CN112296531A - Scribing and breaking method - Google Patents

Scribing and breaking method Download PDF

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Publication number
CN112296531A
CN112296531A CN202010043436.4A CN202010043436A CN112296531A CN 112296531 A CN112296531 A CN 112296531A CN 202010043436 A CN202010043436 A CN 202010043436A CN 112296531 A CN112296531 A CN 112296531A
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China
Prior art keywords
scribing
cutting groove
sheet material
straight channel
splitting
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CN202010043436.4A
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Chinese (zh)
Inventor
徐贵阳
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Wuhan DR Llaser Technology Corp Ltd
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Wuhan DR Llaser Technology Corp Ltd
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Priority to CN202010043436.4A priority Critical patent/CN112296531A/en
Publication of CN112296531A publication Critical patent/CN112296531A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

A scribing and breaking method comprises the steps that sheet materials firstly make linear motion along a scribing segment, in the process of the linear motion, a laser beam and the sheet materials move relatively on a breaking line to form a cutting groove, the extending direction of the cutting groove is consistent with the linear motion direction of the sheet materials, then the sheet materials with the cutting groove make linear motion along the scribing segment, in the process of the linear motion, the sheet materials are split along the cutting groove to obtain sub-pieces, and one cutting groove corresponds to two sub-pieces during splitting; the movement mode of the sheet material with the cutting grooves from the scribing section to the splitting section is linear movement. The design can not only ensure that scribing and breaking are carried out simultaneously with transmission, improve the processing efficiency, but also improve the utilization rate of the laser.

Description

Scribing and breaking method
Technical Field
The invention relates to a processing technology of a sheet material, belongs to the technical field of precision processing equipment, and particularly relates to a scribing and breaking method of a solar sheet material.
Background
In the prior art, when a sheet material is subjected to laser scribing, particularly in the technical field of solar cell processing, a cell sheet is generally conveyed to a rotary processing workbench through a conveyor belt, a manipulator and the like, and then is conveyed to a laser processing device in a stepping manner, then the sheet material is scanned at the position of a cutting groove by laser in a static state to form a cutting groove with a certain depth, then the sheet material with the cutting groove is conveyed to a splitting device through the manipulator and the like to be split to obtain sub-sheets, and then the sub-sheets are conveyed through the manipulator, the conveyor belt and the like.
Therefore, in the prior art, when scribing and breaking are carried out, the sheet materials are required to be kept static, the sheet materials need to occupy a certain time of about 0.4 s/time when being switched and conveyed every time, the time required by laser scanning to process one cutting groove is about 0.5s/pcs, and therefore the time of more than 40% of the sheet material conveying switching is occupied, the utilization rate of a laser is insufficient, and the processing efficiency is low. Similarly, during the splitting, the flaky materials also need to be processed in a static state, resulting in low processing efficiency.
The information disclosed in this background section is only for enhancement of understanding of the general background of the patent application and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
The invention aims to overcome the defects and problems of low processing efficiency in the prior art and provide a scribing and breaking method with high processing efficiency.
In order to achieve the above purpose, the technical solution of the invention is as follows: a scribing and breaking method comprises a scribing process, wherein the scribing process is carried out in a scribing segment, and the scribing process refers to the following steps: the sheet material makes linear motion along the scribing segment, in the process of the linear motion, a laser beam emitted by the laser processing device is focused on a fracture line on the top surface of the sheet material, the laser beam and the sheet material move relatively on the fracture line to form a cutting groove, so that the sheet material with the cutting groove is obtained, and at least one cutting groove is formed.
The method further comprises a splitting procedure after the scribing procedure, wherein the splitting procedure is carried out on a splitting section, and the scribing section and the splitting section are sequentially arranged in front of and behind the splitting section;
the splitting process comprises the following steps: above-mentioned slice material of area cutting groove makes rectilinear motion along splitting the piece, and at rectilinear motion's in-process, slice material splits along cutting the groove in order to obtain the sub-piece, and during the split, a cutting groove corresponds two sub-pieces, the sub-piece is two at least.
The relative movement of the laser beam and the sheet material on the fracture line refers to any one of the following three modes:
the first method comprises the following steps: the sheet material moves linearly, the laser beam keeps still, and the extending direction of the cutting groove is consistent with the linear movement direction of the sheet material;
and the second method comprises the following steps: the sheet material makes linear motion, the laser beam makes sequence or reciprocating motion along the fracture line, and the extending direction of the cutting groove is consistent with the linear motion direction of the sheet material.
And the third is that: the sheet material moves linearly, and the laser beam flies and cuts along the fracture line.
When the number of the cutting grooves formed in a single sheet material is at least two, the laser beam emitted by the laser processing device is focused on the fracture line on the top surface of the sheet material in any one of the following manners:
the first method comprises the following steps: the laser processing devices are in one-to-one correspondence with the cutting grooves;
and the second method comprises the following steps: the laser processing device is divided into a plurality of laser beams by the light dividing device, and the laser beams correspond to the cutting grooves one by one;
and thirdly, one laser processing device is adopted, and a laser beam emitted by the processing device is sequentially focused on different fracture lines to sequentially complete the processing of the plurality of cutting grooves.
The step of splitting the flaky material along the cutting groove to obtain sub-pieces is as follows: the cutting groove receives a first longitudinal force, the parts of the flaky materials, which are positioned on two sides of the cutting groove, respectively receive a second longitudinal force, and the action directions of the first longitudinal force and the second longitudinal force are opposite and are perpendicular to the linear motion direction of the flaky materials.
The first longitudinal force is an upper jacking force, the upper jacking force acts under the cutting groove, the second longitudinal force is a lower pressure, and the lower pressure acts on two sides of the cutting groove.
The extending direction of the cutting groove is the same as the linear motion direction.
The movement mode of the sheet material with the cutting grooves from the scribing section to the splitting section is linear movement.
The scribing section comprises a first scribing straight channel, a second scribing straight channel and a first gap straight channel clamped between the first scribing straight channel and the second scribing straight channel, when the sheet-shaped material moves linearly along the scribing section, the fracture line and the cutting groove are both located right above the first gap straight channel, and the top surfaces of the first scribing straight channel and the second scribing straight channel are both in contact with the bottom surface of the sheet-shaped material.
The splitting section comprises a first splitting straight channel, a second splitting straight channel and a second gap straight channel clamped between the first splitting straight channel and the second splitting straight channel;
when the flaky material moves linearly along the splinter section, the cutting groove is positioned right above the second gap straight path, and the top surfaces of the first splinter straight path and the second splinter straight path are both contacted with the bottom surface of the flaky material.
An upper jacking device is arranged in the second gap straight channel, and the top end of the upper jacking device is higher than the top surface of the second gap straight channel;
in the splitting procedure, when the sheet material with the cutting groove makes linear motion along the splitting segment, the sheet material passes through the upper part of the upper jacking device, at the moment, the upper jacking device and the cutting groove are arranged just up and down, the top end of the upper jacking device is contacted with the bottom surface of the sheet material, and meanwhile, the parts of the sheet material on two sides of the cutting groove are respectively subjected to downward pressure so as to split the sheet material along the cutting groove.
Compared with the prior art, the invention has the beneficial effects that:
1. in the scribing and splitting method, the relative movement of the laser beam and the sheet material (preferably a battery piece) on the fracture line comprises three optional modes, wherein one mode is that the sheet material moves linearly, the laser beam is kept still, the other mode is that the sheet material moves linearly, the laser beam moves sequentially or in a reciprocating manner along the fracture line, the third mode is flight cutting, the sheet material can be continuously placed on a conveying belt to be continuously fed, and in any mode, the laser switch cannot be switched to wait for material change during the feeding and discharging switching of a product, so that the utilization rate of the laser is improved. In addition, when laser beam makes reciprocating motion along the broken line, can carry out scanning many times to the slice material, the advantage of scanning many times lies in through the one-point little energy scan one by one downwards strip the cutting layer by layer, effectively reduces the energy in the twinkling of an eye and piles up, reduces material vaporization particulate matter and splashes, makes the cutting section more exquisite smooth, and then reaches the purpose that reduces cutting heat affected zone, promotes slice material efficiency. And meanwhile, when the second method is selected, the short line segments can be continuously cut by selecting the small-range scanning field lens without covering the whole width of the flaky material like the prior art, so that the field lens with shorter focal length can easily obtain higher cutting precision, smaller light spots and uniformity, and better process effect is brought. Therefore, the invention not only can improve the utilization rate of the laser, but also can improve the cutting quality.
2. According to the scribing and breaking method, when a sheet material is broken along a cutting groove to obtain sub-pieces, the cutting groove is subjected to a first longitudinal force, the parts of the sheet material, which are positioned at two sides of the cutting groove, are respectively subjected to a second longitudinal force, the action directions of the first longitudinal force and the second longitudinal force are opposite, and the two longitudinal forces are mutually cooperated, so that the sheet material is broken in a moving state, and the breaking and conveying are simultaneously carried out. Therefore, the splitting efficiency of the invention is higher.
3. In the scribing and splitting method, when the scribing section comprises a first scribing straight channel, a second scribing straight channel and a first gap straight channel, and the splitting section comprises a first splitting straight channel, a second splitting straight channel and a second gap straight channel, seamless butt joint can be realized between the first scribing straight channel and the first splitting straight channel, between the first gap straight channel and the second gap straight channel, between the second scribing straight channel and the second splitting straight channel, so that scribing, splitting and conveying can be carried out simultaneously, the processing efficiency is improved, particularly when the first scribing straight channel and the first splitting straight channel are connected into an integral structure from head to tail, the second scribing straight channel and the second splitting straight channel are connected into an integral structure from head to tail, and the first gap straight channel and the second gap straight channel are connected into an integral structure from head to tail, the seamless butt joint effect is stronger, and the synchronism of scribing, splitting and conveying is also stronger. Therefore, the processing and the conveying are carried out simultaneously, and the processing efficiency is high.
Drawings
FIG. 1 is a schematic diagram of the operation of the process of the present invention.
Fig. 2 is a top view of fig. 1.
Fig. 3 is a schematic diagram of a method for completing the cutting by reciprocating scanning of the laser beam along the fracture line for multiple times in the present invention.
FIG. 4 is a schematic diagram of the force applied to the sheet material during the sheet breaking process of the present invention.
FIG. 5 is another schematic view of the sheet material being stressed during the breaking step of the present invention.
FIG. 6 is a schematic structural diagram of a first straight groove-scribing lane, a second straight groove-scribing lane, a first straight gap lane, a first straight split lane, a second straight split lane, and a second straight gap lane according to the present invention.
In the figure: the device comprises a sheet material 1, a cutting groove 2, a fracture line 21, a sub-sheet 22, a scribing section 3, a first gap straight channel 30, a first scribing groove straight channel 301, a second scribing groove straight channel 302, a splitting section 4, a second gap straight channel 40, a first splitting straight channel 401, a second splitting straight channel 402, a jacking device 5, a first longitudinal force X, a second longitudinal force Y and a laser beam S.
Detailed Description
The present invention will be described in further detail with reference to the following description and embodiments in conjunction with the accompanying drawings.
The invention is suitable for processing sheet materials, in particular for the application in the technical field of processing solar sheet materials, and the solar sheet materials are taken as an example for explanation.
Referring to fig. 1 to 6, a dicing and breaking method includes a dicing process performed in a dicing segment 3, the dicing process including: the sheet material 1 makes a linear motion along the scribing segment 3, in the process of the linear motion, a laser beam S emitted by a laser processing device is focused on a fracture line 21 on the top surface of the sheet material 1, the laser beam S and the sheet material 1 make relative movement on the fracture line 21 to form a cutting groove 2, so that the sheet material 1 with the cutting groove 2 is obtained, and at least one cutting groove 2 is provided.
The relative movement of the laser beam S and the sheet material 1 on the fracture line 21 refers to any one of the following three modes:
the first method comprises the following steps: the sheet material 1 moves linearly, the laser beam S is kept still, and the extending direction of the cutting groove 2 is consistent with the linear movement direction of the sheet material 1; specifically, the sheet material 1 moves linearly, the fracture line 21 passes through the laser beam S, the cutting of the cutting groove 2 is completed by one-time cutting, and the extending direction of the cutting groove 2 is consistent with the linear movement direction of the sheet material 1; the embodiment can adopt a conventional laser processing system, the laser beam S is focused on the fracture line 21, the sheet material 1 moves relative to the laser beam S when moving linearly, the fracture line 21 continuously passes through the focusing point of the laser beam S, and the cutting groove 2 is formed by laser processing;
and the second method comprises the following steps: the sheet material 1 makes linear motion, the laser beam S makes sequential or reciprocating motion along the fracture line 21, and the extending direction of the cutting groove 2 is consistent with the linear motion direction of the sheet material 1; specifically, the sheet material 1 makes linear motion, the laser beam S scans sequentially or reciprocally along the fracture line 21 for multiple times, the cutting groove 2 is machined through multiple times of cutting, and the extending direction of the cutting groove 2 is consistent with the linear motion direction of the sheet material 1; this embodiment can adopt conventional laser galvanometer scanning system, and laser beam S passes through the galvanometer and scans the straightway of fixed length in order or reciprocating along cutting line 21 of sheet material 1, and when sheet material 1 linear motion, the line of rupture 21 passes through laser beam S ' S scanning straight line section region, and laser beam S ' S scanning speed is greater than sheet material 1 ' S linear motion speed, and sheet material 1 ' S line of rupture 21 accomplishes many times cutting when passing through laser beam S ' S scanning straight line section region. Sequential or reciprocating scanning may be achieved by switching light of a laser galvanometer scanning system. Fig. 3 is a schematic diagram of a method for completing the cutting by the laser beam S scanning back and forth along the fracture line 21 for multiple times. In this embodiment, the length of the scanning straight line segment and the scanning speed of the galvanometer can be set, and are in a set proportional relationship with the linear motion speed. For example, assuming that the sheet material 1 needs 5 times of cutting per cutting groove 2 to achieve the optimal cutting depth, the linear motion of the sheet material 1 is set to be 300mm/s, the length of the scanning linear segment area is set to be 50mm, unidirectional sequential scanning is adopted, two adjacent linear segments are staggered by 10mm (50 mm/5 times) relative to the sheet material 1, and then the frequency of the lowest single reciprocating scanning time of the galvanometer is 300 × 5/50 ═ 30 times/s, namely the period is 1/30 s. The minimum linear velocity Vmin of the galvanometer scanning is 50 × 2/(1/30) ═ 3000 mm/s. If the scanning speed is set in the galvanometer control system, the galvanometer is adjusted to intermittently emit light according to a period (1/30 s). When the set linear motion speed is increased and the scanning interval time of the galvanometer is shortened, higher capacity can be obtained;
and the third is that: the sheet material 1 makes linear motion, and the laser beam S flies and cuts; specifically, the sheet material 1 moves linearly, and the laser beam S performs flying cutting with the fracture line 21 as a pattern, thereby completing the processing of the cutting groove 2.
Preferably, the scribing and breaking method further comprises a breaking step, wherein the breaking step is performed in the breaking section 4, and the scribing section 3 and the breaking section 4 are sequentially arranged in front of and behind each other; specifically, the splitting method in the splitting process comprises the following steps: the sheet material 1 with the cutting groove 2 is split along the cutting groove 2 to obtain sub-sheets 22.
As a preferable scheme, the sheet material 1 with the cutting groove 2 moves linearly along the splitting section 4, during the linear movement, the sheet material 1 is split along the cutting groove 2 by mechanical force to obtain the sub-pieces 22, and during the splitting, one cutting groove 2 corresponds to two sub-pieces 22. After splitting, the resulting sub-sheet 22 preferably continues to move linearly along the split segment 4.
Further, the method for splitting the sheet material 1 along the cutting groove 2 to obtain the sub-sheets 22 is as follows: the cutting groove 2 is subjected to a first longitudinal force X, the parts of the flaky materials 1, which are positioned at two sides of the cutting groove 2, are respectively subjected to a second longitudinal force Y, the acting directions of the first longitudinal force X and the second longitudinal force Y are opposite, and the first longitudinal force X and the second longitudinal force Y are perpendicular to the linear motion direction of the flaky materials 1.
Preferably, the first longitudinal force X is an upward pushing force acting directly below the cutting groove 2, and the second longitudinal force Y is a downward pushing force acting on both sides of the cutting groove 2.
Preferably, the extending direction of the cutting groove 2 is consistent with the direction of the linear motion of the sheet material 1 along the splinter section 4.
Preferably, the movement mode of the sheet material 1 with the cutting groove 2 from the scribing section 3 to the splitting section 4 is preferably a linear movement.
Preferably, the height of the sheet material 1 with the cutting grooves 2 is kept consistent when the sheet material 1 moves from the scribing segment 3 to the splitting segment 4.
In the scribing procedure, at least one cutting groove 2 is formed in a single sheet material 1; in the splitting process, the number of the sub-pieces 22 is at least two.
When the number of the cutting grooves 2 formed on a single sheet material 1 is at least two, focusing the laser beam S emitted by the laser processing device on the fracture line 21 on the top surface of the sheet material 1 means any one of the following ways:
the first method comprises the following steps: a plurality of laser processing devices are arranged, the laser processing devices correspond to the cutting grooves 2 one by one, and one laser beam S emitted by each laser processing device is focused on one fracture line 21;
and the second method comprises the following steps: the laser processing device is divided into a plurality of laser beams S through the light dividing device, and the laser beams S correspond to the cutting grooves 2 one by one;
thirdly, one laser processing device is adopted, and a laser beam S emitted by the processing device is sequentially focused on different fracture lines 21 to sequentially complete the processing of the plurality of cutting grooves 2.
Specifically, the scribing segment 3 includes a first scribing straight channel 301, a second scribing straight channel 302 and a first gap straight channel 30 sandwiched therebetween, and the fracturing segment 4 includes a first fracture straight channel 401, a second fracture straight channel 402 and a second gap straight channel 40 sandwiched therebetween.
Preferably, the tail end of the first grooving straight channel 301 is arranged opposite to the head end of the first lobe straight channel 401, the tail end of the first gap straight channel 30 is communicated with the head end of the second gap straight channel 40, and the tail end of the second grooving straight channel 302 is arranged opposite to the head end of the second lobe straight channel 402.
When the sheet material 1 moves linearly along the scribing segment 3, the fracture line 21 and the cutting groove 2 are both located right above the first gap straight path 30, and the top surfaces of the first scribing straight path 301 and the second scribing straight path 302 are both in contact with the bottom surface of the sheet material 1.
When the sheet material 1 moves linearly along the splinter segment 4, the cutting groove 2 is positioned right above the second gap straight path 40, and the top surfaces of the first splinter straight path 401 and the second splinter straight path 402 are both contacted with the bottom surface of the sheet material 1.
As a preferable scheme, the first grooving straight road 301 and the first splitting straight road 401 are connected end to form an integral structure, the second grooving straight road 302 and the second splitting straight road 402 are connected end to form an integral structure, and the first gap straight road 30 and the second gap straight road 40 are connected end to form an integral structure.
An upper jacking device 5 is arranged in the second gap straight channel 40, and the top end of the upper jacking device 5 is higher than the top surface of the second gap straight channel 40.
In the splitting procedure, when the sheet material 1 with the cutting groove 2 moves linearly along the splitting section 4, the sheet material 1 passes through the upper top device 5, at the moment, the upper top device 5 and the cutting groove 2 are arranged vertically and oppositely, the top end of the upper top device 5 is contacted with the bottom surface of the sheet material 1, and meanwhile, the parts of the sheet material 1, which are positioned at two sides of the cutting groove 2, are respectively subjected to downward pressure so as to split the sheet material 1 along the cutting groove 2.
Specifically, the first straight scribing lane 301, the second straight scribing lane 302, the first straight gap lane 30, the first straight splitting lane 401, the second straight splitting lane 402, and the second straight gap lane 40 described herein do not necessarily have to be provided with a gap with respect to the transfer and processing positions of the scribing process and the splitting process.
Preferably, in order to make the position of the sheet material 1 more accurate in the scribing process and the breaking process and make the operation of scribing and breaking simpler, the method further comprises the step of correcting the position of the sheet material 1 before the scribing process. The relative positions of the sheet material 1 when the scribing segment 3 and the splitting segment 4 perform linear motion are consistent. More preferably, the cutting groove 2 is positioned right on the first and second straight void lanes 30 and 40.
Preferably, the scribing section 3 and the splitting section 4 are belt-type conveying mechanisms, and more preferably, are negative-pressure adsorption belt-type conveying mechanisms.
Referring to fig. 1 and 2, the dividing segment 3 and the splitting segment 4 in the present invention refer to process segments, and are not limited to a segment of a road, a track or a conveyor belt which actually exists, and may be only a segment of a suspended space through which the sheet material 1 passes.
The above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiment, but equivalent modifications or changes made by those skilled in the art according to the present disclosure should be included in the scope of the present invention as set forth in the appended claims.

Claims (11)

1. A scribing and splitting method is characterized in that: the method comprises a scribing process, wherein the scribing process is carried out in a scribing segment (3), and the scribing process comprises the following steps: the sheet material (1) makes linear motion along the scribing segment (3), in the process of the linear motion, a laser beam (S) emitted by a laser processing device is focused on a fracture line (21) on the top surface of the sheet material (1), the laser beam (S) and the sheet material (1) move relatively on the fracture line (21) to form a cutting groove (2), so that the sheet material (1) with the cutting groove (2) is obtained, and the number of the cutting groove (2) is at least one.
2. The scribing and breaking method according to claim 1, wherein: the method further comprises a splitting procedure after the scribing procedure, wherein the splitting procedure is carried out on the split segment (4), and the scribing segment (3) and the split segment (4) are sequentially arranged in front of and behind;
the splitting process comprises the following steps: above-mentioned take slice material (1) of cutting groove (2) and make rectilinear motion along splitting section (4), at rectilinear motion's in-process, slice material (1) splits along cutting groove (2) in order to obtain sub-piece (22), and during the split, one cutting groove (2) corresponds two sub-pieces (22), sub-piece (22) are two at least.
3. A scribing and breaking method according to claim 1 or 2, wherein: the relative movement of the laser beam (S) and the sheet material (1) on the fracture line (21) refers to any one of the following three modes:
the first method comprises the following steps: the sheet material (1) moves linearly, the laser beam (S) keeps still, and the extending direction of the cutting groove (2) is consistent with the linear movement direction of the sheet material (1);
and the second method comprises the following steps: the sheet material (1) moves linearly, the laser beam (S) moves in sequence or in a reciprocating manner along the fracture line (21), and the extending direction of the cutting groove (2) is consistent with the linear movement direction of the sheet material (1);
and the third is that: the sheet material (1) moves linearly, and the laser beam (S) flies and cuts along the fracture line (21).
4. A scribing and breaking method according to claim 1 or 2, wherein: when the number of the cutting grooves (2) formed on a single sheet material (1) is at least two, the laser beam (S) emitted by the laser processing device is focused on a fracture line (21) on the top surface of the sheet material (1) in any one of the following modes:
the first method comprises the following steps: the laser processing devices are in one-to-one correspondence with the cutting grooves (2);
and the second method comprises the following steps: the laser processing device is one, and the laser processing device is split by the light splitting device to obtain a plurality of laser beams (S), wherein the laser beams (S) correspond to the cutting grooves (2) one by one;
thirdly, one laser processing device is adopted, and a laser beam (S) emitted by the processing device is sequentially focused on different fracture lines (21) to sequentially complete the processing of the plurality of cutting grooves (2).
5. The scribing and breaking method according to claim 2, wherein: the sheet material (1) is split along the cutting groove (2) to obtain sub-sheets (22) by: the cutting groove (2) is subjected to a first longitudinal force (X), the parts of the flaky materials (1) on two sides of the cutting groove (2) are respectively subjected to a second longitudinal force (Y), the acting directions of the first longitudinal force (X) and the second longitudinal force (Y) are opposite, and the first longitudinal force (X) and the second longitudinal force (Y) are perpendicular to the linear motion direction of the flaky materials (1).
6. The scribing and breaking method according to claim 5, wherein: the first longitudinal force (X) is an upper jacking force, the upper jacking force acts under the cutting groove (2), the second longitudinal force (Y) is a lower pressure, and the lower pressure acts on two sides of the cutting groove (2).
7. A method of scribing and breaking a sheet according to claim 5 or 6, wherein: the extending direction of the cutting groove (2) is the same as the linear motion direction.
8. The scribing and breaking method according to claim 2, wherein: the movement mode of the sheet material (1) with the cutting groove (2) from the scribing section (3) to the cracking section (4) is linear movement.
9. A scribing and breaking method according to claim 1 or 2, wherein: the scribing block (3) comprises a first scribing straight channel (301), a second scribing straight channel (302) and a first gap straight channel (30) clamped between the first scribing straight channel and the second scribing straight channel, when the flaky material (1) makes linear motion along the scribing block (3), the fracture line (21) and the cutting groove (2) are both positioned right above the first gap straight channel (30), and the top surfaces of the first scribing straight channel (301) and the second scribing straight channel (302) are both in contact with the bottom surface of the flaky material (1).
10. The scribing and breaking method according to claim 2, wherein: the split segment (4) comprises a first split straight channel (401), a second split straight channel (402) and a second gap straight channel (40) clamped between the first split straight channel and the second split straight channel;
when the flaky material (1) moves linearly along the cracking segment (4), the cutting groove (2) is positioned right above the second gap straight channel (40), and the top surfaces of the first cracking straight channel (401) and the second cracking straight channel (402) are in contact with the bottom surface of the flaky material (1).
11. The scribing and breaking method according to claim 10, wherein: an upper jacking device (5) is arranged in the second gap straight channel (40), and the top end of the upper jacking device (5) is higher than the top surface of the second gap straight channel (40);
in the splitting process, when the sheet material (1) with the cutting groove (2) moves linearly along the splitting segment (4), the sheet material (1) passes through the upper ejection device (5), at the moment, the upper ejection device (5) and the cutting groove (2) are arranged vertically and rightly, the top end of the upper ejection device (5) is in contact with the bottom surface of the sheet material (1), and meanwhile, the parts, located on two sides of the cutting groove (2), of the sheet material (1) respectively bear a downward pressure so as to split the sheet material (1) along the cutting groove (2).
CN202010043436.4A 2020-01-15 2020-01-15 Scribing and breaking method Pending CN112296531A (en)

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JP2010155278A (en) * 2008-07-23 2010-07-15 Marubun Corp Beam machining apparatus, beam machining method, and substrate machined by beam
CN103946169A (en) * 2011-11-16 2014-07-23 日本电气硝子株式会社 Glass plate cleaving device, method for cleaving glass plate, method for manufacturing glass plate, and glass plate cleaving system
CN205067899U (en) * 2015-10-27 2016-03-02 昆山龙腾光电有限公司 Lobe of a leaf device
CN106847993A (en) * 2017-01-05 2017-06-13 沃沛斯(常州)能源科技有限公司 Photovoltaic cell automation cutting separation equipment
CN108436297A (en) * 2018-03-30 2018-08-24 中南民族大学 One kind being directed to the contactless sliver segmenting device of sheet fragile material and dividing method
CN109244180A (en) * 2018-08-28 2019-01-18 深圳光远智能装备股份有限公司 One kind being used for solar energy imbrication line sliver apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010155278A (en) * 2008-07-23 2010-07-15 Marubun Corp Beam machining apparatus, beam machining method, and substrate machined by beam
CN103946169A (en) * 2011-11-16 2014-07-23 日本电气硝子株式会社 Glass plate cleaving device, method for cleaving glass plate, method for manufacturing glass plate, and glass plate cleaving system
CN205067899U (en) * 2015-10-27 2016-03-02 昆山龙腾光电有限公司 Lobe of a leaf device
CN106847993A (en) * 2017-01-05 2017-06-13 沃沛斯(常州)能源科技有限公司 Photovoltaic cell automation cutting separation equipment
CN108436297A (en) * 2018-03-30 2018-08-24 中南民族大学 One kind being directed to the contactless sliver segmenting device of sheet fragile material and dividing method
CN109244180A (en) * 2018-08-28 2019-01-18 深圳光远智能装备股份有限公司 One kind being used for solar energy imbrication line sliver apparatus

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