CN112280293B - Hot-melt epoxy resin composition, preparation method and hot-melt prepreg thereof - Google Patents
Hot-melt epoxy resin composition, preparation method and hot-melt prepreg thereof Download PDFInfo
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- CN112280293B CN112280293B CN202011097918.4A CN202011097918A CN112280293B CN 112280293 B CN112280293 B CN 112280293B CN 202011097918 A CN202011097918 A CN 202011097918A CN 112280293 B CN112280293 B CN 112280293B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Abstract
The invention relates to a hot-melt epoxy resin composition, a preparation method and a hot-melt prepreg thereof, wherein the hot-melt epoxy resin composition comprises the following components in parts by mass: 100 parts of main epoxy resin; 4-6 parts of a curing agent A; 5-15 parts of a curing agent B; 2-4 parts of urea accelerant; 5-20 parts of a thermoplastic resin modifier; the preparation method is simple and easy to implement, the resin matrix has good manufacturability and spreadability, the bonding property of the resin matrix and the aramid fiber is obviously enhanced, the interlaminar shear strength of the composite material prepared by the preparation method is more than or equal to 50MPa, and the mechanical property requirement of the aramid fiber reinforced composite material in the field of aerospace can be met.
Description
Technical Field
The invention relates to a hot-melt epoxy resin composition, a preparation method and a hot-melt prepreg thereof, in particular to a composition of a hot-melt epoxy resin composition matched with aramid fibers, a preparation method and an aramid fiber prepreg containing an epoxy resin system, belonging to the technical field of manufacturing of the hot-melt prepreg for structural composite materials.
Technical Field
The aramid fiber composite material has excellent performances of high modulus, high strength, low density and the like, and is widely applied to the fields of aerospace and the like. However, aramid fiber has high surface crystallinity, an amide group is difficult to react with other groups, the surface lacks chemical active groups, the fiber surface is smooth, the wettability is poor, the matching property with a resin matrix is poor, the interface bonding is weak, and the interlaminar shear strength of the composite material is poor, for example, when the aramid fiber is used for subsequent processing of a large-thickness military engine accommodating case product made of a large-scale composite material and bears a harsh load environment, the aramid fiber is easy to tear and peel, so that the interlaminar premature damage is caused, and the application and popularization of the aramid fiber are limited. Therefore, how to improve the interfacial adhesion between the aramid fiber and the resin matrix and improve the interlaminar shear strength of the aramid fiber becomes a key bottleneck technology for the application of the aramid fiber reinforced composite material.
The prior common method is to carry out surface modification of aramid fibers, and chemical surface grafting modification and plasma modification are representative methods of surface modification of the aramid fibers, mainly by improving the surface roughness of the fibers to improve the wettability between the fibers and matrix resin or introducing active groups (such as-COOH, -OH, -NH) on the surfaces of the fibers 2 Etc.) have a relatively more pronounced modifying effect. For example, after the aramid fiber is treated by plasma by Joung-Man Park and the like, the interlaminar shear strength of the aramid fiber/epoxy resin composite material can reach 35.0MPa. However, the method can only treat a small amount of fibers, or the treatment degree is difficult to control, the damage to the fibers is large, and the mechanical property of the composite material is sacrificed. At present, the method is mainly used for theoretical research of composite material interface control, the treatment process is complex, continuous online treatment is difficult, and continuous surface treatment is difficult to realize industrially. In addition, the curing temperature of the aramid fiber/epoxy resin composite material is not too high, otherwise, large internal stress can be generated, and the interfacial properties of the aramid fiber reinforced composite material are further damaged.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide the hot-melt epoxy resin composition, the bonding performance of the epoxy resin composition is obviously improved, the matching property of an epoxy resin matrix and aramid fibers is improved, the interlayer shear strength of the aramid fiber composite material is obviously improved, the interlayer shear strength of the composite material prepared by the hot-melt epoxy resin composition is not less than 50MPa, and the mechanical property requirement of the aramid fiber reinforced composite material in the aerospace field can be met.
It is another object of the present invention to provide a method for preparing a hot-melt epoxy resin composition;
it is still another object of the present invention to provide a hot melt prepreg comprising the hot melt epoxy resin composition.
The above purpose of the invention is mainly realized by the following technical scheme:
the hot-melt epoxy resin composition comprises the following components in parts by mass:
the curing agent A is dicyandiamide;
the curing agent B is one or a combination of 3, 3-diaminodiphenyl sulfone, 4-diaminobenzanilide or 4-aminobenzamide, and has a specific structural formula as follows:
the main epoxy resin is one or a combination of bisphenol A type epoxy resin, triglycidyl isocyanurate IA, hydantoin epoxy resin IB or benzanilide cyclic glycidyl amine IC, and the specific structural formula is as follows:
in the hot-melt epoxy resin composition, the dicyandiamide has a particle size of 5 to 20 μm.
In the hot-melt epoxy resin composition, the urea accelerator is one or a combination of 3, 4-dichlorophenyl-N, N-dimethyl urea or phenyl dimethyl urea.
In the above hot-melt epoxy resin composition, the urea-based accelerator is 3, 4-dichlorophenyl-N, N-dimethylurea.
In the hot-melt epoxy resin composition, the urea accelerator has a particle size of 5 to 20 μm.
In the hot-melt epoxy resin composition, the thermoplastic resin modifier is one or a combination of phenoxy resin, polyamide or hydroxyl-terminated polyether sulfone.
A method for preparing a hot-melt epoxy resin composition, comprising the steps of:
(1) Heating the main epoxy resin to 100-150 ℃, adding the thermoplastic resin modifier, and mechanically stirring for 30-120 min until the main epoxy resin is completely dissolved;
(2) Cooling the component obtained in the step (1) to 60-100 ℃, adding the curing agent A, the curing agent B and the urea promoter, and stirring for 20-60min to uniformly mix to obtain the hot-melt epoxy resin composition.
The hot-melt prepreg comprises the hot-melt epoxy resin composition and aramid fibers, and the mass percentage content of the hot-melt epoxy resin composition in the hot-melt prepreg is 30-50%.
In the hot melt prepreg, the preparation method of the hot melt prepreg comprises the following steps: and coating the hot-melt epoxy resin composition by using a film coating machine, and pre-impregnating and compounding the hot-melt epoxy resin composition and the aramid fiber by using a compound machine to obtain the aramid fiber pre-impregnated material.
A composite material is prepared by adopting the hot-melt prepreg; the longitudinal/transverse interlaminar shear strength of the composite material is more than or equal to 50MPa.
Compared with the prior art, the invention has the following beneficial effects:
(1) The invention discloses a hot-melt epoxy resin composition matched with aramid fiber, a preparation method and a hot-melt prepreg thereof, wherein the hot-melt epoxy resin matched with the aramid fiber is obtained by heating and uniformly mixing a main epoxy resin containing benzoylaniline glycidylamine and a thermoplastic resin containing hydroxyl or amide groups, and then adding an amide and latent curing agent system at a certain temperature, the preparation method is simple and easy to implement, the resin matrix has good manufacturability and spreadability, the bonding property of the resin matrix and the aramid fiber is obviously enhanced, the interlaminar shear strength of a composite material prepared by the preparation method is more than or equal to 50MPa, and the mechanical property requirement of the aramid fiber reinforced composite material in the aerospace field can be met;
(2) According to the invention, through molecular design, the benzoylaniline glycidyl amine is introduced into a cross-linked resin system, so that the molecular resin system has toughness, intermolecular force is increased, and the interface bonding force between the epoxy resin system and aramid fiber is improved;
(3) According to the invention, an amide curing agent containing active hydrogen bonds is introduced to form an amide and latent curing agent system, so that the polarity and the cohesiveness of a resin matrix are obviously increased, and the interfacial cohesiveness between aramid fibers and the resin matrix is facilitated; when 3, 3-diamino diphenyl sulfone is adopted as the curing agent of the epoxy resin, the toughness of the resin matrix is improved through reverse internal plasticization;
(4) The invention adopts phenoxy resin and thermoplastic resin of hydroxyl-terminated polyether sulfone or amide, which both contain polar hydroxyl or amide hydrogen bonds, and further improves the matching property with aramid fiber by utilizing the compatibility with the chemical structure of fiber molecules;
(5) According to the invention, through the optimization of the mixture ratio of different resin systems, the prepared prepreg epoxy resin system has good manufacturability, does not need to carry out surface treatment such as etching on aramid fiber, directly carries out modification optimization on the resin, and is easy for large-scale production and engineering application; the latent curing agent system and the amide-containing aromatic amine are used cooperatively, so that medium-temperature curing and excellent mechanical properties can be realized, the stress generated by curing is reduced, and the aramid fiber composite material is more suitable for popularization and application on a large-thickness military engine containing case.
Drawings
FIG. 1 is a graph showing a comparison of interlaminar shear strength of composites prepared using the hot melt epoxy resin compositions of example 1 of the present invention and comparative example 1.
Detailed Description
The invention is described in further detail below with reference to the following figures and specific examples:
the interlaminar shear strength of the composite material is tested by a universal material testing machine of Instron corporation in America by adopting JC/T773 standard; the viscosity of the resin system (measured from room temperature and the change of viscosity rheological property in the temperature rise process) in the invention is tested by a Physica MCR 301 rheological analyzer of Anton Paar company, the temperature rise rate is 1 ℃/min, and the test range is 25-225 ℃.
The hot-melt epoxy resin composition specifically comprises the following components in parts by mass:
the curing agent A is dicyandiamide; the particle size of the dicyandiamide is 5-20 mu m.
The curing agent B is one or a combination of 3,3 diamino diphenyl sulfone, 4-diamino benzoyl aniline or 4-aminobenzamide, and the specific structural formula is as follows:
the main epoxy resin is one or a combination of bisphenol A type epoxy resin, triglycidyl isocyanurate IA, hydantoin epoxy resin IB or benzanilide cyclic glycidyl amine IC, and the specific structural formula is as follows:
the urea promoter is one or a combination of 3, 4-dichlorophenyl-N, N-dimethyl urea or phenyl dimethyl urea. The urea accelerator is preferably 3, 4-dichlorophenyl-N, N-dimethylurea. The particle size of the urea accelerant is 5-20 mu m.
The thermoplastic resin modifier is one or a combination of phenoxy resin, polyamide or hydroxyl-terminated polyether sulfone.
The invention relates to a hot-melt epoxy resin composition and a preparation method of a hot-melt prepreg, which specifically comprise the following steps:
(1) Heating the main body epoxy resin to 100-150 ℃, adding the thermoplastic resin, and mechanically stirring for 30-120 min until the main body epoxy resin is completely dissolved;
(2) Cooling the component obtained in the step (1) to 60-100 ℃, adding a curing agent A, a curing agent B and a urea promoter, stirring for 20-60min, and uniformly mixing to obtain a hot-melt epoxy resin composition matched with aramid fibers;
(3) And (3) coating the resin system obtained in the step (2) by using a film coating machine, pre-impregnating and compounding the resin system and aramid fibers by using a compound machine to obtain aramid fiber pre-impregnating material, and preparing the composite material by mould pressing.
The hot-melt epoxy resin composition in the hot-melt prepreg comprises 30-50% of glue by mass percent. The longitudinal/transverse interlaminar shear strength of the aramid fiber reinforced composite material prepared by the invention is more than or equal to 50MPa.
Example 1
(1) Heating 40 parts of bisphenol A type epoxy resin and 60 parts of benzanilide glycidyl amine main body epoxy resin to 120 ℃, adding 10 parts of thermoplastic polyamide resin, and mechanically stirring for 60min until the mixture is uniformly dispersed;
(2) Cooling the component obtained in the step (1) to 60 ℃, adding 4 parts of dicyandiamide, 10 parts of 4, 4-diaminobenzanilide and 2 parts of 3, 4-dichlorophenyl-N, N-dimethyl urea accelerator, stirring for 30min, uniformly mixing, and cooling to obtain a hot-melt epoxy resin composition;
(3) And (3) coating the resin system obtained in the step (2) by using a film coating machine, pre-soaking and compounding the resin system with aramid fibers (F-12 fabric) by using a compound machine to obtain aramid fiber pre-soaking materials with the resin content of 45%, and preparing the composite material by mould pressing. The interlaminar shear strength of the composite material plate is tested to be 58MPa.
Comparative example 1
(1) Heating 100 parts of bisphenol A epoxy resin to 120 ℃, adding 10 parts of thermoplastic polyamide resin, and mechanically stirring for 60min until the mixture is uniformly dispersed;
(2) Cooling the component obtained in the step (1) to 60 ℃, adding 4 parts of dicyandiamide and 2 parts of 3, 4-dichlorophenyl-N, N-dimethyl urea accelerator, stirring for 30min, uniformly mixing, and cooling to obtain a hot-melt epoxy resin composition;
(3) And (3) coating the resin system obtained in the step (2) by using a film coating machine, pre-soaking and compounding the resin system with aramid fibers (F-12 fabric) by using a compound machine to obtain aramid fiber pre-soaking materials with the resin content of 45%, and preparing the composite material by mould pressing. The interlaminar shear strength of the composite material plate is tested to be 40MPa.
FIG. 1 is a graph showing a comparison of shear strengths of composite materials prepared using the hot melt epoxy resin compositions of example 1 of the present invention and the comparative example.
Example 2
(1) Heating 50 parts of bisphenol A type epoxy resin and 50 parts of triglycidyl isocyanurate main body epoxy resin to 150 ℃, adding 5 parts of epoxy resin, and mechanically stirring for 120min until complete dissolution;
(2) Cooling the component obtained in the step (1) to 80 ℃, adding 4 parts of dicyandiamide, 5 parts of 3, 3-diaminodiphenyl sulfone curing agent, 5 parts of 4, 4-diaminobenzanilide and 2 parts of 3, 4-dichlorophenyl-N, N-dimethyl urea promoter, stirring for 40min, uniformly mixing, and cooling to obtain a hot-melt epoxy resin composition;
(3) And (3) coating the resin system obtained in the step (2) by using a film coating machine, pre-soaking and compounding the resin system with aramid fibers (F-12 fabric) by using a compound machine to obtain aramid fiber pre-impregnated material with the resin content of 45%, and preparing the composite material by mould pressing. The interlaminar shear strength of the composite material plate is tested to be 50MPa.
Example 3
(1) Heating 40 parts of bisphenol A epoxy resin, 20 parts of hydantoin epoxy resin and 40 parts of benzanilide glycidyl amine main epoxy resin to 120 ℃, adding 15 parts of thermoplastic polyether sulfone (Solvay 10200), and mechanically stirring for 90min until the mixture is uniformly dispersed;
(2) Cooling the component obtained in the step (1) to 80 ℃, adding 5 parts of dicyandiamide, 5 parts of 4-aminobenzamide and 3 parts of 3, 4-dichlorophenyl-N, N-dimethylurea accelerator, stirring for 45min, uniformly mixing, and cooling to obtain a hot-melt epoxy resin composition;
(3) And (3) coating the resin system obtained in the step (2) by using a film coating machine, pre-soaking and compounding the resin system with aramid fibers (F-12 fabric) by using a compound machine to obtain aramid fiber pre-soaking materials with the resin content of 45%, and preparing the composite material by mould pressing. The interlaminar shear strength of the composite sheet was tested to be 53MPa.
The above description is only for the best mode of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Those skilled in the art will appreciate that the invention may be practiced without these specific details.
Claims (8)
1. A composite material characterized by: the longitudinal/transverse interlaminar shear strength of the composite material is more than or equal to 50MPa; the composite material is prepared from a hot-melt prepreg, wherein the hot-melt prepreg comprises a hot-melt epoxy resin composition and aramid fibers, and the mass percentage content of the hot-melt epoxy resin composition in the hot-melt prepreg is 30-50%;
the hot-melt epoxy resin composition comprises the following components in parts by mass:
the curing agent A is dicyandiamide;
the curing agent B is one or a combination of 3, 3-diaminodiphenyl sulfone, 4-diaminobenzanilide or 4-aminobenzamide, and has a specific structural formula as follows:
the main body epoxy resin is a combination of bisphenol A epoxy resin and benzanilide cyclic glycidyl amine IC, or a combination of bisphenol A epoxy resin, hydantoin epoxy resin IB and benzanilide cyclic glycidyl amine IC;
the specific structural formula is as follows:
2. the composite material according to claim 1, characterized in that: the particle size of the dicyandiamide is 5-20 mu m.
3. The composite material according to claim 1, characterized in that: the urea accelerant is one or a combination of 3, 4-dichlorophenyl-N, N-dimethyl urea or phenyl dimethyl urea.
4. The composite material of claim 3, wherein: the urea accelerant is 3, 4-dichlorophenyl-N, N-dimethyl urea.
5. The composite material according to one of claims 1 to 4, characterized in that: the particle size of the urea accelerant is 5-20 mu m.
6. The composite material of claim 1, wherein: the thermoplastic resin modifier is one or a combination of phenoxy resin, polyamide or hydroxyl-terminated polyether sulfone.
7. The composite material according to any one of claims 1 to 6, wherein the method for preparing the hot-melt epoxy resin composition comprises the steps of:
(1) Heating the main epoxy resin to 100-150 ℃, adding the thermoplastic resin modifier, and mechanically stirring for 30-120 min until the main epoxy resin is completely dissolved;
(2) And (2) cooling the components obtained in the step (1) to 60-100 ℃, adding the curing agent A, the curing agent B and the urea promoter, stirring for 20-60min, and uniformly mixing to obtain the hot-melt epoxy resin composition.
8. The composite material of claim 1, wherein: the preparation method of the hot-melt prepreg comprises the following steps: and coating the hot-melt epoxy resin composition by using a film coating machine, and pre-impregnating and compounding the hot-melt epoxy resin composition and the aramid fiber by using a compound machine to obtain aramid fiber pre-impregnated material.
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| WO1997024398A1 (en) * | 1995-12-27 | 1997-07-10 | Hexcel Corporation | Epoxy resin(s) with curing agent and toughener |
| CN102108185B (en) * | 2010-12-29 | 2012-07-04 | 黑龙江省科学院石油化学研究院 | Epoxy matrix resin and prepreg and preparation method thereof and device for preparation thereof |
| JP6354763B2 (en) * | 2012-10-15 | 2018-07-11 | 東レ株式会社 | Fiber reinforced high modulus polymer composite with reinforced interfacial phase |
| EP2938659B1 (en) * | 2012-12-27 | 2019-07-24 | Toray Industries, Inc. | Conductive fiber reinforced polymer composite and multifunctional composite |
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| CN109554149B (en) * | 2018-10-18 | 2021-04-27 | 哈尔滨工业大学无锡新材料研究院 | Epoxy adhesive for flexible circuit board and preparation method and application thereof |
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