CN112290179A - Interconnection structure for plate-level ultrathin flexible connection - Google Patents
Interconnection structure for plate-level ultrathin flexible connection Download PDFInfo
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- CN112290179A CN112290179A CN202011010097.6A CN202011010097A CN112290179A CN 112290179 A CN112290179 A CN 112290179A CN 202011010097 A CN202011010097 A CN 202011010097A CN 112290179 A CN112290179 A CN 112290179A
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- signal line
- board
- line
- rigid
- flexible substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/18—Waveguides; Transmission lines of the waveguide type built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
Abstract
The application provides an interconnect structure for ultra-thin flexible connection of board level, includes: a signal line; the upper floor board and the first flexible substrate are covered above the signal line, and the second flexible substrate, the middle floor board, the rigid substrate and the lower floor board are covered below the signal line; the upper floor, the first flexible substrate, the second flexible substrate, the middle floor and the signal line form a flexible board strip line; the upper floor, the first flexible substrate, the second flexible substrate, the rigid substrate, the lower floor and the signal line form a rigid-flex combined plate bias strip line; the second flexible substrate, the rigid substrate, the lower floor and the signal line form a rigid-flex combined board microstrip line; transition parts of the upper floor, the first flexible substrate, the second flexible substrate, the middle floor, the rigid substrate and the lower floor are connected through metallized through holes. The interconnection structure can gradually widen the line width of the signal line, reduce the signal reflection caused by the abrupt change of the line width, avoid the problem that the line width of the ultrathin flexible transmission line is too narrow and cannot be welded, and improve the welding reliability.
Description
Technical Field
The application belongs to the technical field of radio frequency signal transmission, and particularly relates to an interconnection structure for board-level ultrathin flexible connection.
Background
Present conformal battle array or intelligent wearing equipment receives the extensive research, in order to accomplish extremely thin with the circuit, the conformal design also needs to be carried out to radio frequency signal's interconnection, the harder inflexible unable satisfaction requirement of traditional rigidity single microwave board, and flexible microwave board flexibility is good but the loss is great, consequently can use rigid-flex board, use rigid microwave board at the planar circuit part, use the flexbile plate in the place that needs conformal design, realize radio frequency signal transmission circuit's conformal design.
The rigid-flex microwave board combination part needs to realize the radio frequency signal interconnection of the rigid microwave board and the flexible microwave board, and the traditional interconnection mode is as follows: 1) the rigid plate and the flexible plate at the joint are welded with oppositely inserted connectors, but the size of the joint is large in the mode, and the signal wires of the rigid plate and the flexible plate are extremely small in size in a high-frequency range, so that the connector cannot be applied; 2) the gold wire bonding mode is used, but the mode needs to be carried out in a professional micro-assembly laboratory, the assembly process is complex, and a cavity is required for packaging, so that the gold wire is prevented from being damaged. Therefore, the prior art provides a flexible interconnection line (Liyu, Gexinling, Jiangwangshun: a flexible interconnection line [ C ] 2017 based on coplanar waveguide transmission lines, national microwave millimeter wave conference corpus (volume below) 2017), the method is to directly weld corresponding radio frequency signals and ground signals on a flexible plate and a rigid plate together, and in high-frequency high-density flexible interconnection, because a base material is extremely thin, the space between the coplanar waveguide transmission lines is too small, and the welding reliability is not high.
Disclosure of Invention
It is an object of the present application to provide an interconnect structure for a board level ultra thin flex connection that solves or mitigates at least one of the problems of the background art.
The technical scheme of the application is as follows: an interconnect structure for board-level ultra-thin flexible connections, the interconnect structure comprising:
the flexible printed circuit board comprises an upper floor, a first flexible substrate, a signal line, a second flexible substrate, a middle floor, a rigid substrate and a lower floor;
the upper floor board and the first flexible substrate are covered above the signal lines, and the second flexible substrate, the middle floor board, the rigid substrate and the lower floor board are covered below the signal lines;
the signal line is provided with a strip line signal line region, an offset strip line signal line region and a microstrip line signal line region;
the upper floor, the first flexible substrate, the second flexible substrate and the middle floor are provided with a first structure matched with the strip line signal line region to form a flexible plate strip line;
the upper floor, the first flexible substrate, the second flexible substrate, the rigid substrate and the lower floor are provided with a second structure matched with the bias strip line signal line region to form a rigid-flex combined board bias strip line;
the second flexible substrate, the rigid substrate and the lower floor are provided with a third structure matched with the microstrip line signal line region to form a rigid-flex printed circuit microstrip line, and the rigid-flex printed circuit microstrip line is used for being connected with a daughter board port microstrip line on a daughter board to transmit signals;
the upper floor, the first flexible substrate, the second flexible substrate, the middle floor, the rigid substrate and the lower floor are connected through the metalized through hole at the transition position between the first structure and the second structure.
Furthermore, the signal line width is increased or decreased according to impedance matching in the bias strip line signal line region and the microstrip line signal line region of the signal line.
Furthermore, the lower floor plate of the rigid-flex printed circuit board microstrip line is welded to the daughter board floor plate of the daughter board port microstrip line in a surface-mount welding mode.
Furthermore, the signal line of the rigid-flex printed circuit board microstrip line and the daughter board signal line of the daughter board port microstrip line are connected through silver-plated copper wires in a spot welding mode.
According to the interconnection structure for the board-level ultrathin flexible connection, the line width of a signal line is gradually widened by adopting a multilayer board stacking mode on the premise of not changing the characteristic impedance of the transmission line, and the signal reflection caused by abrupt line width change is reduced; by widening the signal line, the problem that the ultrathin flexible transmission line cannot be welded due to too narrow line width is avoided, and the welding reliability is improved.
Drawings
In order to more clearly illustrate the technical solutions provided by the present application, the following briefly introduces the accompanying drawings. It is to be expressly understood that the drawings described below are only illustrative of some embodiments of the invention.
Fig. 1 is a schematic view of an interconnect structure stack according to the present application.
Fig. 2 is a schematic diagram of an interconnect port in the present application.
Fig. 3 is a schematic diagram of interconnection between daughter boards in the present application.
Fig. 4 is a schematic view of a long connection between daughter boards in the present application.
Reference numerals:
1-upper floor;
2-a first flexible substrate;
3-a signal line;
4-a second flexible substrate;
5-middle floor;
6-a rigid substrate;
7-lower floor;
8-metallized through holes;
10-flexible plate stripline;
20-offsetting the stripline by the rigid-flex board;
30-a rigid-flex printed circuit board microstrip line;
a 40-daughter board port microstrip line;
41-daughter board;
42-daughter board floor;
43-daughter board signal lines;
44-transmission line.
Detailed Description
In order to make the implementation objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the drawings in the embodiments of the present application.
In order to solve the problem of welding of a flexible board and a rigid board under the condition that a base material is very thin in the prior art, the application provides an interconnection structure for flexibly connecting rigid daughter boards.
As shown in fig. 1 and fig. 2, a port connection schematic diagram of a flexible interconnection structure, the inter-daughter board flexible interconnection structure provided by the present application includes an upper floor board 1, a first flexible substrate 2, a signal line 3, a second flexible substrate 4, a middle floor board 5, a rigid substrate 6, and a lower floor board 7. The transmission of signals is realized by stacking the above-described structures.
Specifically, the signal line 3 is a main body structure for transmitting signals, and has a strip line signal line region (P1P2 section), an offset strip line signal line region (P2P3 section), and a microstrip line signal line region (P3P4 section).
In the stage P1P2, the upper floor panel 1 and the first flexible board 2 are disposed above the signal line 3, and the second flexible board 4 and the middle floor panel 5 are disposed below the signal line 3. The upper floor board 1, the first flexible board 2, the second flexible board 4, and the middle floor board 5 have the same constant-width structure as the strip line signal line region (P1P2 section) of the signal line 3, and the flexible board strip line 10 can be constituted by stacking the above structures.
In the stage P2P3, the upper floor panel 1 and the first flexible board 2 are disposed above the signal lines 3, the second flexible board 4 is disposed below the signal lines 3, and the rigid board 6 and the lower floor panel 7 are disposed below the second flexible board 4. The upper floor board 1, the first flexible board 2, the second flexible board 4, the rigid board 6, and the lower floor board 7 have the same constant-width structure as the offset stripline signal line region (P2P3 section) of the signal line 3, and the rigid-flex printed board offset stripline 20 can be configured by stacking the above structures. It should be noted that the "offset" in the flex-rigid board offset stripline 20 means a difference in thickness in the front-rear direction of the signal line 3, not in the left-right direction about the signal line 3 transmission direction.
In section P3P4, the second flexible substrate 4, the rigid substrate 6, and the lower plate 7 are already disposed below the signal line 3, and the second flexible substrate 4, the rigid substrate 6, and the lower plate 7 have a large-area structure of the same width as the microstrip line signal line region (section P3P 4) of the signal line 3, and the rigid-flex printed board microstrip line 30 can be configured by stacking the above structures.
Metallized through holes 8 are formed in the upper floor board 1, the first flexible substrate 2, the second flexible substrate 4, the middle floor board 5, the rigid substrate 6 and the lower floor board 7, and the metallized through holes 8 are connected in series to form a transitional connection between the middle floor board 5 and the lower floor board 7.
The conversion of the flex board ribbon wire 10 to the flex rigid plate bias ribbon wire 20 is accomplished by the arrangement of sections P1P2 and P2P 3.
The conversion from the bias strip line 20 to the rigid-flex printed circuit board micro-strip line 30 is completed through the arrangement of the sections P2P3 and P3P 4.
In the present application, the impedance of the flex-rigid board bias strip line 20 is kept consistent with the impedance of the flexible board strip line 10 by widening or narrowing the line width of the bias strip line signal line region (P2P3 segment) of the signal line 3; the line width of the microstrip line signal line region (P3P4 segment) of the signal line 3 needs to be widened or narrowed so that the impedance of the rigid-flex board microstrip line 30 is consistent with the impedance of the rigid-flex board offset stripline 20.
Finally, the signal line 3 in the interconnect structure is connected to a daughterboard port microstrip line 40 in the daughterboard port microstrip line 40 on the daughterboard 41.
The transmission line 44 on the daughter board 41 is converted into the daughter board port microstrip line 40 of the P4P5 section through a metalized via or other well-known transmission line transition structure, and the thickness of the transmission line is designed to be consistent with that of the rigid-flex board microstrip line 30.
The lower board 7 of the rigid-flex printed circuit board micro-strip line 30 is soldered to the sub-board ground 42 of the micro-strip line 40 by surface mount soldering (known methods such as solder paste local heating and conductive adhesive bonding).
The signal line 3 of the rigid-flex printed circuit board micro-strip line 30 and the daughter board signal line 43 of the daughter board port micro-strip line 40 are connected by spot welding through a silver-plated copper wire with the diameter of 0.5mm or other known materials.
And finally, the connection of the rigid-flex printed circuit board microstrip line 30 to the microstrip line 40 is completed.
As shown in fig. 3 and 4, the daughter board 41' of the other port structure of the flexible interconnect structure is the same as the connection structure of the ports, and is not described herein.
The interconnect structure of the present application can operate in any frequency band, for example, in an embodiment, in Ka frequency band, wherein the rigid substrate is made of Arlon CLTE-XT (low linear expansion coefficient) material, the flexible substrate is made of dupont PI material, and HFSS simulation design is performed using three-dimensional electromagnetic simulation software.
For example, the main parameters of the interconnect structure of the embodiment shown in fig. 4 are as follows:
| thickness of the first |
0.1mm |
| Thickness of the second |
0.1mm |
| Thickness of |
0.13mm |
| Line width of |
0.15mm |
| Line width of |
0.33mm |
| Line width of |
0.85mm |
| Total electrical length | 16.5λ0 |
According to the interconnection structure for the board-level ultrathin flexible connection, the line width of a signal line is gradually widened by adopting a method of stacking multiple boards on the premise of not changing the characteristic impedance of the transmission line, and the signal reflection caused by abrupt change of the line width is reduced; by widening the signal line, the problem that the ultrathin flexible transmission line cannot be welded due to too narrow line width is avoided, and the welding reliability is improved. The method and the device can be widely applied to microwave signal high-density three-dimensional space interconnection, such as aspects of conformal antennas, intelligent skins, wearable equipment and the like.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (4)
1. An interconnect structure for board-level ultra-thin flexible connections, the interconnect structure comprising:
an upper floor (1), a first flexible substrate (2), a signal line (3), a second flexible substrate (4), a middle floor (5), a rigid substrate (6) and a lower floor (7);
the upper floor (1) and the first flexible substrate (2) cover the upper part of the signal line (3), and the second flexible substrate (4), the middle floor (5), the rigid substrate (6) and the lower floor (7) cover the lower part of the signal line (3);
the signal line (3) is provided with a strip line signal line region, an offset strip line signal line region and a microstrip line signal line region;
the upper floor (1), the first flexible substrate (2), the second flexible substrate (4) and the middle floor (5) are provided with a first structure matched with the strip line signal line region to form a flexible plate strip line (10);
the upper floor (1), the first flexible substrate (2), the second flexible substrate (4), the rigid substrate (6) and the lower floor (7) are provided with a second structure matched with the bias strip line signal line region to form a rigid-flex combined board bias strip line (20);
the second flexible substrate (4), the rigid substrate (6) and the lower substrate (7) are provided with a third structure matched with the microstrip line signal line region to form a rigid-flex printed circuit board microstrip line (30), and the rigid-flex printed circuit board microstrip line (30) is used for being connected with a daughter board port microstrip line (40) on a daughter board (41) to transmit signals;
the upper floor (1), the first flexible substrate (2), the second flexible substrate (4), the middle floor (5), the rigid substrate (6) and the lower floor (7) are connected through a metalized through hole (8) at a transition part between the first structure and the second structure.
2. The interconnect structure for board-level ultra-thin flexible connection according to claim 1, wherein the bias strip-line signal line region and the microstrip line signal line region of the signal line (3) are subjected to increase or decrease of signal line width according to impedance matching.
3. The interconnect structure for board-level ultra-thin flexible connection according to claim 1, wherein the lower floor (7) of the rigid-flex combination board microstrip line (30) is soldered to the daughter board floor (42) of the daughter board port microstrip line (40) by means of surface-mount soldering.
4. The interconnection structure for board-level ultra-thin flexible connection according to claim 1, wherein the signal line (3) of the rigid-flex printed board microstrip line (30) and the daughter board signal line (43) of the daughter board port microstrip line (40) are spot-welded by a silver-plated copper wire.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011010097.6A CN112290179B (en) | 2020-09-23 | 2020-09-23 | Interconnection structure for plate-level ultrathin flexible connection |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011010097.6A CN112290179B (en) | 2020-09-23 | 2020-09-23 | Interconnection structure for plate-level ultrathin flexible connection |
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| CN112290179A true CN112290179A (en) | 2021-01-29 |
| CN112290179B CN112290179B (en) | 2021-12-28 |
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283914A (en) * | 1992-03-31 | 1993-10-29 | Mitsubishi Electric Corp | Strip line |
| US20070063783A1 (en) * | 2005-06-28 | 2007-03-22 | Matsushita Electric Industrial Co., Ltd. | Differential transmission line |
| US7605679B1 (en) * | 2008-02-19 | 2009-10-20 | Rockwell Collins, Inc. | System and method for providing a non-planar stripline transition |
| CN102090159A (en) * | 2008-07-16 | 2011-06-08 | 揖斐电株式会社 | Flex-rigid wiring board and electronic device |
| JP2013201596A (en) * | 2012-03-26 | 2013-10-03 | Murata Mfg Co Ltd | Transmission line |
| JP2014086655A (en) * | 2012-10-26 | 2014-05-12 | Murata Mfg Co Ltd | Flexible substrate |
| CN204538173U (en) * | 2012-06-29 | 2015-08-05 | 株式会社村田制作所 | High-frequency signal circuit |
| CN204732509U (en) * | 2015-07-02 | 2015-10-28 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| US20160380326A1 (en) * | 2015-06-26 | 2016-12-29 | Stephen H. Hall | Flexible circuit structures for high-bandwidth communication |
| CN205882136U (en) * | 2013-02-01 | 2017-01-11 | 株式会社村田制作所 | High frequency filter , high frequency duplexer and electronic equipment |
| CN206180068U (en) * | 2014-04-24 | 2017-05-17 | 株式会社村田制作所 | High frequency front end is with flexible cable, high frequency front end component and electronic equipment |
| CN207009625U (en) * | 2015-09-25 | 2018-02-13 | 株式会社村田制作所 | Anneta module and electronic equipment |
| CN207678071U (en) * | 2017-12-24 | 2018-07-31 | 广州盛源通信技术有限公司 | A kind of rigid-flex combined board and its signal transmssion line |
| US10418680B1 (en) * | 2018-11-02 | 2019-09-17 | Werlatone, Inc. | Multilayer coupler having mode-compensating bend |
| CN111224234A (en) * | 2018-11-26 | 2020-06-02 | 信思优有限公司 | Multi-port antenna integrated with low loss and flexible transmission line for millimeter wave frequency band |
-
2020
- 2020-09-23 CN CN202011010097.6A patent/CN112290179B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283914A (en) * | 1992-03-31 | 1993-10-29 | Mitsubishi Electric Corp | Strip line |
| US20070063783A1 (en) * | 2005-06-28 | 2007-03-22 | Matsushita Electric Industrial Co., Ltd. | Differential transmission line |
| US7605679B1 (en) * | 2008-02-19 | 2009-10-20 | Rockwell Collins, Inc. | System and method for providing a non-planar stripline transition |
| CN102090159A (en) * | 2008-07-16 | 2011-06-08 | 揖斐电株式会社 | Flex-rigid wiring board and electronic device |
| JP2013201596A (en) * | 2012-03-26 | 2013-10-03 | Murata Mfg Co Ltd | Transmission line |
| CN204538173U (en) * | 2012-06-29 | 2015-08-05 | 株式会社村田制作所 | High-frequency signal circuit |
| JP2014086655A (en) * | 2012-10-26 | 2014-05-12 | Murata Mfg Co Ltd | Flexible substrate |
| CN205882136U (en) * | 2013-02-01 | 2017-01-11 | 株式会社村田制作所 | High frequency filter , high frequency duplexer and electronic equipment |
| CN206180068U (en) * | 2014-04-24 | 2017-05-17 | 株式会社村田制作所 | High frequency front end is with flexible cable, high frequency front end component and electronic equipment |
| US20160380326A1 (en) * | 2015-06-26 | 2016-12-29 | Stephen H. Hall | Flexible circuit structures for high-bandwidth communication |
| CN204732509U (en) * | 2015-07-02 | 2015-10-28 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| CN207009625U (en) * | 2015-09-25 | 2018-02-13 | 株式会社村田制作所 | Anneta module and electronic equipment |
| CN207678071U (en) * | 2017-12-24 | 2018-07-31 | 广州盛源通信技术有限公司 | A kind of rigid-flex combined board and its signal transmssion line |
| US10418680B1 (en) * | 2018-11-02 | 2019-09-17 | Werlatone, Inc. | Multilayer coupler having mode-compensating bend |
| CN111224234A (en) * | 2018-11-26 | 2020-06-02 | 信思优有限公司 | Multi-port antenna integrated with low loss and flexible transmission line for millimeter wave frequency band |
Non-Patent Citations (3)
| Title |
|---|
| VINCENS GJOKAJ等: "3D Printed Hybrid Rigid-Flex Coaxial-Like Transmission Line Structures", 《2018 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION & USNC/URSI NATIONAL RADIO SCIENCE MEETING》 * |
| 何为等: "刚挠结合印制电路板的制造工艺和应用", 《世界科技研究与发展》 * |
| 杨立杰等: "光模块中刚柔线路板电连接宽带阻抗匹配研究", 《半导体光电》 * |
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