CN112325692A - Heat exchange system with upper structure and lower structure for double-liquid-tank semiconductor processing device - Google Patents
Heat exchange system with upper structure and lower structure for double-liquid-tank semiconductor processing device Download PDFInfo
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- CN112325692A CN112325692A CN202011209123.8A CN202011209123A CN112325692A CN 112325692 A CN112325692 A CN 112325692A CN 202011209123 A CN202011209123 A CN 202011209123A CN 112325692 A CN112325692 A CN 112325692A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B1/00—Methods of steam generation characterised by form of heating method
- F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B37/00—Component parts or details of steam boilers
- F22B37/02—Component parts or details of steam boilers applicable to more than one kind or type of steam boiler
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28B—STEAM OR VAPOUR CONDENSERS
- F28B1/00—Condensers in which the steam or vapour is separate from the cooling medium by walls, e.g. surface condenser
- F28B1/02—Condensers in which the steam or vapour is separate from the cooling medium by walls, e.g. surface condenser using water or other liquid as the cooling medium
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28B—STEAM OR VAPOUR CONDENSERS
- F28B9/00—Auxiliary systems, arrangements, or devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
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- General Engineering & Computer Science (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the technical field of heat exchange, in particular to a heat exchange system for a double-liquid-tank semiconductor processing device with an upper structure and a lower structure, which comprises a liquid supply tank, a liquid supply pipe, a heating liquid tank, a heating wire, an exhaust pipe, a circulating liquid outlet pipe, a circulating liquid return pipe, a cooling water outlet pipe, a cooling water return pipe and a heat exchanger; the heating device comprises a heating liquid tank, a circulating liquid outlet pipe, a liquid supply tank, a heating liquid tank, a circulating liquid outlet pipe, a heating wire and a heating wire, wherein the liquid supply tank is communicated with the heating liquid tank through a liquid supply pipe; a circulating water pump is arranged on the circulating liquid outlet pipe, and part of pipelines of the circulating liquid outlet pipe are laid in the heat exchanger; and a pipeline of a partial cooling water return pipe is laid in the heat exchanger, and the cooling water return pipe is communicated with the cooling water outlet pipe.
Description
Technical Field
The invention belongs to the technical field of heat exchange, and particularly relates to a heat exchange system for a double-liquid-tank semiconductor processing device with an upper structure and a lower structure.
Background
Heat exchange is the process of heat transfer between two objects or parts of the same object due to temperature differences. Heat exchange is generally accomplished by three means, heat conduction, heat convection, and heat radiation.
The common heat exchange system is mostly used for heat exchange near normal temperature, and high-temperature evaporation and low-temperature condensation phenomena can occur in a single liquid tank structure when high temperature (for example, 40 ℃ to 300 ℃) or low temperature (for example, 120 ℃ to 5 ℃) is required; the high-temperature evaporation can lead the circulating liquid to be consumed too early, so that the loss and waste of the circulating liquid are caused, the operation cost is improved, and the liquid vapor is discharged into the production space to influence the environment of the production space; low temperature condensation can cause the circulating liquid to condense water vapor from the air, which affects the physical and chemical properties of the circulating liquid, and can cause ice formation on the cold surface of the plate heat exchanger or the coil heat exchanger, which affects the heat exchange efficiency of the heat exchanger and the service life of the heat exchanger.
Disclosure of Invention
To overcome the disadvantages of the prior art and to solve the problems described in the background, the present invention provides a heat exchange system for a two-tank semiconductor processing apparatus having a top-bottom structure.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a heat exchange system for a double-liquid-tank semiconductor processing device with an upper structure and a lower structure, which comprises a liquid supply tank, a liquid supply pipe, a heating liquid tank, a heating wire, an exhaust pipe, a circulating liquid outlet pipe, a circulating liquid return pipe, a cooling water outlet pipe, a cooling water return pipe and a heat exchanger, wherein the liquid supply tank is connected with the heating liquid tank through the heating wire; the heating device comprises a heating liquid tank, a circulating liquid outlet pipe, a liquid supply tank, a heating liquid tank, a circulating liquid outlet pipe, a heating wire and a heating wire, wherein the liquid supply tank is communicated with the heating liquid tank through a liquid supply pipe; a circulating water pump is arranged on the circulating liquid outlet pipe, and part of pipelines of the circulating liquid outlet pipe are laid in the heat exchanger; and a pipeline of a partial cooling water return pipe is laid in the heat exchanger, and the cooling water return pipe is communicated with the cooling water outlet pipe.
Preferably, a stirring mechanism is arranged in the heating liquid tank; the stirring and mixing mechanism is used for mixing the circulating liquid in the liquid supply tank with the circulating liquid in the heating liquid tank and comprises a driving fan, a driven fan, a connecting rod and a fixing rod; the connecting rod passes through on the fixed heating fluid reservoir inside wall of a plurality of dead levers, and the connecting rod articulates the tip at the dead lever, and the one end of connecting rod is located the exit position that the circulating liquid returned the liquid pipe, and the one end rigid coupling of connecting rod initiative fan, a plurality of driven fans of rigid coupling on the outer lane of connecting rod.
Preferably, the heat exchange system further comprises a temperature sensor, a Y-shaped filter and a flow meter for detecting flow based on the temperature sensor; the temperature sensor is arranged on the circulating liquid outlet pipe and used for detecting the temperature of the circulating liquid; the flowmeter is arranged on the circulating liquid return pipe, the Y-shaped filter is arranged on one side of the water inlets of the circulating liquid return pipe and the cooling water return pipe, and the Y-shaped filter is used for filtering impurities in the circulating liquid.
Preferably, the physical position height of the bottom surface of the liquid supply liquid tank is higher than the physical position height of the upper end surface of the heating liquid tank.
Preferably, one end of the liquid supply pipe is communicated with the inner bottom of the liquid supply tank, and the other end of the liquid supply pipe is communicated with the inner top of the heating tank.
Preferably, one end of the exhaust pipe is positioned at the top of the heating liquid tank, and the other end of the exhaust pipe is positioned above the liquid level in the liquid supply liquid tank.
Preferably, a float switch for detecting the liquid level is arranged in the liquid supply tank, and a plurality of floating balls are arranged on the float switch.
Preferably, manual valves are arranged on the circulating liquid outlet pipe, the circulating liquid return pipe, the cooling water outlet pipe and the cooling water return pipe, and the manual valves on the circulating liquid return pipe and the cooling water return pipe are located at the downstream position of the Y-shaped filter.
Preferably, the surface of a part of pipeline positioned in the heat exchanger on the circulating liquid outlet pipe is an uneven surface; the surface of a part of pipelines positioned in the heat exchanger on the cooling water return pipe is also an uneven surface.
The invention has the technical effects and advantages that:
the double-liquid-tank structure utilizes the characteristic that the upper part liquid supply tank does not participate in circulation, the liquid supply tank supplies liquid to the heating tank, the liquid supply tank plays an isolation role between circulating liquid and air, the problem of too early consumption of the circulating liquid caused by high-temperature evaporation in a high-temperature circulation process is solved, vapor evaporated by the liquid is recycled to the liquid supply tank through the exhaust pipe, recycling of the circulating liquid is realized, meanwhile, the problem that the physical and chemical characteristics of the circulating liquid are influenced due to the fact that the circulating liquid is condensed from the air by low-temperature condensation in a low-temperature circulation process is solved, and the phenomenon of freezing on the cold surface of a plate heat exchanger or a coil heat exchanger is avoided.
The rotation of the driving fan and the driven fan in the stirring mechanism stirs the kinetic energy of the circulating liquid flowing into the heating liquid tank from the circulating liquid return pipe, other energy sources are not used for driving the driving fan and the driven fan, the rotation of the driving fan and the driven fan stirs the mixture for accelerating, the heating efficiency is improved, the energy sources are saved, and the cost is increased.
Drawings
The invention is further described with reference to the following figures and embodiments.
FIG. 1 is a block diagram of a heat exchange system of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is an enlarged view of a portion of FIG. 1 at B;
FIG. 4 is an enlarged view of a portion of FIG. 1 at C;
FIG. 5 is an enlarged view of a portion of FIG. 1 at D;
in the figure: the device comprises a liquid supply tank 1, a float switch 11, a float 111, a liquid supply pipe 2, a heating liquid tank 3, a heating wire 31, an exhaust pipe 32, a circulating liquid outlet pipe 4, a circulating water pump 41, a temperature sensor 42, a circulating liquid return pipe 5, a Y-shaped filter 51, a flow meter 52, a cooling water outlet pipe 6, a cooling water return pipe 7, a manual valve 71, a heat exchanger 8, a mixing mechanism 9, a driving fan 91, a driven fan 92, a connecting rod 93 and a fixing rod 94.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the following embodiments.
As shown in fig. 1 to 5, the heat exchange system for a dual-tank semiconductor processing apparatus with a vertical structure according to the present invention includes a liquid supply tank 1, a liquid supply pipe 2, a heating liquid tank 3, a heating wire 31, an exhaust pipe 32, a circulating liquid outlet pipe 4, a circulating liquid return pipe 5, a cooling water outlet pipe 6, a cooling water return pipe 7, and a heat exchanger 8; the liquid supply tank 1 is communicated with the heating liquid tank 3 through the liquid supply pipe 2, the heating liquid tank 3 is communicated with the liquid supply tank 1 through the exhaust pipe 32, a heating wire 31 is arranged in the heating liquid tank 3, the heating wire 31 extends into the heating liquid tank 3 and carries out heating treatment on liquid in the heating liquid tank 3, one side of the heating liquid tank 3 is communicated with one end of a circulating liquid outlet pipe 4, and the other side wall of the heating liquid tank 3 is communicated with one end of the circulating liquid outlet pipe 4; part of the pipeline of the circulating liquid outlet pipe 4 is laid in the heat exchanger 8; a pipeline of a partial cooling water return pipe 7 is laid in the heat exchanger 8, and the cooling water return pipe 7 is communicated with the cooling water outlet pipe 6; cooling water flows in through a cooling water liquid return pipe 7 and then flows out through a cooling water liquid outlet pipe 6, and when the cooling water flows through a heat exchanger 8, the cooling water carries out cold and heat exchange treatment on circulating liquid flowing into the heating liquid tank 3 from a circulating liquid return pipe 5, the circulating liquid is pumped out from the heating liquid tank 3, flows into the heat exchanger 8 to carry out heat exchange with the cooling water, finally flows out through a circulating liquid outlet pipe 4, and returns to the heat exchange system again after flowing through all cavities of the semiconductor processing equipment;
when the heating wire 31 in the heating liquid pipe heats the circulating liquid again, part of the circulating liquid is in a steam state and is discharged into the liquid supply tank 1 through the exhaust pipe 32, and the steam is liquefied after encountering the circulating liquid at the natural environment temperature, so that the problems of premature consumption of the circulating liquid and external discharge of the steam are solved, the problems that the circulating liquid condenses water vapor from the air due to low-temperature condensation in the low-temperature circulating process, the physical and chemical properties of the circulating liquid are influenced are solved, and the phenomenon of freezing on the cold surface of the plate heat exchanger 8 or the coil heat exchanger 8 is avoided.
As a specific embodiment of the present invention, a stirring mechanism 9 is provided in the heating liquid tank 3; the stirring mechanism 9 is used for mixing the circulating liquid in the liquid supply tank 1 with the circulating liquid in the heating liquid tank 3, and the stirring mechanism 9 comprises a driving fan 91, a driven fan 92, a connecting rod 93 and a fixing rod 94; the connecting rod 93 is fixed on the inner side wall of the heating liquid tank 3 through a plurality of fixing rods 94, the connecting rod 93 is hinged at the end part of the fixing rods 94, one end of the connecting rod 93 is positioned at the outlet position of the circulating liquid return pipe 5, one end of the connecting rod 93 is fixedly connected with the driving fan 91, and the outer ring of the connecting rod 93 is fixedly connected with a plurality of driven fans 92; the temperature of the circulating liquid flowing into the heating liquid tank 3 from the circulating liquid return pipe 5 is reduced, secondary heating is carried out on the heating liquid tank 3, the temperature of the circulating liquid in the heating liquid tank 3 is different from the temperature of the circulating liquid flowing into the heating liquid tank 3 from the circulating liquid return pipe 5, in order to reduce the temperature difference between the two, the cold and heat exchange and the heating efficiency between the circulating liquid and the circulating liquid are improved by a stirring and mixing mode, when the circulating liquid flows into the heating liquid tank 3 from the circulating liquid return pipe 5, the circulating liquid impacts on the driving fan 91, the driving fan 91 drives the driven fan 92 to rotate through the connecting rod 93, then the driving fan 91 and the driven fan 92 stir and mix the circulating liquid in the heating liquid tank 3 together, the heating and mixing of the circulating liquid and the heating efficiency are accelerated, and the kinetic energy of the circulating liquid flowing into the heating liquid tank 3 from the circulating liquid return pipe 5 is utilized by the rotation stirring of the driving fan 91 and the driven fan 92, other energy sources are not used for driving the driving fan 91 and the driven fan 92, the driving fan 91 and the driven fan 92 rotate to stir and accelerate mixing, heating efficiency is improved, energy sources are saved, and cost is improved.
The physical position height of the bottom surface of the liquid supply liquid tank 1 is higher than that of the upper end surface of the heating liquid tank 3.
As a specific embodiment of the invention, one end of the liquid supply pipe 2 is communicated with the inner bottom of the liquid supply tank 1, and the other end of the liquid supply pipe 2 is communicated with the inner top of the heating tank 3; potential energy is converted into kinetic energy by utilizing the height difference between the liquid supply tank 1 and the heating tank 3, so that the circulating liquid can flow automatically, and the liquid supply tank 1 can supplement the circulating liquid for the interior of the heating tank 3 in time.
As a specific embodiment of the present invention, one end of the exhaust pipe 32 is located at the top of the heating liquid tank 3, and the other end of the exhaust pipe 32 is located above the liquid level inside the liquid supply tank 1; one end of the exhaust pipe 32 is located above the liquid level inside the liquid supply tank 1, on one hand, after the steam and the circulating liquid, the steam is liquefied, on the other hand, the circulating liquid inside the liquid supply tank 1 is prevented from flowing into the heating liquid tank 3 from the exhaust pipe 32, and the discharge of the steam inside the heating liquid tank 3 is prevented from being influenced.
As a specific embodiment of the present invention, a float switch 11 for detecting a liquid level is disposed in the liquid supply tank 1, and a plurality of float balls 111 are disposed on the float switch 11; the liquid level height in the liquid supply liquid tank 1 is controlled through the float switch 11, and the overflow of circulating liquid in the liquid supply liquid tank 1 is avoided.
As a specific embodiment of the invention, the surface of a part of the pipe on the circulating liquid outlet pipe 4 inside the heat exchanger 8 is an uneven surface; the surface of a part of pipelines on the cooling water return pipe 7 positioned in the heat exchanger 8 is also an uneven surface; when the circulation liquid flows through the position of the heat exchanger 8 and the cooling water flows through the position of the heat exchanger 8, because the surface of a part of the pipeline positioned inside the heat exchanger 8 on the circulation liquid outlet pipe 4 is uneven and the surface of a part of the pipeline positioned inside the heat exchanger 8 on the cooling water return pipe 7 is also uneven, the uneven surface increases the heat exchange specific surface area of the circulation liquid outlet pipe 4 and the cooling water return pipe 7, thereby enhancing the heat exchange efficiency of the circulation liquid outlet pipe 4 and the cooling water return pipe 7 and further improving the heat exchange efficiency of the heat exchange system.
The working principle is as follows: cooling water flows in through a cooling water liquid return pipe 7 and then flows out through a cooling water liquid outlet pipe 6, and when the cooling water flows through a heat exchanger 8, the cooling water carries out cold and heat exchange treatment on circulating liquid flowing into the heating liquid tank 3 from a circulating liquid return pipe 5, the circulating liquid is pumped out from the heating liquid tank 3, flows into the heat exchanger 8 to carry out heat exchange with the cooling water, finally flows out through a circulating liquid outlet pipe 4, and returns to the heat exchange system again after flowing through all cavities of the semiconductor processing equipment;
when the heating wire 31 in the heating liquid pipe heats the circulating liquid again, part of the circulating liquid is in a steam state and is discharged into the liquid supply tank 1 through the exhaust pipe 32, after the steam meets the circulating liquid at the natural environment temperature, the steam is liquefied, the problems of premature consumption of the circulating liquid and external discharge of the steam are solved in the process, meanwhile, the problem that the circulating liquid condenses water vapor from the air due to low-temperature condensation in the low-temperature circulating process to influence the physical and chemical properties of the circulating liquid is solved, and the phenomenon of freezing on the cold surface of the plate type heat exchanger 8 or the coil type heat exchanger 8 is avoided.
When the circulation liquid flows into the heating liquid tank 3 from the circulation liquid return pipe 5, the circulation liquid impacts on the driving fan 91, the driving fan 91 drives the driven fan 92 to rotate through the connecting rod 93, then the driving fan 91 and the driven fan 92 stir the circulation liquid in the heating liquid tank 3 together, the heating mixing and heating efficiency of the circulation liquid are accelerated, the driving fan 91 and the driven fan 92 rotate to stir the kinetic energy of the circulation liquid flowing into the heating liquid tank 3 from the circulation liquid return pipe 5, other energy sources are not reused to drive the driving fan 91 and the driven fan 92, the mixing is accelerated, the heating efficiency is improved, the energy sources are saved, and the cost is improved.
By utilizing the height difference between the liquid supply tank 1 and the heating tank 3, the potential energy is converted into kinetic energy, thereby facilitating the self-moving of the circulating liquid, so that the circulating liquid can be timely supplemented to the heating tank 3 by the liquid supply tank 1, meanwhile, one end of the exhaust pipe 32 is positioned above the liquid level in the liquid supply tank 1, firstly, after the steam and the circulating liquid, the steam is liquefied, secondly, the circulating liquid in the liquid supply tank 1 is prevented from flowing into the heating tank 3 from the exhaust pipe 32, the discharge of the steam in the heating tank 3 is influenced, and when the circulating liquid flows through the position of the heat exchanger 8, and when the cooling water flows through the position of the heat exchanger 8, because the part of the pipeline surface in the heat exchanger 8 on the circulating liquid outlet pipe 4 is the uneven surface, and the part of the pipeline surface in the heat exchanger 8 on the cooling water return pipe 7 is also the uneven surface, the uneven surface increases the heat exchange specific surface, thereby enhancing the heat exchange efficiency of the circulating liquid outlet pipe 4 and the cooling water return pipe 7 and further improving the heat exchange efficiency of the heat exchange system.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. A heat exchange system for a two-fluid tank semiconductor processing apparatus of a vertical structure, characterized in that: comprises a liquid supply liquid tank (1), a liquid supply pipe (2), a heating liquid tank (3), a heating wire (31), an exhaust pipe (32), a circulating liquid outlet pipe (4), a circulating liquid return pipe (5), a cooling water outlet pipe (6), a cooling water return pipe (7) and a heat exchanger (8); the liquid supply tank (1) is communicated with the heating tank (3) through the liquid supply pipe (2), the heating tank (3) is communicated with the liquid supply tank (1) through the exhaust pipe (32), a heating wire (31) is arranged in the heating tank (3), the heating wire (31) extends into the heating tank (3) and carries out heating treatment on liquid in the heating tank (3), one side of the heating tank (3) is communicated with one end of the circulating liquid outlet pipe (4), and the other side wall of the heating tank (3) is communicated with one end of the circulating liquid outlet pipe (4); a circulating water pump (41) is arranged on the circulating liquid outlet pipe (4), and partial pipelines of the circulating liquid outlet pipe (4) are laid in the heat exchanger (8); and a pipeline of a partial cooling water return pipe (7) is laid in the heat exchanger (8), and the cooling water return pipe (7) is communicated with the cooling water outlet pipe (6).
2. The heat exchange system for a two-tank semiconductor processing apparatus of a top-bottom structure according to claim 1, wherein: a stirring mechanism (9) is arranged in the heating liquid tank (3); the stirring and mixing mechanism (9) is used for mixing the circulating liquid in the liquid supply liquid tank (1) and the circulating liquid in the heating liquid tank (3), and the stirring and mixing mechanism (9) comprises a driving fan (91), a driven fan (92), a connecting rod (93) and a fixing rod (94); the connecting rod (93) is fixed on the inner side wall of the heating liquid tank (3) through a plurality of fixing rods (94), the connecting rod (93) is hinged to the end portion of the fixing rods (94), one end of the connecting rod (93) is located at the outlet position of the circulating liquid return pipe (5), one end of the connecting rod (93) is fixedly connected with the driving fan (91), and the outer ring of the connecting rod (93) is fixedly connected with a plurality of driven fans (92).
3. The heat exchange system for a two-tank semiconductor processing apparatus of a top-bottom structure according to claim 1, wherein: the heat exchange system further comprises a temperature sensor (42), a Y-shaped filter (51) and a flow meter (52) for detecting flow based on the temperature sensor (42); the temperature sensor (42) is arranged on the circulating liquid outlet pipe (4), and the temperature sensor (42) is used for detecting the temperature of the circulating liquid; the flowmeter (52) is arranged on the circulating liquid return pipe (5), the Y-shaped filter (51) is arranged on the water inlet sides of the circulating liquid return pipe (5) and the cooling water return pipe (7), and the Y-shaped filter (51) is used for filtering impurities in the circulating liquid.
4. The heat exchange system for a two-tank semiconductor processing apparatus of a top-bottom structure according to claim 1, wherein: the physical position height of the bottom surface of the liquid supply liquid tank (1) is higher than that of the upper end surface of the heating liquid tank (3).
5. The heat exchange system for a two-tank semiconductor processing apparatus of a top-bottom structure according to claim 1, wherein: one end of the liquid supply pipe (2) is communicated with the inner bottom of the liquid supply liquid tank (1), and the other end of the liquid supply pipe (2) is communicated with the inner top of the heating liquid tank (3).
6. The heat exchange system for a two-tank semiconductor processing apparatus of a top-bottom structure according to claim 1, wherein: one end of the exhaust pipe (32) is positioned at the top of the heating liquid tank (3), and the other end of the exhaust pipe (32) is positioned above the liquid level in the liquid supply liquid tank (1).
7. The heat exchange system for a two-tank semiconductor processing apparatus of a top-bottom structure according to claim 1, wherein: the liquid supply tank (1) is internally provided with a floating ball switch (11) for detecting the liquid level, and a plurality of floating balls (111) are arranged on the floating ball switch (11).
8. The heat exchange system for a two-tank semiconductor processing apparatus of a top-bottom structure according to claim 1, wherein: and the circulating liquid outlet pipe (4), the circulating liquid return pipe (5), the cooling water outlet pipe (6) and the cooling water return pipe (7) are respectively provided with a manual valve (71), and the circulating liquid return pipe (5) and the manual valves (71) on the cooling water return pipe (7) are respectively positioned at the downstream position of the Y-shaped filter (51).
9. The heat exchange system for a two-tank semiconductor processing apparatus of a top-bottom structure according to claim 1, wherein: the surface of a part of the pipeline positioned in the heat exchanger (8) on the circulating liquid outlet pipe (4) is uneven; the surface of the part of the pipeline on the cooling water return pipe (7) positioned inside the heat exchanger (8) is also an uneven surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011209123.8A CN112325692A (en) | 2020-11-03 | 2020-11-03 | Heat exchange system with upper structure and lower structure for double-liquid-tank semiconductor processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011209123.8A CN112325692A (en) | 2020-11-03 | 2020-11-03 | Heat exchange system with upper structure and lower structure for double-liquid-tank semiconductor processing device |
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|---|---|
| CN112325692A true CN112325692A (en) | 2021-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011209123.8A Pending CN112325692A (en) | 2020-11-03 | 2020-11-03 | Heat exchange system with upper structure and lower structure for double-liquid-tank semiconductor processing device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4200147A (en) * | 1976-12-17 | 1980-04-29 | Aktiebolaget Carl Munters | Device for the exchange of heat between supply air and exhaust air in indoor premises |
| CN207649417U (en) * | 2017-11-17 | 2018-07-24 | 广东米特拉电器科技有限公司 | A kind of novel heat exchange water tank |
| CN208059624U (en) * | 2018-03-05 | 2018-11-06 | 北京创昱科技有限公司 | process liquid heating device |
| CN208087929U (en) * | 2018-01-30 | 2018-11-13 | 新乡市天虹医疗器械有限公司 | A kind of de- drift water circulation system of gauze |
| CN211041414U (en) * | 2019-12-20 | 2020-07-17 | 曹译心 | Natural gas heating water bath furnace for gas power plant |
-
2020
- 2020-11-03 CN CN202011209123.8A patent/CN112325692A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4200147A (en) * | 1976-12-17 | 1980-04-29 | Aktiebolaget Carl Munters | Device for the exchange of heat between supply air and exhaust air in indoor premises |
| CN207649417U (en) * | 2017-11-17 | 2018-07-24 | 广东米特拉电器科技有限公司 | A kind of novel heat exchange water tank |
| CN208087929U (en) * | 2018-01-30 | 2018-11-13 | 新乡市天虹医疗器械有限公司 | A kind of de- drift water circulation system of gauze |
| CN208059624U (en) * | 2018-03-05 | 2018-11-06 | 北京创昱科技有限公司 | process liquid heating device |
| CN211041414U (en) * | 2019-12-20 | 2020-07-17 | 曹译心 | Natural gas heating water bath furnace for gas power plant |
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Address after: No.45 and 51, Yougu Industrial Park, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Applicant after: GMC SEMITECH Co.,Ltd. Address before: No. 45, Yougu Enterprise Park, 58 Jinghong Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Applicant before: GMC SEMITECH Co.,Ltd. |
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Application publication date: 20210205 |