CN112272470A - Signal digital processor - Google Patents
Signal digital processor Download PDFInfo
- Publication number
- CN112272470A CN112272470A CN202011140343.XA CN202011140343A CN112272470A CN 112272470 A CN112272470 A CN 112272470A CN 202011140343 A CN202011140343 A CN 202011140343A CN 112272470 A CN112272470 A CN 112272470A
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- China
- Prior art keywords
- circuit board
- shell
- digital processor
- printed board
- board assembly
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a signal digital processor, which comprises a printed board assembly and a shell, wherein the shell is divided into an upper cavity and a lower cavity by a partition board, the inner side wall of the upper cavity is provided with a step surface, the printed board assembly is connected to the step surface through a screw, an insulating heat-conducting pad is arranged above the printed board assembly, a cover plate is arranged above the insulating heat-conducting pad, and the cover plate is screwed on the shell; a power supply module is arranged in the lower cavity and penetrates through the partition plate through a connector to be connected with the printed board assembly; the side wall of the upper cavity is provided with a transition block, an SMP electric connector is arranged in the transition block, and the SMP electric connector is connected with the printed board assembly through a wire. According to the invention, through isolating the power supply module and filtering the power supply, the sealing performance of the product is improved, the interference of current and signals to the working process of the product is reduced, and the electromagnetic compatibility of the product is improved; and the printed board assembly is connected to the step surface by using the screw, so that the manufacturability is improved.
Description
Technical Field
The invention relates to a signal digital processor.
Background
The signal digital processor is an important component of an aircraft fuse system, and is mainly used for carrying out digital sampling on difference frequency signals and Doppler signals from a video amplifier, then carrying out signal processing, carrying out the functions of target existence and Doppler frequency identification and finally sending out action signals. The structural design of the signal digital processor directly influences the signal processing effect and the electromagnetic compatibility of products. Present signal digital processor is mainly shell structure, and the casing inner chamber is provided with circuit board subassembly, and circuit board subassembly structure is: the multilayer circuit boards are stacked, and the circuit boards are fixed through studs and support columns and connected through pluggable board-to-board connectors. For example, chinese patent publication No. CN107041065B discloses a digital signal processor, which includes a housing, a circuit board assembly disposed in an inner cavity of the housing, the circuit board assembly being sequentially stacked from top to bottom by a signal processing circuit board, a power supply circuit board, and an interface circuit board, each board being fixed by a stud and a pillar and connected by a pluggable board connector, a micro plug disposed in an inner cavity at the bottom of the housing and connected with a micro socket at the bottom of the interface circuit board, and extending out of the connecting socket at the bottom of the housing through a cable, and an FPGA chip disposed on the signal processing circuit board. The structure of the circuit board stacked installation reduces the volume of the equipment and makes the structure compact.
However, in this type of signal digital processor, the micro plug is connected to the micro socket at the bottom of the interface circuit board, and extends out of the connecting socket at the bottom of the housing through the cable to take over the functions of data communication and current transmission, so that the data signal is susceptible to interference of the current signal, and the structure is not sealed, so that mutual interference of signals is easily generated during the fuse operation, and thus it is difficult to meet the requirement of high electromagnetic compatibility. In addition, the surface space of the shell of the digital signal processor is not fully utilized, and the requirement of further miniaturization of products is difficult to realize; vertical plugging is difficult to guarantee in the process of plugging between the three layers of circuit boards, welding spots of the connector and elements on the circuit boards are easy to damage under the action of inertia and friction force, and fault removal and repair of a single circuit board are not facilitated; when the printed board assembly is installed, the printed board assembly needs to be installed at the bottom of the shell through the support, then the printed board assembly is screwed into the support through the reverse side screw at the lower side of the shell, the bottom of the shell needs to be upward in the installation process, the printed board assembly is not easy to align and fix, and the manufacturability is poor.
Disclosure of Invention
In order to solve the above technical problem, the present invention provides a signal digital processor.
The invention is realized by the following technical scheme.
The invention provides a signal digital processor, which comprises a printed board assembly and a shell, wherein the shell is divided into an upper cavity and a lower cavity by a partition plate, the inner side wall of the upper cavity is provided with a step surface, the printed board assembly is connected to the step surface through a screw, an insulating heat-conducting pad is arranged above the printed board assembly, a cover plate is arranged above the insulating heat-conducting pad, and the cover plate is screwed on the shell; a power supply module is arranged in the lower cavity and penetrates through the partition plate through a connector to be connected with the printed board assembly; the side wall of the upper cavity is provided with a transition block, an SMP electric connector is arranged in the transition block, and the SMP electric connector is connected with the printed board assembly through a wire.
The power module provides power, the SMP electric connector plays a role in data communication, interference of current to signals is avoided, the sealing performance of the shell is improved through the transition block, and mutual interference of signals is reduced; in addition, when the printed board assembly is installed, the printed board assembly is only required to be positioned with the power supply module firstly and then connected to the step surface through the screws, the shell does not need to be turned over, the manufacturability is improved, and the occupation of the bottom space of the upper cavity is reduced.
The power supply module comprises a power supply filter, the upper surface of the power supply filter is overlapped with the partition plate, a micro plug penetrates through the partition plate, and a socket is arranged on the lower side of the power supply filter. Furthermore, a conductive gasket is arranged between the upper surface of the power filter and the partition plate. The power filter is used for isolating and stabilizing the input current and filtering other signals, so that the interference of the current is further reduced, and the electromagnetic compatibility of the product is improved; and the arrangement further improves the tightness of the power supply module and further reduces the mutual interference of signals.
And a conductive gasket is arranged between the insulating heat conducting pad and the cover plate.
The printed board assembly comprises a signal processing circuit board, a power supply circuit board and an interface circuit board, wherein the signal processing circuit board, the power supply circuit board and the interface circuit board are arranged in a stacked mode from top to bottom and are fixed with the studs through support columns. Furthermore, the signal processing circuit board, the power supply circuit board and the interface circuit board are connected with each other through cables with connectors at two ends. Through cable connection, the plugging difficulty between circuit boards of all layers is reduced, and fault removal and repair of a single circuit board are facilitated; the upper cavity space vacated by the installation printed board of the step surface is fully utilized, and the space utilization rate is increased.
The outer side surface of the shell is also provided with a cable trough at the position of the warp where the transition block is located. Further, the upper side of the shell is provided with 4 lugs. Further, the transition piece is T shape structure, and transition piece the latter half is equipped with connector installation screw hole, and the first half is equipped with the notch, and the notch is relative with the cable trough. Through this setting, make full use of the space of casing outer wall face, made the cable sequencing neat, reduced product occupation space, the wiring is difficult to make mistakes moreover.
The cover plate and the transition block are in threaded connection with the shell through blind screw holes in the shell.
The invention has the beneficial effects that:
in conclusion, the power module and the power filter are isolated, the sealing performance of the product is improved, the interference of current and signals to the working process of the product is reduced, and the electromagnetic compatibility of the product is improved; in addition, when the printed board assembly is installed, the printed board assembly is only required to be positioned with the power supply module firstly and then connected to the step surface through the screw, the shell does not need to be turned upside down, and the manufacturability is improved; the invention also reduces the plugging difficulty of the printed board assembly, and is beneficial to troubleshooting and repairing of a single circuit board.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic surface view of the present invention;
FIG. 3 is a schematic illustration of a printed board assembly;
fig. 4 is a schematic diagram of a transition block.
In the figure: 1-a printed board assembly; 2-a signal processing circuit board; 3-a power supply circuit board; 4-an interface circuit board; 5-a shell; 501-upper cavity; 502-lower cavity; 6-a separator; 7-step surface; 8-a screw; 9-insulating heat conducting pad; 10-a cover plate; 11-a power supply module; 12-a miniature plug; 13-a power supply filter; 14-a socket; 15-a transition block; 151-connector mounting threaded holes; 152-notches; 16-cable run channels; 17-a lug; 18-a support column; 19-a stud; 20-cables with connectors at both ends.
Detailed Description
The technical solution of the present invention is further described below, but the scope of the claimed invention is not limited to the described.
FIGS. 1 to 4 are schematic structural views of the present invention:
the invention provides a signal digital processor, as shown in figures 1-2, comprising a printed board assembly 1 and a shell 5, wherein the shell 5 is divided into an upper cavity 501 and a lower cavity 502 by a partition plate 6, the inner side wall of the upper cavity 501 is provided with a step surface 7, the printed board assembly 1 is connected to the step surface 7 through a screw 8, an insulating heat-conducting pad 9 is arranged above the printed board assembly 1, a cover plate 10 is arranged above the insulating heat-conducting pad 9, and the cover plate 10 is screwed on the shell 5; a power supply module 11 is arranged in the lower cavity 502, and the power supply module 11 penetrates through the partition plate 6 through a connector to be connected with the printed board assembly 1; the side wall of the upper cavity 501 is provided with a transition block 15, and an SMP electrical connector is arranged in the transition block 15 and is connected with the printed board assembly 1 through a wire.
The power module 11 provides power, the SMP electric connector plays a role in data communication, interference of current to signals is avoided, the sealing performance of the shell 5 is improved through the transition block 15, and mutual interference of signals is reduced; in addition, when the printed board assembly 1 is installed, the printed board assembly only needs to be positioned with the power supply module 11 firstly and then connected to the step surface 7 through the screw 8, the shell 5 does not need to be turned upside down, the manufacturability is improved, and the occupied space of the bottom of the upper cavity 501 is reduced.
As shown in fig. 1: the power supply module 11 comprises a power supply filter 13, the upper surface of the power supply filter 13 is overlapped with the partition plate 6, a miniature plug 12 is arranged to penetrate through the partition plate 6, and a socket 14 is arranged on the lower side of the power supply filter 13. Further, a conductive gasket is provided between the upper surface of the power filter 13 and the partition plate 6. The power filter 13 is used for isolating and stabilizing the input current and filtering other signals, so that the interference of the current is further reduced, and the electromagnetic compatibility of the product is improved; and the arrangement further improves the tightness of the power module 11 and further reduces the mutual interference of signals.
And a conductive gasket is arranged between the insulating heat-conducting pad 9 and the cover plate 10.
Fig. 3 shows a schematic structural diagram of the printed board assembly 1:
the printed board assembly 1 comprises a signal processing circuit board 2, a power supply circuit board 3 and an interface circuit board 4, wherein the signal processing circuit board 2, the power supply circuit board 3 and the interface circuit board 4 are arranged in a stacking mode from top to bottom and are fixed with a stud 19 through a support column 18. Further, the signal processing circuit board 2, the power supply circuit board 3 and the interface circuit board 4 are connected with each other through cables 20 with connectors at two ends. Through cable connection, the plugging difficulty between circuit boards of all layers is reduced, and fault removal and repair of a single circuit board are facilitated; the space of the upper cavity 501 vacated by the installation printed board of the step surface 7 is fully utilized, and the space utilization rate is increased.
As shown in fig. 2: and a cable trough 16 is further arranged on the outer side surface of the shell 5 at the position of the warp where the transition block 15 is located. Further, the upper side of the shell 5 is provided with 4 lugs 17. Further, as shown in fig. 4: transition piece 15 is T shape structure, and transition piece 15 the latter half is equipped with connector installation screw hole 151, and the first half is equipped with notch 152, and notch 152 is relative with cable trough 16. Through this setting, make full use of the space of 5 outer wall faces of casing, made the cable sequencing neat, reduced product occupation space, the wiring is difficult to make mistakes moreover.
The cover plate 10 and the transition block 15 are in threaded connection with the shell 5 through blind screws 8 on the shell 5.
Claims (10)
1. A signal digital processor, characterized by: the heat-conducting type heat-conducting module comprises a printed board assembly (1) and a shell (5), wherein the shell (5) is divided into an upper cavity (501) and a lower cavity (502) by a partition plate (6), a step surface (7) is arranged on the inner side wall of the upper cavity (501), the printed board assembly (1) is connected to the step surface (7) through a screw (8), an insulating heat-conducting pad (9) is arranged above the printed board assembly (1), a cover plate (10) is arranged above the insulating heat-conducting pad (9), and the cover plate (10) is screwed on the shell (5); a power supply module (11) is arranged in the lower cavity (502), and the power supply module (11) penetrates through the partition plate (6) through a connector to be connected with the printed board assembly (1); the side wall of the upper cavity (501) is provided with a transition block (15), an SMP electric connector is arranged in the transition block (15), and the SMP electric connector is connected with the printed board assembly (1) through a lead.
2. A signal digital processor according to claim 1, wherein: the power module (11) comprises a power filter (13), the upper surface of the power filter (13) is overlapped with the partition plate (6), a micro plug (12) is arranged to penetrate through the partition plate (6), and a socket (14) is arranged on the lower side of the power filter (13).
3. A signal digital processor according to claim 2, wherein: and a conductive gasket is also arranged between the upper surface of the power filter (13) and the partition plate (6).
4. A signal digital processor according to claim 1, wherein: and a conductive gasket is arranged between the insulating heat-conducting pad (9) and the cover plate (10).
5. A signal digital processor according to claim 1, wherein: the printed board assembly (1) comprises a signal processing circuit board (2), a power supply circuit board (3) and an interface circuit board (4), wherein the signal processing circuit board (2), the power supply circuit board (3) and the interface circuit board (4) are arranged in a stacking mode from top to bottom and are fixed with a stud (19) through a support column (18).
6. Digital processor of signals according to claim 5, characterized in that: the signal processing circuit board (2), the power supply circuit board (3) and the interface circuit board (4) are connected with each other through cables (20) with connectors at two ends.
7. A signal digital processor according to claim 1, wherein: and a cable wiring groove (16) is further formed in the position, where the transition block (15) is located, of the outer side face of the shell (5) at the warp line.
8. A signal digital processor according to claim 7, wherein: the upper side of the shell (5) is provided with 4 lugs (17).
9. A signal digital processor according to claim 7, wherein: transition piece (15) are T shape structure, and transition piece (15) lower half is equipped with connector installation screw hole (151), and the upper half is equipped with notch (152), and notch (152) are relative with cable trough (16).
10. A signal digital processor according to claim 1, wherein: the cover plate (10) and the transition block (15) are in threaded connection with the shell (5) through blind screw holes (8) in the shell (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011140343.XA CN112272470A (en) | 2020-10-22 | 2020-10-22 | Signal digital processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011140343.XA CN112272470A (en) | 2020-10-22 | 2020-10-22 | Signal digital processor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112272470A true CN112272470A (en) | 2021-01-26 |
Family
ID=74341466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011140343.XA Pending CN112272470A (en) | 2020-10-22 | 2020-10-22 | Signal digital processor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112272470A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114243243A (en) * | 2021-12-16 | 2022-03-25 | 贵州航天电子科技有限公司 | Miniaturized cavity structure |
| CN114501891A (en) * | 2022-02-14 | 2022-05-13 | 贵州航天林泉电机有限公司 | Multi-axis electric servo system controller |
Citations (7)
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|---|---|---|---|---|
| JP2008078263A (en) * | 2006-09-20 | 2008-04-03 | Funai Electric Co Ltd | Circuit substrate for electronic instrument, and manufacturing method of circuit substrate for electronic instrument |
| CN101498960A (en) * | 2009-02-09 | 2009-08-05 | 山东超越数控电子有限公司 | Method for manufacturing computer with good electromagnetic compatibility |
| CN105357923A (en) * | 2015-11-28 | 2016-02-24 | 贵州航天电子科技有限公司 | Detonation controller structure |
| CN106712458A (en) * | 2015-07-30 | 2017-05-24 | 台达电子工业股份有限公司 | Frequency converter structure with built-in EMI circuit |
| CN107041065A (en) * | 2017-03-31 | 2017-08-11 | 贵州航天电子科技有限公司 | A kind of digital signal processor |
| CN109474157A (en) * | 2018-12-24 | 2019-03-15 | 彭希南 | A kind of numerical indexes driving stepper motor based on RS485 bus |
| US20190246529A1 (en) * | 2018-02-06 | 2019-08-08 | 3Y Power Technology (Taiwan), Inc. | Electromagnetic shielding assembly, electromagnetic interference and lightning protection module and power supply |
-
2020
- 2020-10-22 CN CN202011140343.XA patent/CN112272470A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078263A (en) * | 2006-09-20 | 2008-04-03 | Funai Electric Co Ltd | Circuit substrate for electronic instrument, and manufacturing method of circuit substrate for electronic instrument |
| CN101498960A (en) * | 2009-02-09 | 2009-08-05 | 山东超越数控电子有限公司 | Method for manufacturing computer with good electromagnetic compatibility |
| CN106712458A (en) * | 2015-07-30 | 2017-05-24 | 台达电子工业股份有限公司 | Frequency converter structure with built-in EMI circuit |
| CN105357923A (en) * | 2015-11-28 | 2016-02-24 | 贵州航天电子科技有限公司 | Detonation controller structure |
| CN107041065A (en) * | 2017-03-31 | 2017-08-11 | 贵州航天电子科技有限公司 | A kind of digital signal processor |
| US20190246529A1 (en) * | 2018-02-06 | 2019-08-08 | 3Y Power Technology (Taiwan), Inc. | Electromagnetic shielding assembly, electromagnetic interference and lightning protection module and power supply |
| CN109474157A (en) * | 2018-12-24 | 2019-03-15 | 彭希南 | A kind of numerical indexes driving stepper motor based on RS485 bus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114243243A (en) * | 2021-12-16 | 2022-03-25 | 贵州航天电子科技有限公司 | Miniaturized cavity structure |
| CN114501891A (en) * | 2022-02-14 | 2022-05-13 | 贵州航天林泉电机有限公司 | Multi-axis electric servo system controller |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210126 |
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| RJ01 | Rejection of invention patent application after publication |