CN112326868A - Temperature measurement method and temperature measurement device based on integral metal structure - Google Patents
Temperature measurement method and temperature measurement device based on integral metal structure Download PDFInfo
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- CN112326868A CN112326868A CN202011241647.5A CN202011241647A CN112326868A CN 112326868 A CN112326868 A CN 112326868A CN 202011241647 A CN202011241647 A CN 202011241647A CN 112326868 A CN112326868 A CN 112326868A
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N31/00—Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroup; Apparatus specially adapted for such methods
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- G—PHYSICS
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Abstract
A temperature measurement method and a temperature measurement device based on an integral metal structure select a test carrier with the same material as a product to be researched, and divide the test carrier into a plurality of parts along the thickness direction; the method comprises the steps of arranging embedded grooves in at least one corresponding area on the outer side surface of each part, respectively carrying out heat insulation packaging on thermocouples in each embedded groove, coating a heat-proof material on the surface of a temperature sensing surface of a test carrier, packaging the surface where each embedded groove is located and the back surface of the temperature sensing surface by using cover plates, connecting the cover plates on the back surfaces of the temperature sensing surfaces by using connecting pieces in a sealing manner, connecting compensation wires of the thermocouples with thermocouple connectors after penetrating out of central holes of the connecting pieces through protective sleeves in a sealing manner, connecting the thermocouple connectors with a data acquisition system, carrying out high-temperature ablation on the test carrier, and transmitting temperature measurement data to the data acquisition system in real time by each. The invention can accurately acquire test data on the premise of not damaging the whole metal structure, can be applied to testing different metal structures, and has low price.
Description
Technical Field
The invention relates to the technical field of temperature measurement, in particular to a gradient temperature measurement method and a temperature measurement device based on an integral metal structure.
Background
Weapons, carrying model launching devices and launching and bearing devices are mostly metal structure products, and the reasonability and reliability of product structure design are main technical indexes of product design and assessment. The related technical index examination usually passes through simulation load verification in a normal temperature environment, but the structure needs to bear the high-temperature ablation load effect in the launching process. The structural rigidity and the strength performance of the metal structure product are changed in a high-temperature environment, meanwhile, structural thermal protection treatment is needed in a high-temperature ablation environment, and the metal structure heat transfer data need to be accurately acquired in thermal protection material performance evaluation.
Therefore, how to design a temperature measurement method and a temperature measurement device based on the integral metal structure for the performance research of the metal ablation-proof material by measuring the temperature change data of different sections of the integral metal structure in the high-temperature ablation process and a certain time after the high-temperature ablation on the premise of not damaging the integral metal structure is the subject of the intensive research of the inventor.
Disclosure of Invention
The invention aims to provide a temperature measuring method and a temperature measuring device based on an integral metal structure, which can accurately acquire test data of a metal structure to be researched on the premise of not damaging the integral metal structure, can be applied to heat transfer performance tests of different metal structures, can repeatedly perform test tests and has low cost.
In order to achieve the purpose, the technical solution of the invention is as follows: a temperature measurement method based on an integral metal structure is characterized in that a test carrier which is the same as a material of a product to be researched is selected, and the test carrier is divided into a plurality of parts along the thickness direction; the method comprises the steps of respectively arranging embedded grooves in at least one corresponding area on the outer side surface of each divided part, respectively packaging and fixing thermocouples of a temperature sensor in each embedded groove in a heat insulation mode, coating heat-proof materials on the other surfaces of a test carrier except a temperature sensing surface, packaging the surface where each embedded groove is located and the back surface of the temperature sensing surface by using cover plates, connecting the cover plates on the back surface of the temperature sensing surface in a sealing mode by using connecting pieces, connecting compensation leads connected with the thermocouples with each thermocouple connector after penetrating out of a central hole of the connecting pieces in a sealing mode through protective sleeves, connecting each thermocouple connector with a data acquisition system, and transmitting temperature measurement data to the data acquisition system in real time through each thermocouple in a preset time after an ablation process and ablation after the test carrier is ablated.
The invention is based on an integral metal structure temperature measurement method, wherein the temperature sensing surface of the test carrier and the back surface shape of the temperature sensing surface are the same as the corresponding surface shape of the researched product.
The invention is based on an integral metal structure temperature measurement method, wherein the test carrier is uniformly divided into a plurality of parts along the thickness direction, and the embedded groove is positioned in the middle part of the test carrier in the thickness direction of the divided parts.
The invention is based on an integral metal structure temperature measurement method, wherein a K-type thermocouple is adopted as the thermocouple, and the diameter of a thermocouple wire of the thermocouple is 0.08-0.2 mm.
The invention is based on an integral metal structure temperature measurement method, wherein the aperture of the embedded groove is matched with the diameter of the thermocouple, and the thermocouple is inserted into the embedded groove and is sealed and fixed in the embedded groove in a glue pouring mode.
The invention is based on an integral metal structure temperature measurement method, wherein the depths of all embedded grooves in corresponding areas on all divided parts of the test carrier are set to be equal, and the depths of all thermocouples inserted into the embedded grooves are equal.
A temperature measuring device based on an integral metal structure comprises a test carrier, wherein at least one group of embedded groove groups are arranged on the outer side surface of the test carrier, each embedded groove group is composed of a plurality of embedded grooves which are uniformly arranged along the thickness direction of the test carrier at intervals, thermocouples of a temperature sensor are fixed in the embedded grooves in a heat insulation packaging mode respectively, heat-proof layers are arranged on the surfaces, except a temperature sensing surface, of the test carrier respectively, the surface where the embedded grooves are located and the back surface of the temperature sensing surface are in heat insulation packaging through cover plates respectively, connecting pieces are connected to the cover plates on the back surface of the temperature sensing surface in a sealing mode, compensation wires connected with the thermocouples penetrate through a central hole of the connecting pieces through the outer surface of the test carrier in a sealing mode through protective sleeves and then are connected with thermocouple connectors, and each thermocouple connector is connected with.
The invention is based on an integral metal structure temperature measuring device, wherein the depths of a plurality of embedded grooves of each group are set to be equal, and the depths of the thermocouples inserted into the embedded grooves are equal.
The invention is based on an integral metal structure temperature measuring device, wherein the outer side surface of the test carrier and the back surface of the temperature sensing surface are respectively provided with a wire groove for the compensation wire to pass through.
The invention relates to a temperature measuring device based on an integral metal structure, wherein a glue filling layer is arranged between each cover plate and the surface corresponding to a test carrier, and the cover plates and the test carrier are fixedly connected through a plurality of detachable connecting pieces.
After the scheme is adopted, on the premise of not damaging the integral metal structure of the test carrier, the temperature change data of different sections of the test carrier in the high-temperature ablation process and within a certain time after the high-temperature ablation can be conveniently measured based on the integral metal structure thermometry method, the thermocouples for measuring the temperature of the sections are tightly attached to the inner surface of the metal structure, and the heat-proof materials are coated on the surfaces of different areas, so that the dynamic temperature data of the different sections of the test carrier metal structure in the heat ablation process can be accurately obtained, the method can be used for the performance research of the metal ablation-proof materials, and also provides accurate data for the screening of the heat-proof materials, and can be applied to the heat transfer performance test of different metal structures; the temperature measuring device has simple structural design, convenient operation and installation, repeated test and low cost.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of a temperature measuring device based on an integral metal structure according to the present invention;
FIG. 2 is a schematic view of a connection structure between a cover plate and a test carrier of a thermal protection structure of a temperature measuring device according to the present invention;
FIG. 3 is a schematic diagram of a side view connection structure of a test carrier, a thermocouple and a screw of the temperature measuring device of the present invention;
FIG. 4 is a rear view of the connecting structure of the test carrier, the thermocouple and the screw of the temperature measuring device of the present invention.
The invention is further explained by embodiments in the following with reference to the drawings;
Detailed Description
As shown in fig. 1 to 4, the temperature measuring device based on the monolithic metal structure of the present invention includes a test carrier 1, and the test carrier 1 of this embodiment is a square plate structure. At least one group of embedded slot groups is arranged on the outer side surface of the upper edge of the test carrier 1, and four groups of embedded slot groups are symmetrically arranged on the left and right sides of the embodiment. Each embedded groove group comprises a plurality of embedded grooves 2 along the thickness direction of the test carrier 1 and in the same region, the embedded grooves 2 are arranged evenly and at intervals, and each embedded groove group comprises three embedded grooves 2. The depth setting of a plurality of buried grooves 2 of each buried groove group equals, and thermal-insulated encapsulation is fixed with temperature sensor respectively in each buried groove 2, and this embodiment temperature sensor adopts thermocouple temperature sensor, and the thermal-insulated encapsulation of temperature sensor's thermocouple 3 is fixed in buried groove 2, and thermal-insulated encapsulation is realized through the high temperature glue of embedment toward buried groove 3 to thermocouple 3 promptly. The thermocouples 3 are inserted into the embedding grooves 2 to the same depth. In the present embodiment, the thermocouple 3 is a K-type thermocouple, the diameter of the thermocouple wire of the thermocouple 3 is 0.08-0.2mm, preferably 0.08mm, and the response time is less than 20 ms.
The heat-proof layers are respectively arranged on the other surfaces of the test carrier 1 except the temperature sensing surface, and the temperature sensing surface of the test carrier 1 is the front surface in the embodiment, so that the heat-proof layers are respectively formed on the back surface (namely the back surface), the upper side surface, the lower side surface, the left side surface and the right side surface of the temperature sensing surface of the test carrier 1 by coating heat insulation materials or winding silicon rubber glass cloth, and the like, and the influence of the temperature sensing around the test carrier 1 on the test temperature data is reduced.
Referring to fig. 2, the back of the temperature sensing surface and the surface of the embedded groove 2 on the test carrier 1 are respectively heat-insulated and packaged by the first cover plate 5 and the second cover plate 6, in this embodiment, the heat-insulated and packaged by the first cover plate 5 are respectively realized on the left side and the right side of the test carrier 1, and the heat-insulated and packaged by the second cover plate 6 is realized on the rear surface of the test carrier 1, and the specific operation mode is as follows: the two first cover plates 5 are fixedly connected with the left side surface and the right side surface of the test carrier 1 through a plurality of bolts 7 respectively, and the second cover plate 6 is fixedly connected with the rear surface of the test carrier 1 through a plurality of bolts 7. And high-temperature epoxy glue is filled and sealed in the spaces between the test carrier 1 and the first cover plates 5 and between the test carrier 1 and the second cover plates 6 to form glue filling layers, so that the test carrier 1, the first cover plates 5 and the second cover plates 6 are sealed and insulated.
Referring to fig. 3 and 4, the outer side surface and the rear surface of the test carrier 1 are respectively provided with a plurality of wire slots 9 through which the compensation wires 8 connected to the thermocouple 3 pass.
The second cover plate 6 is hermetically connected with a connecting piece, the connecting piece of the embodiment adopts a screw rod 10 with a central hole, the screw rod 10 and the second cover plate 6 are hermetically fixed through screwing, a compensation lead 8 connected with each thermocouple 3 penetrates out of a wire groove 9 on the test carrier 1, is sheathed and protected by a protection sleeve 11, penetrates out of the central hole of the screw rod 10 in a sealing manner and is connected with a thermocouple connector 12, and each thermocouple connector 12 is connected with a data acquisition system.
The temperature measuring method based on the integral metal structure comprises the following steps: the test carrier 1 is made of the same material as the product to be researched (the wall of the launching device), the test carrier 1 of the embodiment is made of a square plate block structure as shown in fig. 1, the shape processing of the front surface (used as a temperature sensing surface) and the shape processing of the back surface of the test carrier 1 are the same as the shape processing of the corresponding surface of the product to be researched, so that the structure of the launching device is simulated to the maximum extent, meanwhile, the precise attachment of an installation surface is facilitated, and the influence on the accuracy of test data caused by the heat transfer of high-temperature airflow from the back surface of the temperature sensing surface of the. Other similar test application requirements may be based on the structure design test carrier of the product under study.
Dividing the test carrier 1 into a plurality of parts along the thickness direction, wherein the test carrier 1 is uniformly divided into three parts along the thickness direction in the embodiment; the embedded grooves 2 are respectively machined in at least one corresponding area on the outer side surface of each partition part, four embedded grooves 2 are symmetrically machined on the left and right sides of the outer side surface of each partition part in the embodiment, and each embedded groove is located in the middle of the test carrier 1 in the thickness direction of the partition part. Three embedded grooves 2 in the same area of the three divided parts form an embedded groove group.
And (3) respectively packaging and fixing thermocouples 3 of the temperature sensors in each embedded groove 2 in a heat insulation manner, wherein the thermocouples 3 adopt K-type thermocouples as shown in the figure 1, have wide temperature sensing intervals, are easy to check at normal temperature, and have the function of sensing the measured temperature in time, the diameter of the thermocouple wires of the thermocouple 3 is 0.08mm, and the response time is less than 20 ms. The aperture of the embedded groove 2 is matched with the diameter of the thermocouple wire of the thermocouple 3, and the thermocouple 3 is tightly inserted into the embedded groove 2 and is sealed and fixed in the embedded groove 2 in a high-temperature glue pouring mode. The depths of the three embedded grooves 2 in the corresponding areas on the three divided parts of the test carrier 1 are equal, and the depths of the thermocouples 3 inserted into the embedded grooves 2 are also equal.
The test carrier 1 except the temperature sensing surface is coated with a heat-proof material, in this embodiment, the rear surface, the upper side surface, the lower side surface, the left side surface and the right side surface of the test carrier 1 are respectively coated with a heat-proof material, or a silicon rubber glass cloth winding manner or the like can be adopted for heat-proof.
And then, the surface of each embedded groove 2 and the back of the temperature sensing surface are packaged by cover plates, in the embodiment, the heat insulation packaging is realized on the left side surface and the right side surface of the test carrier 1 through the first cover plate 5, the heat insulation packaging is realized on the rear surface of the test carrier 1 through the second cover plate 6, and the specific operation mode is as follows: the two first cover plates 5 are fixedly connected with the left side surface and the right side surface of the test carrier 1 through a plurality of bolts 7 respectively, and the second cover plate 6 is fixedly connected with the rear surface of the test carrier 1 through a plurality of bolts 7. And high-temperature epoxy glue is filled and sealed in the spaces between the test carrier 1 and the first cover plates 5 and between the test carrier 1 and the second cover plates 6 to form glue filling layers, so that the test carrier 1, the first cover plates 5 and the second cover plates 6 are sealed and insulated.
The second cover plate 6 of the test carrier 1 is connected in a sealing manner by a connecting piece, the connecting piece of the embodiment adopts a screw rod 10 with a central hole, the screw rod 10 and the second cover plate 6 are fixed in a sealing manner by screwing, a compensation lead 8 connected on each thermocouple 3 penetrates out from a wire groove 9 on the test carrier 1, penetrates out from the central hole of the screw rod 10 in a sealing manner through the sleeving protection of a protection sleeve 11, is finally connected with a thermocouple connector 12, and then each thermocouple connector 12 is connected with a data acquisition system.
In the process, the binding surfaces of the test carrier 1 and other components of the temperature measuring device are insulated by asbestos cloth.
When the temperature is tested, the temperature sensing surface facing the test carrier 1 is ablated by high temperature, and the temperature measurement data is transmitted to the data acquisition system in real time through each thermocouple 3 in the high-temperature ablation process of the test carrier 1 and in the preset time after ablation, so that the temperature change data of different sections of the test carrier 1 in the ablation process can be accurately acquired, and accurate data is provided for the structure development of a product to be researched and the research and selection of the performance of the thermal ablation resistant material.
Coating heat-proof materials on the other surfaces of the test carrier except the temperature sensing surface, packaging the surface of each embedded groove and the back surface of the temperature sensing surface by cover plates, sealing and connecting the cover plates on the back surface of the temperature sensing surface by a connecting piece, sealing and penetrating a compensation lead connected with each thermocouple out of a central hole of the connecting piece through a protective sleeve, connecting each thermocouple connector with a data acquisition system, ablating the test carrier through high temperature, and transmitting temperature measurement data to the data acquisition system in real time through each thermocouple in the ablation process and in the preset time after ablation.
On the premise of not damaging the integral metal structure of the test carrier 1, the invention can conveniently measure the data of temperature changes of different sections of the test carrier 1 in the high-temperature ablation process and within a certain time after the high-temperature ablation, the thermocouples 3 for measuring the temperature of each section are tightly attached to the inner surface of the test carrier 1, and the heat-proof materials are coated on the surfaces of different areas, so that the dynamic temperature data of different sections of the test carrier 1 in the heat ablation process can be accurately obtained, therefore, the invention not only can be used for the performance research of the metal anti-ablation materials, but also provides accurate data for the screening of the heat-proof materials, and can be applied to the heat transfer performance test of different metal structures; the temperature measuring device has simple structural design, convenient operation and installation, repeated test and low cost.
The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements made to the technical solution of the present invention by those skilled in the art without departing from the spirit of the present invention shall fall within the protection scope defined by the claims of the present invention.
Claims (10)
1. A temperature measurement method based on an integral metal structure is characterized in that: selecting a test carrier with the same material as a product to be researched, and dividing the test carrier into a plurality of parts along the thickness direction; the method comprises the steps of respectively arranging embedded grooves in at least one corresponding area on the outer side surface of each divided part, respectively packaging and fixing thermocouples of a temperature sensor in each embedded groove in a heat insulation mode, coating heat-proof materials on the other surfaces of a test carrier except a temperature sensing surface, packaging the surface where each embedded groove is located and the back surface of the temperature sensing surface by using cover plates, connecting the cover plates on the back surface of the temperature sensing surface in a sealing mode by using connecting pieces, connecting compensation leads connected with the thermocouples with each thermocouple connector after penetrating out of a central hole of the connecting pieces in a sealing mode through protective sleeves, connecting each thermocouple connector with a data acquisition system, and transmitting temperature measurement data to the data acquisition system in real time through each thermocouple in a preset time after an ablation process and ablation after the test carrier is ablated.
2. The monolithic metal structure based temperature measurement method of claim 1, wherein the temperature sensing surface of the test carrier and the back surface of the temperature sensing surface are the same as the corresponding surface shape of the product under study.
3. The bulk metal structure based temperature measurement method according to claim 1, wherein the test carrier is divided into a plurality of parts uniformly in the thickness direction, and the pre-buried groove is located at the middle part of the divided part of the test carrier in the thickness direction.
4. The bulk metal structure based temperature sensing method of claim 1, wherein the thermocouple is a K-type thermocouple, and a wire diameter of the thermocouple is 0.08-0.2 mm.
5. The temperature measurement method based on the integral metal structure as claimed in claim 1, wherein the diameter of the pre-buried groove is matched with the diameter of the thermocouple, and the thermocouple is inserted into the pre-buried groove and is sealed and fixed in the pre-buried groove in a glue filling mode.
6. The temperature sensing method based on a monolithic metal structure according to claim 1, wherein the depths of all the pre-buried grooves in the corresponding areas on the divided parts of the test carrier are set to be equal, and the depths of the thermocouples inserted into the pre-buried grooves are equal.
7. A temperature measuring device based on an integral metal structure is characterized by comprising a test carrier, wherein at least one group of embedded groove groups are arranged on the outer side surface of the test carrier along the outer side surface, each embedded groove group consists of a plurality of embedded grooves which are uniformly arranged along the thickness direction of the test carrier at intervals, a thermocouple of a temperature sensor is respectively packaged and fixed in each embedded groove in a heat insulation way, the other surfaces of the test carrier except the temperature sensing surface are respectively provided with a heat-proof layer, the surface of the embedded groove and the back surface of the temperature sensing surface are respectively packaged by a cover plate in a heat insulation way, the cover plate on the back of the temperature sensing surface is hermetically connected with a connecting piece, a compensation lead connected with each thermocouple penetrates out of a central hole of the connecting piece through the outer surface of the test carrier through a protection sleeve in a sealing mode and then is connected with a thermocouple connector, and each thermocouple connector is connected with a data acquisition system.
8. The unitary metal structure-based temperature measuring device of claim 7, wherein the depths of said plurality of said fastener slots of each set are equally set, and the depths of said thermocouples inserted into said fastener slots are equally set.
9. The temperature measuring device based on the integral metal structure as claimed in claim 7, wherein the outer side surface of the test carrier and the back surface of the temperature sensing surface are respectively provided with a wire groove for the compensation wire to pass through.
10. The unitary metal structure-based temperature measuring device of claim 7, wherein a potting layer is disposed between each cover plate and the surface corresponding to the test carrier, and the cover plates are fixedly connected to the test carrier by a plurality of detachable connectors.
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| CN110726488A (en) * | 2019-10-24 | 2020-01-24 | 中国核动力研究设计院 | Temperature measuring device resistant to high-speed fluid scouring in narrow channel and assembling process |
| CN111308011A (en) * | 2020-03-18 | 2020-06-19 | 浙江大学 | Method for quantitatively evaluating ablation resistance of material |
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