CN112269448B

CN112269448B - Heat dissipation installation device for intelligently manufacturing CPU

Info

Publication number: CN112269448B
Application number: CN202011009160.4A
Authority: CN
Inventors: 许斐
Original assignee: Jiangsu Shunhai Technology Co ltd
Current assignee: Jiangsu Shunhai Technology Co.,Ltd.
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2021-10-26
Anticipated expiration: 2040-09-23
Also published as: CN112269448A

Abstract

The invention relates to the technical field of computer equipment and discloses a heat dissipation mounting device for intelligently manufacturing a CPU (Central processing Unit), which comprises a shell and a ball valve, wherein a sliding groove is fixedly arranged in the shell, a sliding ball is connected in the sliding groove in a sliding manner, a limiting rod is fixedly arranged at the opposite end of the sliding ball, one end of the sliding ball, which is far away from the limiting rod, is fixedly provided with a spring, the middle parts of the left side and the right side of the shell are connected with a sliding pin in a sliding manner, the upper ends of the sliding pins at the left side and the right side of the shell are fixedly provided with a torsion spring, and the rear end of the torsion spring is fixedly provided with the ball valve. This CPU's heat dissipation installation device is made to intelligence can fix CPU through the sucking disc, and is not only fixed effectual, still prevents to paint the silicone grease and causes gluing in the equipment and glue the maintenance that is unfavorable for the later stage, and automatic alignment cools down after the CPU temperature risees, according to the jet-propelled cooling speed of temperature variation range adjustment, the practicality of messenger is stronger.

Description

Heat dissipation installation device for intelligently manufacturing CPU

Technical Field

The invention relates to the technical field of computer equipment, in particular to a heat dissipation mounting device for intelligently manufacturing a CPU.

Background

The image coding enables data compression to be obtained when the image coding is transmitted or stored by a digital method, a CPU of a computer is a core component for processing information of the type, the CPU generates high heat during working and needs to be additionally provided with a radiator for cooling, the traditional radiator mounting method utilizes silicone grease for connection, silicone grease is easy to splash to a main board to cause faults and is not attractive, the radiator is often manually adjusted by a user, the power of the radiator is adjusted according to the temperature, and automatic cooling cannot be achieved.

In order to solve the problems, the inventor provides a heat dissipation mounting device for intelligently manufacturing a CPU, the CPU can be fixed through a sucker, the fixing effect is good, the phenomenon that the adhesion in equipment is not beneficial to later maintenance due to the fact that silicone grease is coated is also prevented, the CPU is automatically aligned to be cooled after the temperature rises, the air injection cooling speed is adjusted according to the temperature change range, and the practicability is higher.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides the heat dissipation mounting device for intelligently manufacturing the CPU, which has the advantages of stable adsorption, no coating of silicone grease, adjustment according to the temperature change amplitude and air injection cooling speed, and solves the problems of potential safety hazard and incapability of automatic cooling caused by the need of coating the silicone grease.

(II) technical scheme

In order to realize the purposes of stable adsorption, no coating of silicone grease, adjustment according to the temperature change amplitude and air injection cooling speed, the invention provides the following technical scheme: a heat dissipation installation device for intelligently manufacturing a CPU comprises a shell, wherein the shell is fixedly provided with a chute inside, the chute inside is connected with a sliding ball in a sliding manner, the opposite end of the sliding ball is fixedly provided with a limiting rod, one end of the sliding ball far away from the limiting rod is fixedly provided with a spring, the middle parts of the left side and the right side of the shell are connected with a sliding pin in a sliding manner, the upper ends of the sliding pins at the left side and the right side of the shell are fixedly provided with a torsional spring, the rear end of the torsional spring is fixedly provided with a ball valve, the bottom end of the sliding pin is fixedly provided with a fixed rod, the bottom end of the fixed rod is fixedly provided with a sucker, the middle part inside the shell is fixedly provided with an air bag, the top end of the air bag is fixedly provided with an air pump, the bottom end of the air bag is fixedly provided with a radiating pipe, the bottom end of the air pump is fixedly provided with a plate electrode, the temperature sensing cavity is fixedly arranged at the left end and the right end of the electrode plate on the inner wall of the shell, and a dielectric medium is movably arranged at one end, close to the electrode plate, of the temperature sensing cavity.

Preferably, one end, far away from the sliding ball, of the limiting rod is attached to the air bag.

Preferably, the sliding ball and the sliding pin are connected through a connecting rod, and the sliding ball moves to drive the sliding pin to move through the connecting rod.

Preferably, the torsion spring is fixedly connected with a switch of the ball valve.

Preferably, the sucker is fixedly connected with the ball valve through an air pipe and is movably connected with the air bag through the air pipe.

Preferably, the bottom end of the radiating pipe is fixedly provided with a radiating head.

Preferably, the temperature sensing cavity is movably connected with the CPU through a heat conducting wire, liquid mercury is contained in the temperature sensing cavity, the dielectric is connected to the inside of the temperature sensing cavity in a sliding mode through a sliding plate, and the dielectric is electrically connected with the air pump.

(III) advantageous effects

Compared with the prior art, the invention provides the heat dissipation mounting device for the intelligent manufacturing of the CPU, which has the following beneficial effects:

1. this CPU's heat dissipation installation device is made to intelligence, through being taken out the inside gas of gasbag, atmospheric pressure in the sucking disc is higher than the gasbag, inside gas gets into the gasbag, the sliding ball moves relatively under the effect of spring, and then drives the sliding pin decline, the sliding pin descends through the dead lever and then drives the sucking disc decline and pastes tight article, the ball valve switch is closed to the pulling torsional spring simultaneously, make sucking disc and gasbag not communicate, and then make the sucking disc adsorb the article, prevented to paint silicone grease and lead to the safety problem.

2. This CPU's heat dissipation installation device is made to intelligence, through the rising of temperature sensing chamber perception CPU temperature, its inside mercury inflation drives the dielectric and removes to the plate electrode direction, and the just change of area of dielectric and plate electrode leads to the electric current to change, and then makes air pump circular telegram operation, and the inside gas of air pump extraction gasbag is cooled down CPU through the cooling tube, has realized the purpose that can cool down automatically when the CPU temperature risees, has increased the practicality of device.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure and operation of the present invention;

FIG. 3 is a schematic view of the connection of the trachea with the balloon structure of the present invention;

FIG. 4 is an enlarged view of the structure A of FIG. 1 according to the present invention;

FIG. 5 is an enlarged view of the structure B shown in FIG. 1 according to the present invention.

In the figure: 1. a housing; 2. a chute; 3. a sliding ball; 4. a limiting rod; 5. a spring; 6. a slide pin; 7. a torsion spring; 8. a ball valve; 9. fixing the rod; 10. a suction cup; 11. an air bag; 12. a breather pipe; 13. an air pump; 14. a radiating pipe; 15. an electrode plate; 16. a temperature sensing cavity; 17. a dielectric.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, a heat dissipation mounting device for intelligently manufacturing a CPU includes a housing 1, a chute 2 fixedly mounted inside the housing 1, a sliding ball 3 slidably connected inside the chute 2, the sliding ball 3 and the sliding pin 6 connected by a connecting rod, the sliding ball 3 moving to drive the sliding pin 6 to move by the connecting rod, a limiting rod 4 fixedly mounted at an opposite end of the sliding ball 3, one end of the limiting rod 4 far from the sliding ball 3 attached to an airbag 11, a spring 5 fixedly mounted at one end of the sliding ball 3 far from the limiting rod 4, a sliding pin 6 slidably connected to a middle portion of left and right sides of the housing 1, a torsion spring 7 fixedly mounted at an upper end of the sliding pin 6 at left and right sides of the housing 1, a switch fixedly connected between the torsion spring 7 and the ball valve 8, a ball valve 8 fixedly mounted at a rear end of the torsion spring 7, a fixing rod 9 fixedly mounted at a bottom end of the sliding pin 6, and a suction cup 10 fixedly mounted at a bottom end of the fixing rod 9, sucking disc 10 passes through trachea and 8 fixed connection of ball valve, rethread trachea and 11 swing joint of gasbag, the inside middle part fixed mounting of shell 1 has gasbag 11, the top fixed mounting of gasbag 11 has breather pipe 12, the bottom fixed mounting of gasbag 11 has air pump 13, the fixed surface of air pump 13 has cooling tube 14, the bottom fixed mounting of cooling tube 14 has the radiating head, the bottom fixed mounting of shell 1 inner wall has plate electrode 15, both ends fixed mounting has temperature sensing cavity 16 about shell 1 inner wall plate electrode 15, temperature sensing cavity 16 is through heat-conducting wire and CPU swing joint, liquid mercury has been held in temperature sensing cavity 16's inside, dielectric 17 passes through slide sliding connection in temperature sensing cavity 16's inside, dielectric 17 and 13 electric connection of air pump, temperature sensing cavity 16 is close to plate electrode 15's one end movable mounting and has dielectric 17.

The working principle is that air in the air bag 11 is pumped away through the vent pipe 12, the air bag 11 contracts and no longer has a limiting effect on the limiting rod 4, the spring 5 recovers deformation to drive the sliding ball 3 to move towards the air bag 11, the sliding ball 3 moves to drive the sliding pin 6 to descend through the connecting rod, the sliding pin 6 drives the fixing rod 9 to descend so as to drive the sucker 10 to descend to the surface of an object, because the air bag 11 is connected with the sucker 10 through the air pipe, air in the sucker 10 enters the opened ball valve 8 to be pumped out, the sucker 10 fixes the CPU in a vacuum state, the sliding pin 6 descends to drive the torsion spring 7 to rotate through the connecting wire so as to close the switch of the ball valve 8, the sucker 10 is not communicated with the air bag 11 any more, when the temperature rises through the heat transfer of the heat conducting wire in the temperature sensing cavity 16, the mercury in the air expands to push the dielectric 17 to move towards the direction of the electrode plate 15, the facing area of the dielectric 17 and the electrode plate 15 is increased so as to increase the capacitance, and then make the electric current change for the circular telegram work of air pump 13, air pump 13 pumps the gas in gasbag 11 to in cooling tube 14, blow out gas through the radiating head and cool down CPU, because the change of temperature is a dynamic process when CPU cools down, the circuit current change that dielectric 17 connects is less when its temperature variation is less, air pump 13 steady operation, when CPU's temperature risees very fast, the inside mercury inflation speed of temperature sensing chamber 16 becomes fast, and then lead to the electric current change speed very fast, make the power grow of the work of air pump 13, accelerate the cooling to CPU.

To sum up, this CPU's heat dissipation installation device is made to intelligence, gas through being taken out gasbag 11 inside, atmospheric pressure in the sucking disc 10 is higher than gasbag 11, inside gas gets into gasbag 11 inside, sliding ball 3 relative movement under spring 5's effect, and then drive sliding pin 6 descends, sliding pin 6 descends through dead lever 9 and then drives sucking disc 10 decline and paste tight article, the ball valve 8 switch is closed to pulling torsional spring 7 simultaneously, make sucking disc 10 and gasbag 11 not communicate, and then make sucking disc 10 adsorb the article, prevented to paint the silicone grease and lead to the safety problem.

Moreover, according to the heat dissipation mounting device for intelligently manufacturing the CPU, the temperature of the CPU is sensed to rise through the temperature sensing cavity 16, mercury in the heat dissipation mounting device expands to drive the dielectric 17 to move towards the electrode plate 15, the current changes due to the fact that the area of the dielectric 17 and the electrode plate 15 is just changed, the air pump 13 is powered on and operates, the air in the air pump 13 extracting air bag 11 cools the CPU through the heat dissipation pipe 14, the purpose of automatically cooling when the temperature of the CPU rises is achieved, and the practicability of the device is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a CPU's heat dissipation installation device is made to intelligence, includes shell (1), its characterized in that: the novel air conditioner is characterized in that the shell (1), the inside fixed mounting of the shell (1) is provided with a sliding chute (2), the inside sliding connection of the sliding chute (2) is provided with a sliding ball (3), the opposite end of the sliding ball (3) is fixedly provided with a limiting rod (4), one end of the sliding ball (3) far away from the limiting rod (4) is fixedly provided with a spring (5), the middle parts of the left side and the right side of the shell (1) are slidably connected with a sliding pin (6), the upper ends of the sliding pins (6) of the left side and the right side of the shell (1) are fixedly provided with a torsion spring (7), the rear end of the torsion spring (7) is fixedly provided with a ball valve (8), the bottom end of the sliding pin (6) is fixedly provided with a fixing rod (9), the bottom end of the fixing rod (9) is provided with a sucker (10), the middle part of the inside of the shell (1) is fixedly provided with an air bag (11), the top end of the air bag (11) is fixedly provided with an air pipe (12), an air pump (13) is fixedly installed at the bottom end of the air bag (11), a radiating pipe (14) is fixedly installed on the surface of the air pump (13), an electrode plate (15) is fixedly installed at the bottom end of the inner wall of the shell (1), temperature sensing cavities (16) are fixedly installed at the left end and the right end of the electrode plate (15) on the inner wall of the shell (1), and a dielectric medium (17) is movably installed at one end, close to the electrode plate (15), of each temperature sensing cavity (16); the utility model discloses a temperature sensing device, including gag lever post (4), sucking disc (10), temperature sensing chamber (16), slide ball (3), gasbag (11), trachea and ball valve (8), rethread trachea and gasbag (11) swing joint, temperature sensing chamber (16) are through heat-conducting wire and CPU swing joint, and liquid mercury has been held to the inside in temperature sensing chamber (16), dielectric (17) are through the inside of slide sliding connection in temperature sensing chamber (16), dielectric (17) and air pump (13) electric connection.

2. The heat sink mounting apparatus for an intelligent manufacturing CPU as claimed in claim 1, wherein: the sliding ball (3) is connected with the sliding pin (6) through a connecting rod.

3. The heat sink mounting apparatus for an intelligent manufacturing CPU as claimed in claim 1, wherein: and the torsion spring (7) is fixedly connected with a switch of the ball valve (8).

4. The heat sink mounting apparatus for an intelligent manufacturing CPU as claimed in claim 1, wherein: and a radiating head is fixedly arranged at the bottom end of the radiating pipe (14).