments, the conductive sheet may have at least one recess (e.g., recess 3012 in fig. 15) or at least one groove (e.g., groove 6011a in fig. 20A or groove 6011B in fig. 20B) formed in a region overlapping the opening.

According to various embodiments, the openings may include a first sub-opening (e.g., first opening 6221 in fig. 19A) and a second sub-opening (e.g., second opening 6221 in fig. 19A disposed adjacent to the first opening) spaced apart therefrom. The upper surface of the non-conductive member may include a first portion (e.g., second portion 622 in fig. 19A) exposed through the conductive member through the first sub-opening and a second portion (e.g., second portion 622 in fig. 19A) exposed through the conductive member through the second sub-opening.

According to various embodiments, the antenna may include a first antenna (e.g., first conductive patch 510 in fig. 5) and a second antenna (e.g., second conductive patch 520 in fig. 5) spaced apart from each other. The first portion may overlap the first antenna when viewed in a direction substantially perpendicular to the first portion of the upper surface, and the second portion may overlap the second antenna when viewed in a direction substantially perpendicular to the second portion of the upper surface.

According to various embodiments, the conductive member (e.g., conductive first portion 621 in fig. 19A) may overlap the antenna when viewed in a direction substantially perpendicular to the side-facing surface of the printed circuit board.

According to various embodiments, the conductive member may extend into the housing to support a lower surface of an antenna module (e.g., PCB 590 in fig. 18 including array antenna AR 1).

While the present disclosure has been particularly shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the subject matter defined by the appended claims.

While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, comprising:

a front cover and a rear cover forming part of the external appearance of the electronic device;

an array antenna including a plurality of antenna elements disposed between the front cover and the rear cover; and

A support member disposed between the front cover and the rear cover, wherein the support member is configured to:

display for supporting the electronic device

Extends to a side surface of the electronic device to at least partially form a side appearance of the electronic device,

the support member includes:

a conductive first portion forming the side appearance of the electronic device;

a second portion adjacent to the array antenna, the front cover, and the conductive first portion and including at least one opening filled with a non-conductive material; and

a third portion comprising a non-conductive material and disposed adjacent to the array antenna, the back cover and the conductive first portion,

wherein the conductive first portion is exposed to the outside of the electronic device, the second portion and the third portion are hidden from the outside by the front cover and the rear cover, and

wherein a beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.

2. The electronic device of claim 1, wherein the display comprises:

a display panel disposed between the front cover and the rear cover and overlapping the at least one opening; and

And a conductive sheet disposed on a rear surface of the display panel so as not to overlap the at least one opening.

3. The electronic device of claim 2, wherein the conductive sheet comprises at least one notch or slot formed in an area overlapping the at least one opening.

4. The electronic device of claim 2, wherein the electronic device further comprises a conductive connecting member disposed between the conductive sheet and the conductive first portion.

5. The electronic device of claim 4, wherein the conductive connection member comprises a metal member configured to electrically connect the conductive first portion and the conductive sheet.

6. The electronic device of claim 4, wherein the conductive connection member further comprises an electrical connection location disposed between the conductive first portion and the conductive patch and configured to determine a radiation characteristic of the array antenna.

7. The electronic device according to claim 2,

wherein at least one of the electrically conductive first portion or the second portion is disposed to face the front cover,

wherein at least one of the conductive first portion or the second portion includes a flat portion and a curved portion extending from the flat portion, and

Wherein the display panel and the conductive sheet are disposed adjacent to at least a portion of the curved portion extending from the flat portion.

8. The electronic device according to claim 2,

wherein the second portion includes a flat portion and a curved portion extending from the flat portion, an

Wherein the display panel and the conductive sheet are disposed adjacent to at least a portion of the curved portion extending from the flat portion,

wherein the at least one opening is at least partially disposed in the flat portion and the curved portion of the second portion.

9. The electronic device of claim 1, wherein the second portion and the third portion are at least partially disposed in connection with each other.

10. The electronic device of claim 1, wherein the non-conductive material of the second portion and the non-conductive material of the third portion have the same or different dielectric constants.

11. The electronic device of claim 1, wherein the at least one opening is disposed at a location corresponding to the plurality of antenna elements.

12. The electronic device of claim 11, wherein the at least one opening is formed in a number corresponding to a number of the plurality of antenna elements.

13. The electronic device according to claim 1,

wherein the plurality of antenna elements includes a plurality of conductive patches disposed on a printed circuit board at regular intervals, an

Wherein the at least one opening is formed in a size corresponding to all of the plurality of conductive patches.