CN112280005A - Organic silicon hybrid epoxy resin and preparation method thereof - Google Patents
Organic silicon hybrid epoxy resin and preparation method thereof Download PDFInfo
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- CN112280005A CN112280005A CN202011152858.1A CN202011152858A CN112280005A CN 112280005 A CN112280005 A CN 112280005A CN 202011152858 A CN202011152858 A CN 202011152858A CN 112280005 A CN112280005 A CN 112280005A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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Abstract
The invention discloses an organic silicon hybrid epoxy resin and a preparation method thereof, and provides a preparation method of the product, which comprises the steps of reacting epoxy resin and alkoxy organic silicon resin in a solvent under the condition of heating, and obtaining the product after the reaction is finished and the solvent is removed in vacuum under reduced pressure. The method provided by the invention is simple and feasible and is suitable for large-scale production and application.
Description
Technical Field
The invention relates to the technical field of coatings and adhesives, in particular to an organic silicon hybrid epoxy resin and a preparation method thereof.
Background
At present, most of national heavy-duty anticorrosive coatings are mainly solvent type epoxy zinc-rich anticorrosive coatings, the VOC emission is high, along with the promotion of 'oil to water' of the national green environmental protection policy, water-based epoxy zinc-rich anticorrosive coatings are used in part of regional industries, the solvent type and the water-based zinc-rich epoxy essentially have solvent VOC emission, the water-based zinc-rich epoxy anticorrosive coatings have certain difference compared with the solvent type anticorrosive performance, the traditional epoxy resin has poor weather resistance and self-cleaning property, and when the heavy-duty anticorrosive coatings are used in outdoor anticorrosive coatings, corresponding matched finish coats such as polyurethane, fluorocarbon coatings and the like are required.
Disclosure of Invention
The invention aims to provide an organic silicon hybrid epoxy resin and a preparation method thereof, which are used for solving the problems in the prior art, so that the anticorrosive coating is environment-friendly, free of solvent emission, high in anticorrosive performance, weather-resistant, easy to clean and fireproof.
In order to achieve the purpose, the invention provides the following technical scheme: a silicone hybrid epoxy resin having an epoxy group and an alkoxy silicon structure in a molecule thereof.
A preparation method of organic silicon hybrid epoxy resin comprises the following steps:
s1: putting the dehydrated epoxy resin and a saturated inert solvent into a reaction kettle, and heating and dissolving uniformly;
s2: dripping alkoxy organic silicon resin into the reaction kettle, and heating for reaction;
s3: and decompressing the reaction kettle to remove the solvent to obtain the product.
The reaction components in the steps S1, S2 and S3 are in parts by weight: 180-3000 parts of epoxy resin, 247-800 parts of alkoxy organic silicon resin and 180-2000 parts of solvent.
In step S1, the added epoxy resin is bisphenol a epoxy resin or sorbitol hydrophobic glycidyl ether or 1, 4-diol mono-glycidyl ether or at least two of the components thereof, preferably a hydroxyl group-containing glycidyl ether such as 1, 4-diol mono-glycidyl ether.
In step S1, the inert solvent added is toluene or xylene or PMA or at least two of the components constituting them, preferably xylene.
In step S2, the alkoxysiloxane resin added is at least two of triphenylsilanol or phenylmethylbutylsilanol or dimethyldialkoxysilane or isocyanatopropyltrimethoxysilane or isocyanatopropyltriethoxysilane or isocyanatopropylmethylethylmethoxysilane or diethyldimethoxysilane or the components that make up them, preferably like diethyldimethoxysilane or dimethyldimethoxysilane structural silane.
In step S2, the temperature of the catalytic reaction in the reaction kettle is 50 to 150 ℃, and the reaction time is 1 to 10 hours, preferably 80 to 150 ℃, 2 to 3.5 hours.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a preparation method of the product, which comprises the steps of reacting epoxy resin and alkoxy organic silicon resin in a solvent under the condition of heating, and obtaining the product after the reaction is finished and the solvent is removed in vacuum under reduced pressure; the weather resistance is good, and the light and color retention are good; high chemical resistance; easy cleaning and anti-doodling.
Drawings
FIG. 1 is a flow chart of the product preparation of the present invention;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a silicone hybrid epoxy resin having an epoxy group and an alkoxy silicon structure in a molecule thereof.
A preparation method of organic silicon hybrid epoxy resin, wherein all reagents are industrial chemicals, and the preparation method comprises the following steps:
example 1
One embodiment of the preparation method of the organic silicon hybrid epoxy resin and the preparation method thereof comprises the following steps:
s1: putting 370 g of bisphenol A epoxy resin E51 and 600 g of dimethylbenzene which are subjected to dehydration treatment into a reaction kettle, and heating and dissolving uniformly;
s2: dropwise adding 250 g of dimethyl dimethoxy silicon into the reaction kettle, and reacting for 6 hours at 150 ℃;
s3: the solvent was removed under reduced pressure to give the product.
The resulting product had a viscosity of 9000 and an epoxy value of 0.33.
Example 2
One embodiment of the preparation method of the organic silicon hybrid epoxy resin and the preparation method thereof comprises the following steps:
s1: putting 588 g of sorbitol glycidyl ether and 800 g of dimethylbenzene which are subjected to dehydration treatment into a reaction kettle, and heating and dissolving uniformly;
s2: dropwise adding 500 g of dimethyl dimethoxy silicon into the reaction kettle, and reacting for 3 hours at 150 ℃;
s3: the solvent was removed under reduced pressure to give the product.
The resulting product had a viscosity of 9000 and an epoxy value of 0.19.
Example 3
One embodiment of the preparation method of the organic silicon hybrid epoxy resin and the preparation method thereof comprises the following steps:
s1: putting 588 g of sorbitol glycidyl ether and 800 g of dimethylbenzene which are subjected to dehydration treatment into a reaction kettle, and heating and dissolving uniformly;
s2: adding 500 g of dimethyl dimethoxy silicon into the reaction kettle at one time, and reacting for 3 hours at 145 ℃;
s3: the solvent was removed under reduced pressure to give the product.
The product obtained had a viscosity of 6800 and an epoxy value of 0.18.
Example 4
One embodiment of the preparation method of the organic silicon hybrid epoxy resin and the preparation method thereof comprises the following steps:
s1: putting 210 g of 1, 4-butanediol monoglycidyl ether after dehydration treatment and 300 g of dimethylbenzene into a reaction kettle, and heating and dissolving uniformly;
s2: adding 123 g of dimethyl dimethoxy silicon into the reaction kettle at one time, and reacting for 5 hours at 145 ℃;
s3: the solvent was removed under reduced pressure to give the product.
The product obtained had a viscosity of 1000 and an epoxy value of 0.31.
Example 5
One embodiment of the preparation method of the organic silicon hybrid epoxy resin and the preparation method thereof comprises the following steps:
s1: putting 210 g of 1, 4-butanediol monoglycidyl ether after dehydration treatment and 300 g of dimethylbenzene into a reaction kettle, and heating and dissolving uniformly;
s2: adding 130 g of diethyldimethoxysilane into the reaction kettle at one time, and reacting for 5 hours at 145 ℃;
s3: the solvent was removed under reduced pressure to give the product.
The resulting product had a viscosity of 2800 and an epoxy value of 0.30.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An organic silicon hybrid epoxy resin is characterized in that: epoxy groups and alkoxy silicon structures exist in the molecule of the organic silicon hybrid epoxy resin.
2. The preparation method of the organic silicon hybrid epoxy resin is characterized by comprising the following steps:
s1: putting the dehydrated epoxy resin and a saturated inert solvent into a reaction kettle, and heating and dissolving uniformly;
s2: dripping alkoxy organic silicon resin into the reaction kettle, and heating for reaction;
s3: and decompressing the reaction kettle to remove the solvent to obtain the product.
3. The preparation method of the silicone hybrid epoxy resin as claimed in claim 2, wherein the reaction components in the steps S1, S2 and S3 are in the following weight parts: 180-3000 parts of epoxy resin, 247-800 parts of alkoxy organic silicon resin and 180-2000 parts of solvent.
4. The preparation method of the silicone hybrid epoxy resin according to claim 2, characterized in that: in step S1, the added epoxy resin is bisphenol a epoxy resin or sorbitol hydrophobic glyceryl ether or 1, 4-diol water-mono-glyceryl ether or at least two of the components constituting them.
5. The preparation method of the silicone hybrid epoxy resin according to claim 2, characterized in that: in step S1, the inert solvent added is toluene or xylene or PMA or at least two of the components constituting them.
6. The preparation method of the silicone hybrid epoxy resin according to claim 2, characterized in that: in step S2, the added alkoxy silicone resin is triphenyl silanol or phenyl methyl butyl silanol or dimethyl dialkoxy silane or isocyanatopropyl trimethoxy silane or isocyanatopropyl triethoxy silane or isocyanatopropyl methyl ethyl methoxy silane or diethyl dimethoxy silane or at least two of the components constituting them.
7. The preparation method of the silicone hybrid epoxy resin according to claim 2, characterized in that: in step S2, the temperature of the catalytic reaction in the reaction kettle is 50-150 ℃, and the reaction time is 1-10 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011152858.1A CN112280005A (en) | 2020-10-26 | 2020-10-26 | Organic silicon hybrid epoxy resin and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011152858.1A CN112280005A (en) | 2020-10-26 | 2020-10-26 | Organic silicon hybrid epoxy resin and preparation method thereof |
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| CN112280005A true CN112280005A (en) | 2021-01-29 |
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| CN202011152858.1A Pending CN112280005A (en) | 2020-10-26 | 2020-10-26 | Organic silicon hybrid epoxy resin and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113045919A (en) * | 2021-03-23 | 2021-06-29 | 石家庄市油漆厂 | Low-temperature curing high-solid epoxy coating and preparation method thereof |
| CN113354923A (en) * | 2021-06-18 | 2021-09-07 | 华北电力大学（保定） | Organic silicon modified weather-resistant epoxy resin insulating material |
| CN115746703A (en) * | 2022-11-21 | 2023-03-07 | 东莞市雄驰电子有限公司 | Method for preparing photocureable coating composition and coating based on epoxy fluorobenzene silicone resin and application of photocureable coating composition and coating |
| CN115894928A (en) * | 2022-11-21 | 2023-04-04 | 东莞市雄驰电子有限公司 | Preparation method of photocuring epoxy fluorobenzene silicone resin and application of photocuring epoxy fluorobenzene silicone resin in coating |
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| CN101307132A (en) * | 2008-07-10 | 2008-11-19 | 天津市凯华绝缘材料有限公司 | Epoxy resins modified by silanol hydroxyl or alkoxyl blocking silicone resin and method for preparing same |
| CN103450797A (en) * | 2012-06-05 | 2013-12-18 | 武汉赫斯特涂层材料股份有限公司 | Room-temperature cured epoxy polysiloxane resin |
| CN108559060A (en) * | 2018-04-19 | 2018-09-21 | 华南理工大学 | A kind of preparation method of modifying epoxy resin by organosilicon |
-
2020
- 2020-10-26 CN CN202011152858.1A patent/CN112280005A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101307132A (en) * | 2008-07-10 | 2008-11-19 | 天津市凯华绝缘材料有限公司 | Epoxy resins modified by silanol hydroxyl or alkoxyl blocking silicone resin and method for preparing same |
| CN103450797A (en) * | 2012-06-05 | 2013-12-18 | 武汉赫斯特涂层材料股份有限公司 | Room-temperature cured epoxy polysiloxane resin |
| CN108559060A (en) * | 2018-04-19 | 2018-09-21 | 华南理工大学 | A kind of preparation method of modifying epoxy resin by organosilicon |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113045919A (en) * | 2021-03-23 | 2021-06-29 | 石家庄市油漆厂 | Low-temperature curing high-solid epoxy coating and preparation method thereof |
| CN113045919B (en) * | 2021-03-23 | 2022-04-05 | 石家庄市油漆厂 | Low-temperature curing high-solid epoxy coating and preparation method thereof |
| CN113354923A (en) * | 2021-06-18 | 2021-09-07 | 华北电力大学（保定） | Organic silicon modified weather-resistant epoxy resin insulating material |
| CN113354923B (en) * | 2021-06-18 | 2022-09-06 | 华北电力大学（保定） | Organic silicon modified weather-resistant epoxy resin insulating material |
| CN115746703A (en) * | 2022-11-21 | 2023-03-07 | 东莞市雄驰电子有限公司 | Method for preparing photocureable coating composition and coating based on epoxy fluorobenzene silicone resin and application of photocureable coating composition and coating |
| CN115894928A (en) * | 2022-11-21 | 2023-04-04 | 东莞市雄驰电子有限公司 | Preparation method of photocuring epoxy fluorobenzene silicone resin and application of photocuring epoxy fluorobenzene silicone resin in coating |
| CN115746703B (en) * | 2022-11-21 | 2023-11-10 | 东莞市雄驰电子有限公司 | Photo-curing coating composition prepared based on epoxy fluorobenzene silicone resin, coating method and application |
| CN115894928B (en) * | 2022-11-21 | 2024-03-12 | 东莞市雄驰电子有限公司 | Preparation method of photo-curing epoxy fluorobenzene silicone resin and application of photo-curing epoxy fluorobenzene silicone resin in paint coating |
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