CN112341964A - Dual-ion conductive adhesive - Google Patents
Dual-ion conductive adhesive Download PDFInfo
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- CN112341964A CN112341964A CN202011232149.4A CN202011232149A CN112341964A CN 112341964 A CN112341964 A CN 112341964A CN 202011232149 A CN202011232149 A CN 202011232149A CN 112341964 A CN112341964 A CN 112341964A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
- C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the field of conductive adhesives, and discloses a dual-ion conductive adhesive which comprises the following preparation raw materials in parts by weight: 2-8 parts of acidic polymerization monomer, 15-30 parts of double bond and amido, 1-10 parts of salt electrolyte, 0.1-5 parts of dissolving agent, 1-5 parts of alkali, 0.01-1 part of cross-linking agent, 0.5-5 parts of light curing agent, 0.01-0.08 part of polymerization inhibitor, 0.01-0.07 part of adhesive and 20-28 parts of water-retaining agent. In the present invention, since the preparation raw material contains the salt electrolyte in addition to the alkali, even if the addition amount of the alkali is restricted by the acidic polymerization monomer to restrict the conductivity of the conductive paste, the addition of the salt electrolyte increases the concentration of the conductive ion to improve the conductivity of the conductive paste. Therefore, based on the preparation raw materials and the preparation method, the double-ion conductive adhesive with good conductivity and small impedance can be obtained, and can be used for measuring the bioelectrical impedance of the human body.
Description
Technical Field
The invention relates to the field of conductive adhesives, in particular to a dual-ion conductive adhesive.
Background
The conductive adhesive is an adhesive with certain conductivity after being cured or dried, and can connect a plurality of conductive materials together to form an electric path between the connected materials. Therefore, when the conductive adhesive on the electrode plate is attached to the skin of a human body, the bioelectricity in the human body is transmitted to the conductive adhesive, then transmitted to the lead wire connected with the electrode core through the electrode core on the electrode plate, and collected by the monitor connected with the lead wire, so that the functional indexes of the human body are digitalized.
In the process of detecting the bioelectrical impedance of the human body, the bioelectrical impedance of the human body is weak, so that the requirement on the conductivity of the electrode plate is very high, the smaller the impedance of the electrode plate is, the better the impedance is, and the impedance of the electrode plate is usually required to be smaller than 100 ohms. However, the impedance of the electrode plate is usually over 100 ohms at present, which does not meet the requirements, and when the electrode plate is applied to the detection of the bioelectrical impedance of the human body, the accuracy of the detection result is influenced. Therefore, the development of an electrode plate with small impedance and capable of being used for detecting the bioelectrical impedance of the human body is a problem to be solved urgently.
Disclosure of Invention
The invention aims to provide a double-ion conductive adhesive to solve the problem that the existing electrode plate applied to the human body bioelectrical impedance detection has larger impedance.
In order to achieve the purpose, the invention adopts the following technical scheme: the double-ion conductive adhesive comprises the following preparation raw materials in parts by weight: 2-8 parts of acidic polymerization monomer, 15-30 parts of double bond and amido, 1-10 parts of salt electrolyte, 0.1-5 parts of dissolving agent, 1-5 parts of alkali, 0.01-1 part of cross-linking agent, 0.5-5 parts of light curing agent, 0.01-0.08 part of polymerization inhibitor, 0.01-0.07 part of adhesive and 20-28 parts of water-retaining agent.
The invention also provides a preparation method of the double-ion conductive adhesive, which comprises the following steps:
s1, mixing the polymerization inhibitor and the dissolving agent, and uniformly stirring to obtain a mixture A;
s2, dissolving the mixture A in the step S1 in water, and uniformly stirring to obtain a solution A; simultaneously, dissolving alkali in water, and uniformly stirring to obtain a solution B; dissolving the salt electrolyte in water, and uniformly stirring to obtain a solution C;
s3, adding an acidic polymerization monomer into the solution A obtained in the step S2, and uniformly stirring to obtain a solution D;
s4, pouring the solution B in the step S2 into the solution D in the step S3, immediately adding a double bond and an amide group, and uniformly stirring to obtain a solution E;
s5, sequentially and respectively adding the light curing agent, the cross-linking agent and the adhesive into the solution E in the step S4, adding one preparation raw material each time, stirring uniformly, and then adding the next preparation raw material to obtain a solution F;
s6, pouring the solution C in the step S2 into the solution F in the step S5, and uniformly stirring to obtain a solution G;
s7, adding a water-retaining agent into the solution G obtained in the step S6, and uniformly stirring to obtain a solution H;
s8, filtering the solution H obtained in the step S7 to obtain a filtrate;
s9, performing wind resistance and light irradiation on the filtrate obtained in the step S8, and curing to obtain the double-ion conductive adhesive.
Preferably, as an improvement, in step S8, when the wind illumination is blocked, the filtrate is placed into an illumination chamber, a light-transmitting thermal insulation board is horizontally arranged in the illumination chamber, the illumination chamber is divided into an upper chamber and a lower chamber which are independent from each other by the light-transmitting thermal insulation board, a light source is arranged in the upper chamber, and the filtrate is placed into the lower chamber.
Preferably, as a modification, in the step S8, the illumination time is 2-7S, and the illumination intensity is 50-110mW/cm2。
Preferably, as a modification, in the step S1, the step S2, the step S5, the step S6 and the step S7, the stirring speed is 60 to 80r/min, and the stirring time is 10 to 15S; in step S3, the stirring speed is 60-80r/min, and the stirring time is 50-60S; in step S4, the stirring speed is 120-150r/min, and the stirring time is 160-180S.
Preferably, as an improvement, the acidic polymeric monomer is one or two of propane sulfonic acid, acrylic acid and methyl propane sulfonic acid.
Preferably, as an improvement, the double bond and the amide group are one or two of dimethylacrylamide, acrylamide and methylolacrylamide.
Preferably, as an improvement, the alkali is one or two of sodium hydroxide and potassium hydroxide, and the salt electrolyte is one or two of potassium chloride and sodium chloride; the salt electrolyte is potassium chloride when the alkali is sodium hydroxide, and sodium chloride when the alkali is potassium hydroxide.
Preferably, as an improvement, the dissolving agent is ethanol or acetone, the crosslinking agent is one or two of diacetone acrylamide, N-methylol acrylamide and N, N' -methylene bisacrylamide, the light-curing agent is 2-hydroxy-2-methyl-1-phenyl-1-acetone or 1-hydroxycyclohexyl phenyl ketone or methyl benzoylformate, the polymerization inhibitor is p-benzoquinone or 4-methoxyphenol, and the adhesive is polyethylene glycol diacrylate or polyethylene glycol dimethacrylate.
Preferably, as an improvement, the water retention agent is one or two of glycerol, sodium polyacrylate and ammonium polyacrylate.
The principle and the advantages of the scheme are as follows: according to the scheme, based on the selected preparation raw materials and the sequence of the preparation steps, the double-ion conductive adhesive with good hydrophilicity and lipophilicity and good conductivity, stability and consistency can be obtained. Through the steps S1-S3, the corresponding preparation raw materials can be well dissolved; in step S4, the acidic polymeric monomer can form a neutral polymer by neutralization reaction with alkali, and simultaneously, it can form a stable group by copolymerization reaction with double bond and amide group; in step S5, a cross-linking agent is added to maintain a stable network structure of the polymer, and a light curing agent is added to perform a condensation polymerization reaction through subsequent ultraviolet light curing to form a conductive adhesive in a gel state, and an adhesive is added to maintain a certain viscosity of the solution; in the step S6, the salt electrolyte is added and is neutral, so that the passive conductivity of the alkaline raw material is compensated, the dual-ion conductivity is formed, and the concentration of the conductive ions is improved; in step S7, the water retention agent is added to keep the moisture in the subsequently prepared conductive adhesive, so as to prevent the conductive adhesive from shortening the service life due to the volatilization of the moisture. In conclusion, the scheme is based on the preparation raw materials and the preparation steps, the double-ion conductive adhesive with good conductivity can be obtained, the impedance of the double-ion conductive adhesive is less than 50 ohms, the double-ion conductive adhesive can be used for detecting the bioelectrical impedance of the human body, and the accuracy of the bioelectrical impedance detection result of the human body is greatly improved.
Besides, the conductive adhesive has good conductivity, and can achieve hydrophilic and oleophilic effects due to the hydrophilic group hydroxyl and amido, and the oleophilic group methylene and alkyl. Therefore, the double-ion conductive adhesive in the scheme has hydrophilicity and lipophilicity, the impedance is less than 50 ohms, the conductivity is good, the double-ion conductive adhesive can be higher in attaching and infiltrating degree with dry skin and higher in attaching and infiltrating degree with oily skin, the same electrode plate is suitable for both dry skin and oily skin, different electrode plates do not need to be replaced according to the characteristics of human skin, and the use is convenient.
In the scheme, the filtrate is placed in the lower cavity of the illumination chamber, the light-transmitting heat-insulating plate is used for insulating heat, the temperature in the lower cavity cannot rise, and the lower cavity is prevented from being subjected to air draft and heat dissipation, so that the filtrate is ensured to be cured under the condition of no air flow, the phenomenon that the obtained double-ion conductive adhesive is unqualified due to low polymerization degree of the filtrate is avoided, and the curing quality is improved.
In the scheme, in step S8, the illumination time is 2-7S, and the illumination intensity is 50-110mW/cm2The above-mentioned light irradiation parameters are preferred because the filtrate polymerizes well.
In the scheme, the salt electrolyte is defined to be potassium chloride when the alkali is sodium hydroxide, and the salt electrolyte is defined to be sodium chloride when the alkali is potassium hydroxide, so that the double-ion conductive adhesive can ensure that two metal cations, chloride ions and hydroxide ions are contained, and the conductivity of the double-ion conductive adhesive is ensured.
In the scheme, according to the characteristics and the reaction speed of the preparation raw materials, the stirring speed in the step S1, the step S2, the step S5, the step S6 and the step S7 is 60-80r/min, the stirring time is 10-15S, the stirring speed in the step S3 is 60-80r/min, the stirring time is 50-60S, the stirring speed in the step S4 is 120-150r/min, and the stirring time is 160-180S, so that the preparation raw materials can be mixed, reacted and dissolved in the optimal time.
Detailed Description
The following is further detailed by way of specific embodiments:
examples 1 to 5 are examples of the present invention, and selection of raw materials, amounts added, and curing parameters for the preparation in each example are shown in table 1. In table 1, the unit of the addition amount of each raw material for preparation is part, for example, "propanesulfonic acid/2" means that the acidic polymerization monomer is propanesulfonic acid, and the addition amount is 2 parts; "propanesulfonic acid + acrylic acid/3.4 + 3.4" means that the acidic monomer polymer is a mixture of 3.4 parts propanesulfonic acid and 3.4 parts acrylic acid.
TABLE 1
The preparation method of the dual-ion conductive adhesive is described in detail by taking the embodiment 1 as an example, and comprises the following steps:
step one, mixing 0.01 part of p-benzoquinone with 0.1 part of ethanol, and uniformly stirring to obtain a mixture A, wherein the stirring speed is 60-80r/min, and the stirring time is 10-15 s.
And step two, dividing 45.17 parts of water into three groups, namely group A water, group B water and group C water, wherein the group A water, the group B water and the group C water are 15 parts, 15 parts and 15.17 parts respectively. And (3) pouring the mixture A in the step one into the group A water, and uniformly stirring at the stirring speed of 60-80r/min for 10-15s to obtain a solution A. And simultaneously, 1.2 parts of sodium hydroxide is poured into the group B water, and the solution B is obtained by uniformly stirring at the stirring speed of 60-80r/min for 10-15 s. And (3) pouring 1 part of potassium chloride into the group C water, and uniformly stirring at the stirring speed of 60-80r/min for 10-15s to obtain a solution C.
And step three, adding 2 parts of propanesulfonic acid into the solution A obtained in the step two, and uniformly stirring at the stirring speed of 60-80r/min for 50-60s to obtain a solution D.
Step four, pouring the solution B in the step two into the solution D in the step three, immediately adding 30 parts of acrylamide, and uniformly stirring at the stirring speed of 120-180 r/min for 160-180s to obtain a solution E.
And step five, sequentially and respectively adding 0.5 part of 2-hydroxy-2-methyl-1-phenyl-1-acetone, 0.01 part of diacetone acrylamide and 0.01 part of polyethylene glycol diacrylate into the solution E in the step four, specifically, adding 0.5 part of 2-hydroxy-2-methyl-1-phenyl-1-acetone into the solution E in the step four, stirring for 10-15s at 60-80r/min, then adding 0.01 part of diacetone acrylamide, stirring for 10-15s at 60-80r/min, then adding 0.01 part of polyethylene glycol diacrylate, and stirring for 10-15s at 60-80r/min to obtain a solution F.
And step six, pouring the solution C in the step two into the solution F in the step five, and uniformly stirring at the stirring speed of 60-80r/min for 10-15s to obtain a solution G.
And step seven, adding 20 parts of glycerol into the solution G obtained in the step six, and uniformly stirring at the stirring speed of 60-80r/min for 10-15s to obtain a solution H.
And step eight, filtering the solution H in the step seven to obtain a filtrate.
And step nine, performing wind resistance illumination on the filtrate obtained in the step eight, and curing to obtain the double-ion conductive adhesive. When the wind irradiation is blocked, the filtrate is put into an irradiation chamber, which is a curing chamber of an ultraviolet curing machine (model RAY600) in this embodiment. The illumination chamber is fixedly connected with a light-transmitting heat-insulating plate which is horizontally arranged, in the embodiment, the light-transmitting heat-insulating plate is light-transmitting and heat-insulatingThe plate is a quartz glass plate. The light-transmitting heat-insulating plate divides the illumination chamber into an upper chamber and a lower chamber which are independent, and filtrate is placed into the lower chamber for illumination. The illumination time is 2s, and the illumination intensity is 110mW/cm2And obtaining the double-ion conductive adhesive.
Specifically, in the embodiment, the stirring speed in the first step, the second step, the fifth step, the sixth step and the seventh step is 60r/min, and the stirring time is 15 s; the stirring speed in the third step is 60r/min, and the stirring time is 60 s; the stirring speed in the fourth step is 120r/min, and the stirring time is 180 s. And in the third step to the seventh step, the pH value of the solution is monitored, so that the pH value of the solution is kept between 4.0 and 7.5.
Three commercially available electrode sheets (with conductive adhesive) were purchased as comparative examples, comparative example 1, comparative example 2 and comparative example 3.
Comparative example 4
In this comparative example, the following method was used to prepare the conductive adhesive: adding 15.4 parts of acrylic acid, 19.7 parts of potassium hydroxide, 0.8 part of a light curing agent, 43.7 parts of glycerol, 0.7 part of a cross-linking agent, 15.4 parts of water and 4.3 parts of a tackifier into a stirring tank in sequence, and then uniformly stirring at the stirring speed of 110r/min for 5 min. In this comparative example, the curing agent was 2-hydroxy-2-methyl-1-phenyl-1-propanone, the cross-linking agent was tripropylene glycol diacrylate, and the tackifier was aqueous tackifying emulsion 780.
After stirring, the mixture is cured by illumination to form the conductive adhesive. In the curing process, the illumination time is 3s, and the illumination intensity is 100mW/cm2。
The performance of the double-ion conductive adhesive prepared in the examples 1 to 5 and the conductive adhesive prepared in the comparative examples 1 to 4 is detected, and the detection indexes comprise: hydrophilicity, lipophilicity, and conductivity were measured in triplicate for each test index for each example or comparative example, and the results are shown in table 2.
The hydrophilicity is measured by placing the double-ion conductive adhesive prepared in each embodiment and the conductive adhesive in each proportion in purified water respectively, placing for 24 hours, recording the weight after absorbing water, and calculating the water absorption, wherein the water absorption is calculated by the following formula: the water absorption rate is the weight of absorbed water/weight of pre-water absorption gel, and the weight of absorbed water is the weight of post-water absorption gel-weight of pre-water absorption gel.
The lipophilicity is measured by respectively placing the double-ion conductive adhesive prepared in each embodiment and the conductive adhesive in each proportion in an oil phase, namely triolein, and after placing for 24 hours, recording the weight after absorbing the oil, and calculating the oil absorption rate, wherein the calculation formula of the oil absorption rate is as follows: the oil absorption rate is the weight of absorbed oil/weight of pre-oil absorption gel, and the weight of absorbed oil is the weight of post-oil absorption gel-weight of pre-oil absorption gel.
The conductivity was measured by LCR tester (model MT4080A) at 1V at 1KHz frequency. Before the determination, the double-ion conductive adhesive in each embodiment is used for preparing an electrode plate with the same specification as that of the electrode plate in the comparative example; during measurement, two electrode slice pairs with the same conductive adhesive are attached together to form an object to be measured, electrode cores (electrode core female buttons) are arranged on two sides of the object to be measured, and the LCR tester is connected with the electrode cores to perform impedance test.
TABLE 2
As is evident from table 2: 1. the water absorption rate and the oil absorption rate of the dual-ion conductive adhesive in each example are respectively higher than those of the conductive adhesive in the comparative example, so that the hydrophilicity and lipophilicity of the dual-ion conductive adhesive in each example are better than those of the conductive adhesive in each comparative example. In other words, the double-ion conductive adhesive of the present invention has good hydrophilicity and lipophilicity, and can be applied to dry skin and oily skin.
2. The impedance in the examples is obviously much lower than that in the comparative examples, which shows that the conductivity of the electrode sheet in the examples is better than that of the electrode sheet in the comparative examples. The impedance of the electrode sheets in examples 1 to 5 is less than 50 Ω, the impedance of the electrode sheets in comparative examples 1 to 4 is greater than 100 Ω, and the impedance of the electrode sheet in comparative example 1 is even greater than 200 Ω. Although the impedance of the two electrode sheets is measured in the present invention, the impedance is usually only 0.8 to 2.0 ohms in view of the very good conductivity of the electrode core in the electrode sheet, and therefore, the impedance in the examples and comparative examples can be regarded as: the impedance of the two pieces of the dual-ion conductive adhesive and the two pieces of the conductive adhesive, namely, the impedance of the dual-ion conductive adhesive in the embodiment is far lower than that of the conductive adhesive in the comparative example, and the conductivity of the dual-ion conductive adhesive in the embodiment is far better than that of the conductive adhesive in the comparative example. Therefore, the impedance of the double-ion conductive adhesive is less than 50 omega, the conductivity is excellent, the double-ion conductive adhesive can be used for detecting the bioelectrical impedance of the human body, and the accuracy of the bioelectrical impedance detection result of the human body is greatly improved.
Comparing example 2 with comparative example 4, in the preparation of raw materials, hydroxymethyl acrylamide, sodium chloride, acetone and 4-methoxyphenol are added in example 2; the crosslinker used in example 2 was N-methylolacrylamide, the crosslinker used in comparative example 4 was tripropylene glycol diacrylate; the adhesive was selected in example 2 and the tackifier was selected in comparative example 4. In example 2, the addition order of each raw material for preparation was different from that in comparative example 4, and the stirring speed and time were also different. That is, the example 2 and the comparative example 4 are different in the selection of the preparation raw materials, the addition order of the preparation raw materials, and the preparation method, and thus, the hydrophilicity and lipophilicity of the diionic conductive paste in the example 2 are better than those of the conductive paste in the comparative example 4, and the impedance of the diionic conductive paste in the example 2 is also significantly lower than that of the conductive paste in the comparative example 4.
In conclusion, the double-ion conductive adhesive disclosed by the invention not only has hydrophily and lipophilicity, but also has good conductivity, and the impedance of the double-ion conductive adhesive is less than 50 omega, so that the double-ion conductive adhesive is small in impedance, can be used for detecting the bioelectrical impedance of a human body, and ensures the accuracy of a detection result.
The foregoing is merely an example of the present invention and common general knowledge in the art of designing and/or characterizing particular aspects and/or features is not described in any greater detail herein. It should be noted that, for those skilled in the art, without departing from the technical solution of the present invention, several variations and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.
Claims (10)
1. A kind of double ion conductive glue, its characteristic lies in: the preparation method comprises the following preparation raw materials in parts by weight: 2-8 parts of acidic polymerization monomer, 15-30 parts of double bond and amido, 1-10 parts of salt electrolyte, 0.1-5 parts of dissolving agent, 1-5 parts of alkali, 0.01-1 part of cross-linking agent, 0.5-5 parts of light curing agent, 0.01-0.08 part of polymerization inhibitor, 0.01-0.07 part of adhesive and 20-28 parts of water-retaining agent.
2. The bi-ionic conductive adhesive of claim 1, wherein: the preparation method of the double-ion conductive adhesive comprises the following steps:
s1, mixing the polymerization inhibitor and the dissolving agent, and uniformly stirring to obtain a mixture A;
s2, dissolving the mixture A in the step S1 in water, and uniformly stirring to obtain a solution A; simultaneously, dissolving alkali in water, and uniformly stirring to obtain a solution B; dissolving the salt electrolyte in water, and uniformly stirring to obtain a solution C;
s3, adding an acidic polymerization monomer into the solution A obtained in the step S2, and uniformly stirring to obtain a solution D;
s4, pouring the solution B in the step S2 into the solution D in the step S3, immediately adding a double bond and an amide group, and uniformly stirring to obtain a solution E;
s5, sequentially and respectively adding the light curing agent, the cross-linking agent and the adhesive into the solution E in the step S4, adding one preparation raw material each time, stirring uniformly, and then adding the next preparation raw material to obtain a solution F;
s6, pouring the solution C in the step S2 into the solution F in the step S5, and uniformly stirring to obtain a solution G;
s7, adding a water-retaining agent into the solution G obtained in the step S6, and uniformly stirring to obtain a solution H;
s8, filtering the solution H obtained in the step S7 to obtain a filtrate;
s9, performing wind resistance and light irradiation on the filtrate obtained in the step S8, and curing to obtain the double-ion conductive adhesive.
3. The bi-ionic conductive adhesive of claim 2, wherein: in the step S8, when the wind and light are blocked, the filtrate is placed into a light chamber, a light-transmitting heat-insulating plate is horizontally arranged in the light chamber, the light-transmitting heat-insulating plate divides the light chamber into an upper chamber and a lower chamber which are independent, a light source is arranged in the upper chamber, and the filtrate is placed into the lower chamber.
4. The bi-ionic conductive adhesive of claim 3, wherein: in the step S8, the illumination time is 2-7S, and the illumination intensity is 50-110mW/cm2。
5. The bi-ionic conductive adhesive of claim 4, wherein: in the step S1, the step S2, the step S5, the step S6 and the step S7, the stirring speed is 60-80r/min, and the stirring time is 10-15S; in step S3, the stirring speed is 60-80r/min, and the stirring time is 50-60S; in step S4, the stirring speed is 120-150r/min, and the stirring time is 160-180S.
6. The bi-ionic conductive adhesive of claim 1, wherein: the acidic polymerization monomer is one or two of propanesulfonic acid, acrylic acid and methyl propanesulfonic acid.
7. The bi-ionic conductive adhesive of claim 6, wherein: the double bond and the amide group are one or two of dimethylacrylamide, acrylamide and hydroxymethyl acrylamide.
8. The bi-ionic conductive adhesive of claim 7, wherein: the alkali is one or two of sodium hydroxide and potassium hydroxide, and the salt electrolyte is one or two of potassium chloride and sodium chloride; the salt electrolyte is potassium chloride when the alkali is sodium hydroxide, and sodium chloride when the alkali is potassium hydroxide.
9. The bi-ionic conductive adhesive of claim 8, wherein: the light-cured resin comprises a solvent, a crosslinking agent, a light-curing agent, a polymerization inhibitor and an adhesive, wherein the solvent is ethanol or acetone, the crosslinking agent is one or two of diacetone acrylamide, N-hydroxymethyl acrylamide and N, N' -methylene bisacrylamide, the light-curing agent is 2-hydroxy-2-methyl-1-phenyl-1-acetone or 1-hydroxycyclohexyl phenyl ketone or methyl benzoylformate, the polymerization inhibitor is p-benzoquinone or 4-methoxyphenol, and the adhesive is polyethylene glycol diacrylate or polyethylene glycol dimethacrylate.
10. The bi-ionic conductive adhesive of claim 9, wherein: the water-retaining agent is one or two of glycerol, sodium polyacrylate and ammonium polyacrylate.
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| US20020015689A1 (en) * | 1999-02-02 | 2002-02-07 | Munro Hugh Semple | Bioadhesive compositions |
| CN109370471A (en) * | 2018-10-26 | 2019-02-22 | 江门市新会区中盛生物科技有限公司 | A kind of medical conducting resinl and preparation method thereof |
| CN110511690A (en) * | 2019-09-06 | 2019-11-29 | 深圳市同源生物医疗科技有限公司 | A kind of electrode slice of high conductivity and its preparation method and application |
| CN111057186A (en) * | 2019-12-04 | 2020-04-24 | 广东省医疗器械研究所 | Photo-curing cross-linking conductive hydrogel and preparation method and application thereof |
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2020
- 2020-11-06 CN CN202011232149.4A patent/CN112341964A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020015689A1 (en) * | 1999-02-02 | 2002-02-07 | Munro Hugh Semple | Bioadhesive compositions |
| CN109370471A (en) * | 2018-10-26 | 2019-02-22 | 江门市新会区中盛生物科技有限公司 | A kind of medical conducting resinl and preparation method thereof |
| CN110511690A (en) * | 2019-09-06 | 2019-11-29 | 深圳市同源生物医疗科技有限公司 | A kind of electrode slice of high conductivity and its preparation method and application |
| CN111057186A (en) * | 2019-12-04 | 2020-04-24 | 广东省医疗器械研究所 | Photo-curing cross-linking conductive hydrogel and preparation method and application thereof |
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