CN112271523A - PIN conduction method of FFC (flexible flat cable) - Google Patents
PIN conduction method of FFC (flexible flat cable) Download PDFInfo
- Publication number
- CN112271523A CN112271523A CN202011221962.1A CN202011221962A CN112271523A CN 112271523 A CN112271523 A CN 112271523A CN 202011221962 A CN202011221962 A CN 202011221962A CN 112271523 A CN112271523 A CN 112271523A
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- CN
- China
- Prior art keywords
- pin
- lead
- ffc
- conductor layer
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 13
- 239000002313 adhesive film Substances 0.000 claims abstract description 3
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 abstract description 13
- 239000011888 foil Substances 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000005030 aluminium foil Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Conductors (AREA)
Abstract
The invention discloses a PIN foot conduction method of an FFC (flexible flat cable), wherein the FFC comprises a conductor layer, the conductor layer consists of a plurality of conducting wires, an insulating glue film layer used for coating the conducting wires is arranged on the surface of the conductor layer, and a plurality of PIN feet positioned outside the insulating glue film layer are arranged at the end part of the conductor layer; the conducting method comprises the following steps: selecting a PIN which needs to be conducted according to the circuit design, and removing part of the insulating adhesive film layer at the position of the lead corresponding to the PIN which needs to be conducted so as to expose part of the lead; and adding a conductive medium at the exposed wire to form a conductive medium line connected with the wire so as to conduct between the connected wire and the PIN. The method is simple to operate, the PIN can be conducted without overlapping an external lead and attaching a single-lead aluminum foil and a double-lead aluminum foil, the production cost of the product is reduced, and the production efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of FFC (flexible flat cable) and particularly relates to a PIN conduction method of an FFC.
Background
At present, when carrying out ground connection and switching on between the PIN foot to on the FFC winding displacement product, generally adopt aluminium foil and external conductor complex mode, specific process is: attaching a single-conductor aluminum foil to the lower end of a golden finger of the FFC flat cable product, overlapping an external lead at the lower end of a PIN foot which needs to be conducted correspondingly, overlapping the external lead on the single-conductor aluminum foil, and then attaching a double-conductor aluminum foil to fix the external lead; so, utilize two aluminium foils of leading, singly lead the aluminium foil and external wire's cooperation, realize switching on of PIN foot, after being applied to electronic product, can realize ground connection with the shell of product etc. and switch on. However, in this way, the external lead needs to be lapped, and the external lead aluminum foil and the double lead aluminum foil need to be attached, so that the operation is complex, the material is wasted, the production cost is increased, and the production efficiency is low.
Disclosure of Invention
In order to solve the above technical problems, an object of the present invention is to provide a PIN conduction method for an FFC bus; the method is simple to operate, the PIN can be conducted without overlapping an external lead and attaching a single-lead aluminum foil and a double-lead aluminum foil, the production cost of the product is reduced, and the production efficiency is improved.
In order to achieve the technical purpose and achieve the technical effect, the invention is realized by the following technical scheme:
the utility model provides a PIN foot conduction method of FFC winding displacement, wherein, FFC winding displacement includes the conductor layer, and this conductor layer comprises a plurality of mutual isolation arrangement's wire, and the surface of conductor layer is equipped with the insulating glue rete that is used for the clad wire, and the insulating glue rete carries out the insulation isolation with adjacent wire, and the tip of conductor layer is equipped with a plurality of PIN feet that are located outside the insulating glue rete and correspond to the wire one-to-one, and this conduction method includes following step:
(1) selecting a PIN PIN needing to be conducted in the FFC flat cable according to the circuit design;
(2) removing the insulating adhesive film layer at the position of the lead corresponding to the PIN to be conducted, so that the corresponding lead part is exposed;
(3) and adding a conductive medium at the exposed lead to form a conductive medium line connected with the lead to be conducted so as to conduct the connected lead and the PIN.
Further, in the step (2), a laser machine or a removal jig is adopted to remove the marked insulating glue film layer.
Further, in the step (3), an automatic dispenser is used for conducting the operation of adding the conductive medium.
Further, the conductive medium in the step (3) is conductive silver paste.
Further, in the step (3), the formed conductive medium line is perpendicular to the conductive line.
The invention further provides an FFC flat cable manufactured by the PIN conduction method.
The invention has the beneficial effects that:
the invention removes part of the insulating film at the position of the lead corresponding to the PIN PIN to be conducted by laser firing and the like to expose the lead, then adds a conductive medium on the exposed lead to form a conductive medium line to realize the conduction of the PIN PIN and the lead, and after the obtained FFC flat cable product is applied to electronic products such as computers and the like, the grounding conduction with structures such as electronic product shells and the like can be directly realized through the conductive medium line without using an external lead, a double-conductive aluminum foil and a single-conductive aluminum foil as in the prior art, thereby saving the production cost and greatly improving the production efficiency.
Drawings
Fig. 1 is a schematic diagram of a PIN conduction method of an FFC bus according to an embodiment of the present invention.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Fig. 1 shows a preferred embodiment of a PIN conduction method for an FFC bus; it should be noted that the FFC flat cable 1 includes a conductor layer, the conductor layer is composed of a plurality of mutually isolated and arranged wires 11, an insulating glue film layer 12 for coating the wires 11 is arranged on the surface of the conductor layer, the insulating glue film layer 12 insulates and isolates the adjacent wires 11, a plurality of PIN PINs 13 corresponding to the wires 11 one by one are arranged at the end of the conductor layer, and the PIN PINs 13 form the golden finger portion of the FFC flat cable.
The PIN foot conduction method of the FFC bus provided in this embodiment includes the steps of:
(1) selecting a PIN (personal identification number) PIN 13 which needs to be grounded according to the circuit design of the FFC flat cable product;
(2) firing a part of the insulating glue film layer at the lead corresponding to the PIN foot to be conducted by using a laser machine, so that the corresponding lead part is exposed; then, cutting the FFC flat cable product into a plurality of groups of FFC flat cables with specified lengths; arranging the plurality of groups of FFC flat cables into a row;
(3) using an automatic dispenser to dispense conductive silver paste on the exposed wires 11 in all the FFC winding displacement groups to form a conductive medium line (conductive silver paste line) 14 connected with the wires 11 to be conducted; and in this embodiment, the conductive dielectric line 14 is perpendicular to the conductive line 11; in other embodiments, the conductive medium line may not be perpendicular to the conductive line according to different designs; after the conductive medium line is solidified, a connecting lead is formed so as to conduct the connected lead and the PIN foot, and therefore the grounding conduction of subsequent products is achieved.
After the FFC flat cable product prepared by the embodiment is applied to electronic products such as computers, the grounding conduction of the structures such as the lead wire and the PIN foot and the electronic product shell can be realized directly through the connecting lead formed after the conductive silver paste line is solidified, and the external lead wire, the double-lead aluminum foil and the single-lead aluminum foil are not required to be used as in the prior art, so that the production cost is saved, and the production efficiency can be greatly improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. The utility model provides a PIN foot conduction method of FFC winding displacement, wherein, FFC winding displacement includes the conductor layer, and this conductor layer comprises a plurality of mutual isolation arrangement's wire, and the surface of conductor layer is equipped with the insulating glue rete that is used for the clad wire, and the insulating glue rete carries out the insulation isolation with adjacent wire, and the tip of conductor layer is equipped with a plurality of PIN feet that are located outside the insulating glue rete and correspond to the wire one-to-one, its characterized in that, this conduction method includes following step:
(1) selecting a PIN PIN needing to be conducted in the FFC flat cable according to the circuit design;
(2) removing the insulating adhesive film layer at the position of the lead corresponding to the PIN to be conducted, so that the corresponding lead part is exposed;
(3) and adding a conductive medium at the exposed lead to form a conductive medium line connected with the lead to be conducted so as to conduct the connected lead and the PIN.
2. The method for conducting the PIN of the FFC flat cable according to claim 1, wherein a laser machine or a removal jig is used to remove the marked insulating glue film layer in the step (2).
3. The method for conducting the PIN of the FFC flat cable according to claim 1, wherein the conductive medium adding operation is performed by an automatic dispenser in the step (3).
4. The method of claim 1, wherein the conductive medium in step (3) is conductive silver paste.
5. The method of claim 1, wherein in step (3), the conductive dielectric lines are formed perpendicular to the conductive lines.
6. An FFC cable manufactured by the method for conducting the PIN of the FFC cable according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011221962.1A CN112271523A (en) | 2020-11-05 | 2020-11-05 | PIN conduction method of FFC (flexible flat cable) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011221962.1A CN112271523A (en) | 2020-11-05 | 2020-11-05 | PIN conduction method of FFC (flexible flat cable) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112271523A true CN112271523A (en) | 2021-01-26 |
Family
ID=74344622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011221962.1A Pending CN112271523A (en) | 2020-11-05 | 2020-11-05 | PIN conduction method of FFC (flexible flat cable) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112271523A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013712A (en) * | 2021-03-02 | 2021-06-22 | 深圳市佳宏源电子有限公司 | FFC flat cable grounding mechanism machining method and device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201327729Y (en) * | 2008-11-19 | 2009-10-14 | 达昌电子科技(苏州)有限公司 | Flexible flat cable structure |
| JP2012033422A (en) * | 2010-08-02 | 2012-02-16 | Fujikura Ltd | Method of manufacturing flexible flat cable |
| CN103545028A (en) * | 2012-07-11 | 2014-01-29 | 易鼎股份有限公司 | Differential mode signal transmission module |
| CN205230624U (en) * | 2015-10-19 | 2016-05-11 | 惠州威仕特电子有限公司 | High stability FFC shielded wire |
| CN210805279U (en) * | 2019-10-10 | 2020-06-19 | 浙江新富尔电子有限公司 | FFC flat cable |
| CN111724930A (en) * | 2019-03-20 | 2020-09-29 | 海信视像科技股份有限公司 | FFC cable and electronic equipment |
| CN211700648U (en) * | 2020-04-20 | 2020-10-16 | 深圳闻信电子有限公司 | FFC for vehicle |
-
2020
- 2020-11-05 CN CN202011221962.1A patent/CN112271523A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201327729Y (en) * | 2008-11-19 | 2009-10-14 | 达昌电子科技(苏州)有限公司 | Flexible flat cable structure |
| JP2012033422A (en) * | 2010-08-02 | 2012-02-16 | Fujikura Ltd | Method of manufacturing flexible flat cable |
| CN103545028A (en) * | 2012-07-11 | 2014-01-29 | 易鼎股份有限公司 | Differential mode signal transmission module |
| CN205230624U (en) * | 2015-10-19 | 2016-05-11 | 惠州威仕特电子有限公司 | High stability FFC shielded wire |
| CN111724930A (en) * | 2019-03-20 | 2020-09-29 | 海信视像科技股份有限公司 | FFC cable and electronic equipment |
| CN210805279U (en) * | 2019-10-10 | 2020-06-19 | 浙江新富尔电子有限公司 | FFC flat cable |
| CN211700648U (en) * | 2020-04-20 | 2020-10-16 | 深圳闻信电子有限公司 | FFC for vehicle |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013712A (en) * | 2021-03-02 | 2021-06-22 | 深圳市佳宏源电子有限公司 | FFC flat cable grounding mechanism machining method and device |
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Application publication date: 20210126 |
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| RJ01 | Rejection of invention patent application after publication |