CN112333590A - Earphone and head-mounted device - Google Patents
Earphone and head-mounted device Download PDFInfo
- Publication number
- CN112333590A CN112333590A CN202011159945.XA CN202011159945A CN112333590A CN 112333590 A CN112333590 A CN 112333590A CN 202011159945 A CN202011159945 A CN 202011159945A CN 112333590 A CN112333590 A CN 112333590A
- Authority
- CN
- China
- Prior art keywords
- mounting
- cavity
- opening
- earphone
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Headphones And Earphones (AREA)
Abstract
The invention discloses an earphone and a head-mounted device, wherein the earphone comprises a shell, a circuit board, a loudspeaker assembly, an interface assembly and a mounting seat, and the shell is provided with a mounting cavity and a first opening communicated with the mounting cavity. The circuit board is arranged in the mounting cavity. The loudspeaker assembly is arranged in the mounting cavity and is electrically connected with the circuit board. The interface assembly is arranged in the installation cavity and electrically connected with the circuit board, and the interface assembly penetrates through the shell and is electrically connected with the head-mounted equipment. The mounting seat is inserted from the first opening and is located the installation cavity, and with the casing joint, the circuit board, the speaker subassembly with the interface module all install in the mounting seat. The technical scheme of the invention can facilitate assembly and improve assembly efficiency.
Description
Technical Field
The invention relates to the technical field of wearable equipment, in particular to an earphone and head-mounted equipment.
Background
With the development and progress of technologies, wearable intelligent terminals (such as head-mounted devices) are more and more widely applied, for example, VR glasses (virtual reality glasses), AR glasses (augmented reality glasses), and the like. In the head-mounted device, be provided with the earphone structure that is used for playing sound usually, and present earphone structure when the equipment, needs a plurality of locking screws to fix usually between each spare part, leads to the equipment process comparatively loaded down with trivial details, and assembly efficiency is low.
Disclosure of Invention
The invention mainly aims to provide an earphone, which is convenient to assemble and improves the assembly efficiency.
In order to achieve the above object, the present invention provides a headset, including:
the shell is provided with a mounting cavity and a first opening communicated with the mounting cavity;
the circuit board is arranged in the mounting cavity;
the loudspeaker assembly is arranged in the mounting cavity and is electrically connected with the circuit board;
the interface assembly is arranged in the mounting cavity and electrically connected with the circuit board, penetrates through the shell and is used for being electrically connected with the head-mounted equipment; and the number of the first and second groups,
the mounting seat, the mounting seat certainly first opening is inserted and is located the installation cavity, and with the casing joint, the circuit board the speaker subassembly with interface module all install in the mounting seat.
Optionally, the chamber wall of installation cavity is equipped with spacing protruding muscle, spacing protruding muscle is followed the mount pad inserts the direction of insertion of installation cavity extends, the one end of mount pad is equipped with spacing portion, and the other end is equipped with first joint portion, spacing protruding muscle along its extending direction's one end with first joint portion joint, the other end with spacing portion butt.
Optionally, the mount pad is equipped with dodges the recess, dodge the recess and follow the mount pad inserts the direction of insertion extension of installation cavity, spacing protruding muscle is located dodge in the recess, dodge the recess have towards the groove side wall of first joint portion, the groove side wall forms spacing portion.
Optionally, the casing is further provided with a second opening, the second opening is opposite to the first opening, and the earphone further comprises an end cover, wherein the end cover covers the second opening.
Optionally, a second clamping portion is further arranged on the mounting seat, and the end cover is clamped with the second clamping portion.
Optionally, the first clamping portion at least comprises a group of clamping structures, each clamping structure comprises two first buckles respectively arranged on two opposite sides of the mounting seat, and the cavity wall of the mounting cavity is provided with one limiting convex rib corresponding to each first buckle;
the end cover is provided with a third clamping portion extending towards the inside of the installation cavity, the third clamping portion is clamped with the second clamping portion, and the third clamping portion is abutted to two first buckles of the clamping structure.
Optionally, the second clamping portion includes two clamping protrusions arranged at intervals along a first direction, and the first direction is perpendicular to the arrangement direction of the two first buckles in the same group of clamping structures;
third joint portion includes two second buckles, two the second buckle with two the protruding one-to-one joint of joint, one the second buckle butt is in a set of two of joint structure between the first buckle.
Optionally, the mounting seat includes a mounting main body and a splice plate, the mounting main body has a mounting groove, the interface module is at least partially mounted in the mounting groove, and the splice plate covers the mounting groove to fix the interface module in the mounting groove.
Optionally, at least part of the first clamping portion is disposed on the splice plate.
Optionally, the interface assembly is provided with a limiting projection, the splice plate is provided with a limiting hole, and when the splice plate covers the mounting groove, the limiting projection extends into the limiting hole; and/or the mounting main body is provided with an inserting hole, the splicing plate is provided with an inserting protrusion, and the inserting protrusion is matched with the inserting hole in an inserting manner.
The invention further provides a head-mounted device which comprises a main body and the earphone, wherein the earphone is mounted on the main body.
Optionally, the head-mounted device is VR glasses or AR glasses.
According to the technical scheme, the mounting cavity and the first opening communicated with the mounting cavity are formed in the shell, and the mounting seat can be inserted into the mounting cavity from the first opening and is clamped with the shell. So when assembling the earphone, can all install circuit board, speaker subassembly and interface module in the mount pad earlier, insert the casing with the mount pad again to with the casing joint, can realize the assembly of circuit board, speaker subassembly, interface module, mount pad and casing. So reduced the process of beating the screw, simplified the assembly process, still reduced the assembly process of circuit board, speaker subassembly and interface module isotructure and casing, greatly made things convenient for the equipment of earphone, can promote assembly efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a headset according to the present invention;
FIG. 2 is a schematic structural view of the housing of FIG. 1;
FIG. 3 is a schematic view of the earphone of FIG. 1 with the housing removed;
FIG. 4 is an exploded view of the earphone of FIG. 1 with the housing removed;
FIG. 5 is a schematic view of the structure of the earphone housing of FIG. 1;
fig. 6 is a schematic structural diagram of a headset according to an embodiment of the present invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides an earphone, which is used for a head-mounted device, wherein the head-mounted device can be AR glasses (AR: Augmented Reality), VR glasses (VR: Virtual Reality), MR glasses (MR: Mix Reality), intelligent glasses and the like.
In an embodiment of the present invention, referring to fig. 1 to fig. 3, the earphone 100 includes a housing 10, a circuit board, a speaker assembly 50 and an interface assembly 40, the housing 10 has a mounting cavity 11 and a first opening 12 communicating with the mounting cavity 11, and the circuit board is disposed in the mounting cavity 11. The speaker assembly 50 is disposed in the mounting chamber 11 and electrically connected to the circuit board. The interface assembly 40 is disposed in the mounting cavity 11 and electrically connected to the circuit board, and the interface assembly 40 is disposed through the housing 10 to electrically connect to the head-mounted device 70 (see fig. 6). The mounting base 20 is inserted into the mounting cavity 11 from the first opening 12 and clamped with the housing 10, and the circuit board, the speaker assembly 50 and the interface assembly 40 are all mounted on the mounting base 20.
In this embodiment, the housing 10 is elongated, the first opening 12 is disposed on an end surface of one end of the housing 10, one end of the mounting base 20 is inserted into the mounting cavity 11 from the first opening 12, and the other end cap 30 closes the first opening 12. The circuit board, speaker assembly 50 and interface assembly 40 are all mounted to the portion of the mounting base 20 that extends into the mounting cavity 11, and the interface assembly 40 is able to extend from the housing 10. The casing 10 is provided with a sound outlet 15, the sound outlet 15 is communicated with the mounting cavity 11, and the speaker assembly 50 is arranged corresponding to the sound outlet 15. During installation, the circuit board, the speaker assembly 50 and the interface assembly 40 may be installed on the installation base 20, and then the installation base 20 is inserted into the housing 10 and is clamped with the housing 10, so that the circuit board, the speaker assembly 50, the interface assembly 40, the installation base 20 and the housing 10 can be assembled. The portion of the mounting seat 20 covering the first opening 12 may be located in the first opening 12, or may cover an end surface of the housing 10 to cover the first opening 12. The sound outlet 15 may be provided in a portion of the mount 20 that covers the first opening 12.
According to the technical scheme, the shell 10 is provided with the installation cavity 11 and the first opening 12 communicated with the installation cavity 11, and the installation seat 20 can be inserted into the installation cavity 11 from the first opening 12 and is clamped with the shell 10. Therefore, when the earphone 100 is assembled, the circuit board, the speaker assembly 50 and the interface assembly 40 can be firstly installed on the installation seat 20, then the installation seat 20 is inserted into the casing 10 and is clamped with the casing 10, and then the assembly of the circuit board, the speaker assembly 50, the interface assembly 40, the installation seat 20 and the casing 10 can be realized. Therefore, the process of screwing is reduced, the assembly process is simplified, the assembly processes of the structures of the circuit board, the loudspeaker assembly 50, the interface assembly 40 and the like and the shell 10 are also reduced, the earphone 100 is greatly convenient to assemble, and the assembly efficiency can be improved.
Referring to fig. 2 and fig. 3, in an embodiment, a cavity wall of the mounting cavity 11 is provided with a limiting convex rib 14, the limiting convex rib 14 extends along an insertion direction of the mounting seat 20 into the mounting cavity 11, one end of the mounting seat 20 is provided with a limiting portion 26, the other end is provided with a first clamping portion 21, one end of the limiting convex rib 14 along the extension direction thereof is clamped with the first clamping portion 21, and the other end is abutted against the limiting portion 26. Particularly, spacing protruding muscle 14 extends towards the direction of keeping away from first opening 12, and first joint portion 21 and the one end joint of keeping away from first opening 12 of spacing protruding muscle 14, first joint portion 21 joint deviates from the terminal surface of first opening 12 in spacing protruding muscle 14 promptly to can restrict mount pad 20 and move outward towards first opening 12. And when first joint portion 21 and spacing protruding muscle 14 kept away from the one end joint of first opening 12, spacing portion 26 and spacing protruding muscle 14 keep away from the one end butt of first joint portion 21 to restriction mount pad 20 moves towards installation cavity 11. The mounting seat 20 can be arranged, the stability of the mounting seat 20 in the shell 10 can be improved, and the possibility of looseness of the mounting seat 20 can be reduced. Of course, in other embodiments, a limiting protrusion may be disposed at an edge of the first opening 12, so that after the mounting seat 20 is inserted into the mounting cavity 11, the limiting protrusion abuts against an end surface of the mounting seat 20 to limit the mounting seat 20 from being removed from the first opening 12. In addition, the mounting seat 20 may be disposed in an interference fit with the mounting cavity 11.
Referring to fig. 2 and 4, in an embodiment, the mounting base 20 is provided with an avoiding groove 25, the avoiding groove 25 extends along an insertion direction of the mounting base 20 into the mounting cavity 11, the limiting convex rib 14 is located in the avoiding groove 25, the avoiding groove 25 is provided with a groove side wall 251 facing the first clamping portion 21, and the groove side wall 251 forms the limiting portion 26. Specifically, the escape groove 25 is provided on the outer peripheral surface of the mount 20 facing the mount cavity 11, and extends in the insertion direction of the mount 20, and the groove side wall 251 is spaced from the end surface of the mount 20 exposed from the first opening 12 to form the stopper portion 26. In the process of inserting the mounting seat 20 into the mounting cavity 11, the limiting convex rib 14 correspondingly extends into the avoiding groove 25, and as the mounting seat 20 is gradually inserted, one end of the limiting convex rib 14 close to the first opening 12 is close to the groove side wall 251. When first joint portion 21 and spacing protruding muscle 14 keep away from the one end joint of first opening 12, spacing protruding muscle 14 and groove lateral wall 251 butt to can restrict mount pad 20 and continue to move towards installation cavity 11 internal motion. Recess 25 is dodged in the outer peripheral face of mount pad 20 towards installation cavity 11 so through setting up at mount pad 20, can reduce the clearance between the outer peripheral face of mount pad 20 and the installation cavity 11 chamber wall, is favorable to promoting earphone 100's compact structure nature, also can reduce the fit clearance between mount pad 20 and the casing 10 to can reduce mount pad 20 and casing 10 possibility of becoming flexible each other, promote earphone 100's structural stability. Of course, in other embodiments, the limiting portion 26 may be protruded from the outer peripheral surface of the mounting seat 20.
In one embodiment, the housing 10 further has a second opening 13, the second opening 13 is opposite to the first opening 12, and the earphone 100 further includes an end cap 30, and the end cap 30 covers the second opening 13. Particularly, first opening 12 and second opening 13 all are uncovered setting, and casing 10 is the open tube-shape in both ends promptly, so make casing 10's structure comparatively simple, the shaping of being convenient for can promote production efficiency and reduce cost. And the end cover 30 is arranged to cover the second opening 13, so that impurities such as dust can be prevented from entering the mounting cavity 11. Of course, in other embodiments, the end of the housing 10 away from the first opening 12 may be a blocking structure, which is equivalent to the end cap 30 being integrally formed with the housing 10.
Referring to fig. 2 to 4, the manner of fixing the end cap 30 to the first opening 12 is various, for example, in an embodiment, the mounting base 20 is further provided with a second clamping portion, and the end cap 30 is clamped with the second clamping portion. That is, when the end cap 30 covers the second opening 13, the end cap 30 is clamped with the second clamping portion to limit the end cap 30 to be separated from the second opening 13. The structure is simple, the installation is convenient, and the assembly efficiency of the earphone 100 can be improved. Of course, in other embodiments, the end cap 30 and the mounting base 20 may be screwed or bonded. Alternatively, the end cap 30 may be snapped, glued or screwed to the housing 10, or the end cap 30 may be screwed into the second opening 13.
In addition, in an embodiment, the end cap 30 is provided with a relief opening 32, and the insertion portion 41 of the interface component 40 extends out of the relief opening 32, and the insertion portion 41 is used for electrically connecting with the head-mounted device 70. When the mounting seat 20 is inserted into the mounting cavity 11, the insertion portion 41 can protrude from the second opening 13, which facilitates the mounting of the interface module 40. Of course, in other embodiments, the insertion portion 41 may be inserted into the housing 10, or inserted into the end of the mounting seat 20 located at the first opening 12.
In an embodiment, the first fastening portion 21 at least includes a set of fastening structures, the fastening structures include two first fasteners 211 respectively disposed on two opposite sides of the mounting base 20, and a limiting rib 14 is disposed on the cavity wall of the mounting cavity 11 corresponding to each first fastener 211. The end cover 30 is provided with a third clamping portion extending towards the inside of the mounting cavity 11, the third clamping portion is clamped with the second clamping portion, and the third clamping portion abuts between the two first buckles 211 of the clamping structure.
Particularly, 11 relative two chamber walls in installation cavity all are equipped with spacing protruding muscle 14, and each group's joint structure all includes two first buckles 211, and each first buckle 211 all corresponds with a spacing protruding muscle 14 joint, corresponds one of them spacing protruding muscle 14 on the mount pad 20 at least and is equipped with a spacing portion 26, and optionally, mount pad 20 corresponds each spacing protruding muscle 14 and all is equipped with a spacing portion 26. During assembly, install mount pad 20 in with installation cavity 11 earlier to make first buckle 211 and the one end joint of spacing protruding muscle 14, spacing portion 26 and another butt of spacing protruding muscle 14. And the end cover 30 covers the second opening 13, the third clamping part can extend into the mounting cavity 11 and be clamped with the second clamping part, and the third clamping part is also positioned between the two first buckles 211 of the clamping structure. So can be through the direction motion of first buckle 211 towards keeping away from spacing protruding muscle 14 of third joint portion restriction to can prevent that first buckle 211 and spacing protruding muscle 14 from breaking away from each other, improve the reliability of being connected of mount pad 20 and casing 10, make earphone 100's structural stability higher. The first clamping portion 21 may include two, three or four clamping structures, and so on. In addition, in other embodiments, the third fastening part may not be disposed between the two first fasteners 211.
In an embodiment, the second clamping portion includes two clamping protrusions 22 disposed at intervals along a first direction, and the first direction is perpendicular to the arrangement direction of the two first buckles 211 in the same group of clamping structures. The third clamping part comprises two second buckles 31, the two second buckles 31 and the two clamping protrusions 22 are clamped correspondingly one by one, and one second buckle 31 abuts between the two first buckles 211 of the group of clamping structures. Specifically speaking, the first direction is still perpendicular to the direction of insertion of mount pad 20, and first joint portion 21 includes two sets of joint structures, and two sets of joint structures are along first direction interval distribution, and on the first direction, two sets of joint structures are located between two joint archs 22. Each second buckle 31 is correspondingly abutted between two first buckles 211 of one group of clamping structures. So set up, can promote end cover 30's connection stability, can reduce the not hard up or the possibility that drops of end cover 30, can also prevent that all first buckles 211 from warping, can improve the connection reliability of mount pad 20 and casing 10. Of course, in other embodiments, two snap projections 22 may be provided between two sets of snap structures in the first direction. In addition, only one or part of the second buckle 31 may be abutted between the two first buckles 211 of one group of clamping structures
Referring to fig. 2 and 4, in an embodiment, the mounting base 20 includes a mounting body 23 and a splicing plate 24, the mounting body 23 has a mounting groove 231, the interface module 40 is at least partially mounted in the mounting groove 231, and the splicing plate 24 covers the mounting groove 231 to fix the interface module 40 in the mounting groove 231. Specifically, the circuit board, the interface assembly 40, and the speaker assembly 50 are all mounted to the mounting body 23. Wherein, interface module 40 installs in mounting groove 231, and interface module 40's grafting portion 41 can stretch out from mounting groove 231 to wear to establish casing 10, splice plate 24 when closing mounting groove 231, can restrict interface module 40 and install the main part 23 motion relatively, thereby can guarantee interface module 40's stability. In one embodiment, the mounting groove 231 extends toward the relief opening 32, so that the insertion portion 41 of the interface component 40 extends out of the relief opening 32. Of course, in other embodiments, the interface module 40 can be fixed in the mounting groove 231 by screws, or the interface module 40 can be snapped into the mounting groove 231. In an embodiment, two clamping protrusions 22 of the second clamping portion are respectively disposed on two opposite sides of the mounting groove 231, so that the space utilization rate of the mounting body 23 can be improved, the structure of the mounting seat 20 is more compact, and the reduction of the overall size of the earphone 100 is facilitated.
The limiting structures of the splicing plate 24 and the interface component 40 can be various, for example, in an embodiment, the interface component 40 is provided with a limiting projection 42, the splicing plate 24 is provided with a limiting hole 242, and when the splicing plate 24 covers the installation groove 231, the limiting projection 42 extends into the limiting hole 242. The interface assembly 40 is provided with a limiting bump 42 protruding toward the surface of the splice plate 24, and when the splice plate 24 is covered on the mounting groove 231, the limiting bump 42 is inserted into the limiting hole 242, so that the interface assembly 40 can be limited from moving relative to the splice plate 24. When the splice plate 24 is fixed to the mounting body 23, the movement of the interface module 40 relative to the mounting body 23 can be limited, and the stability of the interface module 40 is improved.
The limiting structures of the splice plate 24 and the installation main body 23 can be various, for example, in an embodiment, the installation main body 23 is provided with an insertion hole 232, the splice plate 24 is provided with an insertion protrusion 241, and the insertion protrusion 241 is inserted and matched with the insertion hole 232. The inserting hole 232 is formed in the surface of the mounting body 23 facing the splicing plate 24, and when the splicing plate 24 covers the mounting groove 231, the inserting protrusion 241 is correspondingly inserted into the inserting hole 232, so that the splicing plate 24 can be limited to move relative to the mounting body 23. When the mounting seat 20 is mounted in the mounting cavity 11, the movement of the splice plate 24 in a direction away from the mounting groove 231 can be restricted by the cavity wall of the mounting cavity 11. The number of the plugging holes 232 may be one or more, specifically, two, three, four or more, and the like. When the number of the insertion holes 232 is plural, the plural insertion holes 232 are respectively disposed at two opposite sides of the mounting groove 231. Of course, in other embodiments, a protrusion may be provided on the mounting body 23, and a groove may be provided on the splice plate 24 for mating with the protrusion.
In addition, in an embodiment, the first clamping portion 21 is at least partially disposed on the splice plate 24. Specifically, one of the first buckles 211 of the same set of clamping structures is disposed on the mounting seat 20, and the other first buckle 211 is disposed on the splice plate 24. So utilize splice plate 24 to set up first buckle 211, can promote space utilization on mount pad 20 for mount pad 20's structure is compacter, is favorable to reducing earphone 100 overall dimension. Of course, in other embodiments, the first clamping portion 21 may be integrally disposed on the splice plate 24. Or the first snap-in portion 21 may be integrally provided on the mounting body 23.
Referring to fig. 1 and 5, in an embodiment, the earphone 100 further includes an earphone cover 60, the earphone cover 60 includes a connecting portion 61 and a sound outlet portion 62, the connecting portion 61 is connected to the housing 10, the sound outlet portion 62 covers the sound outlet 15 and extends in a direction away from the sound outlet 15, a wearing opening 621 is disposed on a side of the sound outlet portion 62, and the wearing opening 621 is communicated with the sound outlet 15. Specifically, a speaker assembly is provided in the casing 10, and the speaker assembly is provided corresponding to the sound outlet 15. The sound emitting portion 62 has a sound emitting cavity, and when the connecting portion 61 is attached to the housing 10, the sound emitting portion 62 covers the outer periphery of the sound outlet 15 so that the sound outlet 15 communicates with the sound emitting cavity. The sound outlet 62 extends along the opening direction of the sound outlet 15, and the wearing port 621 is disposed on the sound outlet side and is communicated with the sound outlet cavity, that is, the opening direction of the wearing port 621 forms an angle with the opening direction of the sound outlet 15 or is substantially perpendicular to the opening direction. The sound of the speaker assembly in the housing 10 can thus be transmitted from the sound outlet 15, the sound outlet chamber and the wearing port 621 in this order. When the earphone 100 is mounted on the head set 70 (see fig. 6) and the user wears the head set 70, the wearing hole 621 is disposed toward the user's ear, so that the sound of the speaker assembly can be better transmitted to the user's ear. The housing 10 may have a cylindrical shape, an elliptical cylindrical shape, a disk shape, a semicircular disk shape, a prismatic shape, or the like.
The housing 10 is provided with the earphone cover 60 so as to cover the sound outlet 15 with the sound outlet 62 of the earphone cover 60, and a wearing hole 621 communicating with the sound outlet 15 is provided in a side direction of the sound outlet 62. In this way, when the user wears the head-mounted device 70 for use, the wearing port 621 can be directed toward the ear of the user, so that the sound of the speaker assembly in the housing 10 can be transmitted from the sound outlet 15, the sound outlet chamber and the wearing port 621 in sequence, and finally transmitted to the ear of the user. So set up earphone housing 60, can guarantee to deliver to user's ear from the sound that sound outlet 15 sent better, reduced the sound from sound outlet 15 send the back towards the condition of diffusion all around, can promote the user and listen to the effect. Moreover, by disposing the wearing hole 621 in the lateral direction of the sound emitting portion 62, the thickness of the earphone 100 in the opening direction of the wearing hole 621 can be reduced, that is, when the user wears the headset 70 and uses the earphone 100, the size of the earphone 100 protruding toward the lateral direction of the user can be reduced, and the possibility that the user touches the earphone 100 by the hand of the user or a foreign object can be reduced, which is convenient for the user to wear and use.
In one embodiment, the sound emitting portion 62 includes an expansion portion 622 and a sound blocking portion 623, the two ends of the expansion portion 622 are respectively connected to the sound blocking portion 623 and the connecting portion 61, the expansion portion 622 is expandable and contractible along the opening direction of the sound outlet 15, and the wearing opening 621 penetrates through the side surfaces of the expansion portion 622 and the sound blocking portion 623. Particularly, flexible portion 622 sets up between connecting portion 61 and sound blocking portion 623, and sound blocking portion 623 sets up towards sound outlet 15, through setting up flexible portion 622, can adjust the interval between wearing mouthful 621 and sound outlet 15, can be with adjusting the position of wearing mouthful 621 to in order to adapt to different users ' ear, promoted earphone 100 to different users ' adaptability, can guarantee to wear mouthful 621 and can wear well at user's ear, in order to guarantee that the user listens to the effect. Optionally, the expansion portion 622 is of an accordion structure to facilitate expansion and contraction of the expansion portion 622. Wherein, the telescopic sleeve can be made of elastic materials such as silica gel or rubber. Of course, in other embodiments, the telescopic portion 622 may also have a telescopic structure with an inner sleeve and an outer sleeve, and so on.
In one embodiment, the earphone housing 60 is a flexible member for ease of use by a user. That is, the connecting portion 61 and the sound emitting portion 62 are made of flexible materials, and the connecting portion 61 and the sound emitting portion 62 are integrally formed. So set up for earphone cover 60 is comparatively soft, can reduce the extrusion of earphone cover 60 to user's skin, has reduced the tired condition when the user wears earphone cover 60 for a long time, has promoted the travelling comfort when the user wears earphone cover 60. The earphone cover 60 may be made of silicon gel, flexible plastic or rubber. Of course, in other embodiments, only the sound emitting portion 62 may be provided as a flexible member, and the entire earphone cover 60 may be provided as a hard member.
In one embodiment, the connection portion 61 includes a connection ring 611 and a connection sleeve 612, the connection ring 611 is connected between the connection sleeve 612 and the expansion portion 622 and is disposed around the outer circumference of the sound outlet 15, and the connection sleeve 612 is disposed on the outer surface of the housing 10. The connecting sleeve 612 is sleeved on the outer surface of the housing 10, so that the contact area between the connecting portion 61 and the housing 10 is increased, the connection stability between the connecting portion 61 and the housing 10 can be improved, and the possibility that the earphone cover 60 falls off from the housing 10 is reduced. Alternatively, the connecting sleeve 612 is an elastic member, that is, the connecting sleeve 612 has elasticity, and when the connecting sleeve 612 is sleeved on the housing 10, the connecting sleeve 612 has a tendency to contract. This enables the connecting sleeve 612 to tightly fit on the outer surface of the housing 10, which can further improve the connection stability of the connecting portion 61 and the housing 10. And so locate the adapter sleeve 612 on the casing 10, can reduce and connect the bullet and additionally set up the process of connecting piece on the casing 10, the assembly of being convenient for can promote production efficiency. In one embodiment, the connection sleeve 612 is sleeved on the end cover and the portion of the mounting base located in the first opening. Of course, in other embodiments, the connection portion 61 and the housing 10 may be integrally injection molded, and the connection portion 61 and the housing 10 may be clamped, adhered, or connected by screws, etc.
In one embodiment, the earphone 100 further includes a microphone disposed in the casing 10 and electrically connected to the circuit board, and the casing 10 is provided with a sound recording hole corresponding to the microphone. Therefore, the user can record or talk through the microphone, and the use is convenient. Of course, in some embodiments, a microphone may not be provided.
Referring to fig. 6, the head-mounted device 70 includes a main body and an earphone 100, and the specific structure of the earphone 100 refers to the above embodiments, and since the head-mounted device 70 adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here. Wherein the earphone 100 is mounted to the main body. Specifically, the main body includes a glasses assembly 71 and a wearing assembly 72 connected to the glasses assembly 71, the wearing assembly 72 is for wearing on the head of the user, and the headset 100 may be mounted to the wearing assembly 72 or the glasses assembly 71. The head mounted device 70 may be AR glasses, VR glasses, smart glasses, or the like.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (12)
1. An earphone for a head-mounted device, the earphone comprising:
the shell is provided with a mounting cavity and a first opening communicated with the mounting cavity;
the circuit board is arranged in the mounting cavity;
the loudspeaker assembly is arranged in the mounting cavity and is electrically connected with the circuit board;
the interface assembly is arranged in the mounting cavity and electrically connected with the circuit board, penetrates through the shell and is used for being electrically connected with the head-mounted equipment; and the number of the first and second groups,
the mounting seat, the mounting seat certainly first opening is inserted and is located the installation cavity, and with the casing joint, the circuit board the speaker subassembly with interface module all install in the mounting seat.
2. The earphone according to claim 1, wherein a wall of the mounting cavity is provided with a limiting convex rib, the limiting convex rib extends along an insertion direction of the mounting seat into the mounting cavity, one end of the mounting seat is provided with a limiting portion, the other end of the mounting seat is provided with a first clamping portion, one end of the limiting convex rib along the extension direction is clamped with the first clamping portion, and the other end of the limiting convex rib is abutted to the limiting portion.
3. The earphone according to claim 2, wherein the mounting base is provided with an avoiding groove extending in an insertion direction of the mounting base into the mounting cavity, the stopper rib is located in the avoiding groove, the avoiding groove has a groove side wall facing the first catching portion, and the groove side wall forms the stopper portion.
4. The headset of claim 3, wherein the housing further defines a second opening, the second opening being opposite the first opening, the headset further comprising an end cap that covers the second opening.
5. The earphone according to claim 4, wherein the mounting base is further provided with a second clamping portion, and the end cover is clamped with the second clamping portion.
6. The earphone according to claim 5, wherein the first clamping portion comprises at least one group of clamping structures, each clamping structure comprises two first buckles respectively arranged on two opposite sides of the mounting seat, and the cavity wall of the mounting cavity is provided with one limiting convex rib corresponding to each first buckle;
the end cover is provided with a third clamping portion extending towards the inside of the installation cavity, the third clamping portion is clamped with the second clamping portion, and the third clamping portion is abutted to two first buckles of the clamping structure.
7. The earphone according to claim 6, wherein the second clamping portion comprises two clamping protrusions arranged at intervals along a first direction, and the first direction is perpendicular to the arrangement direction of the two first buckles in the same group of clamping structures;
third joint portion includes two second buckles, two the second buckle with two the protruding one-to-one joint of joint, one the second buckle butt is in a set of two of joint structure between the first buckle.
8. The headset of any one of claims 2 to 7, wherein the mount includes a mounting body having a mounting slot, the interface assembly being at least partially mounted to the mounting slot, and a splice plate covering the mounting slot for securing the interface assembly within the mounting slot.
9. The earphone according to claim 8, wherein the first clamping portion is at least partially disposed on the splice plate.
10. The earphone according to claim 8, wherein the interface module is provided with a limiting projection, the splice plate is provided with a limiting hole, and when the splice plate covers the mounting groove, the limiting projection extends into the limiting hole; and/or the presence of a gas in the gas,
the installation main body is provided with an inserting hole, the splicing plates are provided with inserting protrusions, and the inserting protrusions are matched with the inserting hole in an inserting mode.
11. A headset comprising a body and an earpiece as claimed in any one of claims 1 to 10, the earpiece being mounted to the body.
12. The head-mounted device of claim 11, wherein the head-mounted device is VR glasses or AR glasses.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011159945.XA CN112333590A (en) | 2020-10-23 | 2020-10-23 | Earphone and head-mounted device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011159945.XA CN112333590A (en) | 2020-10-23 | 2020-10-23 | Earphone and head-mounted device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112333590A true CN112333590A (en) | 2021-02-05 |
Family
ID=74312371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011159945.XA Withdrawn CN112333590A (en) | 2020-10-23 | 2020-10-23 | Earphone and head-mounted device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112333590A (en) |
-
2020
- 2020-10-23 CN CN202011159945.XA patent/CN112333590A/en not_active Withdrawn
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN220087447U (en) | Earphone | |
CN107454492B (en) | Bone conduction earphone | |
CN101656903B (en) | Headphone | |
US8194910B2 (en) | Headphones | |
CN107493532B (en) | Bone conduction earphone | |
CN107484054B (en) | Bone conduction earphone | |
CN115767343A (en) | Bone conduction earphone | |
CN212463478U (en) | Earphone set | |
EP2456228A1 (en) | Earphone, and electronic device | |
CN113848650A (en) | Mirror leg and head-mounted display device | |
CN214045943U (en) | Earphone and head-mounted device | |
CN112333590A (en) | Earphone and head-mounted device | |
CN112346249A (en) | Head-mounted device | |
CN114679657A (en) | Magnetic suction connector and bone conduction loudspeaker device | |
CN214041874U (en) | Head-mounted device | |
CN114095822A (en) | Ear hanging type earphone | |
CN214045944U (en) | Earphone and head-mounted device | |
CN216485803U (en) | Mirror leg and head-mounted display device | |
CN220043620U (en) | Earphone | |
US20230269519A1 (en) | Open-ear headphone | |
CN112333589A (en) | Earphone and head-mounted device | |
CN214256561U (en) | In-ear earphone | |
CN221598101U (en) | Movement module and earphone | |
US20230412966A1 (en) | Open-ear headphone | |
CN221784332U (en) | Ear clip type earphone |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210205 |
|
WW01 | Invention patent application withdrawn after publication |