CN112285200B - Array vortex and phased array ultrasonic composite detection probe - Google Patents
Array vortex and phased array ultrasonic composite detection probe Download PDFInfo
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- CN112285200B CN112285200B CN202011312499.1A CN202011312499A CN112285200B CN 112285200 B CN112285200 B CN 112285200B CN 202011312499 A CN202011312499 A CN 202011312499A CN 112285200 B CN112285200 B CN 112285200B
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- 239000000523 sample Substances 0.000 title claims abstract description 74
- 238000001514 detection method Methods 0.000 title abstract description 28
- 239000002131 composite material Substances 0.000 title description 5
- 235000012431 wafers Nutrition 0.000 claims abstract description 64
- 238000013329 compounding Methods 0.000 claims abstract description 8
- 238000003491 array Methods 0.000 claims abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 29
- 238000009659 non-destructive testing Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 238000002604 ultrasonography Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000005284 excitation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- WABPQHHGFIMREM-FTXFMUIASA-N lead-202 Chemical compound [202Pb] WABPQHHGFIMREM-FTXFMUIASA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
- G01N27/904—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents with two or more sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
- G01N27/9013—Arrangements for scanning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/043—Analysing solids in the interior, e.g. by shear waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/262—Arrangements for orientation or scanning by relative movement of the head and the sensor by electronic orientation or focusing, e.g. with phased arrays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/0289—Internal structure, e.g. defects, grain size, texture
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/10—Number of transducers
- G01N2291/106—Number of transducers one or more transducer arrays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
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Abstract
The invention belongs to the field of nondestructive testing, and discloses a detection probe for ultrasonic compounding of an array vortex and a phased array, which comprises a shell; an eddy current coil array formed by two rows of eddy current coils which are staggered mutually is arranged on the inner wall of one side of the shell; each vortex coil is provided with a first wire, one end of the first wire is connected with the vortex coil, and the other end of the first wire is connected with a multiplexer arranged on the outer wall of the shell; one side of the vortex coil array is provided with a plurality of first piezoelectric wafers, and the wire arrays of the plurality of first piezoelectric wafers are longitudinally arranged or transversely arranged; and a second lead is arranged on each first piezoelectric wafer, one end of the second lead is connected with the positive electrode of the first piezoelectric wafer, and the other end of the second lead is connected with a first interface arranged on the outer wall of the shell. By integrating the array eddy current probe and the phased array ultrasonic probe on the same probe, the detection of surface defects, near-surface defects and internal defects can be realized only by one-time detection, and higher surface and near-surface resolution is realized.
Description
Technical Field
The invention belongs to the field of nondestructive testing, and relates to a probe for detecting the ultrasonic combination of an array vortex and a phased array.
Background
The array eddy current probe is a probe which is used for realizing large-area and high-efficiency scanning by integrating a plurality of coils on one probe on the basis of the traditional single-coil eddy current probe. The commonly used array eddy current probe adopts a time-sharing multi-excitation transmitting-receiving array eddy current detection technology, each coil in the array eddy current probe is sequentially excited in the detection process, and meanwhile, adjacent coils are used as receiving coils to receive eddy current signals, so that the large-area rapid scanning of the surface of a workpiece is realized, and the array eddy current probe has the advantages of insensitivity to lift-off, high signal-to-noise ratio, insensitivity to defect directivity and the like.
The phased array ultrasonic detection technology combines a plurality of independent piezoelectric wafers into an array according to a certain arrangement mode, and realizes deflection and focusing of sound beams by controlling the excitation sequence and delay of the piezoelectric wafers. The phased array ultrasonic probe is generally divided into a one-dimensional phased array probe and a two-dimensional phased array probe, and the one-dimensional phased array ultrasonic probe is most widely applied due to simple manufacturing process; the two-dimensional phased array ultrasonic probe is mainly applied to the medical field due to the limitation of a processing technology, complex circuit, high manufacturing cost and the like.
While array eddy current probes and phased array ultrasound probes each have advantages, the respective technical limitations are also apparent. The array eddy current probe is mainly used for detecting surface and near-surface defects, and cannot detect defects in a workpiece; the phased array ultrasonic probe is mainly used for detecting internal defects of a workpiece, and the near-surface resolution is poor due to the influence of interface waves and circuit design. When detecting parts, the array eddy current probe and the phased array ultrasonic probe are required to be used for detection respectively, and the separate detection mode not only leads to larger errors of detection results, but also has low detection efficiency.
Disclosure of Invention
The invention aims to overcome the defects of large error of detection results and low detection efficiency when detecting parts in the prior art, and provides a detection probe combining array eddy current and phased array ultrasound.
In order to achieve the purpose, the invention is realized by adopting the following technical scheme:
A detection probe combining array eddy current and phased array ultrasound comprises a shell;
an eddy current coil array formed by two rows of eddy current coils which are staggered mutually is arranged on the inner wall of one side of the shell; each vortex coil is provided with a first wire, one end of the first wire is connected with the vortex coil, and the other end of the first wire is connected with a multiplexer arranged on the outer wall of the shell;
One side of the vortex coil array is provided with a plurality of first piezoelectric wafers, and the wire arrays of the plurality of first piezoelectric wafers are longitudinally arranged or transversely arranged; and a second lead is arranged on each first piezoelectric wafer, one end of the second lead is connected with the positive electrode of the first piezoelectric wafer, and the other end of the second lead is connected with a first interface arranged on the outer wall of the shell.
The invention is further improved in that:
the other side of the eddy current coil array is provided with a plurality of second piezoelectric wafers which are arranged in an array along a direction line perpendicular to the first piezoelectric wafers;
and a third lead is arranged on each second piezoelectric wafer, one end of the third lead is connected with the positive electrode of the second piezoelectric wafer, and the other end of the third lead is connected with a second interface arranged on the outer wall of the shell.
The first wire, the second wire and the third wire are all enamelled copper wires.
The number of the second piezoelectric wafers is 16-32.
The length of the second piezoelectric wafer is 5-10 mm, and the distance between every two adjacent second piezoelectric wafers is 0.2-1.0 mm.
The multiplexer is a time division multiplexer.
The frequency of the eddy current coil is 100-500 kHz, and the diameter of the eddy current coil is 1-3 mm.
The number of the first piezoelectric wafers is 16-32.
The length of the first piezoelectric wafer is 5-10 mm, and the distance between adjacent first piezoelectric wafers is 0.2-1.0 mm.
Compared with the prior art, the invention has the following beneficial effects:
According to the probe for detecting the surface defects, the near-surface defects and the internal defects by integrating the array eddy current probe and the phased array ultrasonic probe on the same probe, the defects that the defects in a workpiece cannot be detected by a traditional single array eddy current probe and the defects that the near-surface resolution of the traditional single phased array ultrasonic probe is poor are overcome, and higher surface and near-surface resolution is realized.
Furthermore, the first piezoelectric wafer and the second piezoelectric wafer are respectively arranged longitudinally or transversely, so that the defect that phased array ultrasound is sensitive to the orientation of internal defects is overcome, the effective detection of the internal defects in different orientations is realized, and the function of a two-dimensional area array probe is realized by adopting a one-dimensional linear array probe with lower cost.
Drawings
FIG. 1 is a schematic diagram of a structure of a probe for ultrasonic composite detection of an array eddy current and a phased array according to an embodiment of the invention;
Fig. 2 is a layout diagram of eddy current coils of an array eddy current and phased array ultrasonic composite inspection probe array and a piezoelectric wafer of a phased array ultrasonic probe according to an embodiment of the present invention.
Wherein: 1-array eddy current probe; 2-a first phased array ultrasound probe; 3-a second phased array ultrasonic probe; 101-eddy current coil; 102-a first wire; a 103-multiplexer; 201-a first piezoelectric wafer; 202-a second wire; 203-a first interface; 301-a second piezoelectric wafer; 302-a third wire; 303-second interface.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is described in further detail below with reference to the attached drawing figures:
Referring to fig. 1 and 2, in an embodiment of the present invention, there is provided a probe for ultrasonic combination of an array eddy current and a phased array, which includes a housing, wherein an eddy current coil array composed of two rows of eddy current coils 101 staggered with each other is disposed on an inner wall of one side of the housing to form an array eddy current probe 1; a first lead 102 is arranged on each eddy current coil 101, one end of the first lead 102 is connected with the eddy current coil 101, and the other end is connected with a multiplexer 103 arranged on the outer wall of the shell; a plurality of first piezoelectric wafers 201 are arranged on one side of the eddy current coil array, generally 16-32 first piezoelectric wafers can be arranged, specific quantity can be selected according to actual detection requirements, and the first piezoelectric wafers 201 are longitudinally arranged in a line array or transversely arranged in a line array; each first piezoelectric chip 201 is provided with a second lead 202, one end of the second lead 202 is connected with the positive electrode of the first piezoelectric chip 201, and the other end is connected with a first interface 203 arranged on the outer wall of the shell. The first conductive line 102 and the second conductive line 202 may be copper-clad wires with good insulation.
In use, the multiplexer 103 is connected to an array eddy current detector or module through which each eddy current coil 101 can be excited; the first interface 203 is connected to a phased array ultrasonic detector or module, through which each first piezoelectric wafer 201 can be excited, and the negative electrode of the first piezoelectric wafer 201 is grounded through the housing.
Preferably, in this embodiment, the multiplexer 103 is a time division multiplexer, and is integrally integrated onto the probe by using a time division multiplexing technology.
Preferably, in this embodiment, the length of the first piezoelectric wafer 201 is 5-10 mm, and the distance between adjacent first piezoelectric wafers 201 is 0.2-1.0 mm, which is beneficial to reducing the cost.
Preferably, in this embodiment, the frequency of the eddy current coil 101 is 100-500 kHz and the diameter is 1-3 mm, so that the eddy current detection frequency and coil diameter are the same as those commonly used at present, and are easy to obtain, and no additional research and development is needed, thereby being beneficial to reducing the cost.
Preferably, a plurality of second piezoelectric wafers 301 are arranged on the other side of the eddy current coil array of the detection probe for the combination of the array eddy current and the phased array ultrasonic, generally 16-32 second piezoelectric wafers can be arranged, a specific number can be selected according to actual detection requirements, and the plurality of second piezoelectric wafers 301 are arranged in an array along a direction line perpendicular to the first piezoelectric wafers 201; in this embodiment, a plurality of first piezoelectric wafers 201 are disposed at the left side of the eddy current coil array, and are longitudinally arranged by adopting a line array to form a first phased array ultrasonic probe 2; the plurality of second piezoelectric wafers 301 are arranged on the right side of the eddy current coil array and are perpendicular to the first piezoelectric wafers 201, and are transversely distributed by adopting a line array to form a second phased array ultrasonic probe 3; a third lead 302 is disposed on each second piezoelectric chip 301, one end of the third lead 302 is connected to the positive electrode of the second piezoelectric chip 301, and the other end is connected to a second interface 303 disposed on the outer wall of the housing. The third conductive wire 302 may be an enameled copper wire with good insulation.
In use, the second interface 303 is connected to a phased array ultrasonic detector or module, through which each second piezoelectric wafer 301 can be excited, the negative pole of the second piezoelectric wafer 301 being grounded through the housing.
Preferably, in this embodiment, the length of the second piezoelectric wafer 301 is 5-10 mm, and the distance between the adjacent first piezoelectric wafers 201 is 0.2-1.0 mm, so that the length and the distance of the piezoelectric wafers are the same as those of the piezoelectric wafers commonly used at present, and the piezoelectric wafers are easy to obtain, do not need additional research and development, and are beneficial to reducing the cost.
The invention further discloses a detection probe for ultrasonic compounding of an array vortex and a phased array, which specifically comprises the following steps.
The first step: the multiplexer 103 is connected with the array eddy current detector or the module, the array eddy current detector or the module and the multiplexer 103 excite the array eddy current probe 1, each eddy current coil 101 in the array eddy current probe 1 is sequentially excited, meanwhile, the adjacent eddy current coils 101 are used as receiving coils to receive eddy current signals, and the eddy current coil array has a transmitting-receiving mode with various topological modes, so that the surface defects and near-surface defects with different orientations can be effectively detected.
And a second step of: the first interface is connected with the phased array ultrasonic detector or module, the phased array ultrasonic detector or module and the first interface 203 excite the first phased array ultrasonic probe 2, and focusing and deflection of ultrasonic sound beams in the workpiece are realized by controlling the excitation sequence and delay of each first piezoelectric wafer 201, so that effective detection of defects in the workpiece, which are oriented vertically to the longitudinal direction, is realized.
And a third step of: the first interface is connected with the phased array ultrasonic detector or module, the second phased array ultrasonic probe 3 is excited through the phased array ultrasonic detector or module and the second interface 303, and focusing and deflection of ultrasonic beams in the workpiece are realized by controlling the excitation sequence and delay of each second piezoelectric wafer 301, so that effective detection of defects in the workpiece, which are oriented vertically to the transverse direction, is realized.
Although the respective array eddy current probe 1, the first phased array ultrasonic probe 2 and the second phased array ultrasonic probe 3 are sequentially excited, the array eddy current probe 1, the first phased array ultrasonic probe 2 and the second phased array ultrasonic probe 3 can be considered to be excited simultaneously in the detection process at the conventional scanning speed because the transmitting and receiving processes are completed in a very short time.
In summary, according to the probe for detecting the composite of the array eddy current and the phased array ultrasonic, the array eddy current probe and the phased array ultrasonic probe are integrated on the same probe, and the surface, near-surface defects and internal defects can be detected only by one detection, so that the defect that the traditional single array eddy current probe cannot detect the defects in a workpiece and the defect that the traditional single phased array ultrasonic probe has poor near-surface resolution are overcome, and higher surface and near-surface resolution is realized. Meanwhile, the mode of longitudinally and transversely arranging the piezoelectric wafers is adopted, the defect that phased array ultrasound is sensitive to the orientation of internal defects is overcome, the effective detection of the internal defects in different orientations is realized, and the function of a two-dimensional area array probe is realized by adopting a one-dimensional linear array probe with lower cost.
The above is only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited by this, and any modification made on the basis of the technical scheme according to the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (8)
1. The probe is characterized by comprising a shell;
an eddy current coil array consisting of two rows of eddy current coils (101) which are staggered with each other is arranged on the inner wall of one side of the shell; a first wire (102) is arranged on each eddy current coil (101), one end of the first wire (102) is connected with the eddy current coil (101), and the other end is connected with a multiplexer (103) arranged on the outer wall of the shell;
One side of the eddy current coil array is provided with a plurality of first piezoelectric wafers (201), and the plurality of first piezoelectric wafers (201) are longitudinally arranged in a line array or transversely arranged in a line array; a second lead (202) is arranged on each first piezoelectric wafer (201), one end of the second lead (202) is connected with the positive electrode of the first piezoelectric wafer (201), and the other end of the second lead is connected with a first interface (203) arranged on the outer wall of the shell;
A plurality of second piezoelectric wafers (301) are arranged on the other side of the eddy current coil array, and the plurality of second piezoelectric wafers (301) are arranged in an array along a direction line perpendicular to the first piezoelectric wafers (201);
And a third lead (302) is arranged on each second piezoelectric wafer (301), one end of the third lead (302) is connected with the positive electrode of the second piezoelectric wafer (301), and the other end of the third lead is connected with a second interface (303) arranged on the outer wall of the shell.
2. The probe of claim 1, wherein the first wire (102), the second wire (202), and the third wire (302) are all enameled copper wires.
3. The probe for ultrasonic compounding of an array eddy current and a phased array according to claim 1, wherein the number of the second piezoelectric wafers (301) is 16 to 32.
4. A probe for ultrasonic compounding of an array eddy current and a phased array according to claim 3, wherein the length of the second piezoelectric wafer (301) is 5-10 mm, and the distance between adjacent second piezoelectric wafers (301) is 0.2-1.0 mm.
5. The probe for ultrasonic compounding of an array eddy current with a phased array according to claim 1, wherein the multiplexer (103) is a time division multiplexer.
6. The probe for ultrasonic compounding of array eddy currents and phased arrays according to claim 1, wherein the frequency of the eddy current coil (101) is 100-500 kHz and the diameter is 1-3 mm.
7. The probe for ultrasonic compounding of an array eddy current and a phased array according to claim 1, wherein the number of the first piezoelectric wafers (201) is 16 to 32.
8. The probe for ultrasonic compounding of an array eddy current and a phased array according to claim 1, wherein the length of the first piezoelectric wafer (201) is 5-10 mm, and the distance between adjacent first piezoelectric wafers (201) is 0.2-1.0 mm.
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| CN202011312499.1A CN112285200B (en) | 2020-11-20 | 2020-11-20 | Array vortex and phased array ultrasonic composite detection probe |
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| CN202011312499.1A CN112285200B (en) | 2020-11-20 | 2020-11-20 | Array vortex and phased array ultrasonic composite detection probe |
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| CN112285200B true CN112285200B (en) | 2024-06-04 |
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