CN112289265A

CN112289265A - External compensation circuit structure and external compensation method of display panel

Info

Publication number: CN112289265A
Application number: CN201910677800.XA
Authority: CN
Inventors: 严进嵘; 施秉彛
Original assignee: Incoflex Semiconductor Technology Ltd
Current assignee: Incoflex Semiconductor Technology Ltd
Priority date: 2019-07-25
Filing date: 2019-07-25
Publication date: 2021-01-29

Abstract

The invention provides an external compensation circuit structure of a display panel, which comprises a panel and a driving integrated circuit used for executing external compensation to the panel, wherein the driving integrated circuit comprises: a first digital-to-analog converter connected to a first conductive line of the plurality of conductive lines; a second digital-to-analog converter connected to a second conductive line of the plurality of conductive lines; an analog-to-digital converter connected to the first and second conductive lines via a multiplexer; a first transistor switch connected to the first wire; a second transistor switch connected to the first wire and the multiplexer; a third transistor switch connected to the second wire and the multiplexer; and a fourth transistor switch connected to the second wire; the transistor switches and the multiplexer control the drive integrated circuit to write data into the first component in the first sub-pixel on the panel through the first lead and sense the first component through the second lead. Therefore, the number of pins of the driving integrated circuit can be greatly reduced.

Description

External compensation circuit structure and external compensation method of display panel

Technical Field

The present invention relates to the field of display panel technology, and more particularly, to a sensing assembly, a mobile terminal and a method for performing a fingerprint recognition by using an ltpo (low Temperature Polycrystalline Oxide) process to form an array layout by using an Oxide semiconductor (Oxide) therein to manufacture a photosensitive circuit.

Background

In current process fabrication, both LTPS and Oxide have uniformity or stability problems, and the OLED itself gradually degrades in brightness with increasing turn-on time. Since these problems are difficult to overcome completely in the process, they must be solved by various compensation techniques in the design. The compensation method can be divided into two major categories, internal compensation and external compensation. The internal compensation refers to a method of compensating inside a pixel using a sub circuit constructed with TFTs. The external compensation refers to a method of sensing electrical or optical characteristics of the pixel by an external driving circuit or device and then compensating. The external compensation may be classified into an optical extraction type and an electrical extraction type according to a data extraction method. The optical extraction type is to extract the brightness signal by an optical CCD photographing method after the back plate is lightened, and the electrical extraction type is to extract the electrical signals of the TFT and the OLED by an induction circuit of a driving chip. The two methods extract different kinds of signals, and thus the data processing modes are different.

At present, in the related art, the electrical compensation is performed, that is, the I-V characteristic of the driving tube and the I-V characteristic of the OLED device are read to an external sensing circuit through the TFT inside the pixel, and a driving voltage value to be compensated is calculated and fed back to the chip of the driving panel, so that the compensation is realized. It is necessary to develop a new type of IC having a signal extraction function. Although the method of external compensation does not affect the driving speed, the accuracy of the voltage detected by the IC chip is reduced and the compensation accuracy is affected because the voltage signal is susceptible to interference and the display panel has a parasitic capacitance. The external compensation method requires two signal lines in SUB-PIXEL, one is a Data Line (Data Line) and the other is a sensing Line (sensing Line) which can draw the current of the TFT and the OLED into the driving IC. It has two ways of pumping the electrical signal, one is to pump the TFT current, called TFT sensing, and the other is to pump the OLED current, called OLED sensing. However, the external IC driving circuit design almost doubles the number of IC pins, which is not suitable for the development of small size.

In view of the above, the present inventors have made diligent experiments and studies to overcome the above-mentioned shortcomings in the prior art, and have provided a method for performing touch control in a full display area and performing fingerprint recognition by using an array layout formed by manufacturing a photosensitive circuit using an Oxide semiconductor (Oxide) in an LTPO process.

Disclosure of Invention

The invention aims to: the utility model provides an outside compensation circuit structure of display panel solves the above-mentioned technical problem that exists among the prior art.

To achieve the purpose of the present invention, a technical solution provided by the present invention is as follows:

an external compensation circuit structure of a display panel comprises a panel and a driving integrated circuit for performing external compensation on the panel, wherein the driving integrated circuit comprises:

a first digital-to-analog converter connected to a first conductive line of the plurality of conductive lines;

a second digital-to-analog converter connected to a second conductive line of the plurality of conductive lines;

an analog-to-digital converter connected to the first and second conductive lines via a multiplexer;

a first transistor switch connected to the first wire;

a second transistor switch connected to the first wire and the multiplexer;

a third transistor switch connected to the second wire and the multiplexer; and

a fourth transistor switch connected to the second wire;

the first transistor switch, the second transistor switch, the third transistor switch, the fourth transistor switch and the multiplexer control drive integrated circuit write data into a first component in a first sub-pixel on the panel through a first lead and sense the first component through a second lead, or write data into a second component in a second sub-pixel on the panel through the second lead and sense the second component through the first lead.

To achieve another objective of the present invention, the present invention provides a technical solution as follows:

a first transistor switch connected to the first wire;

a second transistor switch connected to the first wire and the multiplexer;

a third transistor switch connected to the second wire and the multiplexer; and

a fourth transistor switch connected to the second wire;

the first transistor switch, the second transistor switch, the third transistor switch, the fourth transistor switch and the multiplexer control drive integrated circuit write data into a first component in a first sub-pixel on the panel through a first lead and sense the first component through a second lead, or write data into a second component in a second sub-pixel on the panel through the second lead and sense the second component through a third lead.

In one possible design, the plurality of conductive lines is divided into a first group of conductive lines and a second group of conductive lines, and each conductive line in the first group of conductive lines is adjacent to one conductive line in the second group of conductive lines.

In one possible design, the driving integrated circuit writes data to a plurality of first components on the panel through the first set of wires and senses the plurality of first components through the second set of wires during a first driving period; during a second driving period, data is written to a plurality of second components on the panel through the second set of wires and the plurality of second components are sensed through the first set of wires.

In one possible design, the first group of conductive lines includes the conductive lines in the odd-numbered rows of the plurality of conductive lines, and the second group of conductive lines includes the conductive lines in the even-numbered rows of the plurality of conductive lines.

an external compensation method of a display panel, comprising the steps of:

step 1: in the first driving period, data are written into the nth component in the nth sub-pixel in the plurality of sub-pixels through the nth conducting wire, and the nth component is sensed through the (n + 1) th conducting wire;

step 2: in the second driving period, data are written into the n +1 th component in the n +1 th sub-pixel in the plurality of sub-pixels through the n +1 th conducting wire, and the n component is sensed through the n conducting wire; and

and repeating the step 1 to the step 2.

To achieve still another objective of the present invention, the present invention provides a technical solution as follows:

an external compensation method of a display panel, comprising the steps of:

step 2: in the second driving period, data are written into the n +1 th component in the n +1 th sub-pixel in the plurality of sub-pixels through the n +1 th conducting wire, and the n component is sensed through the n +2 th conducting wire; and

and repeating the step 1 to the step 2.

In one possible design, the nth component and the (n + 1) th component are organic light emitting diodes in a panel.

In one possible design, the nth component and the (n + 1) th component are thin film transistors in a panel.

In one possible design, the nth sub-pixel is adjacent to the (n + 1) th sub-pixel.

By adopting the external compensation circuit structure to realize the external compensation method, each row wire can be used as a data line or a sensing line and is shared by adjacent sub-pixels. The elements in the odd-numbered rows of sub-pixels and the elements in the even-numbered rows of sub-pixels alternately perform data writing and sensing operations. In the driver integrated circuit. By the external compensation method of the invention, the pin number of the driving integrated circuit can be greatly reduced.

Drawings

Fig. 1 is a schematic diagram of a pixel structure of a prior art external compensation method.

FIG. 2 is a schematic diagram of a pixel structure for implementing an external compensation method according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of a pixel structure for implementing an external compensation method according to another embodiment of the present invention.

FIG. 4 is a schematic diagram of an external compensation circuit of the present invention.

Fig. 5 is a schematic diagram of a driving circuit for implementing fig. 4 according to the present invention.

Description of reference numerals: 10-a display; 100-a panel; 110-a drive integrated circuit; 20-a display; 200-a panel; 210-a driver integrated circuit; 30-a panel; 300-a drive integrated circuit; L1-L5-conductor; l1 '-L4' -conductors; P1-P4-sub-pixels; p1 '-P4' -subpixels; DL 1-DL 4-conductor;

DAC 1-DAC 4-digital analog converter; ADC 1-ADC 2-analog-to-digital converter; MUX 1-MUX 2-multiplexer; SW 1-SW 8-transistor switches; S1-S3-external compensation method flow.

Detailed Description

The following detailed description and technical contents of the present invention are described with reference to the drawings, which are provided for reference and illustration purposes only and are not intended to limit the present invention. Various embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention is not limited to only these embodiments. The invention is intended to cover alternatives, modifications, equivalents, and alternatives that may be included within the spirit and scope of the invention. In the following description of the preferred embodiments of the present invention, specific details are set forth in order to provide a thorough understanding of the present invention, and it will be apparent to those skilled in the art that the present invention may be practiced without these specific details.

Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The use of "including," "comprising," "having," and the like in this disclosure is intended to mean that the component or object before the word "appears in the art" includes reference to the component or object listed after the word and its equivalents, rather than excluding other components or objects. The terms "upper", "lower", and the like are used only to indicate relative positional relationships, and when the absolute position of the object to be described is changed, the relative positional relationships may be changed accordingly.

Referring to fig. 1, fig. 1 is a schematic diagram of a pixel structure of an external compensation method in the prior art. The display panel comprises a plurality of sub-pixels which are arranged in a matrix form. For each row of sub-pixels, a data line (source line) connects the sub-pixels to a driving integrated circuit (not shown), so that display data can be output to the tfts in the sub-pixels through the data line. Meanwhile, a sensing line (sensing line) is also connected between each row of sub-pixels and the driving integrated circuit. The sensing lines can be used for external compensation, and can transmit the electrical characteristics of the thin film transistors or the organic light emitting diodes in the sub-pixels to the driving integrated circuit, so that the driving integrated circuit can perform subsequent processing according to the received electrical characteristic data. In this case, each column of sub-pixels needs two wires to communicate with the driving ic, so that the driving ic has a large number of input/output pins, thereby increasing the cost of the driving ic. If the panel includes n rows of sub-pixels, 2n conducting wires are needed for data display and external compensation. For example, a full-HD oled display includes 1080 rows of pixels, i.e., 1080 × 3 rows of sub-pixels, and thus, the driver ic includes 1080 × 6 input/output pins (1080 × 3 for data lines and 1080 × 3 for sensing lines) for connecting wires, so that the large number of pins increases the cost of the driver ic. In view of the above, there is a need for improvement in the prior art.

Referring to fig. 2, fig. 2 is a schematic diagram of a pixel structure of an Active Matrix Organic Light Emitting Diode (AMOLED) display 10 according to an embodiment of the invention (hereinafter referred to as a display). As shown in fig. 2, the display 10 includes a panel 100 and a driving ic 110. The panel 100 includes a plurality of sub-pixels arranged in a matrix, and the panel 100 is connected to the driving integrated circuit 110 through a plurality of wires. For convenience of illustration, only 4 subpixels P1-P4 and 5 conducting lines L1-L5 are shown in fig. 2, but it should be understood that the panel 100 may include hundreds or thousands of rows of subpixels and conducting lines.

As shown in fig. 2, each sub-pixel has 2 contacts for connecting to the driving ic 110 through two wires. For example, the sub-pixel P1 is connected to the driver IC 110 via the conductive lines L1 and L2, the sub-pixel P2 is connected to the driver IC 110 via the conductive lines L2 and L3, and so on. In this way, each wire can be shared by two adjacent sub-pixels. For example, line L2 may be shared by subpixels P1 and P2, line L3 may be shared by subpixels P2 and P3, and so on. Due to the sharing of the wires, the number of wires required for the panel 100 can be greatly reduced compared to the number of wires for the panel 100 in fig. 1. In this case, if the panel 100 includes N rows of sub-pixels, only N +1 wires are needed to achieve the data display and external compensation operations of the oled display system 10, and the number of pins of the driving ic 110 can be greatly reduced.

In a display mode, the panel 100 can display images according to data from the driving ic 110, and the data can be transmitted to each row of sub-pixels through each row of wires for display. For example, subpixel P1 may receive data from conductor L1, subpixel P2 may receive data from conductor L2, and so on. In a compensation mode, the driving ic 110 can perform external compensation on the components on the panel 100, and the driving ic 110 can write data to the components in a sub-pixel through one wire and sense the components through another wire. For example, the driving integrated circuit 110 can write data to the component in the sub-pixel P1 through the line L1 and sense the component in the sub-pixel P1 through the line L2; the driver ic 110 can write data to the component in the subpixel P2 through the line L2 and sense the component in the subpixel P2 through the line L3.

More specifically, as shown in FIG. 2, for the sub-pixel P1, the arrow from the conductive line L1 toward a connection point of the sub-pixel P1 indicates that the conductive line L1 can be used as a data line for writing data to the components of the sub-pixel P1 by a specific voltage signal; the arrow from the other contact of subpixel P1 toward line L2 indicates that line L2 can be used as a sensing line for receiving the electrical characteristics of the components in subpixel P1. For the sub-pixel P2, the arrow from the wire L2 toward a connection point of the sub-pixel P2 indicates that the wire L2 can be used as a data line for writing data to the components of the sub-pixel P2 by a specific voltage signal; the arrow from the other contact of subpixel P2 toward line L3 indicates that line L3 can be used as a sensing line for receiving the electrical characteristics of the components in subpixel P2. By analogy, according to the arrow shown in fig. 2, a person skilled in the art should understand the data writing and sensing operation manner of each sub-pixel on the panel 100.

In one embodiment, each of the conductive lines other than the first and last column conductive lines may alternately serve as a data line and a sense line. Therefore, the data writing and sensing operations of the entire panel 100 can be completed in two periods. During the first driving period, the driving integrated circuit 110 can write data to the component in the sub-pixel P1 through the conducting line L1 and sense the component in the sub-pixel P1 through the conducting line L2. Therefore, for the sub-pixel P1, the data writing operation of the wire L1 and the sensing operation of the wire L2 can be performed at the same time. Similarly, the driving integrated circuit 110 can write data into the component of the sub-pixel P3 through the conducting line L3 and sense the component of the sub-pixel P3 through the conducting line L4 during the first driving period. During the second driving period, the driving integrated circuit 110 can write data to the component in the sub-pixel P2 through the conducting line L2 and sense the component in the sub-pixel P2 through the conducting line L3. Therefore, for the sub-pixel P2, the data writing operation of the wire L2 and the sensing operation of the wire L3 can be performed at the same time. Similarly, the driving integrated circuit 110 can write data to the component in the sub-pixel P4 through the conducting line L4 and simultaneously sense the component in the sub-pixel P4 through the conducting line L5 during the second driving period. As shown in fig. 2, the solid arrows represent data write or sense operations performed during the first driving period, and the dotted arrows represent data write or sense operations performed during the second driving period.

In this case, the sub-pixels on the panel 100 can be divided into two groups of sub-pixels. The elements in the first group of sub-pixels perform data writing and sensing during the first driving period, and the elements in the second group of sub-pixels perform data writing and sensing during the second driving period. In this example, the first group of sub-pixels includes sub-pixels in odd-numbered rows, i.e., sub-pixels P1, P3,. and so on, and the second group of sub-pixels includes sub-pixels in even-numbered rows, i.e., sub-pixels P2, P4,. and so on.

It should be noted that the above-mentioned configuration for data writing and sensing operations is only one of many embodiments of the present invention. For example, in another embodiment, the sub-pixels in the even-numbered rows can perform data writing and sensing in the first driving period, and the sub-pixels in the odd-numbered rows can perform data writing and sensing in the second driving period. In order to further reduce the number of pins of the driver ic, a Multiplexer (Multiplexer) may be disposed between the input/output pins of the driver ic and the two wires corresponding to the two rows of sub-pixels. In this case, the input/output pins of the driver ic can be selectively communicated with the two wires through the multiplexer, and the data writing and sensing operations of the entire panel require more time to complete. Therefore, the number of pins of the driving integrated circuit can be reduced by half, so that the external compensation method realized by the wire sharing can be applied to a small-size display system, such as a touch screen of a smart phone.

It should be noted that the lengths of the first driving period and the second driving period can be set arbitrarily, in other words, each data writing and sensing operation can be performed within an arbitrary time period. The time duration for performing the data writing and sensing can be preset according to the system requirements, and can be the same as or different from the period of displaying the pixel data.

Referring to fig. 3, fig. 3 is a schematic diagram of another organic light emitting diode display 20 according to another embodiment of the invention. As shown in fig. 3, the display 20 includes a panel 200 and a driving ic 210. The panel 200 includes a plurality of sub-pixels arranged in a matrix, and the panel 200 is connected to the driving integrated circuit 210 through a plurality of wires. For illustrative purposes, only 4 subpixels P1 '-P4' and 4 conducting lines L1 '-L4' are shown in FIG. 3, but it should be understood that the panel 200 may include hundreds or thousands of rows of subpixels and conducting lines. The sub-pixels on the panel 200 are arranged in a similar manner to the panel 100, but the wires are not shared.

In the external compensation mode, the driving integrated circuit 210 can write data to the component in the sub-pixel P1 'through the conductor L1', and sense the component in the sub-pixel P1 'through the conductor L2'. In another period, the driving integrated circuit 210 can write data to the component in the sub-pixel P2 'through the conducting line L2', and sense the component in the sub-pixel P2 'through the conducting line L1'. In this way, every two adjacent sub-pixels can share two same wires. Due to the sharing of the wires, the number of wires required for the panel 200 can be greatly reduced compared to the number of wires for the panel 100 of fig. 1. In this example, if the panel 200 includes N rows of sub-pixels and N is an even number, only N wires are needed to achieve the data display and external compensation operations of the oled display system 20, and the number of pins of the driving ic 210 can be greatly reduced.

More specifically, as shown in FIG. 3, for the sub-pixel P1 ', the arrow starting from the wire L1 ' and heading to a connection point of the sub-pixel P1 ' indicates that the wire L1 ' can be used as a data line for writing data to the components of the sub-pixel P1 ' with a specific voltage signal; the arrow from the other contact of subpixel P1 'and toward line L2' indicates that line L2 'can be used as a sensing line for receiving the electrical characteristics of the components in subpixel P1'. For the sub-pixel P2 ', an arrow starting from the wire L2 ' and heading to a connection point of the sub-pixel P2 ' indicates that the wire L2 ' can be used as a data line for writing data to the components in the sub-pixel P2 ' with a specific voltage signal; the arrow from the other contact of subpixel P2 'and toward line L1' indicates that line L1 'can be used as a sensing line for receiving the electrical characteristics of the components in subpixel P2'. By analogy, according to the arrow shown in fig. 3, a person skilled in the art should understand the data writing and sensing operation manner of each sub-pixel on the panel 200.

Similarly, each conductive line can be alternately used as a data line and a sensing line, and the data writing and sensing operations of the entire panel 200 can be completed in two periods. As shown in fig. 3, the solid arrows represent data write or sense operations performed during the first driving period, and the dotted arrows represent data write or sense operations performed during the second driving period. A person skilled in the art can understand the detailed data writing and sensing operation manner of the panel 200 according to the above paragraphs and the description of fig. 3, which are not described herein.

The above-mentioned programming and sensing operations for the OLED display system can be summarized as an external compensation method, and the external compensation process 80 can be executed in the driving IC, which includes the following steps:

s1: in the first driving period, data is written to the nth component in the nth sub-pixel of the plurality of sub-pixels through the nth conducting wire, and the nth component is sensed through the (n + 1) th conducting wire.

S2: in the second driving period, data is written into the n +1 th component in the n +1 th sub-pixel in the plurality of sub-pixels through the n +1 th conducting wire, and the n component is sensed through the n conducting wire or an n +2 th conducting wire.

S3: the steps of S1 to S2 are repeated.

To implement the data writing and sensing method, the driving integrated circuit (driving integrated circuit 110 or 210) in the embodiments can be implemented as follows. Referring to fig. 4 and fig. 5, the following embodiments of the invention respectively provide an external compensation circuit structure of a display panel. The external compensation circuit structure includes a panel 30 and a driving ic 300, and the detailed circuit structure of the driving ic 100 is a partially enlarged schematic diagram in fig. 2. The driving integrated circuit 100 includes a plurality of conductive lines connected to corresponding conductive lines and sub-pixels on the panel. The driving integrated circuit 100 further includes a plurality of Digital to Analog converters (DACs) and output buffers for writing data into the devices in the sub-pixels on the panel, and a plurality of ADCs and a plurality of multiplexers for sensing the devices in the sub-pixels on the panel. The circuit components can be connected to the wires through the MOS switch components and are respectively connected to the corresponding sub-pixels on the panel through pins. For convenience of illustration, FIG. 2 only shows the neighboring 2 conductive lines SL 1-SL 2 and the corresponding digital-to-analog converters DAC 1-DAC 4, analog-to-digital converters ADC 1-ADC 2, multiplexers MUX 1-MUX 2 and transistor switches SW 1-SW 8.

The following description takes the conductive wires DL 1-DL 2 and the corresponding circuit components as examples; the DAC1 and the output buffer B1 are connected to the conductive line DL1, the DAC2 is connected to the conductive line DL2, and the ADC1 is connected to the conductive lines DL1 and DL2 through the multiplexer MUX 1. In addition, transistor switch SW1 is connected to conductor DL1, transistor switch SW2 is connected between conductor DL1 and multiplexer MUX1, transistor switch SW3 is connected between conductor DL2 and multiplexer MUX1, and transistor switch SW4 is connected to conductor DL 2. In the display mode, the driving integrated circuit 100 can send display data to the panel 30 for displaying images. Therefore, the transistor switches SW1 and SW4 are turned on to pass the display data transmitted through the digital-to-analog converters DAC 1-DAC 2 and the output buffers B1-B2, and the transistor switches SW2 and SW3 are turned off.

In the external compensation mode, the driving integrated circuit 100 performs external compensation on the panel 30. At this time, the DACs 1-2 output voltage signals for writing data to the components on the panel 30. The ADC1 senses the components to receive the electrical characteristics of the components from the panel 30. The transistor switches SW 1-SW 4 and the multiplexer MUX1 control the driver IC 100 to selectively perform data writing or sensing of the devices on the panel 30. Assuming that the layout of the conductive lines of the panel 30 is similar to the layout of the panel 200, during the first driving period, the transistor switches SW 1-SW 4 and the multiplexer MUX1 can control the driving ic 100 to write data to a first component of a first sub-pixel on the panel 30 (e.g. the component in the sub-pixel P1 ' on the panel 200 shown in fig. 3) through the conductive line DL1 (e.g. the conductive line L1 ' shown in fig. 3) and to sense the first component through the conductive line DL2 (e.g. the conductive line L2 ') shown in fig. 3). Then, during the second driving period, the transistor switches SW 1-SW 4 and the multiplexer MUX1 can control the driving ic 100 to write data to a second component of a second sub-pixel (e.g. the component in the sub-pixel P2 ' of the panel 200 shown in fig. 3) on the panel 30 through the conductive line DL2 (e.g. the conductive line L2 ' shown in fig. 3) and to sense the second component through the conductive line DL1 (e.g. the conductive line L1 ' shown in fig. 3). It is noted that the arrangement of circuit elements in FIG. 4 can also be used for the arrangement of elements and sub-pixels on the panel 100 of FIG. 2, and data writing and sensing operations are performed in a similar manner. In this case, the second module can write data through the conductive line DL2 and sense through the conductive line DL3 (e.g., the conductive line L3 shown in FIG. 2).

The operation of the transistor switches SW 1-SW 4 can be analogized to the transistor switches SW 5-SW 8 and other transistor switches in the driver IC 410. In this case, the conductive lines in the driver ic 410 can be divided into two sets of conductive lines, and each conductive line in the first set of conductive lines is adjacent to one conductive line in the second set of conductive lines. During the first driving period, the first set of conductive lines (i.e., the odd numbered conductive lines, such as DL1 and DL3) can be used as data lines for writing data to the devices in the first set of sub-pixels (i.e., the odd numbered sub-pixels), and the second set of conductive lines (i.e., the even numbered sub-pixels, such as DL2 and DL4) can be used as sensing lines for sensing the devices in the first set of sub-pixels. In the second driving period, the first group of wires can be used as sensing wires for sensing the components in the second group of sub-pixels (sub-pixels in even rows), and the second group of wires can be used as data wires for writing data into the components in the second group of sub-pixels. Therefore, the data writing and sensing operation of the whole panel can be completed in two periods.

In one embodiment, the driving IC processes the digital data, converts the processed digital data into analog data through the DAC, and outputs the analog data, and the sensing data from the panel is converted through the DAC and received by the driving IC. Therefore, both the DAC and the ADC are necessary components in the driving IC. For the external compensation of the sub-pixels on the panel, the component to be sensed can be an organic light emitting diode or a thin film transistor. The driving integrated circuit can compensate the parameters of the organic light emitting diode and the thin film transistor when generating the display data according to the sensing results of the components.

In summary, the present invention provides an external compensation circuit structure and an external compensation method for a display panel. According to the external compensation method, each row wire can be used as a data line or a sensing line and shared by adjacent sub-pixels. The elements in the odd-numbered rows of sub-pixels and the elements in the even-numbered rows of sub-pixels alternately perform data writing and sensing operations. In the driving integrated circuit, except for holding the data line, all the pins are short-circuited to the transfer MOS through a common switch MOS switch, and the MOS is in a normally-off state to avoid short circuit; after data writing, the common switch MOS switch can be opened to read the charge data stored in the pixel circuit to the transfer MOS, because S and D of the transfer MOS have transverse voltage, the transfer MOS switch can be turned on and provide current, different compensation data can cause the transfer MOS to give different current, and the uniform state of the charge stored in the pixel can be judged and recorded in the memory in the drive integrated circuit for data compensation. In addition, the external compensation method of the present invention can be applied to any pixel structure, such as 2T1C or 3T1c. Through the external compensation method of the present invention, if the panel includes N rows of sub-pixels, only N or N +1 wires are needed to achieve the data display and the external compensation operation, and at the same time, the number of pins of the driving integrated circuit can be greatly reduced.

In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples

The foregoing description shows and describes several preferred embodiments of the invention, but as before, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An external compensation circuit structure of a display panel, the external compensation circuit structure of the display panel comprising a panel and a driving IC for performing external compensation on the panel, the driving IC comprising:

a first transistor switch connected to the first wire;

a second transistor switch connected to the first wire and the multiplexer;

a third transistor switch connected to the second wire and the multiplexer; and

a fourth transistor switch connected to the second wire;

wherein the first transistor switch, the second transistor switch, the third transistor switch, the fourth transistor switch, and the multiplexer control the driving integrated circuit to write data into a first component in a first sub-pixel on the panel through the first conductive line and sense the first component through the second conductive line, or to write data into a second component in the second sub-pixel on the panel through the second conductive line and sense the second component through the first conductive line.

2. An external compensation circuit structure of a display panel, the external compensation circuit structure of the display panel comprising a panel and a driving IC for performing external compensation on the panel, the driving IC comprising:

a first transistor switch connected to the first wire;

a second transistor switch connected to the first wire and the multiplexer;

a third transistor switch connected to the second wire and the multiplexer; and

a fourth transistor switch connected to the second wire;

wherein the first transistor switch, the second transistor switch, the third transistor switch, the fourth transistor switch, and the multiplexer control the driving integrated circuit to write data into a first component in a first sub-pixel on the panel through the first conductive line and sense the first component through the second conductive line, or to write data into a second component in the second sub-pixel on the panel through the second conductive line and sense the second component through the third conductive line.

3. The external compensation circuit structure of claim 1 or 2, wherein the plurality of conductive lines are divided into a first group of conductive lines and a second group of conductive lines, each conductive line of the first group of conductive lines is adjacent to a conductive line of the second group of conductive lines.

4. The external compensation circuit structure of a display panel according to claim 3, wherein the driving integrated circuit writes data to a plurality of first components on the panel through the first set of conductive lines and senses the plurality of first components through the second set of conductive lines during a first driving period; and

during a second drive period, data is written to the second component on the panel through the second set of conductive lines and the second component is sensed through the first set of conductive lines.

5. The external compensation circuit structure of claim 3, wherein the first group of conductive lines comprises odd-numbered conductive lines of the plurality of conductive lines, and the second group of conductive lines comprises even-numbered conductive lines of the plurality of conductive lines.

6. An external compensation method based on the external compensation circuit structure of the display panel of claim 1, characterized in that the external compensation method comprises the steps of:

step 1: during the first driving period, writing data into the nth component in the nth sub-pixel in the plurality of sub-pixels through the nth conducting wire, and sensing the nth component through the (n + 1) th conducting wire;

step 2: during the second driving period, writing data into the n +1 component in the n +1 sub-pixel in the plurality of sub-pixels through the n +1 conducting line, and sensing the n component through the n conducting line; and

and repeating the step 1 to the step 2.

7. An external compensation method based on the external compensation circuit structure of the display panel of claim 2, characterized in that the external compensation method comprises the steps of:

step 1: during the first driving period, writing data into an nth component in an nth sub-pixel in the plurality of sub-pixels through the nth conducting wire, and sensing the nth component through an n +1 th conducting wire;

and repeating the step 1 to the step 2.

8. An external compensation method according to claim 6 or 7, wherein the n-th element and the n + 1-th element are organic light emitting diodes in a panel.

9. An external compensation method according to claim 6 or 7, wherein the n-th element and the n + 1-th element are thin film transistors in a panel.

10. An external compensation method according to claim 6 or 7, wherein the nth sub-pixel is adjacent to the (n + 1) th sub-pixel.