CN112291979A

CN112291979A - Electronic device

Info

Publication number: CN112291979A
Application number: CN202011330429.9A
Authority: CN
Inventors: 王雪波
Original assignee: Hangzhou Hikvision Digital Technology Co Ltd
Current assignee: Hangzhou Hikvision Digital Technology Co Ltd
Priority date: 2020-11-24
Filing date: 2020-11-24
Publication date: 2021-01-29
Anticipated expiration: 2040-11-24
Also published as: CN112291979B

Abstract

The application discloses electronic equipment, disclosed electronic equipment include first casing, second casing, thermal-insulated subassembly, major control system and chip, wherein: the first shell and the second shell are respectively connected to two sides of the heat insulation assembly, which are opposite to each other, the first shell and the heat insulation assembly form a front equipment cavity, the second shell and the heat insulation assembly form a rear equipment cavity, and the front equipment cavity and the rear equipment cavity are isolated from each other; the main control system is arranged in the rear cavity of the equipment, the chip is arranged in the front cavity of the equipment, and the chip is electrically connected with the main control system; the heat insulation component comprises a heat insulation plate, the heat insulation plate comprises a peripheral hollowed-out edge, at least one of two surfaces of the peripheral hollowed-out edge, which are opposite to each other, is provided with a hollowed-out groove, and the first shell and the second shell are respectively butted on the two surfaces of the peripheral hollowed-out edge, which are opposite to each other. Above-mentioned scheme can be solved the electronic equipment among the background art and have the relatively poor problem of heat-proof quality.

Description

Electronic device

Technical Field

The application belongs to the technical field of heat insulation design of electronic equipment, and particularly relates to electronic equipment.

Background

Along with the development of science and technology, electronic equipment has changed people's life style, has appeared a large amount of electronic equipment in people's life, but people discover at the in-process that uses electronic equipment, and electronic equipment's heat dispersion and heat-proof quality are to a great extent influencing electronic equipment's life and user experience. The traditional insulation design usually uses insulation materials singly or designs an insulation structure to achieve the purpose of directional control of heat transfer, but has the problem of poor insulation effect.

Disclosure of Invention

An object of the embodiment of the present application is to provide an electronic device, which can solve the problem of poor heat insulation effect of the electronic device in the background art.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides an electronic device, including a first casing, a second casing, a thermal insulation assembly, a main control system, and a chip, wherein:

the first shell and the second shell are respectively connected to two sides of the heat insulation assembly, which are opposite to each other, the first shell and the heat insulation assembly form an equipment front cavity, the second shell and the heat insulation assembly form an equipment rear cavity, and the equipment front cavity and the equipment rear cavity are isolated from each other.

The main control system is arranged in the rear cavity of the equipment, the chip is arranged in the front cavity of the equipment, and the chip is electrically connected with the main control system.

The heat insulation assembly comprises a heat insulation plate, the heat insulation plate comprises a peripheral hollowed-out edge, at least one of two surfaces of the peripheral hollowed-out edge, which are opposite to each other, is provided with a hollowed-out groove, and the first shell and the second shell are respectively butted on the two surfaces of the peripheral hollowed-out edge, which are opposite to each other.

The technical scheme adopted by the application can achieve the following beneficial effects:

the electronic equipment that this application embodiment discloses improves through the structure to electronic equipment in the correlation technique, set up thermal-insulated subassembly between first casing and second casing, make equipment rear chamber and equipment front chamber keep apart by thermal-insulated subassembly, thereby make the heat in the equipment rear chamber can not directly transmit to the equipment front chamber in, thereby realize the thermal-insulated effect to the equipment front chamber, and then realize the protection to the structure in the equipment front chamber, be used for avoiding the influence of heat to the structural element in the equipment front chamber of electronic equipment.

Meanwhile, the arrangement of the hollow-out grooves enables the first shell and the butt joint contact area of the second shell and the heat insulation plate during installation to be reduced, and the directional transmission of heat is blocked to a great extent, so that the heat in the rear cavity of the equipment can be reduced and transmitted to the front cavity of the equipment, and after the electronic equipment is installed, each hollow-out groove can form a sealed space, the sealed space can not form local air convection, so that the heat exchange between the rear cavity of the equipment and the front cavity of the equipment can be basically isolated, the heat insulation effect on functional elements in the front cavity of the equipment of the electronic equipment can be realized, namely, the functional elements in the front cavity of the equipment are protected from being damaged by heat, and the problem of poor heat insulation effect of the electronic equipment in the background technology can be solved.

Drawings

Fig. 1 is an exploded view of an electronic device according to an embodiment of the present disclosure;

fig. 2 is a schematic perspective view of an electronic device disclosed in an embodiment of the present application;

FIG. 3 is an exploded view of a thermal isolation assembly of an electronic device according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural view of an insulating assembly of an electronic device from one perspective as disclosed in an embodiment of the present application;

FIG. 5 is a schematic view of an insulating assembly of an electronic device from another perspective as disclosed in an embodiment of the present application;

FIG. 6 is a side view of an insulating assembly of an electronic device as disclosed in an embodiment of the present application;

FIG. 7 is a schematic structural assembly diagram of an electronic device according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram of a process of transferring heat of an electronic device in an insulation assembly according to an embodiment of the present application.

Description of reference numerals:

100-a first shell, 110-a first shell body, 120-a first end cap;

200-a second shell, 210-a second shell body, 220-a second end cap;

300-heat insulation component, 310-heat insulation board, 311-peripheral hollowed-out edge, 311 a-hollowed-out groove, 312-central flat plate area, 320-heat insulation component, 321-graphite sheet, 322-aerogel heat insulation pad, 323-Low-E film, 330-flat cable plug and 340-hole opening;

400-a main control system, 410-a main board, 420-a first interface board and 430-a second interface board;

500-chip;

600-flat cable;

700-a heat sink;

800-lens;

910-front device cavity, 920-back device cavity.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

Referring to fig. 1 to 8, an electronic device disclosed in an embodiment of the present application includes a first housing 100, a second housing 200, a thermal insulation assembly 300, a main control system 400, and a chip 500.

The first casing 100 and the second casing 200 are basic members of the electronic apparatus, and other components of the electronic apparatus may be mounted on the first casing 100 or the second casing 200. The heat insulation assembly 300 is a heat insulation structure in the electronic device, and the heat insulation assembly 300 can play a role in heat insulation, so that the heat transfer in the electronic device can be reduced.

The first casing 100 and the second casing 200 are respectively connected to two opposite sides of the heat insulation assembly 300, the first casing 100 and the heat insulation assembly 300 form a front equipment cavity 910, a main function unit of the electronic equipment is installed on the front equipment cavity 910, the second casing 200 and the heat insulation assembly 300 form a rear equipment cavity 920, and a main heat generating device of the electronic equipment is installed in the rear equipment cavity 920, that is, the heat insulation assembly 300 is arranged between the front equipment cavity 910 and the rear equipment cavity 920, so that the front equipment cavity 910 and the rear equipment cavity 920 are isolated from each other. Heat in the electronic equipment is transferred from the equipment rear cavity 920 provided with a main heat generating device to the equipment front cavity 910, the heat in the electronic equipment is isolated by the arrangement of the heat insulation component 300, so that a large amount of heat is prevented by the heat insulation component 300, and partial heat cannot be directly transferred from the equipment rear cavity 920 to the equipment front cavity 910, so that the condition that the normal function operation of the device in the equipment front cavity 910 is influenced by the large amount of heat can be relieved.

The main control system 400 is a system for controlling a circuit in an electronic device, the main control system 400 is disposed in the rear cavity 920 of the electronic device, the main control system 400 is a main heating device of the electronic device, a functional unit of an electronic device part is integrated on the chip 500, the chip 500 is disposed in the front cavity 910 of the electronic device, and the chip 500 is electrically connected to the main control system 400, so that the electronic device can control the chip 500 by using the main control system 400, and finally, the function of the electronic device is realized.

The heat insulation assembly 300 comprises a heat insulation plate 310, the heat insulation plate 310 is a main functional structure of the heat insulation assembly 300, the heat insulation plate 310 comprises a peripheral hollow edge 311, at least one of two surfaces of the peripheral hollow edge 311 opposite to each other is provided with a hollow groove 311a, and the first casing 100 and the second casing 200 are respectively butted on the two surfaces of the peripheral hollow edge 311 opposite to each other. In this case, the peripheral hollow edge 311 is a basic structure provided with a hollow groove 311a, and the arrangement of the hollow groove 311a reduces the abutting contact area when the first casing 100, the second casing 200 and the heat insulation assembly 300 are installed, thereby hindering the directional heat transfer to a great extent.

The electronic equipment disclosed in the embodiment of the application is improved through the structure of the electronic equipment in the related art, the heat insulation assembly 300 is arranged between the first shell 100 and the second shell 200, the equipment rear cavity 920 and the equipment front cavity 910 are isolated by the heat insulation assembly 300, heat in the equipment rear cavity 920 cannot be directly transferred to the equipment front cavity 910, the heat insulation effect on the equipment front cavity 910 is realized, the protection of the structure in the equipment front cavity 910 is realized, and the influence of the heat on structural elements in the equipment front cavity 910 of the electronic equipment is avoided.

Meanwhile, the arrangement of the hollow-out groove 311a reduces the abutting contact area between the first casing 100 and the second casing 200 when the heat insulation board 310 is installed, which hinders the directional transfer of heat to a great extent, so that the transfer of heat in the rear cavity 920 of the device to the front cavity 910 of the device can be reduced, and after the electronic device is installed in the hollow-out groove 311a, each hollow-out groove 311a forms a sealed space, which does not form local air convection, so that the heat exchange between the rear cavity 920 of the device and the front cavity 910 of the device can be basically isolated, and the heat insulation effect on the functional elements in the front cavity 910 of the electronic device can be realized, that is, the functional elements in the front cavity 910 of the device are protected from being damaged by heat, thereby solving the problem of poor heat insulation effect of the electronic device in the background art.

In the electronic device disclosed in the embodiment of the present application, the heat insulation plate 310 may include a first surface facing the rear cavity 920 of the device and a second surface facing the front cavity 910 of the device, the heat insulation assembly 300 may include the heat insulation material assembly 320, at least one of the first surface and the second surface is provided with the heat insulation material assembly 320, and the heat insulation material assembly 320 is made of a material having good heat insulation, so that the heat insulation plate 310 can be assisted, and the heat insulation effect of the heat insulation assembly 300 is better. In this case, the heat insulating material assembly 320 may be disposed only on the first surface facing the rear cavity 920 of the apparatus, or only on the second surface facing the front cavity 910 of the apparatus, so as to prevent the heat in the rear cavity 920 of the apparatus from being transferred to the front cavity 910 of the apparatus. In a more preferred embodiment, the thermal insulation material assembly 320 may be disposed on both the first surface and the second surface, thereby achieving a dual thermal insulation effect and achieving a better thermal insulation effect in the electronic device.

In the electronic device disclosed in the embodiment of the present application, the heat insulating material assembly 320 may include at least one of a graphite sheet 321, an aerogel heat insulating mat 322, and a Low-E film 323, which are sequentially stacked on the first surface or the second surface. In this case, the heat insulating material assembly 320 may include only the graphite sheet 321, and the graphite sheet 321 is diffused from the hot spot region to the periphery when transferring heat, so that the temperature gradient across the graphite sheet 321 is reduced, thereby reducing the hot spot temperature value and blocking the heat transfer.

In another case, the insulation material assembly 320 can include only the aerogel insulation pad 322, and the aerogel insulation pad 322 has a lower thermal conductivity than air, which can greatly reduce the amount of heat passing through per unit time, i.e., can block the heat transfer per unit time, so as to reduce the heat transfer from the device back cavity 920 to the device front cavity 910 in the electronic device.

In another case, the heat insulating material assembly 320 may include only the Low-E film 323, the Low-E film 323 is a material with Low infrared rate and Low infrared heating rate, and may effectively reduce infrared radiation in a certain wavelength band, and the amount of heat radiated outward is also small in a certain wavelength band, that is, the Low-E film 323 has good heat insulating property, and when the Low-E film 323 is included in the heat insulating material assembly 320, the Low-E film 323 may better reflect and block heat, so as to reduce the heat transfer from the rear cavity 920 to the front cavity 910.

In another preferred embodiment, the insulation material assembly 320 may include any two of the graphite sheet 321, the aerogel insulation blanket 322, and the Low-E film 323, such that the effects of the two structures are superimposed, thereby better blocking the transfer of heat.

In another more preferred embodiment, the heat insulating material assembly 320 may include and distribute the graphite sheet 321, the aerogel heat insulating pad 322, and the Low-E film 323 on two sides of the heat insulating board 310, so that the effects of the three structures are multiplied to achieve better heat resistance and heat insulation.

When the heat insulation material assembly 320 works specifically, the effect of multi-layer heat insulation control can be achieved inside the electronic equipment, and as the main heat dissipation device is installed in the equipment rear cavity 920, the heat in the electronic equipment is transferred from the equipment rear cavity 920 to the equipment front cavity 910, namely after heat is generated in the equipment rear cavity 920, the heat firstly passes through the Low-E film 323, and the Low-E film 323 reflects part of the heat back into the equipment rear cavity 920, so that the heat passing through the Low-E film 323 is reduced.

Next, the heat passing through the Low-E film 323 passes through the aerogel thermal insulation pad 322, since the thermal conductivity coefficient of the aerogel thermal insulation pad 322 is lower than that of air, so that the heat that can pass through the aerogel thermal insulation pad 322 per unit time is reduced, and thus the heat that passes through the aerogel thermal insulation pad 322 is less, and then, the heat that passes through the aerogel thermal insulation pad 322 passes through the graphite sheet 321, the heat colliding with the graphite sheet 321 is diffused to the surroundings of the graphite sheet 321, i.e., part of the heat is digested by the structure of the graphite sheet 321 itself, so that the heat that can pass through the graphite sheet 321 is less, and the heat that passes through the graphite sheet 321 then passes through the thermal insulation plate 310, the hollow-out groove 311a on the thermal insulation plate 310 again obstructs part of the heat.

Meanwhile, the heat passing through the heat insulation plate 310 sequentially passes through the graphite sheet 321, the aerogel heat insulation pad 322 and the Low-E film 323, and due to the self-performance of the graphite sheet 321, the aerogel heat insulation pad 322 and the Low-E film 323, the heat passing through each structure can be partially reduced, so that the heat generated in the rear cavity 920 of the device can be greatly reduced from being transferred to the front cavity 910 of the device after passing through the heat insulation material assembly 320, the total heat input into the front cavity 910 of the device is greatly reduced compared with the rear cavity 920 of the device, and the heat insulation material assembly 320 is further exerted, so that the electronic device has a better heat insulation function.

In a further technical solution, the heat insulation board 310 may be a plastic partition board, plastic is a material with poor thermal conductivity, that is, heat cannot be transferred well, and plastic is used as the material of the heat insulation board 310, which may hinder heat in the rear device cavity 920 from being transferred to the front device cavity 910, so that the heat insulation effect of the heat insulation board 310 in the electronic device can be well exerted. Meanwhile, the heat insulation plate 310 may be integrally formed, which is convenient for manufacturing and installation.

In the electronic device disclosed in the embodiment of the present application, the thermal insulation board 310 may include a central flat board region 312, the central flat board region 312 may have a solid structure, which is beneficial to the separation of the thermal insulation component 300 from the device rear cavity 920 and the device front cavity 910, and the peripheral hollow edge 311 may be disposed around the central flat board region 312, so that the base point of the peripheral hollow edge 311 is easily found during manufacturing, which is convenient for designing and manufacturing the peripheral hollow edge 311, and two opposite side board surfaces of the central flat board region 312 are respectively a first surface and a second surface.

In the electronic device disclosed in the embodiment of the present application, the heat insulation assembly 300 may have an opening 340, a flat cable plug 330 may be disposed in the opening 340, and the main control system 400 is electrically connected to the chip 500 through a flat cable 600 passing through the flat cable plug 330. In this case, the opening 340 is a space for accommodating the flat cable plug 330, and the flat cable plug 330 can be penetrated by the flat cable 600, one end of the flat cable 600 penetrating through the flat cable plug 330 is connected to the main control system 400, and the other end is electrically connected to the chip 500, and the main control system 400 can control the chip 500 through the flat cable 600, so that the chip 500 can perform its function.

In the electronic device disclosed in the embodiment of the present application, the heat sink 700 may be disposed in the front cavity 910 of the device, and a layer of heat conductive silicone grease may be coated on the surface of the heat sink 700, so that the heat entering the front cavity 910 of the device may be more effectively conducted to the heat sink 700, and then the heat on the heat sink 700 may be directionally diffused to the surrounding air, thereby avoiding the damage to the main functional components and devices and the failure of normal function operation, and the chip 500 may be disposed on the heat sink 700, thereby preventing the damage to the chip 500 from the heat.

In the electronic device disclosed in the embodiment of the present application, the main control system 400 may include a main board 410, a first interface board 420, and a second interface board 430, where the first interface board 420 is electrically connected to the main board 410, the second interface board 430 is electrically connected to the first interface board 420, and the main board 410, the first interface board 420, and the second interface board 430 are sequentially disposed in a direction away from the heat insulation assembly 300. In this case, motherboard 410, first interface board 420, and second interface board 430 are electrically connected in sequence in a direction away from thermal isolation assembly 300, such that motherboard 410 can be closer to one side of thermal isolation assembly 300, and thus motherboard 410 is closer to chip 500, thereby making control of chip 500 by motherboard 410 more beneficial.

In the electronic device disclosed in the embodiment of the present application, the plurality of hollow-out grooves 311a are provided, and the plurality of hollow-out grooves 311a are distributed in an array. In this case, the plurality of hollow-out grooves 311a distributed in an array may further reduce the contact area between the first casing 100 and the second casing 200 and the thermal insulation assembly 300, so as to reduce the directional transfer of heat in the rear cavity 920 to the front cavity 910, thereby better blocking heat in the rear cavity 920. In a more specific scheme, as shown in fig. 3, the plurality of hollow-out grooves 311a may be distributed in a regular triangle array, and of course, the hollow-out grooves 311a may also be in other shapes, and the specific shape of the hollow-out grooves 311a is not limited in this embodiment of the application.

In the electronic device disclosed in the embodiment of the present application, the first casing 100 and the second casing 200 may both be metal casings, and the metal casings have good heat dissipation performance, which can be beneficial to heat dissipation of the electronic device. Specifically, the first casing 100 and the second casing 200 may be made of metal aluminum, which is light, and is beneficial to reducing the weight of the electronic device. Of course, other materials with good metallic properties may be used for the first casing 100 and the second casing 200, and the specific materials of the first casing 100 and the second casing 200 are not limited in the embodiments of the present application.

In the electronic device disclosed in the embodiment of the present application, the first casing 100 may include a first casing main body 110 and a first end cap 120, the first end cap 120 may be detachably disposed at one end of the first casing main body 110 and disposed opposite to the heat insulation assembly 300, the second casing 200 may include a second casing main body 210 and a second end cap 220, the second end cap 220 may be detachably disposed at one end of the second casing main body 210 and disposed opposite to the heat insulation assembly 300, the first end cap 120 is provided with a lens 800, the lens 800 is disposed opposite to the chip 500, and the lens 800, the first casing main body 110, the first end cap 120, and the heat insulation assembly 300 form a device front cavity 910; the insulation assembly 300, the second shell body 210, and the second end cap 220 form a rear cavity 920 of the apparatus. Under this kind of condition, the split type structure of detachable is favorable to reducing the complexity of electronic equipment's structure to more can make things convenient for, simultaneously, still be favorable to the change and the maintenance of later stage to the local spare part of electronic equipment.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electronic device comprising a first housing (100), a second housing (200), a thermal isolation assembly (300), a master control system (400), and a chip (500), wherein:

the first shell (100) and the second shell (200) are respectively connected to two opposite sides of the heat insulation assembly (300), the first shell (100) and the heat insulation assembly (300) form a front equipment cavity (910), the second shell (200) and the heat insulation assembly (300) form a rear equipment cavity (920), and the front equipment cavity (910) and the rear equipment cavity (920) are isolated from each other;

the master control system (400) is arranged in the rear device cavity (920), the chip (500) is arranged in the front device cavity (910), and the chip (500) is electrically connected with the master control system (400);

the heat insulation assembly (300) comprises a heat insulation plate (310), the heat insulation plate (310) comprises a peripheral hollow edge (311), at least one of two surfaces of the peripheral hollow edge (311) opposite to each other is provided with a hollow groove (311a), and the first shell (100) and the second shell (200) are respectively butted on the two surfaces of the peripheral hollow edge (311) opposite to each other.

2. The electronic device of claim 1, wherein the thermal shield (310) comprises a first surface facing the device back cavity (920) and a second surface facing the device front cavity (910), the thermal shield assembly (300) comprising an insulating material assembly (320), at least one of the first surface and the second surface being provided with the insulating material assembly (320).

3. The electronic device of claim 2, wherein the insulation material assembly (320) comprises a graphite sheet (321), an aerogel insulation mat (322), and a Low-E film (323) sequentially stacked on the first surface or the second surface.

4. The electronic device of claim 2, wherein the thermal shield (310) is a plastic spacer.

5. The electronic device according to claim 2, wherein the heat insulation board (310) comprises a central flat area (312), the peripheral hollow edge (311) is disposed around the central flat area (312), and two opposite side boards of the central flat area (312) are the first surface and the second surface respectively.

6. The electronic device of claim 1, wherein the heat insulation assembly (300) defines an opening (340), a cable plug (330) is disposed in the opening (340), and the main control system (400) is electrically connected to the chip (500) through a cable (600) passing through the cable plug (330).

7. The electronic device of claim 1, wherein a heat sink (700) is disposed within the device front cavity (910), the chip (500) being disposed on the heat sink (700).

8. The electronic device of claim 1, wherein the main control system (400) comprises a main board (410), a first interface board (420) and a second interface board (430), the first interface board (420) is electrically connected to the main board (410), the second interface board (430) is electrically connected to the first interface board (420), and the main board (410), the first interface board (420) and the second interface board (430) are sequentially arranged in a direction away from the heat insulation assembly (300).

9. The electronic device according to claim 1, wherein the plurality of the hollow-out grooves (311a) are distributed in an array.

10. The electronic device of claim 1, wherein the first housing (100) and the second housing (200) are both metal housings.

11. The electronic device of claim 1, wherein the first housing (100) comprises a first housing body (110) and a first end cap (120), the first cap (120) is detachably provided at one end of the first case main body (110), and is disposed opposite to the heat insulation assembly (300), the second case (200) includes a second case main body (210) and a second end cap (220), the second cap (220) is detachably provided at one end of the second case main body (210), and is arranged opposite to the heat insulation component (300), the first end cover (120) is provided with a lens (800), the lens (800) is arranged opposite to the chip (500), and the lens (800), the first shell body (110), the first end cover (120) and the heat insulation component (300) form the front device cavity (910); the insulation assembly (300), the second shell body (210), and the second end cap (220) form the rear device cavity (920).