CN112300571A - Organic ceramic mobile phone backboard and tape casting preparation method thereof - Google Patents

Organic ceramic mobile phone backboard and tape casting preparation method thereof Download PDF

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Publication number
CN112300571A
CN112300571A CN201910696788.7A CN201910696788A CN112300571A CN 112300571 A CN112300571 A CN 112300571A CN 201910696788 A CN201910696788 A CN 201910696788A CN 112300571 A CN112300571 A CN 112300571A
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mobile phone
resin
casting
parts
curing
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Inventor
王治虎
魏建设
李鹏辉
赵林强
王庆杰
秦振忠
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Langfang Gaoci New Material Technology Co ltd
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Langfang Gaoci New Material Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C08K2003/166—Magnesium halide, e.g. magnesium chloride
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3009—Sulfides
    • C08K2003/3036—Sulfides of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
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  • Signal Processing (AREA)
  • Ceramic Engineering (AREA)
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  • Fluid Mechanics (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
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Abstract

The application discloses an organic ceramic mobile phone backboard and a tape casting preparation method thereof, wherein the organic ceramic mobile phone backboard is mainly prepared from the following raw materials in parts by weight: 30-70 parts of high-frequency resin, 10-50 parts of epoxy resin, 200 parts of inorganic non-metal powder, 5-30 parts of curing agent, 1-30 parts of pigment and 5-20 parts of additive; 20-90 parts of a solvent; the high-frequency resin has a dielectric constant of less than 4.0 and a dielectric loss of less than 0.01. The polymer resin in the mobile phone back plate is subjected to polymerization reaction after high-temperature curing, so that the flexibility and the processability of the resin material are good; inorganic matters such as aluminum oxide and the like are subjected to high-temperature polymerization reaction, so that the mobile phone back plate has ceramic rigid texture. The dielectric loss is lower and less than 0.01, and the electrical property meets the use requirement of 5G; the comprehensive performances such as toughness, strength, heat dissipation and the like are better, and the wireless charging design requirement can be met; the processing energy consumption is low, and the batch production and application are convenient.

Description

Organic ceramic mobile phone backboard and tape casting preparation method thereof
Technical Field
The application belongs to the technical field of mobile phone backboard materials, and particularly relates to an organic ceramic mobile phone backboard and a tape casting preparation method thereof.
Background
Several types of mobile phone back boards in the current mainstream are made of four types of materials: plastic, metal, glass, ceramic.
The plastic material has the advantages of high strength, impact resistance, wide range of use temperature, free dyeing, self coloring, no paint falling, good signal performance, good flame retardance and the like, and is most widely applied to plastic machine bodies in the early stage. But the appearance and the hand feeling are cheaper and the quality feeling is poorer, so that the method is basically applied to the thousand-element machines at present.
The metals used on the mobile phone are classified differently, but the metal material on the mobile phone is mainly aluminum alloy, namely aluminum metal is doped with a small amount of magnesium or other metal materials to enhance the strength of the metal, including magnesium-aluminum alloy, titanium-aluminum alloy and the like. The stainless steel material and the titanium alloy are also applied to the mobile phone body. The metal machine body has higher process and better hand feeling, so the metal machine body is mainly used for medium and high-end machine types.
Besides metal, glass is not used in mobile phones, and compared with common metal and plastic, glass has higher hardness, thermal conductivity coefficient between the metal and the plastic, is more transparent than plastic, and is more easily colored than metal. And the glass has small influence on wireless signals. However, the glass material itself has a difficulty in the 3D Unibody body processing process, a low yield, and is easily broken. Therefore, the glass back plate is generally flat, and a curved glass back plate is applied to a high-end model.
The ceramic material used on the smart phone is generally formed by sintering metal oxides or borides such as alumina or zirconia, and the like, and has the advantages of metal luster, good heat conduction, high hardness and good surface luster. However, the ceramic sintering requires a high temperature process of over 1000 ℃, and a post-complex processing process brought by high hardness and low toughness, so that the ceramic back plate has low yield, low productivity and high cost.
In general, the comprehensive image of the existing mobile phone back plate material has more serious problems, wherein the plastic cement and the plastic have low heat-conducting property and low overall quality; the back plates made of metal materials such as aluminum alloy and the like shield signals and cannot be designed for wireless charging, and 5G high frequency cannot be used; the glass is fragile and has low toughness; the ceramic back plate has low toughness, high energy consumption in the production and processing process, low productivity and high cost. Therefore, a mobile phone backboard material with better comprehensive performance needs to be developed.
Disclosure of Invention
In view of the above-mentioned drawbacks or deficiencies in the prior art, it is desirable to provide an organic ceramic handset back sheet and a casting method thereof.
The application provides an organic ceramic mobile phone backboard, which is mainly prepared from the following raw materials in parts by weight:
Figure BDA0002149598010000021
the high-frequency resin has a dielectric constant of less than 4.0 and a dielectric loss of less than 0.01.
The polymer resin in the organic ceramic mobile phone back plate is subjected to polymerization reaction after high-temperature curing, so that the flexibility and the processability of the resin material are good; inorganic matters such as alumina in the composite material are subjected to high-temperature polymerization reaction, so that the mobile phone back plate has ceramic rigid texture. The dielectric loss is lower and less than 0.01, and the electrical property meets the use requirement of 5G; the comprehensive properties such as toughness, strength, heat dissipation are better, can satisfy wireless charging design requirement.
Preferably, the high-frequency resin is one or more selected from the group consisting of cyanate ester resin, polyphenylene sulfide resin, polytetrafluoroethylene resin, and modified epoxy resin.
Preferably, the additives include:
Figure BDA0002149598010000022
preferably, the curing agent is a latent curing agent such as dicyandiamide, DDS, or the like.
Preferably, the inorganic non-metal powder comprises one or more of aluminum nitride, boron nitride, aluminum oxide, zirconium oxide, silicon oxide, gallium arsenide, zinc sulfide, zinc selenide, magnesium fluoride, calcium fluoride, magnesium oxide, beryllium oxide and yttrium oxide.
Preferably, the inorganic non-metal powder is alumina.
Preferably, the solvent may be a conventional organic solvent such as acetone, butanone, or the like.
In a second aspect, the application further provides a casting preparation method of the above organic ceramic mobile phone back plate, including the following steps:
casting: mixing inorganic non-metal powder, high-frequency resin, epoxy resin, a curing agent, pigment, an additive and a solvent according to a certain proportion, and casting into a sheet by using casting equipment;
gum dipping: preparing glass fiber cloth into gum dipping glass fiber cloth through coating equipment;
semi-curing: feeding the sheet obtained by the casting step and the gummed glass fiber cloth obtained by the gumming step into a vacuum hot press in a laminated manner, and pressing into a semi-cured product;
and (3) curing: cutting the semi-cured product into small pieces required by mould pressing, and hot-pressing the small pieces into a mobile phone backboard blank in a vacuum hot-pressing machine through a mould;
trimming: and polishing, trimming and surface treating the surface of the mobile phone back plate blank to obtain a finished mobile phone back plate.
Preferably, the casting temperature is 80-200 ℃ and the time is 2-30 min.
Preferably, the semi-curing temperature is 80-150 ℃ and the time is 20-50 min.
Preferably, the curing temperature is 100-230 ℃, and the time is 30-150 min.
The application has the advantages and positive effects that: the polymer resin in the organic ceramic mobile phone back plate is subjected to polymerization reaction after high-temperature curing, so that the flexibility and the processability of the resin material are good; inorganic matters such as alumina in the composite material are subjected to high-temperature polymerization reaction, so that the mobile phone back plate has ceramic rigid texture. The dielectric loss is lower and less than 0.01, and the electrical property meets the use requirement of 5G; the comprehensive properties such as toughness, strength, heat dissipation are better, can satisfy wireless charging design requirement.
In addition to the technical problems addressed by the present application, the technical features constituting the technical solutions, and the advantages brought by the technical features of the technical solutions described above, other technical problems solved by the present application, other technical features included in the technical solutions, and advantages brought by the technical features will be described in further detail below.
Detailed Description
The present application will be described in further detail with reference to examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Example 1
The embodiment provides an organic ceramic mobile phone backboard, which is mainly prepared from the following raw materials in parts by weight:
Figure BDA0002149598010000041
the high-frequency resin has a dielectric constant of less than 4.0 and a dielectric loss of less than 0.01.
The embodiment also provides a casting preparation method of the organic ceramic mobile phone backboard, which specifically comprises the following steps:
casting: mixing 1500g of alumina powder, 500g of cyanate ester high-frequency resin, 300g of epoxy resin, 150g of dicyandiamide curing agent, 20g of pigment, 20g of flatting agent, 20g of defoaming agent, 30g of toughening agent, 30g of dispersing agent and 500g of acetone solvent; casting into sheet by casting equipment at 120 deg.C for 20 min;
gum dipping: preparing glass fiber cloth into gum dipping glass fiber cloth through coating equipment;
semi-curing: laminating the sheet material and the gum dipping glass fiber cloth according to requirements, putting the laminated sheet material and the gum dipping glass fiber cloth into a vacuum hot press, and hot-pressing for 30min at 120 ℃ to obtain a semi-cured product;
and (3) curing: cutting the semi-cured product into small pieces required by mould pressing, and carrying out hot pressing for 90min by a mould in a vacuum hot press at 200 ℃ to obtain a mobile phone backboard blank;
trimming: and polishing, trimming and surface treating the surface of the mobile phone back plate blank to obtain a finished mobile phone back plate.
Example 2
The embodiment provides an organic ceramic mobile phone backboard, which is mainly prepared from the following raw materials in parts by weight:
Figure BDA0002149598010000051
the high-frequency resin has a dielectric constant of less than 4.0 and a dielectric loss of less than 0.01.
The embodiment also provides a casting preparation method of the organic ceramic mobile phone backboard, which specifically comprises the following steps:
casting: mixing 500g of aluminum nitride powder, 500g of boron nitride powder, 300g of polyphenylene sulfide high-frequency resin, 100g of epoxy resin, 50g of DDS curing agent, 10g of pigment, 10g of flatting agent, 10g of defoaming agent, 10g of toughening agent, 10g of dispersing agent and 200g of butanone solvent, and casting into a sheet by using casting equipment; the casting temperature is 80 ℃, and the casting time is 30 min;
gum dipping: preparing glass fiber cloth into gum dipping glass fiber cloth through coating equipment;
semi-curing: laminating the sheet material and the gum dipping glass fiber cloth into a vacuum hot press, and hot-pressing for 50min at 80 ℃ to obtain a semi-cured product;
and (3) curing: cutting the semi-cured product into small pieces required by mould pressing, and carrying out hot pressing for 30min by a mould in a vacuum hot press at 230 ℃ to obtain a mobile phone backboard blank;
trimming: and polishing, trimming and surface treating the surface of the mobile phone back plate blank to obtain a finished mobile phone back plate.
Example 3
The embodiment provides an organic ceramic mobile phone backboard, which is mainly prepared from the following raw materials in parts by weight:
Figure BDA0002149598010000061
the high-frequency resin has a dielectric constant of less than 4.0 and a dielectric loss of less than 0.01.
The embodiment also provides a casting preparation method of the organic ceramic mobile phone backboard, which specifically comprises the following steps:
casting: mixing 1000g of zinc sulfide powder, 600g of zinc selenide powder, 400g of magnesium fluoride powder, 400g of polytetrafluoroethylene high-frequency resin, 300g of modified epoxy high-frequency resin, 500g of epoxy resin, 300g of dicyandiamide curing agent, 300g of pigment, 50g of flatting agent, 50g of defoaming agent, 50g of toughening agent, 50g of dispersing agent and 900g of butanone solvent, and casting into a sheet by using casting equipment; the casting temperature is 200 ℃, and the casting time is 2 min;
gum dipping: preparing glass fiber cloth into gum dipping glass fiber cloth through coating equipment;
semi-curing: laminating the sheet material and the gum dipping glass fiber cloth into a vacuum hot press, and hot-pressing at 150 ℃ for 20min to obtain a semi-cured product;
and (3) curing: cutting the semi-cured product into small pieces required by mould pressing, and carrying out hot pressing for 150min by a mould in a vacuum hot press at 100 ℃ to obtain a mobile phone backboard blank;
trimming: and polishing, trimming and surface treating the surface of the mobile phone back plate blank to obtain a finished mobile phone back plate.
Example 4
The embodiment provides an organic ceramic mobile phone backboard, which is mainly prepared from the following raw materials in parts by weight:
Figure BDA0002149598010000071
the high-frequency resin has a dielectric constant of less than 4.0 and a dielectric loss of less than 0.01.
The embodiment also provides a casting preparation method of the organic ceramic mobile phone backboard, which specifically comprises the following steps:
casting: mixing 1800g of calcium fluoride powder, 600g of polytetrafluoroethylene high-frequency resin, 400g of epoxy resin, 200g of dicyandiamide curing agent, 50g of pigment, 30g of flatting agent, 40g of defoaming agent, 20g of toughening agent, 10g of dispersing agent and 400g of acetone solvent, and casting into a sheet by using casting equipment; the casting temperature is 100 ℃, and the casting time is 10 min;
gum dipping: preparing glass fiber cloth into gum dipping glass fiber cloth through coating equipment;
semi-curing: laminating the sheet material and the gum dipping glass fiber cloth into a vacuum hot press, and hot-pressing at 100 ℃ for 40min to obtain a semi-cured product;
and (3) curing: cutting the semi-cured product into small pieces required by mould pressing, and carrying out hot pressing for 40min by a mould in a vacuum hot press at 150 ℃ to obtain a mobile phone backboard blank;
trimming: and polishing, trimming and surface treating the surface of the mobile phone back plate blank to obtain a finished mobile phone back plate.
Example 5
The embodiment provides an organic ceramic mobile phone backboard, which is mainly prepared from the following raw materials in parts by weight:
Figure BDA0002149598010000081
the high-frequency resin has a dielectric constant of less than 4.0 and a dielectric loss of less than 0.01.
The embodiment also provides a casting preparation method of the organic ceramic mobile phone backboard, which specifically comprises the following steps:
casting: 1300g of silicon oxide powder, 450g of modified epoxy high-frequency resin, 200g of epoxy resin, 100g of dicyandiamide curing agent, 100g of pigment, 40g of flatting agent, 30g of defoaming agent, 50g of toughening agent, 10g of dispersing agent, 300g of acetone solvent and 400g of butanone solvent are mixed and cast into a sheet by a tape casting device; the casting temperature is 110 ℃, and the casting time is 15 min;
gum dipping: preparing glass fiber cloth into gum dipping glass fiber cloth through coating equipment;
semi-curing: laminating the sheet material and the gum dipping glass fiber cloth into a vacuum hot press, and hot-pressing at 110 ℃ for 40min to obtain a semi-cured product;
and (3) curing: cutting the semi-cured product into small pieces required by mould pressing, and carrying out hot pressing for 30min by a mould in a vacuum hot press at 180 ℃ to obtain a mobile phone backboard blank;
trimming: and polishing, trimming and surface treating the surface of the mobile phone back plate blank to obtain a finished mobile phone back plate.
The inorganic nonmetal powder can be oxides, nitrides, fluorides, arsenides, selenides, sulfides and the like; in addition to the inorganic non-metal powder used in the above embodiments, in other embodiments of the present application, the inorganic non-metal powder may also be one or a combination of several of zirconia, gallium arsenide, magnesium fluoride, magnesium oxide, beryllium oxide, yttrium oxide, or a combination of zirconia, gallium arsenide, magnesium fluoride, magnesium oxide, beryllium oxide, yttrium oxide and the non-metal powder in embodiments 1 to 5.
Comparative example 1
Plastics cell-phone backplate.
Comparative example 2
Glass cell-phone backplate.
Comparative example 3
An aluminum alloy mobile phone backboard.
Comparative example 4
Ceramic cell-phone backplate.
The performance tests were performed on examples 1 to 5 and comparative examples 1 to 4, and the test standards and test results are shown in table 1.
Table 1 results of performance testing
Figure BDA0002149598010000091
The organic ceramic mobile phone backboard material provided by the application is a composite material with flexibility processability of a resin material and ceramic rigidity texture, the electric heating performance meets 5G frequency application, the appearance ceramic texture is better in comprehensive performances such as toughness, strength and heat dissipation, the organic ceramic mobile phone backboard material can be applied to a wireless charging design scheme, and the heat dissipation requirement meets 5G application. In addition, the method has low processing energy consumption and is convenient for batch production and application.
The method is verified by a laboratory, and is tried by terminal customers in small batches, and other good electric heating performances can meet the quality requirement.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (10)

1. An organic ceramic mobile phone backboard is characterized by being mainly prepared from the following raw materials in parts by weight:
Figure FDA0002149595000000011
the high-frequency resin is a resin with a dielectric constant less than 4.0 and a dielectric loss less than 0.01.
2. The organic ceramic mobile phone backboard according to claim 1, wherein the high-frequency resin is selected from one or more of cyanate ester resin, polyphenylene sulfide resin, polytetrafluoroethylene resin and modified epoxy resin.
3. The organo-ceramic handset backplate of claim 1, wherein the additive comprises:
Figure FDA0002149595000000012
4. the organo-ceramic phone backplate of claim 1, wherein the curing agent is a latent curing agent.
5. The organic ceramic mobile phone backboard according to claim 1, wherein the inorganic non-metal powder comprises one or more of aluminum nitride, boron nitride, aluminum oxide, zirconium oxide, silicon oxide, gallium arsenide, zinc sulfide, zinc selenide, magnesium fluoride and calcium fluoride.
6. The organic ceramic mobile phone backboard according to claim 5, wherein the inorganic non-metal powder is aluminum oxide.
7. A casting preparation method of the organic ceramic mobile phone backboard according to any one of claims 1 to 6, which is characterized by comprising the following steps:
casting: mixing the inorganic nonmetal powder, the high-frequency resin, the epoxy resin, the curing agent, the pigment, other additives and the solvent according to a certain proportion, and casting into a sheet by using casting equipment;
gum dipping: preparing glass fiber cloth into gum dipping glass fiber cloth through coating equipment;
semi-curing: feeding the sheet obtained by the casting step and the gummed glass fiber cloth obtained by the gumming step into a vacuum hot press in a laminated manner, and pressing into a semi-cured product;
and (3) curing: cutting the semi-cured product into small pieces required by mould pressing, and hot-pressing the small pieces into a mobile phone backboard blank in a vacuum hot-pressing machine through a mould;
trimming: and polishing, trimming and surface treating the surface of the mobile phone back plate blank to obtain a finished mobile phone back plate.
8. The casting production method as claimed in claim 7, wherein the casting temperature is 80 to 200 ℃ and the time is 2 to 30 min.
9. The cast preparation method of claim 7, wherein the semi-curing temperature is 80 to 150 ℃ and the time is 20 to 50 min.
10. The casting preparation method as claimed in claim 7, wherein the curing temperature is 100-230 ℃ and the time is 30-150 min.
CN201910696788.7A 2019-07-30 2019-07-30 Organic ceramic mobile phone backboard and tape casting preparation method thereof Pending CN112300571A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10237271A (en) * 1997-02-27 1998-09-08 Hitachi Chem Co Ltd Thermosetting resin composition, film or sheet adhesive and adhesive-coated metal foil
CN105949717A (en) * 2016-05-05 2016-09-21 廊坊市高瓷新材料科技有限公司 Flame retardant organic ceramic substrate composition, flame retardant organic ceramic substrate, making method thereof and copper-clad plate
CN106082781A (en) * 2016-06-02 2016-11-09 廊坊市高瓷新材料科技有限公司 Ceramic composition, ceramic substrate and phone housing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10237271A (en) * 1997-02-27 1998-09-08 Hitachi Chem Co Ltd Thermosetting resin composition, film or sheet adhesive and adhesive-coated metal foil
CN105949717A (en) * 2016-05-05 2016-09-21 廊坊市高瓷新材料科技有限公司 Flame retardant organic ceramic substrate composition, flame retardant organic ceramic substrate, making method thereof and copper-clad plate
CN106082781A (en) * 2016-06-02 2016-11-09 廊坊市高瓷新材料科技有限公司 Ceramic composition, ceramic substrate and phone housing

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