CN112285969A - Method for manufacturing liquid crystal display panel 1 - Google Patents
Method for manufacturing liquid crystal display panel 1 Download PDFInfo
- Publication number
- CN112285969A CN112285969A CN202011430148.0A CN202011430148A CN112285969A CN 112285969 A CN112285969 A CN 112285969A CN 202011430148 A CN202011430148 A CN 202011430148A CN 112285969 A CN112285969 A CN 112285969A
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- China
- Prior art keywords
- thin film
- film transistor
- array substrate
- transistor array
- liquid crystal
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
Abstract
The invention discloses a manufacturing method of a liquid crystal display panel. The manufacturing method comprises the following steps: step A, arranging a frame glue mixture at a peripheral area of a thin film transistor array substrate, wherein the frame glue mixture comprises conductive particles and a liquid frame glue material, and the frame glue mixture arranged at the peripheral area surrounds a display area of the thin film transistor array substrate; step B, arranging liquid crystal in the area surrounded by the frame glue mixture on the thin film transistor array substrate 1; step C, aligning the color film substrate and the thin film transistor array substrate and combining the color film substrate and the thin film transistor array substrate into a whole; d, curing the frame glue mixture arranged between the color film substrate and the thin film transistor array substrate; the invention can lead the liquid crystal display panel to have longer service life.
Description
Technical Field
The invention relates to the field of display, in particular to a manufacturing method of a liquid crystal display panel.
Background
A sealing member is disposed between a thin film transistor array substrate and a color film substrate of a conventional liquid crystal display panel, and the sealing member is used for sealing a liquid crystal accommodating space between the thin film transistor array substrate and the color film substrate.
The width of the sealing member at different positions is greatly different from that of the liquid crystal display panel when viewed perpendicularly, that is, the width of the sealing member is large at one position and small at another position.
The conventional sealing member is formed by moving a coating opening of a sealant mixture material from one position to another position of the thin film transistor array substrate, and when the speed of outputting the sealant mixture material at the coating opening cannot keep up with the moving speed of the sealant mixture material, the width of a local area of a strip-shaped sealant mixture coated on the thin film transistor array substrate is easily too small.
In this case, the portion of the sealing member having a small width is likely to be a gap for leakage of the liquid crystal, and particularly, when the liquid crystal display panel is pressed, the portion of the sealing member having a small width is likely to be broken by the liquid crystal subjected to the pressing force. This is disadvantageous in ensuring a long life span of the liquid crystal display panel.
Therefore, a new technical solution is needed to solve the above technical problems.
Disclosure of Invention
The invention aims to provide a manufacturing method of a liquid crystal display panel, which can enable the liquid crystal display panel to have longer service life.
In order to solve the problems, the technical scheme of the invention is as follows:
a method of manufacturing a liquid crystal display panel, the method comprising the steps of: step A, arranging a frame glue mixture at a peripheral area of a thin film transistor array substrate, wherein the frame glue mixture comprises conductive particles and a liquid frame glue material, and the frame glue mixture arranged at the peripheral area surrounds a display area of the thin film transistor array substrate; step B, arranging liquid crystal in the area surrounded by the frame glue mixture on the thin film transistor array substrate 1; step C, aligning the color film substrate and the thin film transistor array substrate and combining the color film substrate and the thin film transistor array substrate into a whole; and D, curing the frame glue mixture arranged between the color film substrate and the thin film transistor array substrate.
In the above method for manufacturing a liquid crystal display panel, the step a includes: a1, erecting a coating member provided with a frame glue mixture on the thin film transistor array substrate, wherein an opening of the coating member is annular, and the shape and the area of the opening correspond to the shape and the area of the peripheral area; step a2, coating the sealant mixture on the thin film transistor array substrate and the peripheral region through the coating member.
In the above method for manufacturing a liquid crystal display panel, the coating member includes four strip-shaped sub-members, and the four strip-shaped sub-members are connected end to form a rectangle.
In the above method for manufacturing a liquid crystal display panel, the step a2 includes: and extruding the frame glue mixture in the coating member to coat the frame glue mixture on the peripheral area of the thin film transistor array substrate through the opening of the coating member.
In the above method for manufacturing a liquid crystal display panel, the step a2 includes: and simultaneously extruding the frame glue mixture in the four strip-shaped sub-components, so that the frame glue mixture in the four strip-shaped sub-components is simultaneously coated to the peripheral area of the thin film transistor array substrate from the opening of the coating component.
In the method for manufacturing a liquid crystal display panel, the extrusion acting force applied to the sealant mixture in one of the four strip-shaped sub-members is equal to the extrusion acting force applied to the sealant mixture in the other of the four strip-shaped sub-members.
In the above method for manufacturing a liquid crystal display panel, the widths of any two positions of the strip-shaped sub-members corresponding to the openings are equal.
In the above method for manufacturing a liquid crystal display panel, after the step a2, the step a further includes: step a3, separating the sealant mixture coated on the peripheral region of the thin film transistor array substrate from the opening of the coating member.
In the above method for manufacturing a liquid crystal display panel, after the step a1 and before the step a2, the step a further includes: step a4, aligning the coating member with the peripheral region of the thin film transistor array substrate.
In the above method of manufacturing a liquid crystal display panel, a distance between a distal end of the opening of the coating member erected on the thin film transistor array substrate and the surface of the thin film transistor array substrate is less than or equal to 3 mm.
In the technical scheme, the frame adhesive mixture on the thin film transistor array substrate is coated at one time from top to bottom through the coating member erected on the thin film transistor array substrate, so that the frame adhesive mixture on the thin film transistor array substrate is uniform in width, the situation that a sealing member formed by the frame adhesive mixture is small in local area width and is easily broken by liquid crystal under extrusion force is avoided, and the liquid crystal display device is favorably ensured to have long service life.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a liquid crystal display panel according to the present invention;
fig. 2 is a flowchart illustrating a step of disposing sealant mixture at a peripheral region of the tft array substrate in the method of manufacturing the lcd panel shown in fig. 1;
FIG. 3 is a top view of the position relationship between the coating member and the TFT array substrate in the method for fabricating the LCD panel according to the present invention;
FIG. 4 is a schematic view of section P-P' of FIG. 3;
FIG. 5 is a schematic view of the coating member shown in FIG. 4 with the opening in a closed state;
fig. 6 is a schematic view of the coating member shown in fig. 4 with the opening in an open state.
Detailed Description
As shown in fig. 1 and 2, the method for manufacturing a liquid crystal display panel according to the present invention includes the steps of:
step a (step 101), disposing a sealant mixture at the peripheral area BA of the thin film transistor array substrate 301, wherein the sealant mixture includes conductive particles and a liquid sealant material, the conductive particles are uniformly mixed in the liquid sealant material, and the sealant mixture disposed at the peripheral area BA surrounds the display area AA of the thin film transistor array substrate 301.
And step B (step 102), disposing liquid crystal on the region surrounded by the sealant mixture on the thin film transistor array substrate 301.
And step C (step 103), aligning the color film substrate with the thin film transistor array substrate 301, and combining the color film substrate and the thin film transistor array substrate into a whole.
And step D (step 104), curing the sealant mixture arranged between the color film substrate and the thin film transistor array substrate 301 so as to cure the sealant mixture into a sealing member.
The liquid crystal display panel comprises a display area AA and a peripheral area BA surrounding the display area AA, the liquid crystal display panel comprises a thin film transistor array substrate 301, a color film substrate and liquid crystal, a sealing component is arranged between the thin film transistor array substrate 301 and the color film substrate and is positioned in the peripheral area BA of the liquid crystal display panel, the thin film transistor array substrate 301, the sealing component and the color film substrate surround a closed liquid crystal accommodating space, and the liquid crystal is arranged in the liquid crystal accommodating space.
A first conductive pad is disposed at a portion of the thin film transistor array substrate 301 corresponding to the peripheral area BA, a second conductive pad is disposed at a portion of the color film substrate corresponding to the first conductive pad, conductive particles are disposed in the sealing member, and the conductive particles are in contact with the first conductive pad and the second conductive pad. The conductive particles are one of spheres and cubes. The conductive particles include a magnetic conductive material, for example, the entirety of the conductive particles is made of the magnetic conductive material, or the conductive particles include an elongated elastic body and a magnetic conductive material layer covering the elastic body, and the material of the elastic body may be, for example, rubber. The magnetically conductive material may be iron, for example.
The second conductive pad is connected to the common electrode of the color filter substrate, and the first conductive pad is connected to the common line of the thin film transistor array substrate 301. The common line extends from the display area AA to the peripheral area BA. The portion of the common line located in the peripheral area BA is located near the edge of the thin film transistor array substrate 301.
The thin film transistor array substrate 301 includes at least two scan lines, at least two data lines, at least two thin film transistor switches, and at least two pixel electrodes, where the thin film transistor switches include a gate, a source, and a drain, the gate is connected to the scan lines, the source is connected to the data lines, and the drain is connected to the pixel electrodes.
The step A comprises the following steps:
step a1 (step 1011), erecting a coating member 302 provided with sealant mixture on the thin film transistor array substrate 301, as shown in fig. 3 and 4, wherein an opening of the coating member 302 is annular, and a shape and an area of the opening correspond to a shape and an area of the peripheral area BA.
Step a2 (step 1013), the sealant mixture is coated on the portion of the tft array substrate 301 corresponding to the peripheral area BA by the coating member 302.
The coating member 302 comprises four strip-shaped sub-members connected end to form a rectangle.
The step a2 includes:
the sealant mixture in the coating member 302 is extruded, so that the sealant mixture is coated on the peripheral area BA of the thin film transistor array substrate 301 through the opening of the coating member 302.
The step a2 includes:
the sealant mixture in the four strip-shaped sub-members is simultaneously squeezed, so that the sealant mixture in the four strip-shaped sub-members is simultaneously coated on the peripheral area BA of the thin film transistor array substrate 301 from the opening of the coating member 302.
The pressing force applied to the sealant mixture in one of the four strip-shaped sub-members is equal to the pressing force applied to the sealant mixture in the other of the four strip-shaped sub-members.
Alternatively, the step a2 includes:
under the condition that the opening of the coating member 302 is in an open state, the sealant mixture is coated on the peripheral area BA of the thin film transistor array substrate 301 by using the self-gravity of the sealant mixture uniformly distributed in the coating member 302.
The width of any two positions of the strip-shaped sub-component corresponding to the opening is equal.
After the step a2, the step a further includes:
step a3 (step 1014), separating the sealant mixture applied to the peripheral area BA of the tft array substrate 301 from the opening of the coating member 302.
After the step a1, and before the step a2, the step a further comprises:
step a4 (step 1012), aligning the coating member 302 with the peripheral area BA of the thin film transistor array substrate 301.
The distance between the end of the opening of the coating member 302 mounted on the thin film transistor array substrate 301 and the surface of the thin film transistor array substrate 301 is less than or equal to 3 mm.
The part of the strip-shaped sub-component corresponding to the opening is the frame adhesive mixture output port 3028, and the strip-shaped sub-component further includes a frame adhesive mixture input port 3027 opposite to the frame adhesive mixture output port 3028. The width of the sealant mixture output port 3028 is smaller than the width of the sealant mixture input port 3027. The width of the sealant mixture outlet port 3028 is in the range of 0.3 mm to 1 mm.
Before the step a, the manufacturing method further includes the steps of:
and E, placing the thin film transistor array substrate 301 on a horizontal plane.
As shown in fig. 5 and 6, the strip-shaped sub-component includes a strip-shaped main board 3021 and a strip-shaped sub-board 3022, the sub-board 3022 is movably connected to the main board 3021, the main board 3021 includes a first edge portion and a second edge portion, the first edge portion and the second edge portion face away from each other, and the sub-board 3022 includes a third edge portion and a fourth edge portion, the third edge portion and the fourth edge portion face away from each other. The first edge portion of the main board body 3021 and the third edge portion constitute the frame adhesive mixture input port 3027, the first edge portion and the third edge portion are arranged in parallel, the second edge portion and the fourth edge portion of the main board body 3021 constitute the frame adhesive mixture output port 3028, and the second edge portion and the fourth edge portion are arranged in parallel. The main board 3021 and the sub board 3022 define an accommodating space for accommodating the sealant mixture, and the accommodating spaces of the four strip sub-members connected end to end are communicated.
The step a3 includes:
controlling the third edge portion to contact with the first edge portion, so that the sealant mixture applied to the peripheral area BA of the thin film transistor array substrate 301 is separated from the opening of the applying member 302.
One of the sub plate body 3022 and the main plate body 3021 is connected to a transmission assembly, and the transmission assembly is connected to a motor, and the motor is used for controlling the swing of one of the sub plate body 3022 and the main plate body 3021 through the transmission assembly, so as to control the opening or closing of the coating member 302. The transmission assembly may for example be a combination of a transmission rod and a gear. One end of the transmission rod is connected with the edge of the gear, the gear is sleeved on the rotating shaft 3026 of the motor, and the other end of the transmission rod is connected with one of the auxiliary plate body 3022 and the main plate body 3021.
Specifically, the step a3 includes:
the motor drives one of the sub-plate 3022 and the main plate 3021 to swing through the transmission assembly, so that the first edge of the main plate 3021 and the third edge of the sub-plate 3022 contact each other, and the sealant mixture applied to the peripheral area BA of the thin film transistor array substrate 301 is separated from the opening of the applying member 302.
The step A further comprises the following steps:
step a 5: the third edge portion is controlled to be separated from the first edge portion, so that the sealant mixture in the coating member 302 falls from the opening to the peripheral area BA of the thin film transistor array substrate 301.
Specifically, the step a5 includes:
the motor drives one of the sub-plate 3022 and the main plate 3021 to swing through the transmission assembly, so as to separate the first edge portion of the main plate 3021 from the third edge portion of the sub-plate 3022, and the sealant mixture in the coating member 302 falls from the opening to the peripheral area BA of the thin film transistor array substrate 301.
The four main board bodies 3021 are fixedly connected to form a rectangle, the four sub board bodies 3022 are respectively movably connected to the corresponding main board bodies 3021, and the ends of two adjacent sub board bodies 3022 are connected by a flexible member. Or, the four auxiliary board bodies 3022 are fixedly connected to form a rectangle, the four main board bodies 3021 are respectively movably connected to the corresponding auxiliary board bodies 3022, and the ends of two adjacent main board bodies 3021 are connected by a flexible member.
The mainboard body 3021 orientation be provided with first side wing 3023 on a side of subplate body 3022, first side wing 3023 is kept away from the end of mainboard body 3021 is provided with first shaft hole, subplate body 3022 orientation be provided with second side wing 3024 on a side of mainboard body 3021, second side wing 3024 is kept away from the end of subplate body 3022 is provided with the second shaft hole, and a pivot 3026 passes first shaft hole with the second shaft hole.
The transmission assembly is connected to a side of the main board body 3021 facing away from the sub-board body 3022 or a side of the main board body 3021 facing away from the main board body 3021.
The sealant mixture input port 3027 is provided with a screen 3025, a diameter of a mesh of the screen 3025 is greater than or equal to a preset value x 1 and less than or equal to the preset value x 1.1, where the preset value is a distance between the first conductive pad and the second conductive pad when the tft array substrate 301 and the color filter substrate are combined into a whole, for example, the diameter of the mesh of the screen 3025 is equal to one of the preset value x 1, the preset value x 1.01, the preset value x 1.02, the preset value x 1.03, the preset value x 1.04, the preset value x 1.05, the preset value x 1.06, the preset value x 1.07, the preset value x 1.08, the preset value x 1.09, and the preset value x 1.1, and preferably, the diameter of the mesh of the screen 3025 is equal to the preset value x 1.
The mesh 3025 is used to filter conductive particles having a diameter greater than that of the mesh.
Before the step a1, the step a further includes:
step a6, under the condition that the opening of the coating member 302 is closed, the sealant mixture is poured into the coating member 302 through the screen 3025.
Before the step a2, the step a further includes:
step a7, under the condition that the opening of the coating member 302 is in a closed state, applying a vibration acting force with a predetermined frequency to the coating member 302 provided with the sealant mixture, so that the coating member 302 provided with the sealant mixture vibrates with the predetermined frequency for a predetermined time, thereby uniformly distributing the sealant mixture in the coating member 302. The predetermined frequency is in the range of 0.1 to 100 times/second and the amplitude is in the range of 0.01 to 1 mm, and the predetermined time may be, for example, 5 to 300 seconds.
Wherein, the contact position of the vibration source for applying the vibration acting force to the coating member 302 and the coating member 302 is located on one side surface of the main plate body 3021 of the coating member 302 facing the sub plate body 3022 (in the case that the four main plate bodies 3021 are fixedly connected into a rectangle) or one side surface of the sub plate body 3022 facing the main plate body 3021 (in the case that the four sub plate bodies 3022 are fixedly connected into a rectangle).
In the technical scheme, the frame adhesive mixture on the thin film transistor array substrate is coated at one time from top to bottom through the coating member erected on the thin film transistor array substrate, so that the frame adhesive mixture on the thin film transistor array substrate is uniform in width, the situation that a sealing member formed by the frame adhesive mixture is small in local area width and is easily broken by liquid crystal under extrusion force is avoided, and the liquid crystal display device is favorably ensured to have long service life.
The frame adhesive mixture is coated on the peripheral area BA of the thin film transistor array substrate 301 through the annular opening, so that the frame adhesive mixture on the thin film transistor array substrate 301 has uniform width, and the situation of local width and narrow width is avoided. Meanwhile, the situation that the width of the formed sealing member is larger at the part due to overlarge volume of the overlapped part caused by overlapping the head end (the part of the frame glue mixture coated at the beginning) and the tail end (the part of the frame glue mixture coated at the end) of the frame glue mixture can be avoided.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. A method for manufacturing a liquid crystal display panel, the method comprising:
step A, arranging a frame glue mixture at a peripheral area of a thin film transistor array substrate, wherein the frame glue mixture comprises conductive particles and a liquid frame glue material, and the frame glue mixture arranged at the peripheral area surrounds a display area of the thin film transistor array substrate;
b, arranging liquid crystal in a region surrounded by the frame glue mixture on the thin film transistor array substrate;
step C, aligning the color film substrate and the thin film transistor array substrate and combining the color film substrate and the thin film transistor array substrate into a whole;
and D, curing the frame glue mixture arranged between the color film substrate and the thin film transistor array substrate.
2. The method for manufacturing a liquid crystal display panel according to claim 1, wherein the step a includes:
a1, erecting a coating member provided with a frame glue mixture on the thin film transistor array substrate, wherein an opening of the coating member is annular, and the shape and the area of the opening correspond to the shape and the area of the peripheral area;
step a2, coating the sealant mixture on the thin film transistor array substrate and the peripheral region through the coating member.
3. The method according to claim 2, wherein the coating member comprises four strip-shaped sub-members connected end to form a rectangle.
4. The method for manufacturing a liquid crystal display panel according to claim 3, wherein the step a2 includes:
and extruding the frame glue mixture in the coating member to coat the frame glue mixture on the peripheral area of the thin film transistor array substrate through the opening of the coating member.
5. The method for manufacturing a liquid crystal display panel according to claim 4, wherein the step a2 includes:
and simultaneously extruding the frame glue mixture in the four strip-shaped sub-components, so that the frame glue mixture in the four strip-shaped sub-components is simultaneously coated to the peripheral area of the thin film transistor array substrate from the opening of the coating component.
6. The method according to claim 4, wherein the pressing force applied to the sealant mixture in one of the four strip-shaped sub-members is equal to the pressing force applied to the sealant mixture in the other of the four strip-shaped sub-members.
7. The method of manufacturing a liquid crystal display panel according to claim 3, wherein the width of any two positions of the strip-shaped sub-member corresponding to the opening is equal.
8. The method for manufacturing a liquid crystal display panel according to claim 2, wherein after the step a2, the step a further comprises:
step a3, separating the sealant mixture coated on the peripheral region of the thin film transistor array substrate from the opening of the coating member.
9. The method for manufacturing a liquid crystal display panel according to claim 2, wherein after the step a1 and before the step a2, the step a further comprises:
step a4, aligning the coating member with the peripheral region of the thin film transistor array substrate 301.
10. The method of manufacturing a liquid crystal display panel according to claim 2, wherein a distance between a distal end of the opening of the coating member erected on the thin film transistor array substrate and the surface of the thin film transistor array substrate is less than or equal to 3 mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011430148.0A CN112285969A (en) | 2020-12-09 | 2020-12-09 | Method for manufacturing liquid crystal display panel 1 |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011430148.0A CN112285969A (en) | 2020-12-09 | 2020-12-09 | Method for manufacturing liquid crystal display panel 1 |
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| CN112285969A true CN112285969A (en) | 2021-01-29 |
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| CN202011430148.0A Pending CN112285969A (en) | 2020-12-09 | 2020-12-09 | Method for manufacturing liquid crystal display panel 1 |
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| CN1721956A (en) * | 2004-07-16 | 2006-01-18 | 鸿富锦精密工业（深圳）有限公司 | Frame adhesive curing method and LCD panel manufacturing method |
| CN101561591A (en) * | 2008-04-17 | 2009-10-21 | 北京京东方光电科技有限公司 | Frame sealant coating and curing method, frame sealant and liquid crystal panel |
| CN104678659A (en) * | 2015-03-20 | 2015-06-03 | 合肥京东方光电科技有限公司 | Frame sealing glue coating device |
| CN207882631U (en) * | 2018-02-27 | 2018-09-18 | 张家港康得新光电材料有限公司 | A kind of liquid crystal cell |
| CN109143693A (en) * | 2018-09-28 | 2019-01-04 | 深圳市华星光电半导体显示技术有限公司 | A kind of liquid crystal display panel and preparation method thereof |
| CN110967878A (en) * | 2019-10-22 | 2020-04-07 | 武汉华星光电技术有限公司 | Narrow-frame liquid crystal display panel and manufacturing method thereof |
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2020
- 2020-12-09 CN CN202011430148.0A patent/CN112285969A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1721956A (en) * | 2004-07-16 | 2006-01-18 | 鸿富锦精密工业（深圳）有限公司 | Frame adhesive curing method and LCD panel manufacturing method |
| CN101561591A (en) * | 2008-04-17 | 2009-10-21 | 北京京东方光电科技有限公司 | Frame sealant coating and curing method, frame sealant and liquid crystal panel |
| CN104678659A (en) * | 2015-03-20 | 2015-06-03 | 合肥京东方光电科技有限公司 | Frame sealing glue coating device |
| CN207882631U (en) * | 2018-02-27 | 2018-09-18 | 张家港康得新光电材料有限公司 | A kind of liquid crystal cell |
| CN109143693A (en) * | 2018-09-28 | 2019-01-04 | 深圳市华星光电半导体显示技术有限公司 | A kind of liquid crystal display panel and preparation method thereof |
| CN110967878A (en) * | 2019-10-22 | 2020-04-07 | 武汉华星光电技术有限公司 | Narrow-frame liquid crystal display panel and manufacturing method thereof |
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