CN112327368B - Ultra-deep metal pipeline buried depth detection equipment and use method thereof - Google Patents
Ultra-deep metal pipeline buried depth detection equipment and use method thereof Download PDFInfo
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Abstract
The invention discloses an ultra-deep metal pipeline buried depth detection device and a use method thereof, and the structure of the ultra-deep metal pipeline buried depth detection device comprises: the system comprises a three-dimensional vector probe, an analog switch module, an instrument amplification module, a program control amplification module, an active band-pass filtering module, a 16-bit bipolar ADC, an FPGA, an MSP430 singlechip and a standard signal generation module; the invention solves the problems of attenuation of input signals and introduction of external noise caused by transmission of analog signals through a 10-meter connecting line in the conventional ultra-deep metal pipeline buried depth detection equipment.
Description
Technical Field
The invention relates to the field of detecting the depth of a metal pipeline, in particular to an ultra-deep metal pipeline burial depth detection device and a use method thereof.
Background
Metal pipelines such as petroleum, natural gas and the like need to pass through a large river in the process of oil gas transmission, regular inspection is often needed to be carried out on the section of pipeline in engineering, the buried depth condition of the metal pipeline is mainly detected, the metal pipeline passing through the section is prevented from being exposed out of a river bed and directly contacting with river water, the corrosion and damage of the pipeline are prevented, and finally the condition of oil gas leakage is caused. The current detection method is mainly based on an electromagnetic method, and the main principle is that an alternating current signal with fixed frequency is applied to a metal pipeline at the bottom of a river, when the electric signal passes through the metal pipeline, a magnetic field can be radiated to the space around the pipeline, the magnetic field signal can be received, the magnetic field signal is converted into the electric signal, and the burial depth of the pipeline is inverted by judging the size of the electric signal.
The equipment that uses in the engineering at present is in the weak signal of telecommunication of passing through the mode of connecting wire with probe output carry the receiver in, whole system need carry out calibration many times, will fix the probe on the sopwith staff at the calibration in-process, rise to the position about 10 meters apart from the ground, present design is that the weak small signal of probe output inputs the receiver circuit through 10 meters cable, because analog signal's interference killing feature is relatively poor, analog signal that this kind of design can lead to inputing in the receiver receives the interference, the interference of external noise, the shake of connecting cable all can make the output result fluctuate, influence measuring efficiency and accuracy nature.
Disclosure of Invention
Aiming at the defects in the prior art, the ultra-deep metal pipeline buried depth detection equipment and the use method thereof provided by the invention solve the problems of attenuation of input signals and introduction of external noise caused by transmission of analog signals through a 10-meter connecting line by the conventional ultra-deep metal pipeline buried depth detection equipment.
In order to achieve the purpose of the invention, the invention adopts the technical scheme that: an ultra-deep metal pipeline burial depth detection device, comprising: the system comprises a three-dimensional vector probe, an analog switch module, an instrument amplification module, a program control amplification module, an active band-pass filtering module, a 16-bit bipolar ADC, an FPGA, an MSP430 singlechip and a standard signal generation module;
the probe signal output end of the three-dimensional vector probe is connected with the first input end of the analog switch module; the second input end of the analog switch module is connected with the differential signal output end of the standard signal generation module, and the output end of the analog switch module is connected with the input end of the instrument amplification module; the output end of the instrument amplification module is connected with the input end of the program control amplification module; the output end of the program control amplification module is connected with the input end of the active band-pass filtering module; the output end of the active band-pass filtering module is connected with the input end of the 16-bit bipolar ADC; the output end of the 16-bit bipolar ADC is connected with the acquisition interface end of the FPGA; the FPGA is connected with an SPI interface of the MSP430 singlechip through the SPI interface; the MSP430 singlechip has an I/O1 end connected with the control end of the analog switch module, an I/O2 end connected with the control end of the program control amplification module, and an I/O3 end connected with the input end of the standard signal generation module.
The beneficial effects of the above further scheme are: the ultra-deep metal pipeline burial depth detection equipment comprises: the instrument amplification module and the program control amplification module, the zero drift generated by the amplification circuit influenced by other factors such as temperature and the like can seriously influence the measurement precision, so the analog switch module is added, the module can be controlled by a microprocessor MSP430 singlechip, selects which signal passes through the circuit, before the signal output of the probe passes through the analog switch module, the analog switch is controlled to input a grounding signal, at the moment, the whole system works in a state without an input signal, but due to zero drift of the circuit, an output signal exists at the output end of the circuit, after the amplitude of the signal is measured and obtained by U1, the signal output by the probe passes through the analog switch module through the selection of the analog switch module to obtain the amplitude of the probe signal passing through the circuit U2, after the signal passes through U2-U1, the accurate value of the output signal of the probe after the influence of the zero drift of the circuit is removed is obtained.
Further: the standard signal generation module comprises: the device comprises a waveform generation submodule, a single-end slip molecule module, a voltage following submodule and a resistance attenuation submodule;
the input end of the waveform generation submodule is used as the input end of the standard signal generation module; the output end of the waveform generation submodule is connected with the input end of the single-ended slip molecule module; the output end of the single-ended slip molecule module is connected with the input end of the voltage following submodule; the output end of the voltage following submodule is connected with the input end of the resistance attenuation submodule; and the output end of the resistance attenuation submodule is used as a differential signal output end of the standard signal generation module.
Further: the resistance attenuation submodule includes: a resistor R1, a resistor R2, a resistor R3, a resistor R4, a ground resistor R5, a ground resistor R6, a resistor R7, a resistor R8, a resistor R9, a resistor R10, a ground resistor R11, a ground resistor R12, a ground resistor R13, a ground resistor R14, a ground resistor R15 and a ground resistor R16;
one end of the resistor R1 is used as an input end IN1 of the resistance attenuation submodule, and the other end of the resistor R1 is respectively connected with one end of a resistor R2 and a grounding resistor R5; one end of the resistor R7 is used as an input end IN2 of the resistance attenuation submodule, and the other end of the resistor R7 is respectively connected with one end of a grounding resistor R6 and one end of a resistor R8; the other end of the resistor R2 is respectively connected with one end of a resistor R3 and a grounding resistor R11; the other end of the resistor R3 is respectively connected with one end of a resistor R4 and a grounding resistor R13; the other end of the resistor R4 is connected with a grounding resistor R15 and serves as an output end OUT1 of the resistance attenuation submodule; the other end of the resistor R8 is respectively connected with one end of a grounding resistor R12 and one end of a resistor R9; the other end of the resistor R9 is respectively connected with one end of a grounding resistor R14 and one end of a resistor R10; the other end of the resistor R10 is connected with a grounding resistor R16 and serves as an output end OUT2 of the resistance attenuation submodule;
the input end IN1 of the resistance attenuation submodule and the input end IN2 of the resistance attenuation submodule are used as the input ends of the resistance attenuation submodule; and the output end OUT1 of the resistance attenuation submodule and the output end OUT2 of the resistance attenuation submodule are used as output ends of the resistance attenuation submodule.
The beneficial effects of the above further scheme are: the ultra-deep metal pipeline buried depth detection device comprises a multistage amplifying circuit and an active band-pass filtering module, wherein the circuit can generate certain influence on the gain of the whole device under the influence of temperature, the change of the gain can generate serious influence on the system measurement result, a waveform generation submodule, a single-end slip molecule module, a voltage following submodule and a resistance attenuation submodule are added into the ultra-deep metal pipeline buried depth detection device, the waveform generation submodule adopts a direct digital frequency synthesis technology, the amplitude of an output signal is stable, the resistance attenuation submodule adopts a low-temperature drift precision resistor, so that the stability and the precision of a standard signal of the signal generation circuit are ensured, after the gain of the whole system is selected, the standard sinusoidal signal is enabled to pass through the circuit to obtain a measurement value through the selection of an analog switch module, and the final measurement result can be corrected through the system gain of the standard sinusoidal signal and the measurement value of the circuit, the influence of circuit zero drift and system temperature drift on the measurement result can be effectively overcome, and the measurement precision is improved.
A use method of ultra-deep metal pipeline burial depth detection equipment comprises the following steps:
s1, controlling the analog switch module through the MSP430 singlechip, inputting a grounding signal, and measuring a zero drift voltage U1 output by the active band-pass filter module;
s2, acquiring a magnetic field intensity electric signal in the X, Y, Z direction by adopting a three-dimensional vector probe;
s3, controlling the analog switch module through the MSP430 singlechip, inputting the magnetic field intensity electric signal into the instrument amplification module, and measuring the output voltage U2 of the active band-pass filter module;
s4, subtracting the zero drift voltage U1 from the output voltage U2 to obtain an amplitude value U' of the magnetic field intensity electric signal output by the probe;
s5, generating a standard sinusoidal signal through a standard signal generation module, and correcting the amplitude value U 'of the electric signal of the magnetic field intensity output by the probe to obtain an amplitude correction value U' of the electric signal of the magnetic field intensity output by the probe;
s6, collecting the amplitude correction value U ' through the 16-bit bipolar ADC, detecting through the FPGA to obtain an amplitude accurate value U ', and transmitting the amplitude accurate value U ' to a receiver through the MSP430 single chip microcomputer to finish the use of the ultra-deep metal pipeline buried depth detection equipment.
Further: step S5 includes the following substeps:
s51, generating a standard sinusoidal signal through a standard signal generation module, controlling an analog switch module through an MSP430 singlechip, inputting the standard sinusoidal signal into an instrument amplification module, and measuring the output voltage U3 of the active band-pass filter module;
s52, obtaining a system gain through the output voltage U3 and the zero drift voltage U1;
and S53, correcting the amplitude value U 'of the electric signal of the magnetic field intensity output by the probe according to the system gain to obtain an amplitude correction value U' of the electric signal of the magnetic field intensity output by the probe.
Further: step S6 includes the following substeps:
s61, acquiring an amplitude correction value U' by driving a 16-bit bipolar ADC through the FPGA to obtain amplitude data;
s62, generating a sine table and a cosine table which have the same frequency with the electric signal of the magnetic field intensity output by the probe;
s63, multiplying the amplitude data by the data in the sine table and the data in the cosine table respectively to obtain first amplitude modulation data and second amplitude modulation data which have a phase difference of 180 degrees with the first amplitude modulation data;
s64, accumulating and averaging the first amplitude modulation data and the second amplitude modulation data in one sampling period to obtain a first accumulated average amplitude modulation value I and a second amplitude modulation accumulated average value Q;
s65, calculating an amplitude accurate value U 'of the amplitude correction value U' according to the first accumulated average amplitude modulation value I and the second amplitude modulation accumulated average value Q;
s66, transmitting the accurate amplitude value U 'to an MSP430 single chip microcomputer through an SPI protocol, and transmitting the accurate amplitude value U' of the magnetic field intensity electric signal output by the probe to a receiver through the MSP430 single chip microcomputer, so that the use of the ultra-deep metal pipeline burial depth detection equipment is completed.
The beneficial effects of the above further scheme are: the active band-pass filter can not completely filter out-of-band noise due to the inherent characteristics, and the use of the digital phase-sensitive detection technology can accurately extract the amplitude value of the sinusoidal signal output by the active band-pass filter on the one hand, and can realize the function of the digital filter on the other hand, thereby improving the signal-to-noise ratio of the system and effectively improving the accuracy of measurement.
Further: the formula for calculating the amplitude accurate value U' ″ of the amplitude correction value U ″ in step S65 is:
further: in step S63, the method of multiplying the amplitude data by the data in the sine table and the data in the cosine table respectively includes: and acquiring amplitude data of corresponding quantity according to the sampling times of the 16-bit bipolar ADC in a sampling period, and multiplying all the amplitude data with data in a sine table and data in a cosine table in sequence according to time in a row one-to-one correspondence manner to obtain first amplitude modulation data and second amplitude modulation data which are 180 degrees different from the first amplitude modulation data.
In conclusion, the beneficial effects of the invention are as follows: a signal processing circuit is arranged at the near end of the probe, the analog magnetic field intensity electric signal is amplified, filtered, corrected and detected to obtain an accurate amplitude value of the digital signal, and the amplitude value of the digital signal is transmitted to a receiver through a cable, so that the problem of introducing external noise is avoided, and the anti-interference capability of the system is improved.
Drawings
FIG. 1 is a block diagram of a buried depth detection device for an ultra-deep metal pipeline;
FIG. 2 is a circuit diagram of a resistance attenuation submodule;
fig. 3 is a flow chart of a using method of the ultra-deep metal pipeline burial depth detection device.
Detailed Description
The following description of the embodiments of the present invention is provided to facilitate the understanding of the present invention by those skilled in the art, but it should be understood that the present invention is not limited to the scope of the embodiments, and it will be apparent to those skilled in the art that various changes may be made without departing from the spirit and scope of the invention as defined and defined in the appended claims, and all matters produced by the invention using the inventive concept are protected.
As shown in fig. 1, an ultra-deep metal pipeline burial depth detection device includes: the system comprises a three-dimensional vector probe, an analog switch module, an instrument amplification module, a program control amplification module, an active band-pass filtering module, a 16-bit bipolar ADC, an FPGA, an MSP430 singlechip and a standard signal generation module;
the probe signal output end of the three-dimensional vector probe is connected with the first input end of the analog switch module; the second input end of the analog switch module is connected with the differential signal output end of the standard signal generation module, and the output end of the analog switch module is connected with the input end of the instrument amplification module; the output end of the instrument amplification module is connected with the input end of the program control amplification module; the output end of the program control amplification module is connected with the input end of the active band-pass filtering module; the output end of the active band-pass filtering module is connected with the input end of the 16-bit bipolar ADC; the output end of the 16-bit bipolar ADC is connected with the acquisition interface end of the FPGA; the FPGA is connected with an SPI interface of the MSP430 singlechip through the SPI interface; the MSP430 singlechip has an I/O1 end connected with the control end of the analog switch module, an I/O2 end connected with the control end of the program control amplification module, and an I/O3 end connected with the input end of the standard signal generation module.
The standard signal generation module comprises: the device comprises a waveform generation submodule, a single-end slip molecule module, a voltage following submodule and a resistance attenuation submodule;
the input end of the waveform generation submodule is used as the input end of the standard signal generation module; the output end of the waveform generation submodule is connected with the input end of the single-ended slip molecule module; the output end of the single-ended slip molecule module is connected with the input end of the voltage following submodule; the output end of the voltage following submodule is connected with the input end of the resistance attenuation submodule; and the output end of the resistance attenuation submodule is used as a differential signal output end of the standard signal generation module.
As shown in fig. 2, the resistance attenuation submodule includes: a resistor R1, a resistor R2, a resistor R3, a resistor R4, a ground resistor R5, a ground resistor R6, a resistor R7, a resistor R8, a resistor R9, a resistor R10, a ground resistor R11, a ground resistor R12, a ground resistor R13, a ground resistor R14, a ground resistor R15 and a ground resistor R16;
one end of the resistor R1 is used as an input end IN1 of the resistance attenuation submodule, and the other end of the resistor R1 is respectively connected with one end of a resistor R2 and a grounding resistor R5; one end of the resistor R7 is used as an input end IN2 of the resistance attenuation submodule, and the other end of the resistor R7 is respectively connected with one end of a grounding resistor R6 and one end of a resistor R8; the other end of the resistor R2 is respectively connected with one end of a resistor R3 and a grounding resistor R11; the other end of the resistor R3 is respectively connected with one end of a resistor R4 and a grounding resistor R13; the other end of the resistor R4 is connected with a grounding resistor R15 and serves as an output end OUT1 of the resistance attenuation submodule; the other end of the resistor R8 is respectively connected with one end of a grounding resistor R12 and one end of a resistor R9; the other end of the resistor R9 is respectively connected with one end of a grounding resistor R14 and one end of a resistor R10; the other end of the resistor R10 is connected with a grounding resistor R16 and serves as an output end OUT2 of the resistance attenuation submodule;
the input end IN1 of the resistance attenuation submodule and the input end IN2 of the resistance attenuation submodule are used as the input ends of the resistance attenuation submodule; and the output end OUT1 of the resistance attenuation submodule and the output end OUT2 of the resistance attenuation submodule are used as output ends of the resistance attenuation submodule.
As shown in fig. 2, attenuation is realized by using a resistor voltage division mode, the module can realize voltage attenuation of 20 times, 200 times, 2000 times and 6000 times, the minimum peak value of the output signal voltage is 0.1 millivolt, and the attenuated signal is used as a standard sinusoidal signal of equipment, so that the accuracy and stability of the signal are crucial to a system, and resistors in the resistor attenuation submodule all adopt low-temperature drift precision resistors (the error is 0.1%, and the temperature characteristic is 10 PPM/DEG C means that the resistance value changes in parts per million under the unit temperature change).
The node voltage at which the resistor R1 and the resistor R2 are connected attenuates with respect to the input terminal IN 1: { { [ (R15+ R4)// R13+ R3]// R11} + R2}// R5/{ [ (R15+ R4)// R13+ R3]// R11} + R2}// R5+ R1 ≈ 20. // denotes parallel/denotes division.
In this embodiment, the MSP430 single-chip microcomputer controls the waveform generation submodule to generate a standard sinusoidal signal, the peak value of an output signal of the waveform generation submodule is about 600 mv, the output signal is amplified and converted into a differential signal through the single-end slip molecule module, then the differential signal is input into the resistance attenuation submodule through the isolation of the voltage following submodule, and finally the standard sinusoidal signal of 3 mv, 0.3 mv and 0.1 mv can be output.
As shown in fig. 3, a method for using an ultra-deep metal pipeline burial depth detection device includes the following steps:
s1, controlling the analog switch module through the MSP430 singlechip, inputting a grounding signal, and measuring a zero drift voltage U1 output by the active band-pass filter module;
s2, acquiring a magnetic field intensity electric signal in the X, Y, Z direction by adopting a three-dimensional vector probe;
s3, controlling the analog switch module through the MSP430 singlechip, inputting the magnetic field intensity electric signal into the instrument amplification module, and measuring the output voltage U2 of the active band-pass filter module;
s4, subtracting the zero drift voltage U1 from the output voltage U2 to obtain an amplitude value U' of the magnetic field intensity electric signal output by the probe;
s5, generating a standard sinusoidal signal through a standard signal generation module, and correcting the amplitude value U 'of the electric signal of the magnetic field intensity output by the probe to obtain an amplitude correction value U' of the electric signal of the magnetic field intensity output by the probe;
step S5 includes the following substeps:
s51, generating a standard sinusoidal signal through a standard signal generation module, controlling an analog switch module through an MSP430 singlechip, inputting the standard sinusoidal signal into an instrument amplification module, and measuring the output voltage U3 of the active band-pass filter module;
s52, obtaining a system gain through the output voltage U3 and the zero drift voltage U1;
and S53, correcting the amplitude value U 'of the electric signal of the magnetic field intensity output by the probe according to the system gain to obtain an amplitude correction value U' of the electric signal of the magnetic field intensity output by the probe.
S6, collecting the amplitude correction value U ' through the 16-bit bipolar ADC, detecting through the FPGA to obtain an amplitude accurate value U ', and transmitting the amplitude accurate value U ' to a receiver through the MSP430 single chip microcomputer to finish the use of the ultra-deep metal pipeline buried depth detection equipment.
Step S6 includes the following substeps:
s61, acquiring an amplitude correction value U' by driving a 16-bit bipolar ADC through the FPGA to obtain amplitude data;
s62, generating a sine table and a cosine table which have the same frequency with the electric signal of the magnetic field intensity output by the probe;
s63, multiplying the amplitude data by the data in the sine table and the data in the cosine table respectively to obtain first amplitude modulation data and second amplitude modulation data which have a phase difference of 180 degrees with the first amplitude modulation data;
in step S63, the method of multiplying the amplitude data by the data in the sine table and the data in the cosine table respectively includes: and acquiring amplitude data of corresponding quantity according to the sampling times of the 16-bit bipolar ADC in a sampling period, and multiplying all the amplitude data with data in a sine table and data in a cosine table in sequence according to time in a row one-to-one correspondence manner to obtain first amplitude modulation data and second amplitude modulation data which are 180 degrees different from the first amplitude modulation data.
S64, accumulating and averaging the first amplitude modulation data and the second amplitude modulation data in one sampling period to obtain a first accumulated average amplitude modulation value I and a second amplitude modulation accumulated average value Q;
s65, calculating an amplitude accurate value U 'of the amplitude correction value U' according to the first accumulated average amplitude modulation value I and the second amplitude modulation accumulated average value Q;
the formula for calculating the amplitude accurate value U' ″ of the amplitude correction value U ″ in step S65 is:
s66, transmitting the accurate amplitude value U 'to an MSP430 single chip microcomputer through an SPI protocol, and transmitting the accurate amplitude value U' of the magnetic field intensity electric signal output by the probe to a receiver through the MSP430 single chip microcomputer, so that the use of the ultra-deep metal pipeline burial depth detection equipment is completed.
Claims (8)
1. The utility model provides an ultra-deep metal pipeline burial depth check out test set which characterized in that includes: the system comprises a three-dimensional vector probe, an analog switch module, an instrument amplification module, a program control amplification module, an active band-pass filtering module, a 16-bit bipolar ADC, an FPGA, an MSP430 singlechip and a standard signal generation module;
the probe signal output end of the three-dimensional vector probe is connected with the first input end of the analog switch module; the second input end of the analog switch module is connected with the differential signal output end of the standard signal generation module, and the output end of the analog switch module is connected with the input end of the instrument amplification module; the output end of the instrument amplification module is connected with the input end of the program control amplification module; the output end of the program control amplification module is connected with the input end of the active band-pass filtering module; the output end of the active band-pass filtering module is connected with the input end of the 16-bit bipolar ADC; the output end of the 16-bit bipolar ADC is connected with the acquisition interface end of the FPGA; the FPGA is connected with an SPI interface of the MSP430 singlechip through the SPI interface; the MSP430 singlechip has an I/O1 end connected with the control end of the analog switch module, an I/O2 end connected with the control end of the program control amplification module, and an I/O3 end connected with the input end of the standard signal generation module.
2. The ultra-deep metal pipeline burial depth detection device of claim 1, wherein the standard signal generation module comprises: the device comprises a waveform generation submodule, a single-end slip molecule module, a voltage following submodule and a resistance attenuation submodule;
the input end of the waveform generation submodule is used as the input end of the standard signal generation module; the output end of the waveform generation submodule is connected with the input end of the single-ended slip molecule module; the output end of the single-ended slip molecule module is connected with the input end of the voltage following submodule; the output end of the voltage following submodule is connected with the input end of the resistance attenuation submodule; and the output end of the resistance attenuation submodule is used as a differential signal output end of the standard signal generation module.
3. The ultra-deep metal pipeline burial depth detection device of claim 2, wherein the resistance attenuation submodule comprises: a resistor R1, a resistor R2, a resistor R3, a resistor R4, a ground resistor R5, a ground resistor R6, a resistor R7, a resistor R8, a resistor R9, a resistor R10, a ground resistor R11, a ground resistor R12, a ground resistor R13, a ground resistor R14, a ground resistor R15 and a ground resistor R16;
one end of the resistor R1 is used as an input end IN1 of the resistance attenuation submodule, and the other end of the resistor R1 is respectively connected with one end of a resistor R2 and a grounding resistor R5; one end of the resistor R7 is used as an input end IN2 of the resistance attenuation submodule, and the other end of the resistor R7 is respectively connected with one end of a grounding resistor R6 and one end of a resistor R8; the other end of the resistor R2 is respectively connected with one end of a resistor R3 and a grounding resistor R11; the other end of the resistor R3 is respectively connected with one end of a resistor R4 and a grounding resistor R13; the other end of the resistor R4 is connected with a grounding resistor R15 and serves as an output end OUT1 of the resistance attenuation submodule; the other end of the resistor R8 is respectively connected with one end of a grounding resistor R12 and one end of a resistor R9; the other end of the resistor R9 is respectively connected with one end of a grounding resistor R14 and one end of a resistor R10; the other end of the resistor R10 is connected with a grounding resistor R16 and serves as an output end OUT2 of the resistance attenuation submodule;
the input end IN1 of the resistance attenuation submodule and the input end IN2 of the resistance attenuation submodule are jointly used as the input end of the resistance attenuation submodule; and the output end OUT1 of the resistance attenuation submodule and the output end OUT2 of the resistance attenuation submodule are jointly used as the output end of the resistance attenuation submodule.
4. The use method of the ultra-deep metal pipeline burial depth detection device according to claim 1, characterized by comprising the following steps:
s1, controlling the analog switch module through the MSP430 singlechip, inputting a grounding signal, and measuring a zero drift voltage U1 output by the active band-pass filter module;
s2, acquiring a magnetic field intensity electric signal in the X, Y, Z direction by adopting a three-dimensional vector probe;
s3, controlling the analog switch module through the MSP430 singlechip, inputting the magnetic field intensity electric signal into the instrument amplification module, and measuring the output voltage U2 of the active band-pass filter module;
s4, subtracting the zero drift voltage U1 from the output voltage U2 to obtain an amplitude value U' of the magnetic field intensity electric signal output by the probe;
s5, generating a standard sinusoidal signal through a standard signal generation module, and correcting the amplitude value U 'of the electric signal of the magnetic field intensity output by the probe to obtain an amplitude correction value U' of the electric signal of the magnetic field intensity output by the probe;
s6, collecting the amplitude correction value U ' through the 16-bit bipolar ADC, detecting through the FPGA to obtain an amplitude accurate value U ', and transmitting the amplitude accurate value U ' to a receiver through the MSP430 single chip microcomputer to finish the use of the ultra-deep metal pipeline buried depth detection equipment.
5. The use method of the ultra-deep metal pipeline burial depth detection device according to claim 4, wherein the step S5 includes the following sub-steps:
s51, generating a standard sinusoidal signal through a standard signal generation module, controlling an analog switch module through an MSP430 singlechip, inputting the standard sinusoidal signal into an instrument amplification module, and measuring the output voltage U3 of the active band-pass filter module;
s52, obtaining a system gain through the output voltage U3 and the zero drift voltage U1;
and S53, correcting the amplitude value U 'of the electric signal of the magnetic field intensity output by the probe according to the system gain to obtain an amplitude correction value U' of the electric signal of the magnetic field intensity output by the probe.
6. The use method of the ultra-deep metal pipeline burial depth detection device according to claim 4, wherein the step S6 includes the following sub-steps:
s61, acquiring an amplitude correction value U' by driving a 16-bit bipolar ADC through the FPGA to obtain amplitude data;
s62, generating a sine table and a cosine table which have the same frequency with the electric signal of the magnetic field intensity output by the probe;
s63, multiplying the amplitude data by the data in the sine table and the data in the cosine table respectively to obtain first amplitude modulation data and second amplitude modulation data which have a phase difference of 180 degrees with the first amplitude modulation data;
s64, accumulating and averaging the first amplitude modulation data and the second amplitude modulation data in one sampling period to obtain a first accumulated average amplitude modulation value I and a second amplitude modulation accumulated average value Q;
s65, calculating an amplitude accurate value U 'of the amplitude correction value U' according to the first accumulated average amplitude modulation value I and the second amplitude modulation accumulated average value Q;
s66, transmitting the accurate amplitude value U 'to an MSP430 single chip microcomputer through an SPI protocol, and transmitting the accurate amplitude value U' of the magnetic field intensity electric signal output by the probe to a receiver through the MSP430 single chip microcomputer, so that the use of the ultra-deep metal pipeline burial depth detection equipment is completed.
7. The use method of the ultra-deep metal pipeline burial depth detection device according to claim 6, wherein the step S63 of multiplying the amplitude data by the data in the sine table and the data in the cosine table respectively comprises the following steps: and acquiring amplitude data of corresponding quantity according to the sampling times of the 16-bit bipolar ADC in a sampling period, and multiplying all the amplitude data with data in a sine table and data in a cosine table in sequence according to time in a row one-to-one correspondence manner to obtain first amplitude modulation data and second amplitude modulation data which are 180 degrees different from the first amplitude modulation data.
8. The use method of the ultra-deep metal pipeline burial depth detection device according to claim 6, wherein the formula for calculating the amplitude accurate value U' "of the amplitude correction value U" in the step S65 is as follows:
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| KR100594349B1 (en) * | 2005-10-28 | 2006-06-30 | 한국지질자원연구원 | System and method for delineation of hvdc (high voltage direct current)cable/cast iron pipeline buried beneath the seafloor by vectoral 3-axis measurement of the magnetic field |
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