CN112323067A - Diamond surface metallization processing system - Google Patents

Diamond surface metallization processing system Download PDF

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Publication number
CN112323067A
CN112323067A CN202011198680.4A CN202011198680A CN112323067A CN 112323067 A CN112323067 A CN 112323067A CN 202011198680 A CN202011198680 A CN 202011198680A CN 112323067 A CN112323067 A CN 112323067A
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China
Prior art keywords
diamond
fixedly connected
multifunctional
frame
processing system
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CN202011198680.4A
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Chinese (zh)
Inventor
邹林汇
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Hubei Little Ant Diamond Tools Co ltd
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Hubei Little Ant Diamond Tools Co ltd
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Priority to CN202011198680.4A priority Critical patent/CN112323067A/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1628Specific elements or parts of the apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1632Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886Multistep pretreatment
    • C23C18/1893Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/06Filtering particles other than ions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt

Abstract

The invention discloses a diamond surface metallization processing system, relating to the technical field of diamond processing, comprising the processes of cleaning, sensitization and activation processing, reduction processing, chemical plating, electroplating and the like, as well as an integrated bottom plate, a multifunctional pool and a multifunctional tank which are arranged on the integrated bottom plate, wherein the diamond which is processed before plating is put into 30g/l NiCl for chemical plating2·6H2O+26g/lNaH2POr·H2O+20g/INaKC4H4O6·4H2O, the pH value is 4.5 to 5.5, and the temperature is 90 ℃ to 100 ℃; electroplating, placing the diamond after chemical plating into 280g/l NISO4·H2O+30g/1NiCI·6H2O+35g/lH3B03de plating solution with pH of 3-4, temperature of 60-70 deg.C, time of 8-10 hr, and current density of 2A/dm2To 3A/dm2(ii) a The surface of the diamond is metallized by a chemical plating and electroplating method, so that the firmness and the thickness of the metal coating are enhanced, and the conditions that the metal coating on the surface of the diamond is separated and abraded due to over-thin thickness are reduced.

Description

Diamond surface metallization processing system
Technical Field
The invention relates to the technical field of diamond treatment, in particular to a diamond surface metallization treatment system.
Background
Diamond is a mineral composed of carbon elements, is an allotrope of graphite, has a chemical formula of C, and is also the original body of common diamond, graphite can form artificial diamond under high temperature and high pressure, and the diamond has a wide range of applications, for example: the diamond is a precious gem, and is a simple substance crystal composed of carbon elements formed under the conditions of high pressure and high temperature in the deep part of the earth. Diamond is a colorless octahedral crystal whose component is pure carbon linked by carbon atoms in a quaternary bond, and is known to exist naturally as the hardest substance.
The surface of the diamond needs to be metallized in the production process, and the existing diamond surface metallization system only uses one plating method, so that the metal plating on the surface of the diamond is thin and is easy to fall off and wear.
To this end we propose a diamond surface metallization processing system to solve the above problems.
Disclosure of Invention
1. Problems to be solved
In view of the problems in the prior art, the present invention is directed to a diamond surface metallization processing system to solve the problems mentioned in the background above.
2. Technical scheme
In order to achieve the purpose, the invention provides the following technical scheme:
a diamond surface metallization processing system comprises processes of cleaning, quick and activation processing, reduction processing, chemical plating, electroplating and the like, an integrated bottom plate, and a multifunctional pool and a multifunctional tank which are arranged on the integrated bottom plate, and specifically comprises the following steps:
cleaning, the diamond is boiled in 10% NaOH solution for 5 to 10 minutes, and then rinsed with distilled water;
minhua and activation treatment, Minhua regionPutting the diamond into 20g/l SnCl2·2H2Stirring for 5-8 min in HCI solution of O +20ml/l at normal temperature, rinsing, and activating by adding diamond after Minhua treatment into 0.25g/1pdCl2+10ml/l HCI solution, stirred at 50 to 60 ℃ for 5 to 8 minutes and rinsed;
reduction treatment, namely putting the diamond after the activation treatment into 20g/l NaH2PO2·H2Stirring for 3-4 minutes at normal temperature by using 1000mL of O + distilled water;
chemical plating, namely putting the diamond which is subjected to the pre-plating treatment into 30g/l NiCl2·6H2O+26g/l NaH2POr·H2O+20g/I NaKC4H4O6·4H2O, the pH value is 4.5 to 5.5, and the temperature is 90 ℃ to 100 ℃;
electroplating, placing the diamond after chemical plating into 280g/l NISO4·H2O+30g/1NiCI·6H2O+35g/l H3B03de plating solution with pH of 3-4, temperature of 60-70 deg.C, time of 8-10 hr, and current density of 2A/dm2To 3A/dm2
As a further scheme of the invention: the upper surface of integrated bottom plate is provided with multi-functional pond and multi-functional jar, two rotary columns of outer peripheral face fixedly connected with of multi-functional jar, and the rotary column is kept away from the one end of multi-functional jar and is rotated the lower surface of connection in the backup pad, the heater strip is all installed to the inside of multi-functional pond and multi-functional jar, and a side-mounting of multi-functional pond has the controller, the fixed intercommunication in a side of multi-functional pond has the discharging pipe, install the valve on the discharging pipe, be provided with discharge mechanism in the multi-functional pond, two of the outer peripheral face fixedly connected with of multi-functional jar insert a section of thick bamboo, and equal sliding connection has an inserted a section of thick bamboo assorted bolt in two.
As a further scheme of the invention: discharge mechanism includes spout A, T type handle, fixed frame, filter screen A, slider, and the medial surface fixedly connected with filter screen A of fixed frame, and the equal fixedly connected with slider of two relative lateral surfaces of fixed frame, two relative medial surfaces in multi-functional pond all seted up with slider assorted spout A, slider and spout A sliding connection.
As a further scheme of the invention: the upper surface of the sliding block is fixedly connected with a T-shaped handle.
As a further scheme of the invention: the upper end of the sliding chute A penetrates through the side wall of the multifunctional pool, and the lower end of the sliding chute A is located in the middle of the side wall of the multifunctional pool.
As a further scheme of the invention: rabbling mechanism includes U type frame, and the both ends fixed connection of U type frame is at the upper surface of multi-functional jar, and the last surface mounting of U type frame has the motor, and the output of motor runs through the upper wall of U type frame and through shaft coupling fixedly connected with bull stick, fixedly connected with puddler on the bull stick.
As a further scheme of the invention: receiving agencies includes ejection of compact frame, filter screen B and collection frame, and one side fixed connection of ejection of compact frame is in the side of integrated bottom plate, and the opposite side and the collection frame intercommunication of ejection of compact frame, the filter screen B that fixedly connected with slope set up in the ejection of compact frame, and the one end sliding connection of collecting the frame has gate valve mechanism.
As a further scheme of the invention: the gate valve mechanism comprises a gate plate, a pull handle, a sliding strip and a sliding groove B, the sliding strip is fixedly connected to two opposite side faces of the gate plate, the sliding groove B matched with the sliding strip is formed in the two opposite side faces of the collecting frame, the sliding strip is connected with the sliding groove B in a sliding mode, and the pull handle is fixedly connected to the upper surface of the gate plate.
As a further scheme of the invention: the lower surface of the multifunctional tank is fixedly connected with another pull handle; the pull handle is convenient for rotating the multifunctional pot.
As a further scheme of the invention: fixedly connected with U type pipe on the U type frame, and U type pipe runs through the U type frame, on the U type pipe with the fixed intercommunication of one end of hose, and the one end of fixedly connected with inlet tube on the lateral wall of multi-functional pond, and the other end of hose and inlet tube all is connected with the water supply.
Compared with the prior art, the invention has the beneficial effects that:
1. the system has high integration level and is convenient for workers to operate, and the metallization treatment is carried out on the surface of the diamond by a chemical plating and electroplating method, so that the firmness and the thickness of the metal coating are enhanced, and the conditions that the metal coating on the surface of the diamond is separated and abraded due to over-thin thickness are reduced.
2. According to the diamond discharging device, the bolt is pulled out of the inserting cylinder, the multifunctional tank can be rotated to discharge diamonds in the tank, so that the diamonds can be discharged conveniently, the diamonds can be completely discharged at one time, materials poured out from the multifunctional tank fall onto the filter screen B, a solution can fall into the discharging frame from the filter screen B, the diamonds can fall into the collecting frame along with the filter screen B, the diamonds are separated from the solution, and the diamonds are convenient to collect.
Drawings
FIG. 1 is a system diagram of the process of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is an enlarged schematic view of FIG. 2 at A in accordance with the present invention;
fig. 4 is a schematic structural view of a section of the multipurpose tank of the present invention.
In the figure: 1. an integrated chassis; 2. a multifunctional pool; 3. a chute A; 4. a T-shaped handle; 5. a water inlet pipe; 6. a fixing frame; 7. a filter screen A; 8. a controller; 9. a discharge pipe; 10. a support plate; 11. a U-shaped frame; 12. a U-shaped pipe; 13. a rotating rod; 14. a hose; 15. discharging the material frame; 16. a filter screen B; 17. a collection frame; 18. a shutter plate; 19. pulling a handle; 20. a slide bar; 21. a chute B; 22. a slider; 23. inserting a cylinder; 24. a bolt; 25. turning the column; 26. a stirring rod; 27. a multifunctional tank; 28. an electric motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
Referring to fig. 1 to 4, in an embodiment of the present invention, a diamond surface metallization processing system includes processes of cleaning, alleviation, activation, reduction, chemical plating, electroplating, and the like, and an integrated base plate 1, and a multifunctional pool 2 and a multifunctional tank 27 disposed on the integrated base plate 1, and is characterized by including the following steps:
cleaning, the diamond is boiled in 10% NaOH solution for 5 to 10 minutes, and then rinsed with distilled water;
performing allelochemical treatment and activation treatment, wherein the diamond is put into 20g/l SnCl during the allelochemical treatment2·2H2Stirring for 5-8 min in HCI solution of O +20ml/l at normal temperature, rinsing, and activating by adding diamond after Minhua treatment into 0.25g/1pdCl2+10ml/l HCI solution, stirred at 50 to 60 ℃ for 5 to 8 minutes and rinsed;
reduction treatment, namely putting the diamond after the activation treatment into 20g/l NaH2PO2·H2Stirring for 3-4 minutes at normal temperature by using 1000mL of O + distilled water;
chemical plating, namely putting the diamond which is subjected to the pre-plating treatment into 30g/l NiCl2·6H2O+26g/l NaH2POr·H2O+20g/I NaKC4H4O6·4H2O, the pH value is 4.5 to 5.5, and the temperature is 90 ℃ to 100 ℃;
electroplating, placing the diamond after chemical plating into 280g/l NISO4·H2O+30g/1NiCI·6H2O+35g/l H3B03de plating solution with pH of 3-4, temperature of 60-70 deg.C, time of 8-10 hr, and current density of 2A/dm2To 3A/dm2
The upper surface of the integrated bottom plate 1 is provided with a multifunctional pool 2 and a multifunctional tank 27, the outer peripheral surface of the multifunctional tank 27 is fixedly connected with two rotary columns 25, one ends of the rotary columns 25, far away from the multifunctional tank 27, are rotatably connected to the lower surface of the supporting plate 10, heating wires are respectively installed inside the multifunctional pool 2 and the multifunctional tank 27, a controller 8 is installed on one side surface of the multifunctional pool 2, a discharging pipe 9 is fixedly communicated with one side surface of the multifunctional pool 2, a valve is installed on the discharging pipe 9, a discharging mechanism is arranged in the multifunctional pool 2, two inserting cylinders 23 are fixedly connected to the outer peripheral surface of the multifunctional tank 27, inserting cylinders 23 are respectively connected to the two supporting plates 10 in a sliding mode, matched inserting pins 24 are respectively connected to the two inserting cylinders 23, a stirring mechanism is fixedly connected to the; can carry out quick hua and activation treatment and reduction treatment in multi-functional jar 27, can clean in multi-functional pond 2, chemical plating and electroplating, this system integration degree is high, it is more convenient that the staff operates, carry out metallization treatment to the diamond surface through chemical plating and electroplating dual method, thereby strengthen metallic coating's fastness and thickness degree, the metallic coating that reduces diamond surface to appear breaks away from and the condition of wearing and tearing, extract bolt 24 from inserting a section of thick bamboo 23, alright pour the diamond in jar in order to rotate multi-functional jar 27, thereby the convenient ejection of compact to the diamond, make the diamond can once be poured completely, the heater strip can heat multi-functional jar 27 and multi-functional pond 2.
The discharging mechanism comprises a sliding chute A3, a T-shaped handle 4, a fixed frame 6, a filter screen A7 and a sliding block 22, wherein the inner side surface of the fixed frame 6 is fixedly connected with the filter screen A7, two opposite outer side surfaces of the fixed frame 6 are both fixedly connected with the sliding block 22, two opposite inner side surfaces of the multifunctional pool 2 are both provided with a sliding chute A3 matched with the sliding block 22, and the sliding block 22 is in sliding connection with the sliding chute A3; when carrying out work in multi-functional pond 2, after clean, chemical plating and electroplating are accomplished, the fixed frame 6 of upwards sliding alright give with fixed frame 6 and filter screen A7 and take out to the diamond is conveniently taken, makes things convenient for the ejection of compact of diamond.
The upper surface of the sliding block 22 is fixedly connected with a T-shaped handle 4; the fixing frame 6 is conveniently pulled out by the T-shaped handle 4.
The upper end of the chute A3 runs through the side wall of the multifunctional pool 2, and the lower end of the chute A3 is positioned in the middle of the side wall of the multifunctional pool 2.
The stirring mechanism comprises a U-shaped frame 11, two ends of the U-shaped frame 11 are fixedly connected to the upper surface of the multifunctional tank 27, a motor 28 is mounted on the upper surface of the U-shaped frame 11, the output end of the motor 28 penetrates through the upper wall of the U-shaped frame 11 and is fixedly connected with a rotating rod 13 through a coupler, and a stirring rod 26 is fixedly connected to the rotating rod 13; activation of the motor 28 causes the paddle 26 to agitate the diamonds.
The receiving mechanism comprises a discharging frame 15, a filter screen B16 and a collecting frame 17, one side of the discharging frame 15 is fixedly connected to the side face of the integrated base plate 1, the other side of the discharging frame 15 is communicated with the collecting frame 17, the filter screen B16 which is obliquely arranged is fixedly connected in the discharging frame 15, and one end of the collecting frame 17 is connected with a gate valve mechanism in a sliding manner; on filter screen B16 was fallen to the material that multi-functional jar 27 was poured, in the material frame 15 was fallen to the solution can be followed filter screen B16, the diamond can be along with filter screen B16 whereabouts to collection frame 17 in to make diamond and solution alternate segregation, the convenience is collected the diamond.
The gate valve mechanism comprises a gate plate 18, a pull handle 19, a sliding strip 20 and a sliding groove B21, the sliding strip 20 is fixedly connected to two opposite side surfaces of the gate plate 18, the sliding groove B21 matched with the sliding strip 20 is formed in each of the two opposite side surfaces of the collecting frame 17, the sliding strip 20 is in sliding connection with the sliding groove B21, and the pull handle 19 is fixedly connected to the upper surface of the gate plate 18; the removal of the diamonds from the collection frame 17 is facilitated by pulling the shutter plate 18 upwards by means of a pull handle 19.
The lower surface of the multifunctional pot 27 is fixedly connected with another pull handle 19; the pull handle 19 facilitates the rotation of the multipurpose tank 27.
A U-shaped pipe 12 is fixedly connected to the U-shaped frame 11, the U-shaped pipe 12 penetrates through the U-shaped frame 11, the U-shaped pipe 12 is fixedly communicated with one end of a hose 14, one end of a water inlet pipe 5 is fixedly connected to the side wall of the multifunctional pool 2, and the other ends of the hose 14 and the water inlet pipe 5 are both connected with a water supply source; the U-shaped tube 12 allows distilled water to be injected into the multifunctional tank 27, thereby facilitating the cleaning of the diamond.
The power supply interface of the power utilization element in the invention is connected with a power supply system through a switch (not shown in the figure) and a lead (not shown in the figure), so as to realize the control of the power supply interface, wherein the related circuits and control are the prior art, are well known in the prior art, and are not described herein in detail.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, only for the convenience of description of the present invention and for simplicity of description, rather than to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, the present invention should not be construed as being limited thereto, and it should be noted that the terms "mounted" and "connected" should be interpreted broadly, for example, as being able to be fixedly connected, detachably connected, or integrally formed, mechanically connected or indirectly connected through an intermediate, and the specific meaning of the terms in the invention can be understood through specific situations.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. A diamond surface metallization processing system comprises processes of cleaning, quick and activation processing, reduction processing, chemical plating, electroplating and the like, an integrated bottom plate 1, and a multifunctional pool 2 and a multifunctional tank 27 which are arranged on the integrated bottom plate 1, and is characterized by comprising the following specific steps:
cleaning, the diamond is boiled in 10% NaOH solution for 5 to 10 minutes, and then rinsed with distilled water;
performing allelochemical treatment and activation treatment, wherein the diamond is put into 20g/l SnCl during the allelochemical treatment2·2H2Stirring for 5-8 min in HCI solution of O +20ml/l at normal temperature, rinsing, and activating by adding diamond after Minhua treatment into 0.25g/1pdCl2+10ml/l HCI solution, stirred at 50 to 60 ℃ for 5 to 8 minutes and rinsed;
reduction treatment, namely putting the diamond after the activation treatment into 20g/l NaH2PO2·H2Stirring for 3-4 minutes at normal temperature by using 1000mL of O + distilled water;
chemical plating, namely putting the diamond which is subjected to the pre-plating treatment into 30g/l NiCl2·6H2O+26g/l NaH2POr·H2O+20g/I NaKC4H4O6·4H2O, the pH value is 4.5 to 5.5, and the temperature is 90 ℃ to 100 ℃;
electroplating, placing the diamond after chemical plating into 280g/l NISO4·H2O+30g/1NiCI·6H2O+35g/l H3B03de plating solution with pH of 3-4, temperature of 60-70 deg.C, time of 8-10 hr, and current density of 2A/dm2To 3A/dm2
2. The diamond surface metallization processing system according to claim 1, wherein the upper surface of the integrated bottom plate (1) is provided with a multifunctional tank (2) and a multifunctional tank (27), the outer peripheral surface of the multifunctional tank (27) is fixedly connected with two rotary columns (25), one ends of the rotary columns (25) far away from the multifunctional tank (27) are rotatably connected with the lower surface of the supporting plate (10), heating wires are respectively arranged inside the multifunctional tank (2) and the multifunctional tank (27), a controller (8) is arranged on one side surface of the multifunctional tank (2), a discharge pipe (9) is fixedly communicated with one side surface of the multifunctional tank (2), a valve is arranged on the discharge pipe (9), a discharge mechanism is arranged in the multifunctional tank (2), the outer peripheral surface of the multifunctional tank (27) is fixedly connected with two inserting cylinders (23), and the two supporting plates (10) are respectively connected with a bolt (24) matched with the inserting cylinders (23) in a sliding manner, and the upper surface of the multifunctional tank (27) is fixedly connected with a stirring mechanism, and one side of the side surface of the integrated bottom plate (1) is fixedly connected with a material receiving mechanism.
3. The diamond surface metallization processing system according to claim 2, wherein the discharging mechanism comprises a sliding groove A (3), a T-shaped handle (4), a fixing frame (6), a filtering net A (7) and a sliding block (22), the filtering net A (7) is fixedly connected to the inner side surface of the fixing frame (6), the sliding block (22) is fixedly connected to two opposite outer side surfaces of the fixing frame (6), the sliding groove A (3) matched with the sliding block (22) is formed in each of the two opposite inner side surfaces of the multifunctional pool (2), and the sliding block (22) is slidably connected with the sliding groove A (3).
4. A diamond surface metallization system according to claim 3, wherein a T-shaped handle (4) is fixedly attached to the upper surface of the slider (22).
5. A diamond surface metallization treatment system according to claim 3, characterized in that the upper end of the chute a (3) extends through the side wall of the multifunctional bath (2) and the lower end of the chute a (3) is located in the middle of the side wall of the multifunctional bath (2).
6. The diamond surface metallization processing system according to claim 2, wherein the stirring mechanism comprises a U-shaped frame (11), two ends of the U-shaped frame (11) are fixedly connected to the upper surface of the multifunctional tank (27), a motor (28) is mounted on the upper surface of the U-shaped frame (11), an output end of the motor (28) penetrates through the upper wall of the U-shaped frame (11) and is fixedly connected with a rotating rod (13) through a coupler, and a stirring rod (26) is fixedly connected to the rotating rod (13).
7. The diamond surface metallization processing system according to claim 2, wherein the receiving mechanism comprises a discharging frame (15), a filter screen B (16) and a collecting frame (17), one side of the discharging frame (15) is fixedly connected to the side surface of the integrated base plate (1), the other side of the discharging frame (15) is communicated with the collecting frame (17), the filter screen B (16) which is obliquely arranged is fixedly connected to the inside of the discharging frame (15), and one end of the collecting frame (17) is slidably connected with a gate valve mechanism.
8. The diamond surface metallization processing system according to claim 7, wherein the gate valve mechanism comprises a gate plate (18), a pull handle (19), a slide bar (20) and a sliding groove B (21), the slide bar (20) is fixedly connected to two opposite side surfaces of the gate plate (18), the sliding groove B (21) matched with the slide bar (20) is formed in each of the two opposite side surfaces of the collecting frame (17), the slide bar (20) is slidably connected with the sliding groove B (21), and the pull handle (19) is fixedly connected to the upper surface of the gate plate (18).
9. A diamond surface metallization system according to claim 1, wherein a further pull handle (19) is fixedly attached to the lower surface of the multifunctional canister (27); the pull handle (19) facilitates the rotation of the multi-functional jar (27).
10. A diamond surface metallization processing system according to claim 6, wherein a U-shaped pipe (12) is fixedly connected to the U-shaped frame (11), the U-shaped pipe (12) penetrates through the U-shaped frame (11), the U-shaped pipe (12) is fixedly communicated with one end of a hose (14), one end of a water inlet pipe (5) is fixedly connected to the side wall of the multifunctional tank (2), and the other ends of the hose (14) and the water inlet pipe (5) are both connected with a water supply source.
CN202011198680.4A 2020-10-31 2020-10-31 Diamond surface metallization processing system Pending CN112323067A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101173356A (en) * 2006-10-31 2008-05-07 佛山市顺德区汉达精密电子科技有限公司 Surface treating method for magnesium alloy
CN103388170A (en) * 2013-07-30 2013-11-13 江西核工业兴中科技有限公司 Diamond wire saw and rapid production method thereof
CN104947095A (en) * 2015-05-29 2015-09-30 北京吉瑞恒升科技有限公司 Chemical plating solution for preparing nickel splinter plated diamond abrasive particle, and chemical plating method
CN209631219U (en) * 2019-01-24 2019-11-15 西安润川环保科技有限公司 A kind of novel metal mesh catalyst plating preparation facilities

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101173356A (en) * 2006-10-31 2008-05-07 佛山市顺德区汉达精密电子科技有限公司 Surface treating method for magnesium alloy
CN103388170A (en) * 2013-07-30 2013-11-13 江西核工业兴中科技有限公司 Diamond wire saw and rapid production method thereof
CN104947095A (en) * 2015-05-29 2015-09-30 北京吉瑞恒升科技有限公司 Chemical plating solution for preparing nickel splinter plated diamond abrasive particle, and chemical plating method
CN209631219U (en) * 2019-01-24 2019-11-15 西安润川环保科技有限公司 A kind of novel metal mesh catalyst plating preparation facilities

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