CN112312651A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
CN112312651A
CN112312651A CN201910713912.6A CN201910713912A CN112312651A CN 112312651 A CN112312651 A CN 112312651A CN 201910713912 A CN201910713912 A CN 201910713912A CN 112312651 A CN112312651 A CN 112312651A
Authority
CN
China
Prior art keywords
circuit board
printed circuit
electrically connected
general
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910713912.6A
Other languages
Chinese (zh)
Inventor
彭章龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Priority to CN201910713912.6A priority Critical patent/CN112312651A/en
Publication of CN112312651A publication Critical patent/CN112312651A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Abstract

A printed circuit board comprises a mounting area, a control chip and an alternating current coupling module. The mounting region is provided with a special welding pad group and a general welding pad group, the special welding pad group is provided with a plurality of special welding pads, and the general welding pad group is provided with a plurality of general welding pads. The control chip is electrically connected with the special welding pad group and the general welding pad group. The alternating current coupling module is electrically connected between the general pad group and the control chip and used for blocking direct current components in electric signals transmitted between the control chip and the first specification connector or the second specification connector. When the printed circuit board selects to install a first specification connector, the pins of the first specification connector are installed on the universal welding plates. When the printed circuit board selects to install a second specification connector, the pins of the second specification connector are installed on the special welding discs and the universal welding discs. Thus, the universality of the printed circuit board can be improved.

Description

Printed circuit board
Technical Field
The present invention relates to a printed circuit board.
Background
Generally, electronic products are usually developed with circuit boards of different interface types to meet different demands of the market. For example, a computer may be designed as a Display Port (DP) type motherboard and a High Definition Multimedia Interface (High Definition Multimedia Interface) type motherboard.
However, this method requires designing a different Printed Circuit Board (PCB) and printing the different PCB, which wastes development cost.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a printed circuit board of a general type.
A printed circuit board for selectively mounting a first format connector or a second format connector, the printed circuit board comprising:
the mounting device comprises a mounting area, a plurality of groups of special bonding pads and a plurality of general bonding pads, wherein the mounting area is provided with the special bonding pads and the general bonding pads;
the control chip is electrically connected with the special bonding pad group and the general bonding pad group and is used for establishing communication connection with the first specification connector or the second specification connector;
the alternating current coupling module is electrically connected between the general pad group and the control chip and is used for blocking direct current components in electric signals transmitted between the control chip and the first specification connector or the second specification connector;
when the printed circuit board selects to install the first specification connector, the first pins of the first specification connector are correspondingly installed on the universal pads;
when the printed circuit board selects to install the second specification connector, the second pins of the second specification connector are correspondingly installed on the special welding discs and the universal welding discs.
Furthermore, the printed circuit board further comprises a first circuit group, and a first end of the first circuit group is electrically connected to the general pad group.
Further, the printed circuit board further includes a south bridge chip, the south bridge chip is electrically connected to the control chip, and the second end of the first circuit group is electrically connected to the south bridge chip.
Furthermore, the printed circuit board further comprises a second circuit group, wherein the first end of the second circuit group is electrically connected to the special bonding pad group and the general bonding pad group.
Further, a second end of the second line set is electrically connected to the south bridge chip.
Further, the first circuit group and the second circuit group are both printed circuits.
Furthermore, the alternating current coupling module comprises a first capacitor to an eighth capacitor, one end of the first capacitor to the eighth capacitor is electrically connected with the control chip, and the other end of the first capacitor to the eighth capacitor is electrically connected with the first general pad to the eighth general pad.
Further, the general purpose pad group comprises nineteen general purpose pads, and the special purpose pad group comprises one special purpose pad.
Further, the control chip is a central processing unit.
Further, the first specification connector is a high-definition multimedia interface, and the second specification connector is a display interface.
According to the printed circuit board, by arranging the universal welding disc group and the special welding disc group, when the high-definition multimedia interface is configured according to the design requirement of a product, pins of the high-definition multimedia interface are installed on the universal welding discs in the universal welding disc group. When the design requirement of a product is to configure a display interface, pins of the display interface are installed on a plurality of general pads of the general pad group and special pads in the special pad group. In this way, the versatility of the printed circuit board can be enhanced.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings in conjunction with preferred embodiments.
FIG. 1 is a diagram of a printed circuit board according to a preferred embodiment of the present invention.
FIG. 2 is a schematic view of a preferred embodiment of the mounting area of FIG. 1.
Fig. 3 is a block diagram of a preferred embodiment of the printed circuit board of fig. 1 with a first format connector mounted thereon.
Fig. 4 is a block diagram of a preferred embodiment of the printed circuit board of fig. 1 with a second format connector mounted thereon.
Fig. 5 is a circuit diagram of the printed circuit board of fig. 3 with a first format connector mounted thereon.
Fig. 6 is a circuit diagram of the printed circuit board of fig. 4 with a second format connector mounted thereon.
Description of the main elements
Printed circuit board 100
First specification connector 200
Second specification connector 300
Body 10
Mounting area 12
Universal padset 14
Special land set 16
AC coupling module 20
First line set 30
Second line set 40
South bridge chip 50
Control chip 60
Capacitor C1-C8
Resistors R1-R4
Bonding pads G1-G20
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following will be described in detail and related descriptions of the printed circuit board in the present invention with reference to the accompanying drawings and embodiments.
Referring to fig. 1 and 2, in a preferred embodiment, a Printed Circuit Board (PCB) 100 can selectively mount a first-specification connector 200 or a second-specification connector 300. In this embodiment, the first specification connector 200 is a High Definition Multimedia Interface (High Definition Multimedia Interface). The second specification connector 300 is a Display Port (DP).
The printed circuit board 100 includes a body 10. The body 10 is provided with a mounting area 12. The mounting region 12 is provided with a general pad group 14 and a special pad group 16, wherein the general pad group 14 includes a plurality of general pads, the special pad group 16 includes a plurality of special pads, and the general pads and the special pads are used for transmitting electrical signals. A number of universal pads in the universal pad set 14 are used to mount the first specification connector 200. The general pads of the general pad group 14 and the special pads of the special pad group 16 are used for mounting the second specification connector 300.
When the printed circuit board 100 selects to mount the first specification connector 200, the pins of the first specification connector 200 are correspondingly mounted on the general pads of the general pad group 14.
When the printed circuit board 100 selects to mount the second specification connector 300, the pins of the second specification connector 300 are correspondingly mounted on the general pads of the general pad group 14 and the special pads of the special pad group 16. Therefore, the printed circuit board 100 can be mounted with connectors of different specifications according to actual requirements, thereby saving design cost.
Referring to fig. 3 to 4, in the present embodiment, the printed circuit board 100 is further provided with an ac coupling module 20, a first circuit group 30, a second circuit group 40, a south bridge chip 50 and a control chip 60. The control chip 60 is electrically connected to the general pad set 14 and the special pad set 16 for establishing a communication connection with the first specification connector 200 or the second specification connector 300.
Since the electrical signals transmitted between the control chip 60 and the first specification connector 200 or the second specification connector 300 are high-speed differential signals and some dc components exist during the transmission of the signals, the ac coupling module 20 is electrically connected between the general pad set 14 and the control chip 60, so that the dc components in the electrical signals transmitted between the control chip 60 and the first specification connector 200 or the second specification connector 300 can be blocked, and the dc interference between the control chip 60 and the first specification connector 200 or the second specification connector 300 can be eliminated. The south bridge chip 50 is electrically connected to the control chip 60. In this embodiment, the control chip 60 is a central processing unit.
In a preferred embodiment, one end of the first circuit group 30 is electrically connected to the general purpose pad group 14, and the other end of the first circuit group 30 is electrically connected to the south bridge chip 50. One end of the second circuit group 40 is electrically connected to the general pad group 14 and the dedicated pad group 16, and the other end of the second circuit group 40 is electrically connected to the south bridge 50.
In this way, the first specification connector 200 can establish communication connection with the control chip 60 and the south bridge chip 50 through the ac coupling module 20 and the first circuit group 30, respectively. The second specification connector 300 can establish communication connection with the control chip 60 and the south bridge chip 50 through the ac coupling module 20 and the second line set 40, respectively.
Referring to fig. 5 to 6, in the present embodiment, the printed circuit board 100 further includes four resistors R1-R4. The ac coupling module 20 includes eight capacitors C1-C8. The universal pad set 14 includes nineteen universal pads G1-G19. The dedicated pad group 16 includes a dedicated pad G20.
When the printed circuit board 100 selects to mount a high-definition multimedia interface, the nineteen general pads G1-G19 are used for mounting nineteen pins of the high-definition multimedia interface in a one-to-one correspondence. Eight general pads G1, G3, G4, G6, G7, G9, G10 and G12 correspond to the eight capacitors C1-C8 one by one, and are electrically connected with the control chip 60 through the eight capacitors C1-C8 respectively, so as to establish a data transmission channel between the high-definition multimedia interface and the control chip 60. The six general pads G2, G5, G8, G11, G13, G14 are all grounded. Three general pads G15, G16, G19 are all electrically connected to the first line set 30 to establish a communication control channel between the high definition multimedia interface and the south bridge chip 50. The general pad G17 is grounded through the resistor R1. The general pad G18 is electrically connected to a power supply V1 through the resistor R2. In this way, a communication connection between the high-definition multimedia interface and the control chip 60 is realized.
When the printed circuit board 100 selects to mount the display interface, the nineteen general pads G1-G19 and the special pad G20 are used for mounting twenty pins of the display interface in a one-to-one correspondence. Eight general pads G1, G3, G4, G6, G7, G9, G10 and G12 correspond to the eight capacitors C1-C8 one by one, and are electrically connected with the control chip 60 through the eight capacitors C1-C8 respectively, so as to establish a data transmission channel between the display interface and the control chip 60. The six general pads G2, G5, G8, G11, G13, G14 are all grounded. Three general pads G15, G17, G18 are electrically connected to the second line group 40 to establish a communication control channel between the display interface and the south bridge chip 50. Two common pads G16, G19 are grounded through the resistors R3, R4. The general pad G20 is electrically connected to a power supply V2. In this way, a communication connection between the display interface and the control chip 60 is realized.
In this embodiment, the power supply V1 can output a voltage of 3.3 volts, and the power supply V2 can output a voltage of 5V.
In the present embodiment, the first line group 30 and the second line group 40 are printed lines.
By arranging the general bonding pad group 14 and the special bonding pad group 16, when the design requirement of the product is to configure a high-definition multimedia interface, the printed circuit board 100 mounts the pins of the high-definition multimedia interface to a plurality of general bonding pads in the general bonding pad group 14. When the design requirement of the product is to configure the display interface, the pins of the display interface are mounted to the general pads of the general pad group 14 and the special pads of the special pad group 16. Thus, the universality of the printed circuit board 100 can be enhanced, and the design cost can be saved.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited, although the present invention is described in detail with reference to the preferred embodiments. It will be understood by those skilled in the art that various modifications and equivalent arrangements can be made without departing from the spirit and scope of the present invention. Moreover, based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without any creative effort will fall within the protection scope of the present invention.

Claims (10)

1. A printed circuit board for selectively mounting a first format connector or a second format connector, the printed circuit board comprising:
the mounting device comprises a mounting area, a plurality of groups of special bonding pads and a plurality of general bonding pads, wherein the mounting area is provided with the special bonding pads and the general bonding pads;
the control chip is electrically connected with the special bonding pad group and the general bonding pad group and is used for establishing communication connection with the first specification connector or the second specification connector;
the alternating current coupling module is electrically connected between the general pad group and the control chip and is used for blocking direct current components in electric signals transmitted between the control chip and the first specification connector or the second specification connector;
when the printed circuit board selects to install the first specification connector, the first pins of the first specification connector are correspondingly installed on the universal pads;
when the printed circuit board selects to install the second specification connector, the second pins of the second specification connector are correspondingly installed on the special welding discs and the universal welding discs.
2. The printed circuit board of claim 1, further comprising a first set of traces, a first end of the first set of traces being electrically connected to the set of universal pads.
3. The printed circuit board of claim 2, further comprising a south bridge chip electrically connected to the control chip, wherein the second end of the first circuit group is electrically connected to the south bridge chip.
4. The printed circuit board of claim 3, further comprising a second circuit group, a first end of the second circuit group being electrically connected to the dedicated pad group and the general pad group.
5. The printed circuit board of claim 4, wherein the second terminals of the second wire set are electrically connected to the south bridge chip.
6. The printed circuit board of claim 4, wherein the first wire set and the second wire set are both printed wires.
7. The printed circuit board of claim 1, wherein the ac coupling module includes first to eighth capacitors, one ends of the first to eighth capacitors are electrically connected to the control chip, respectively, and the other ends of the first to eighth capacitors are electrically connected to first to eighth general pads, respectively.
8. The printed circuit board of claim 1, wherein the universal pad set includes nineteen universal pads and the dedicated pad set includes one dedicated pad.
9. The printed circuit board of claim 1, wherein the control chip is a central processing unit.
10. The printed circuit board of claim 1, wherein the first format connector is a high definition multimedia interface and the second format connector is a display interface.
CN201910713912.6A 2019-08-02 2019-08-02 Printed circuit board Pending CN112312651A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910713912.6A CN112312651A (en) 2019-08-02 2019-08-02 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910713912.6A CN112312651A (en) 2019-08-02 2019-08-02 Printed circuit board

Publications (1)

Publication Number Publication Date
CN112312651A true CN112312651A (en) 2021-02-02

Family

ID=74485276

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910713912.6A Pending CN112312651A (en) 2019-08-02 2019-08-02 Printed circuit board

Country Status (1)

Country Link
CN (1) CN112312651A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6480020B1 (en) * 1999-05-18 2002-11-12 Western Digital Technologies, Inc. Printed circuit assembly having integrated resistors for terminating data and control lines of a host-peripheral interface
CN101083873A (en) * 2007-07-13 2007-12-05 华为技术有限公司 Circuit board product and printed circuit board
CN101136003A (en) * 2006-09-01 2008-03-05 鸿富锦精密工业（深圳）有限公司 High speed differential signal transmission structure
US20110025699A1 (en) * 2009-07-28 2011-02-03 Seiko Epson Corporation Integrated circuit device and electronic apparatus
US20170360280A1 (en) * 2016-06-21 2017-12-21 Endochoice, Inc. Endoscope System with Multiple Connection Interfaces to Interface with Different Video Data Signal Sources

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6480020B1 (en) * 1999-05-18 2002-11-12 Western Digital Technologies, Inc. Printed circuit assembly having integrated resistors for terminating data and control lines of a host-peripheral interface
CN101136003A (en) * 2006-09-01 2008-03-05 鸿富锦精密工业（深圳）有限公司 High speed differential signal transmission structure
CN101083873A (en) * 2007-07-13 2007-12-05 华为技术有限公司 Circuit board product and printed circuit board
US20110025699A1 (en) * 2009-07-28 2011-02-03 Seiko Epson Corporation Integrated circuit device and electronic apparatus
US20170360280A1 (en) * 2016-06-21 2017-12-21 Endochoice, Inc. Endoscope System with Multiple Connection Interfaces to Interface with Different Video Data Signal Sources

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Application publication date: 20210202

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