CN112291912A - High-energy microfocus X-ray production equipment - Google Patents
High-energy microfocus X-ray production equipment Download PDFInfo
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- CN112291912A CN112291912A CN202011319587.4A CN202011319587A CN112291912A CN 112291912 A CN112291912 A CN 112291912A CN 202011319587 A CN202011319587 A CN 202011319587A CN 112291912 A CN112291912 A CN 112291912A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—X-ray radiation generated from plasma
- H05G2/008—X-ray radiation generated from plasma involving a beam of energy, e.g. laser or electron beam in the process of exciting the plasma
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
Abstract
The invention discloses high-energy microfocus X-ray production equipment which comprises an electron source component for generating high-energy electron beams and rotating target equipment for generating the high-energy X-rays by bombardment of the electron beams, wherein the high-energy focusing electron beams generated by the electron source component bombard the rotating target equipment to generate the high-energy microfocus X-rays. This application is through adopting specific electron source and linear accelerator to cooperate, provides the electron beam that long macropulse height average flow is strong, and rethread solenoid and the focus of strong focus quadrupole lens group focus, with the electron beam lateral dimension that long macropulse height average flow is strong focusing to the less size of comparison at the target position to carry out accurate measurement control to electron beam lateral dimension through beam spot measuring assembly, with beam spot size control to below 0.1mm, realize the purpose of high-energy microfocus X ray output.
Description
Technical Field
The invention belongs to the field of radiation devices, and particularly relates to high-energy microfocus X-ray production equipment.
Background
Industrial ct (industrial Computed tomography) is used as an optimal nondestructive testing means, can visually display internal structure information of an object, can perform positioning and spatial dimension measurement on defects, and is widely applied to the fields of nondestructive testing, nondestructive evaluation, reverse engineering and the like of aerospace, aviation, nuclear power, metallurgy, machinery, electronics, buildings, petrochemical industry and the like.
The X-ray source is a core component of industrial CT imaging, and mainly comprises a low-energy micro-focus ray source, a conventional X-ray tube ray source and a traditional high-energy accelerator ray source. Electron beams are used for accelerating and targeting in an electric field, and bremsstrahlung is converted into X rays. The low-energy micro-focus ray source (voltage <300kV), small focus size, high resolution, low ray energy and low penetration capacity are commonly used for detecting nonmetal small workpieces. Conventional X-ray tube sources are limited in large scale equipment and high density material detection due to low energy (up to 600kV), limited penetration capability, up to 80mm equivalent steel. The traditional high-energy accelerator has large focal spot size (about 2.0mm) and low imaging resolution, and is not beneficial to the detection of tiny details.
X-ray detection in the fields of aviation, aerospace, high-end equipment, nuclear power, reactors, cultural relics and the like requires the requirements of high energy, high detection resolution, high detection speed and the like of a ray source, and a high-energy micro-focus ray source is urgently required.
Accordingly, further developments and improvements are still needed in the art.
Disclosure of Invention
In order to solve the above problems, a high-energy microfocus X-ray production apparatus is proposed. The invention provides the following technical scheme:
a high-energy microfocus X-ray production device comprises an electron source assembly and a rotating target device, wherein the electron source assembly is used for generating high-energy electron beams, the rotating target device is used for being bombarded by the electron beams to generate high-energy X-rays, and the high-energy focusing electron beams generated by the electron source assembly are bombarded on the rotating target device to generate the high-energy microfocus X-rays.
Furthermore, the electron source assembly comprises an electron source for generating an electron beam, a focusing assembly for focusing the electron beam and a linear accelerator for increasing the energy of the electron beam, and the electron beam generated by the electron source is accelerated by the linear accelerator and focused by the focusing assembly and then bombarded on a rotating target to generate high-energy microfocus X-rays.
Further, the focusing assembly includes a solenoid disposed between the electron source and the linear accelerator.
Further, the focusing assembly includes a strongly focusing quadrupole lens set disposed between the linear accelerator and the rotating target.
Further, the linear accelerator comprises a superconducting linear accelerator or a normal temperature microwave linear accelerator or a photocathode direct current high voltage electron gun.
Further, the electron source comprises a photocathode microwave electron gun or a cold cathode microwave electron gun.
Furthermore, the rotating target device comprises a rotating target for dispersing the target hitting energy of the electron beam and a beam spot measuring assembly for measuring the size of a beam spot of the electron beam, wherein the rotating target and the beam spot measuring assembly can move relatively, so that the beam spot formed by the electron beam is formed on the same position of the rotating target and the beam spot measuring assembly.
Further, the beam spot measuring assembly comprises a beam spot measuring target for forming a beam spot, a measuring assembly for measuring the size of the beam spot, and a vertical moving assembly for defining the position of the beam spot measuring target, wherein the beam spot measuring target and the measuring assembly are fixed below the vertical moving assembly.
Further, the measuring component comprises a reflector and an imaging camera, the reflector and the beam spot measuring target are at 45-degree included angles, the imaging camera and the reflector are at 45-degree included angles, and the imaging camera is perpendicular to the beam spot measuring target.
Furthermore, the rotating target comprises a target disc which is bombarded by an electron beam to generate X rays, a horizontal moving assembly used for enabling the target disc to move back and forth and a rotating assembly used for enabling the target disc to rotate, a target center of the target disc is fixed on an output shaft of the rotating assembly, and the rotating assembly is fixed on the horizontal moving assembly.
Has the advantages that:
the high-energy micro-focus accelerator improves the energy of an electron beam, reduces the focus size of the electron beam, can effectively overcome the contradiction that the current ray source cannot give consideration to high energy of rays and small focus size, and meets the detection requirements of an industrial CT system on high-end precision equipment and the like which are urgently needed. The specific electron source is matched with the linear accelerator to provide the long-macropulse high-average-flow-strength electron beam, then the long-macropulse high-average-flow-strength electron beam is focused to a smaller size at a target shooting position through the focusing of the solenoid and the strong focusing quadrupole lens group, the transverse size of the electron beam is accurately measured and controlled through the beam spot measuring assembly, the beam spot size is controlled to be below 0.1mm, and the purpose of outputting high-energy microfocus X rays is achieved.
Drawings
FIG. 1 is a schematic diagram of a high-energy microfocus X-ray production apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the operation of a photocathode microwave electron gun in an embodiment of the present invention;
FIG. 3 is a schematic diagram of the operation of a cold cathode microwave electron gun in an embodiment of the present invention;
FIG. 4 is a schematic diagram of a pulse time structure for driving a laser to generate a driving laser according to an embodiment of the present invention;
FIG. 5 is a diagram illustrating a structure of a strong focusing quadrupole lens set according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of the front view internal structure and extreme position of a rotary target apparatus for generating high-energy microfocus X-rays in accordance with an embodiment of the present invention;
FIG. 7 is a schematic diagram of the right-view internal structure of a rotary target apparatus for generating high-energy microfocus X-rays according to an embodiment of the present invention;
FIG. 8 is a schematic view of a beam spot measurement of a rotary target apparatus for generating high-energy microfocus X-rays in accordance with an embodiment of the present invention;
FIG. 9 is a schematic diagram of a target state of a rotary target apparatus for generating high-energy microfocus X-rays, in accordance with an embodiment of the present invention;
FIG. 10 is a schematic view of a measurement state of a measurement assembly in an embodiment of the present invention;
in the drawings: 1. a horizontal movement assembly; 2. a rotating assembly; 3. a target disc; 4. a vertical movement assembly; 5. a beam spot measurement assembly; 6. a vacuum chamber; 7. an electron beam; 8. a beam spot measurement target; 9. a mirror; 10. an imaging camera; 11. an electron source; 12. a solenoid; 13. a linear accelerator; 14. a strongly focusing quadrupole lens group; 15. rotating the target device; 16. driving a laser; 17. a photocathode; 18. a microwave electron gun; 19. an accelerating electric field; 20. and (4) a cold cathode.
Detailed Description
In order to make the technical solutions of the present invention better understood, the following description of the technical solutions of the present invention with reference to the accompanying drawings of the present invention is made clearly and completely, and other similar embodiments obtained by a person of ordinary skill in the art without any creative effort based on the embodiments in the present application shall fall within the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustrating the present invention and not for limiting the present invention.
As shown in fig. 1-10, a high-energy microfocus X-ray production apparatus comprises an electron source 11 assembly for generating a high-energy electron beam and a rotating target apparatus 15 for generating high-energy X-rays by being bombarded by the electron beam 7, wherein the high-energy focused electron beam 7 generated by the electron source 11 assembly is bombarded on the rotating target apparatus 15 to generate the high-energy microfocus X-rays.
Furthermore, the electron source 11 assembly comprises an electron source 11 for generating an electron beam 7, a focusing assembly for focusing the electron beam 7, and a linear accelerator 13 for increasing the energy of the electron beam 7, and the electron beam 7 generated by the electron source 11 is accelerated by the linear accelerator 13 and focused by the focusing assembly, and then bombarded on a rotating target to generate high-energy microfocus X-rays. The electron beam 7 is generated by a photocathode microwave electron gun, energy gain is obtained in a normal-temperature microwave linear accelerator, a small focal spot is obtained through the strong focusing action of a quadrupole lens group, and the X ray of the microfocus is generated through the interaction of the electron beam 7 and an X ray target.
Further, the focusing assembly includes a solenoid 12 disposed between the electron source 11 and the linear accelerator 13. The solenoid 12 transversely focuses the electron beam 7 at the outlet of the microwave electron gun 18, restrains the size of the beam spot of the electron beam 7, and inhibits the increase of the transverse emittance of the electron beam 7, and the solenoid 12 transversely focuses the electron beam 7 through magnetic field force and then enters the normal-temperature microwave linear accelerator.
Further, the focusing assembly includes a strong focusing quadrupole lens set 14 disposed between the linear accelerator 13 and the rotating target. The strong focusing quadrupole lens group 14 is composed of a plurality of quadrupole magnets, has a short focal length, can realize strong focusing, and focuses the beam spot size of the high-energy electron beam on the X-ray conversion target to be smaller, so as to achieve a micro-focus state less than 0.1 mm. In this embodiment, the high-energy electron beam with energy of 13MeV is focused by a set of three-unit quadrupole lens set, and the beam spot size (full width at half maximum) is less than 0.1mm at about 10cm behind the lens set.
Further, the linac 13 includes a superconducting linac 13 or a normal temperature microwave linac. The normal temperature microwave linear accelerator accelerates the low energy electron beam generated by the electron gun to high energy (the low energy electron beam is the electron beam 7 generated by the electron gun but not accelerated by the normal temperature microwave accelerator, in the embodiment, the low energy electron beam energy generated by the microwave electron gun 18 is 2-5MeV, the high energy electron beam is the electron beam 7 accelerated by the microwave linear accelerator, and the high energy electron beam energy is 9-15 MeV). The normal temperature microwave linear accelerator operates in a pulse working mode and is driven by a pulse power source with a corresponding wave band. The energy of the electron beam 7 can be continuously adjusted by adjusting the gradient of the linac 13. The normal temperature microwave accelerator includes a standing wave accelerator and a traveling wave accelerator, and in this embodiment, a standing wave accelerator with a working frequency of 1.3GHz is used.
Further, the electron source 11 includes a photocathode microwave electron gun or a cold cathode microwave electron gun or a photocathode direct current high voltage electron gun. The photocathode microwave electron gun is composed of a driving laser 16, a photocathode 17 and a microwave electron gun 18, the driving laser 16 generates a photocathode 17 (a metal cathode and a semiconductor cathode lamp) for driving laser to irradiate the electron gun, electrons are generated through a photoelectric emission effect, the photocathode 17 of the electron gun can generate a low-energy electron beam with megavolt energy under the irradiation of the driving laser, and the pulse time structure of the electron beam 7 can be adjusted according to the requirement of radiation dose. The cold cathode microwave electron gun is composed of a cold cathode 20 and a microwave electron gun 18, wherein the cold cathode 20 generates electrons under the traction of a microwave field, and the microwave electric field in the electron gun leads the electrons out and accelerates the electrons to low-energy electrons with quasi-relativistic energy. Further, the electron source 11 may be a high-voltage electron gun with a dc photocathode 17. The drive laser 16 is used to generate a drive laser, the temporal structure of which determines the temporal structure of the electron beam 7. In this embodiment, the driving laser has a macropulse structure, and each macropulse structure includes a plurality of micropulses. The micro-pulse time size is picosecond (ps) magnitude, the micro-pulse repetition frequency is integral multiple of the microwave period, and the energy consistency of the generated electron beam 7 is ensured; the macro-pulse time structure is microsecond magnitude, and the repetition frequency is 10-100 Hz. The temporal structure of driving the laser is shown in fig. 4. In this embodiment, a picosecond laser is used as the drive laser, and an L-band (frequency 1.3GHz) photocathode microwave electron gun is used as the electron gun. In this embodiment, the photocathode 17 is made of cesium telluride semiconductor cathode, and the accelerating electric field 19 is a radio-frequency electromagnetic field excited by a microwave power source. The photocathode direct-current high-voltage electron gun comprises a driving laser for emitting laser, a cathode and an anode, wherein an extraction electric field is formed between the cathode and the anode, the laser emitted by the driving laser is incident on the cathode to generate electrons, the electrons move to the anode through the extraction electric field, and then electron beams are extracted from the anode.
Further, the rotary target device 15 includes a rotary target for dispersing the target energy of the electron beam 7 and a beam spot measuring assembly 5 for measuring the beam spot size of the electron beam 7, and both the rotary target and the beam spot measuring assembly 5 can move relatively, so that the beam spot formed by the electron beam 7 is formed on the same position of the rotary target and the beam spot measuring assembly 5. Since the high-energy microfocus X-ray requires that the electron beam is shot on the target as intensively as possible, the target is required to bear local instantaneous high-power bombardment, while the common target is easy to melt under the instantaneous high-power bombardment condition, the problem can be well avoided by rotating the target disc 3, the daily used target can be well adapted to the focusing bombardment of the high-power high-energy electron beam without replacing expensive substitute materials, and therefore, a rotating mechanism for rotating the target disc 3 needs to be added on the basis of the original target disc 3. However, since the target disk 3 is continuously rotated, the size of the beam spot of the electron beam bombarded on the rotating target disk 3 cannot be known, and the size of the beam spot is directly related to the size of the generated X-ray focus, a set of beam spot measuring assembly 5 capable of detecting and adjusting the size of the beam spot needs to be added, so that the size of the beam spot can be dynamically controlled in real time by the emission device for adjusting the electron beam.
Further, the beam spot measuring unit 5 includes a beam spot measuring target 8 for forming a beam spot, a measuring unit for measuring a size of the beam spot, and a vertical moving unit 4 for defining a position of the beam spot measuring target, and the beam spot measuring target 8 and the measuring unit are fixed below the vertical moving unit 4. The beam spot measuring target 8 and the measuring component are fixed below the vertical moving component 4, so that the vertical moving component 4 can move up and down to drive the beam spot measuring target 8 and the measuring component to move up and down, the beam spot measuring target 8 and the measuring component are fixed relatively, the size of the converted beam spot can be calculated conveniently, the beam center can be moved away before the target shooting is carried out conveniently, and the target shooting process of the electron beam is prevented from being influenced. Further, the vertical moving assembly 4 is a vertical locking cylinder, and a beam spot measuring target 8 is fixedly connected to the end of a telescopic rod of the vertical locking cylinder. The flexible length of cylinder is fixed to guarantee that the beam spot of connecting measures 8 movement paths and fixes, the flexible scope of perpendicular locking cylinder just makes beam spot measure 8 and moves between two upper and lower extreme positions of vacuum chamber 6, and can not lead to the condition of beam spot measure 8 collision to vacuum chamber 6 inner wall to take place because of surpassing extreme position, simultaneously because locking effect, make can guarantee after extreme position targets in place that beam spot measure 8 still can not take place the position deviation at measurement process or target 3 target shooting, and then do not influence testing process and target shooting process. Furthermore, the vertical moving assembly 4 is a manual rod with a limiting clamping sleeve, the limiting clamping sleeve is clamped on the manual rod when the manual rod is lifted, and the end part of the manual rod is fixedly connected with a beam spot measuring target 8. When the manual rod is pressed downwards to the limit position without being influenced by the limiting clamping sleeve, the manual rod is slowly pulled upwards to the limit position, which is moved upwards when the top of the beam spot measuring target 8 is connected with the top of the inner wall of the vacuum chamber 6, of the beam spot measuring target 8 fixed at the end part of the vertical moving assembly 4, and the manual rod is clamped by the limiting clamping sleeve from the outside, so that the falling of the manual rod is prevented from influencing the target practice of the electron beam.
Further, the measuring assembly comprises a reflector 9 and an imaging camera 10, the reflector 9 and the beam spot measuring target 8 form a 45-degree included angle, the imaging camera 10 and the reflector 9 form a 45-degree included angle, and the imaging camera 10 is perpendicular to the beam spot measuring target 8. The electron beam hits on beam spot measurement target 8 to on 8 shines 45 degrees speculum 9 of beam spot measurement target were penetrated through, 45 degrees speculum 9 again through reflection projection to imaging camera 10 on, carry out twice 45 degrees reflections through speculum 9, thereby in projecting the vertical camera lens that sets up upwards with the beam spot of horizontality, and then draw forth through the signal line, convenient observation. Further, the beam spot measuring target 8 is a YAG target. The YAG target is a common target material and is simple and easy to obtain, and an electron beam can generate a fluorescence reaction after striking the YAG target, so that the beam spot size can be conveniently and indirectly measured by measuring the fluorescent light spot size.
Further, the rotating target comprises a target disc 3 which is bombarded by an electron beam to generate X rays, a horizontal moving component 1 which is used for enabling the target disc 3 to move back and forth and a rotating component which is used for enabling the target disc 3 to rotate, a target center of the target disc 3 is fixed on an output shaft of the rotating component 2, and the rotating component 2 is fixed on the horizontal moving component 1. Through removing horizontal migration subassembly 1, drive and set up the 2 horizontal migration of rotating assembly on horizontal migration subassembly 1, the center pin of 2 output shaft end fixed connection target discs 3 of rotating assembly, consequently the horizontal migration of rotating assembly 2 directly drives the horizontal migration of target discs 3 to realize that the mutual removal between target discs 3 and the beam spot measurement target 8 gives way. Further, the horizontal moving assembly 1 is a horizontal locking cylinder, and a rotating assembly 2 is fixedly connected to the end portion of a telescopic rod of the horizontal locking cylinder. The flexible length of cylinder is fixed to guarantee to connect the target disc 3 seesaw route of rotating assembly 2 output shaft tip fixed, the flexible scope of horizontal locking cylinder just makes target disc 3 remove between two extreme positions of vacuum chamber 6, and can not lead to the condition of target disc 3 collision to vacuum chamber 6 inner wall to take place because of surpassing extreme position, simultaneously because locking effect, feasible extreme position targets in place the back and can guarantee that target disc 3 still can not take place the skew at rotatory in-process. Furthermore, the horizontal moving component 1 is a sliding block and a sliding rail with a limiting block. Be fixed with rotating component 2 on the slider, the slider can only follow 2 output shaft axis direction back and forth movements of rotating component on the slide rail to be provided with the stopper at the both ends of slide rail, make the target disc 3 of connecting at 2 output shaft tip of rotating component only can remove between two extreme position in vacuum chamber 6, and can not lead to the condition emergence that target disc 3 collided 6 inner walls of vacuum chamber because of surpassing extreme position. Further, the target disk 3 is a high atomic number target. The target disk 3 can be made of high atomic number materials such as tungsten, tantalum, gold and the like, is disc-shaped in structure, and in the rotating process, electron beams bombard the target disk 3 close to the periphery to generate X rays. The target disk 3 is typically made of a high-Z material that is hard, fast in heat transfer, and high in melting point, and typically uses tungsten or tantalum. In this embodiment, the target plate 3 is a tungsten target.
The target disc 3, the beam spot measuring target 8 and the measuring assembly are all arranged in the same vacuum chamber 6, beam current of the electron beam 7 is guaranteed not to deflect under the influence of external force, the vertical moving assembly 4 drives the beam spot measuring target 8 to move up and down, the beam spot measuring target 8 cannot interfere with horizontal movement of the target disc 3 when lifted, when the target disc 3 moves far away from an incident port of the electron beam 7, the vertical moving assembly 4 drives the beam spot measuring target 8 to reach a beam current center when descending to a limit position, the electron beam 7 vertically strikes on the beam spot measuring target 8, the beam current measuring target generally uses a YAG target, and the electron beam 7 strikes the YAG target to generate fluorescence. After the beam spot measuring target 8, a mirror surface is used for reflecting 45 degrees, and the beam spot generated by the electron beam 7 is reflected to a Charge Coupled Device (CCD) camera, so that the size of the beam spot can be measured through the display of the CCD camera, as shown in fig. 10. The transmission directions of the YAG target and the electron beam 7 are 90 degrees, so that the size of a light spot of the electron beam 7 on the YAG target is strictly equal to that of the electron beam 7, after the light spot is reflected by the 45-degree reflecting mirror 9, the size of a light spot image on the CCD is also equal to that of the electron beam 7, and the size of the electron beam 7 can be accurately measured. And lifting the beam spot measuring target 8 after the beam spot size meets the use requirement. The horizontal moving component 1 is connected with the rotating component 2 and the target disc 3, the rotating component 2 and the target disc 3 are driven to move horizontally, when the beam spot measuring target 8 is lifted, the target disc 3 is moved horizontally to a limit position close to beam current, the target disc 3 and the beam spot measuring target 8 are superposed in position when descending, namely the position of the YAG target forming the beam spot is the same as the position of the target disc 3 forming the beam spot, and the YAG target and the target disc are not located at the position at the same time. The beam spot bombarded on the target disk 3 is now of the same size as the beam spot measured by the measurement target. The method can accurately measure and control the beam spot size of the electron beam 7 on the target disc 3 to realize the aim of micro-focus, and the beam spot of the electron beam 7 generated by the electron source can be dynamically adjusted.
The present invention has been described in detail, and it should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Claims (10)
1. The high-energy microfocus X-ray production equipment is characterized by comprising an electron source assembly and a rotating target device, wherein the electron source assembly is used for generating high-energy electron beams, the rotating target device is used for generating high-energy X-rays through bombardment of the electron beams, and the high-energy focused electron beams generated by the electron source assembly are bombarded on the rotating target device to generate the high-energy microfocus X-rays.
2. The apparatus of claim 1, wherein the electron source assembly comprises an electron source for generating an electron beam, a focusing assembly for focusing the electron beam, and a linear accelerator for increasing the energy of the electron beam, and the electron beam generated by the electron source is accelerated by the linear accelerator and focused by the focusing assembly, and then bombarded onto the rotating target to generate the high-energy microfocus X-ray.
3. The apparatus of claim 2, wherein the focusing assembly comprises a solenoid disposed between the electron source and the linear accelerator.
4. The apparatus of claim 2, wherein the focusing assembly comprises a strongly focusing quadrupole lens set disposed between the linac and the rotating target.
5. The apparatus for producing high-energy microfocus X-ray according to claim 2, wherein said linear accelerator comprises a superconducting linear accelerator or a normal temperature microwave linear accelerator.
6. The apparatus of claim 2, wherein the electron source comprises a photocathode microwave electron gun or a cold cathode microwave electron gun or a photocathode direct current high voltage electron gun.
7. The apparatus of claim 1, wherein the rotary target apparatus comprises a rotary target for dispersing the energy of the electron beam targeting and a beam spot measuring assembly for measuring the beam spot size of the electron beam, and the rotary target and the beam spot measuring assembly are movable relative to each other to form a beam spot on the electron beam at the same position of the rotary target and the beam spot measuring assembly.
8. The apparatus according to claim 7, wherein the beam spot measuring assembly comprises a beam spot measuring target for forming a beam spot, a measuring assembly for measuring a size of the beam spot, and a vertical moving assembly for defining a position of the beam spot measuring target, the beam spot measuring target and the measuring assembly being fixed below the vertical moving assembly.
9. The apparatus of claim 8, wherein the measuring assembly comprises a reflector and an imaging camera, the reflector and the beam spot measuring target form a 45-degree angle, the imaging camera and the reflector form a 45-degree angle, and the imaging camera is perpendicular to the beam spot measuring target.
10. The apparatus of claim 7, wherein the rotary target comprises a target disk for generating X-rays by being bombarded by electron beams, a horizontal moving assembly for moving the target disk back and forth, and a rotating assembly for rotating the target disk, wherein a target center of the target disk is fixed on an output shaft of the rotating assembly, and the rotating assembly is fixed on the horizontal moving assembly.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011319587.4A CN112291912A (en) | 2020-11-23 | 2020-11-23 | High-energy microfocus X-ray production equipment |
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| CN202011319587.4A CN112291912A (en) | 2020-11-23 | 2020-11-23 | High-energy microfocus X-ray production equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225886A (en) * | 2021-07-07 | 2021-08-06 | 中国工程物理研究院应用电子学研究所 | Water-cooling rotary radiation conversion target for high-energy microfocus X-ray |
| CN113311472A (en) * | 2021-05-19 | 2021-08-27 | 中国原子能科学研究院 | Detection device and particle accelerator |
| CN113325012A (en) * | 2021-05-27 | 2021-08-31 | 中国工程物理研究院应用电子学研究所 | High-energy charged particle imaging device |
-
2020
- 2020-11-23 CN CN202011319587.4A patent/CN112291912A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113311472A (en) * | 2021-05-19 | 2021-08-27 | 中国原子能科学研究院 | Detection device and particle accelerator |
| CN113325012A (en) * | 2021-05-27 | 2021-08-31 | 中国工程物理研究院应用电子学研究所 | High-energy charged particle imaging device |
| CN113225886A (en) * | 2021-07-07 | 2021-08-06 | 中国工程物理研究院应用电子学研究所 | Water-cooling rotary radiation conversion target for high-energy microfocus X-ray |
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