CN112331769A - Coexistence of Negative Resistance and Non-saturating Magnetoresistive Effects Based on Local Impact Ionization - Google Patents
Coexistence of Negative Resistance and Non-saturating Magnetoresistive Effects Based on Local Impact Ionization Download PDFInfo
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Abstract
本发明公开了基于局部碰撞电离的负阻和非饱和磁阻效应共存的器件，属于半导体器件技术领域，包括半导体基体和两个金属电极；两个金属电极设置于半导体基体的同一表面且至少有一个金属电极位于半导体基体表面的边缘；向金属电极施加持续增大的电流，半导体基体内形成的局部非均匀电场的电场强度增强，局部碰撞电离的发生，产生等效的载流子注入效应，使器件形成负阻效应；器件置于磁场中，半导体基体内部载流子由于洛伦兹力作用发生非均匀性变化，呈现出非饱和磁阻效应，实现负阻效应和非饱和磁阻效应共存于器件。本发明结构简单、性能测量方法成熟，可应用于发展新型多功能器件，比如具有高磁敏特性的脉冲发生器、新型多功能磁存储器件。
The invention discloses a device with coexistence of negative resistance and unsaturated magnetoresistance effects based on local impact ionization, belonging to the technical field of semiconductor devices, comprising a semiconductor substrate and two metal electrodes; the two metal electrodes are arranged on the same surface of the semiconductor substrate and have at least two metal electrodes. A metal electrode is located at the edge of the surface of the semiconductor substrate; when a continuously increasing current is applied to the metal electrode, the electric field strength of the local non-uniform electric field formed in the semiconductor substrate increases, and local impact ionization occurs, resulting in an equivalent carrier injection effect. The device forms a negative resistance effect; when the device is placed in a magnetic field, the carriers in the semiconductor matrix undergo non-uniform changes due to the Lorentz force, showing a non-saturated magnetoresistive effect, realizing the coexistence of the negative resistance effect and the non-saturated magnetoresistive effect. on the device. The invention has simple structure and mature performance measurement method, and can be applied to develop new multifunctional devices, such as pulse generators with high magnetic sensitivity and new multifunctional magnetic storage devices.
Description
Technical Field
The invention belongs to the technical field of semiconductor devices, and particularly relates to a device with coexisting negative resistance and unsaturated magnetoresistance effects based on local impact ionization.
Background
The negative differential resistance (negative resistance) effect refers to a nonlinear electrical transport effect in which the measurement voltage decreases (or the measurement current decreases with the increase of the input voltage) while the input current increases. The magnetoresistance effect refers to an effect in which the resistivity of a sample is affected by an external magnetic field. The negative resistance effect and the magnetoresistance effect are widely used in the fields of pulse generators, magnetic memories, and the like, respectively, and thus have received much attention. With the development and application of semiconductors in the field of electronic information, people put higher demands on high-density integration and miniaturization of electronic devices. The advent of multifunction devices has provided a potential solution to this.
In the prior art, a plurality of negative resistance devices and magnetic resistance devices with excellent performance are designed, but due to the influence of factors such as device structures, materials for forming the devices and the like, the coexistence of the negative resistance effect and the unsaturated magnetic resistance effect is difficult to realize. And the coexistence characteristic of the negative resistance and the unsaturated magnetic resistance is utilized, which is helpful for promoting the development of novel multifunctional devices with higher integration level and better performance, such as pulse generators with high magnetic sensitivity characteristic, novel multifunctional magnetic memories and the like. Therefore, how to design a device with both negative resistance and unsaturated magnetoresistance is of great significance.
Disclosure of Invention
In view of the above drawbacks and needs of the prior art, the present invention provides a device with coexisting negative resistance and unsaturated magnetoresistance effects based on local impact ionization, thereby solving the technical problem that negative resistance and unsaturated magnetoresistance do not easily coexist in the same device.
To achieve the above object, according to one aspect of the present invention, there is provided a device in which negative resistance and unsaturated magnetoresistance effects based on local impact ionization coexist, the device comprising: a semiconductor substrate and two metal electrodes;
the two metal electrodes are respectively arranged on the same surface of the semiconductor substrate, and at least one metal electrode is positioned on the edge of the surface of the semiconductor substrate;
the semiconductor substrate is used for enhancing the electric field intensity of a local non-uniform electric field formed in the semiconductor substrate after continuously increased current is obtained, so that local impact ionization in the semiconductor substrate is caused, and an equivalent carrier injection effect is generated, so that the device forms a negative resistance effect;
the semiconductor substrate is also used for generating non-uniform change of internal carriers under the action of a magnetic field which is not parallel to the current direction due to the action of Lorentz force, so that the device presents a non-saturated magnetoresistance effect, and the negative resistance effect and the non-saturated magnetoresistance effect coexist in the same device.
Preferably, the material of the semiconductor substrate is one of Ge, Si, GaAs, and GaN semiconductor lightly-doped non-magnetic materials.
Preferably, the semiconductor substrate has a rectangular parallelepiped structure.
Preferably, the material of the metal electrode is one of In, Ag, Cu, Au or Pt nonmagnetic metals.
Preferably, the two metal electrodes form ohmic contacts with the semiconductor base body.
According to another aspect of the present invention, there is provided a system for coexistence of negative resistance and non-saturated magnetoresistance effect based on local impact ionization, comprising the above-mentioned device for coexistence of negative resistance and non-saturated magnetoresistance effect based on local impact ionization, further comprising a current source and a magnetic field generating device;
the current sources are respectively connected with the two metal electrodes; the magnetic field generating device is used for generating a magnetic field which is not parallel to the current direction of the current source;
the current source applies continuously increased current to the two metal electrodes, so that the electric field intensity of a local non-uniform electric field formed in the semiconductor substrate is enhanced, local impact ionization in the semiconductor substrate is caused, and an equivalent carrier injection effect is generated, so that the device forms a negative resistance effect;
the inner current carrier of the semiconductor substrate generates non-uniform change under the action of the magnetic field due to the action of Lorentz force, so that the device presents a non-saturated magnetoresistance effect, and the negative resistance effect and the non-saturated magnetoresistance effect coexist in the same device.
Preferably, a voltmeter is further included, and the voltmeter is used for measuring the voltage between the two metal electrodes.
In general, compared with the prior art, the above technical solution contemplated by the present invention can achieve the following beneficial effects:
1. according to the invention, two metal electrodes are respectively arranged on the same surface of the semiconductor substrate, at least one metal electrode is arranged on the edge of the surface of the semiconductor substrate, and after current and a magnetic field are respectively applied, a device with coexisting negative resistance and unsaturated magnetoresistance effects can be obtained, and the device has the advantages of simple structure, mature performance measurement method and easiness in production and application;
2. the device of the present invention can be applied to the development of novel multifunctional devices such as a pulse generator having high magnetic sensitivity characteristics, a novel multifunctional magnetic memory device, and the like.
Drawings
FIG. 1 is a schematic structural diagram of a device based on coexistence of negative resistance and unsaturated magnetoresistance effects of local impact ionization according to the present invention;
FIG. 2 is a measurement schematic diagram of a device based on coexistence of negative resistance and unsaturated magnetoresistance effects of local impact ionization according to the present invention;
FIG. 3 is a graph of V-I curves measured at 300K under different magnetic field conditions in an example of the present invention;
FIG. 4 is a schematic diagram of electric field lines of a device in an embodiment of the invention;
FIG. 5 shows V calculated in an embodiment of the present inventionpeak/V100mAA plot of variation with magnetic field strength;
FIG. 6 is a graph of MR-B at currents corresponding to an example of 80mA and 100mA at a temperature of 300K as calculated in an embodiment of the present invention;
FIG. 7 is a schematic diagram showing device measurements of a comparative example in accordance with an embodiment of the present invention;
FIG. 8 is a corresponding V-I curve measured at 300K temperature under zero magnetic field conditions for comparative examples in accordance with an embodiment of the present invention;
fig. 9 is a schematic diagram of electric field lines for a comparative example device in an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
FIG. 1 is a schematic structural diagram of a device based on coexistence of negative resistance and unsaturated magnetoresistance effects of local impact. As shown in FIG. 1, the invention proposes a device with coexisting negative resistance and unsaturated magnetoresistance effects based on local impact ionization, comprising a semiconductor substrate and two metal electrodes. Specifically, the semiconductor substrate is of a rectangular structure, the two metal electrodes are respectively arranged on the same surface of the semiconductor substrate, and at least one metal electrode is located on the edge of the surface of the semiconductor substrate.
In a further description, by applying continuously increased current to the two metal electrodes, the electric field strength of a local non-uniform electric field formed in the semiconductor substrate is increased, so that local impact ionization occurs in the semiconductor substrate, and an equivalent carrier injection effect is generated, so that the device forms a negative resistance effect; the device is placed in a magnetic field, and internal carriers of the semiconductor substrate are subjected to non-uniform change under the action of the magnetic field due to the action of Lorentz force, so that the device presents a non-saturated magnetoresistance effect, and the negative resistance effect and the non-saturated magnetoresistance effect coexist in the device.
In a further description, the material of the semiconductor substrate is one of Ge, Si, GaAs, and GaN semiconductor lightly doped non-magnetic materials.
In a further description, the material of the metal electrode is one of In, Ag, Cu, Au or Pt nonmagnetic metals.
FIG. 2 is a measurement schematic diagram of a device based on coexistence of negative resistance and unsaturated magnetoresistance effects of local impact. In one embodiment of the present invention, as shown in fig. 2, the semiconductor substrate is a non-magnetic p-Ge: ga is used as a semiconductor base material, and the material of the metal electrode is In. The preparation method of the semiconductor substrate and the metal electrode comprises the following steps:
selectingGa is used as a semiconductor base material, the room temperature resistivity of the material is 10-30 omega cm, and the thickness of the material is 0.5 mm. The carrier concentration and mobility of the selected semiconductor substrate are respectively about 2.6 multiplied by 10 under the temperature of 300K measured by Van der Pager method14cm-3And 2X 103cm2·V-1·s-1. An alloy lettering pen was used to cut a strip having an average length of about 3.4mm and an average width of about 3.0 mm. And ultrasonically cleaning the cut base material for 10min by using acetone and absolute ethyl alcohol in sequence to ensure that the surface of the base material is cleaned, finally taking out the cleaned base material, and drying the surface by using argon. Preparing two metal In electrodes at two ends of a certain surface of the semiconductor by an indium welding method, leading out a lead by silver paste, and obtaining the required device after the silver paste is solidified. Because indium is not easy to be oxidized In the air environment at room temperature, a very thin oxide layer can be formed on the surface at a higher temperature to prevent further oxidation, and the main component of the prepared electrode is In.
Stated further, the direction of the current applied to the two metal electrodes is not parallel to the direction of the magnetic field in which the device is placed. The direction of the magnetic field and the direction of the current have a certain included angle, and when the included angle tends to 90 degrees, the current carriers in the semiconductor are more likely to generate non-uniform change due to the action of Lorentz force, so that the obvious unsaturated magnetoresistance effect is favorably observed.
As shown In fig. 2, the current source In the embodiment of the present invention supplies a current to the entire device through two In electrodes, and then measures the voltage across the metal electrodes using a voltmeter. The direction of the applied magnetic field is parallel to the device surface and perpendicular to the direction along the lines of the two electrodes.
Further, the electric transport performance of the manufactured device is measured by a two-wire method under the conditions of 300K temperature and different magnetic fields, the applied current range is 0-100 mA, and the formula V is [ V (B)+)+V(B-)]The results of the elimination of the Hall effect are shown in FIG. 3, where V (B)+) And V (B)-) Positive and negative magnetic fields are applied, respectively. It can be seen from FIG. 3 that when no magnetic field is applied, the magnetic field is appliedWith increasing applied current, the measured voltage first shows a linear increasing trend with current through the origin, indicating that the In electrode forms an ohmic contact with the semiconductor. The current is continuously increased, the measured voltage shows a nonlinear increasing trend, and the fitting finds that the current and the voltage are close to the peak value (V) of the voltagepeak) At that time, deviation from I ℃. alpha.V has begun2And (4) relationship. This suggests that this non-linear conduction mechanism does not stem solely from space charge effects. Analysis has shown that even intrinsic impact ionization of Ge corresponds to electric field strengths as high as about 105V/cm, but the device electric field distribution provided in this embodiment is non-uniform (as shown in fig. 4), which means that the local electric field strength can reach that required for semiconductor germanium breakdown. Therefore, there is also a local impact ionization effect within the semiconductor Ge during this process. After the local ionization occurs, the carrier concentration p in the semiconductor increases. According to the formula of semiconductor resistance R
Wherein q is the amount of charge, mupFor the mobility of the semiconductor, l and S are the metal electrode spacing and the sample cross-sectional area, respectively. Wherein the values of q, l and S are constant and mu is at constant temperaturepCan be considered as a constant. Therefore, when the local ionization occurs to a certain extent, the device resistance R gradually starts to decrease, exhibiting a negative resistance effect. I.e. when the measured voltage reaches VpeakAfter that, the current continues to increase, and the measurement voltage is reduced significantly. Important index parameter V corresponding to negative resistance performance in V-I curve obtained by zero magnetic field measurementpeak/V100mA(wherein V100mAThe corresponding measured voltage at a current of 100 mA) is approximately 1.08. FIG. 5 shows V calculated in an embodiment of the present inventionpeak/V100mAAccording to the curve chart of the change along with the magnetic field intensity, after the magnetic field is applied, the carriers are deflected under the action of Lorentz force, the probability of local collision ionization is higher, the electron injection effect is more obvious, and therefore V ispeak/V100mAThe negative resistance effect can be obviously enhanced under the action of the magnetic field. Corresponding measured voltage with magnetismThe field strength increases and appears as a positive magnetoresistance effect. According to calculation formula of magnetic resistance
Wherein R (B) and R (0) are the resistance values of the device under the conditions of applying a magnetic field B with certain intensity and zero magnetic field respectively. In the current range corresponding to the negative resistance, 80mA and 100mA were selected as examples for the magnetoresistance effect analysis, and the results are shown in fig. 6. It can be seen from fig. 6 that the reluctance values at different magnetic fields are symmetric about a zero magnetic field, wherein the reluctance values increase quadratically with the magnetic field strength and then linearly with the magnetic field strength, showing a pronounced tendency to non-saturation, wherein the reluctance values at 1T can reach about 15%. The above analysis has demonstrated that the present invention provides a device with coexisting negative resistance and unsaturated magnetoresistance effects based on local impact ionization, which can enhance the negative resistance effect and simultaneously obtain unsaturated excellent magnetoresistance performance.
The invention also provides a comparative example in which two metal electrodes are not arranged on the same surface of the semiconductor substrate, which specifically comprises the following steps:
ga was selected as a non-magnetic p-Ge which was the same as that of the above-mentioned example, and a long strip having approximately the same average size as that of the example was cut out with an alloy marker. And ultrasonically cleaning the cut base material for 10min by using acetone and absolute ethyl alcohol in sequence to ensure that the surface of the base material is cleaned, finally taking out the cleaned base material, and drying the surface by using argon. And preparing metal In electrodes by an indium welding method, wherein the In electrodes are distributed on two different side surfaces of the semiconductor, then leading out a lead through silver paste, and obtaining the required device after the silver paste is solidified. The measurement method is the same as the above embodiment, and the schematic diagram of the device structure and the performance test method is shown in fig. 7.
FIG. 8 is a corresponding V-I curve measured at 300K temperature under zero magnetic field conditions for comparative examples in accordance with the present invention. As shown in fig. 8, the curve is a straight line through the origin in a smaller current range, and then the measured voltage shows a non-linear increasing trend with current. The negative resistance effect is difficult to observe In the figure, which shows that the negative resistance effect is difficult to form when the metal In electrode is not on the same surface of the semiconductor. Fig. 9 is a schematic view of electric field lines of a device according to a comparative example of the present invention, and it is analytically believed that when In electrodes of metal are welded on both sides of p-Ge: Ga of semiconductor, the electric field lines are relatively more uniformly distributed In the semiconductor after current is applied, the local electric field strength inside the semiconductor is substantially the same, and local impact ionization is difficult to form or weak, and thus it is finally difficult to observe a negative resistance effect In the case of the comparative example, compared with the embodiment.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. Device based on coexistence of negative resistance and unsaturated magnetoresistance effects of localized impact ionization, characterized in that it comprises: a semiconductor substrate and two metal electrodes;
the two metal electrodes are respectively arranged on the same surface of the semiconductor substrate, and at least one metal electrode is positioned on the edge of the surface of the semiconductor substrate;
the semiconductor substrate is used for enhancing the electric field intensity of a local non-uniform electric field formed in the semiconductor substrate after continuously increased current is obtained, so that local impact ionization in the semiconductor substrate is caused, and an equivalent carrier injection effect is generated, so that the device forms a negative resistance effect;
the semiconductor substrate is also used for generating non-uniform change of internal carriers under the action of a magnetic field which is not parallel to the current direction due to the action of Lorentz force, so that the device presents a non-saturated magnetoresistance effect, and the negative resistance effect and the non-saturated magnetoresistance effect coexist in the same device.
2. The device of claim 1, wherein the material of the semiconductor substrate is one of Ge, Si, GaAs, and a lightly doped non-magnetic material in GaN semiconductor.
3. The device based on coexistence of negative resistance and non-saturated magnetoresistance effects of local impact ionization according to claim 1 or 2, characterized in that said semiconductor body is a rectangular parallelepiped structure.
4. The device of claim 3, wherein the metal electrode is made of one of In, Ag, Cu, Au or Pt nonmagnetic metal.
5. The device of claim 1 or 4, wherein the two metal electrodes form an ohmic contact with the semiconductor body.
6. The system for coexistence of negative resistance and unsaturated magnetic resistance effects based on local impact ionization is characterized by comprising the device for coexistence of negative resistance and unsaturated magnetic resistance effects based on local impact ionization according to any one of claims 1 to 5, and further comprising a current source and a magnetic field generating device;
the current sources are respectively connected with the two metal electrodes; the magnetic field generating device is used for generating a magnetic field which is not parallel to the current direction of the current source;
the current source applies continuously increased current to the two metal electrodes, so that the electric field intensity of a local non-uniform electric field formed in the semiconductor substrate is enhanced, local impact ionization in the semiconductor substrate is caused, and an equivalent carrier injection effect is generated, so that the device forms a negative resistance effect;
the inner current carrier of the semiconductor substrate generates non-uniform change under the action of the magnetic field due to the action of Lorentz force, so that the device presents a non-saturated magnetoresistance effect, and the negative resistance effect and the non-saturated magnetoresistance effect coexist in the same device.
7. The coexisting system of negative resistance and non-saturated magnetoresistance effects based on localized impact ionization according to claim 6, further comprising a voltmeter for measuring the voltage between the two metal electrodes.
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