CN112261543A - Electronic equipment and speaker module thereof - Google Patents
Electronic equipment and speaker module thereof Download PDFInfo
- Publication number
- CN112261543A CN112261543A CN202011145431.9A CN202011145431A CN112261543A CN 112261543 A CN112261543 A CN 112261543A CN 202011145431 A CN202011145431 A CN 202011145431A CN 112261543 A CN112261543 A CN 112261543A
- Authority
- CN
- China
- Prior art keywords
- sound
- speaker module
- hole
- sound outlet
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims abstract description 50
- 238000010168 coupling process Methods 0.000 claims abstract description 50
- 238000005859 coupling reaction Methods 0.000 claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 10
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 4
- 230000001960 triggered effect Effects 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
- H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/02—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The invention provides an electronic device and a loudspeaker module thereof. The loudspeaker module comprises a shell, a sound production unit and a bass tube. The casing has and holds the chamber, and the casing is equipped with first phonate hole and second phonate hole. The sound production unit is located and holds the chamber to hold the chamber and separate for leading the sound antetheca and coupling back chamber, lead the sound antetheca and communicate through first phonate hole and electronic equipment's exterior space. The bass tube is arranged in the coupling rear cavity and communicated with the inner space of the electronic equipment through the second sound outlet hole. So, can improve the low frequency sensitivity of speaker module, and then promote whole tone quality. In addition, the working voltage required by the sounding unit working under the maximum amplitude can be reduced, the performance requirement on the power amplifier is reduced, the power consumption of the electronic equipment is reduced, and the endurance time of the electronic equipment is prolonged. In addition, at resonant frequency department, can restrain the amplitude of speaker module, make this frequency channel be difficult to trigger the amplitude protection of intelligent power amplifier, exert the performance of acoustic device better.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of acoustoelectric technology, in particular to electronic equipment and a loudspeaker module thereof.
[ background of the invention ]
With the advent of the mobile internet age, the number of smart mobile devices is increasing. Among a plurality of mobile devices, a smart phone becomes an indispensable electronic device in life, but sound reproduction of the smart phone cannot achieve satisfactory acoustic experience for users.
Speaker modules are indispensable electroacoustic transducers in electronic equipment, which mainly convert electrical energy into acoustic energy. Common speaker module is at the in-process of vibration sound production, and the consumption of electronic equipment complete machine can rise sharply, leads to the time of endurance of complete machine to reduce to influence user's experience. In addition, when using intelligent power amplifier, can monitor the amplitude of speaker module usually. When triggering the upper limit of amplitude protection, limit the output of intelligent power amplifier to this protection speaker module. However, since the amplitude of each frequency point of the speaker module is different in the same voltage within the playback frequency band of 20Hz to 20kHz, amplitude protection is very easily triggered in some frequency regions, and amplitude protection is not basically triggered in some frequency regions, which inhibits the performance of the speaker module.
[ summary of the invention ]
The invention aims to provide an electronic device and a loudspeaker module thereof; the loudspeaker module can improve the low-frequency sensitivity of the micro loudspeaker and improve the integral tone quality; the cost can be reduced, the power consumption of the whole machine can be reduced, and the endurance time of the equipment can be prolonged; meanwhile, the performance of the acoustic device can be exerted to a greater extent.
The technical scheme of the invention is as follows:
a speaker module, comprising:
the sound box comprises a shell, a sound box body and a sound box, wherein the shell is provided with an accommodating cavity and is provided with a first sound outlet hole and a second sound outlet hole;
the sound production unit is arranged in the accommodating cavity, the accommodating cavity is divided into a sound guide front cavity and a coupling rear cavity by the sound production unit, and the sound guide front cavity is communicated with the external space of the electronic equipment through the first sound outlet; and
the bass tube is arranged in the coupling back cavity and communicated with the coupling back cavity, and the bass tube is communicated with the inner space of the electronic equipment through the second sound outlet hole.
The technical solution is further explained below:
in one embodiment, the first sound outlet hole and the second sound outlet hole are oppositely arranged on two side walls of the shell.
In one embodiment, the housing comprises a front cover and a rear cover, the front cover comprises a cover plate, a bottom plate and a side plate arranged around the bottom plate, and the first sound outlet is arranged in the side plate; the bottom plate is provided with an accommodating hole, the sounding unit is arranged in the accommodating hole, the cover plate is correspondingly covered below the accommodating hole, and the sound guide front cavity is formed between the sounding unit and the cover plate at intervals; the rear cover is arranged on one side, far away from the cover plate, of the front cover, and the rear cover, the side plates, the bottom plate and the sound generating unit are arranged in a surrounding mode to form the coupling rear cavity.
In one embodiment, a sound guiding groove is formed in the position, corresponding to the second sound outlet, of the bottom plate, the sound guiding groove is communicated with the coupling rear cavity, and a groove wall of the sound guiding groove and the rear cover are arranged in an enclosing mode to form the bass tube.
In one embodiment, the hole wall of the receiving hole has a first step portion extending toward the opposite side, and the bottom edge of the sound generating unit is connected to the first step portion.
In one embodiment, the wall of the accommodating hole is provided with a groove recessed towards the side far away from the accommodating hole, and a space is formed between the wall of the groove and the sounding unit.
In one embodiment, one end of the side plate of the front cover, which is far away from the cover plate, is provided with a second step part extending inwards, and the bottom edge of the rear cover is connected with the second step part.
In one embodiment, the housing is provided with a mounting portion for mounting inside the electronic device, the mounting portion being provided with a mounting hole.
In one embodiment, the mounting portions are provided with at least two, two of the mounting portions are arranged oppositely, and the mounting portions are located on two side walls adjacent to the first sound outlet.
In one embodiment, the sound generating unit is at least one of a moving-coil speaker, a MEMS speaker, a moving coil, and a moving-iron earphone core.
An electronic device comprises a device body and the loudspeaker module, wherein the loudspeaker module is arranged in the device body; the equipment body is provided with a sound outlet hole, a first sound outlet hole of the loudspeaker module is arranged corresponding to the sound outlet hole, a sound guide front cavity of the loudspeaker module is communicated with the external space of the equipment body through the first sound outlet hole and the sound outlet hole, and a coupling rear cavity of the loudspeaker module is communicated with the internal space of the equipment body through the second sound outlet hole.
The invention has the beneficial effects that: the bass tube is arranged in the coupling rear cavity, the bass tube is communicated with the inner space of the electronic equipment through the second sound outlet hole, the coupling of the coupling rear cavity of the loudspeaker module and the inner space of the electronic equipment can be increased, the coupling rear cavity of the loudspeaker module is equivalently enlarged, the low-frequency sensitivity of the loudspeaker module can be improved, the integral tone quality is further improved, and the product performance is further improved. Because the low-frequency sensitivity of the loudspeaker module is improved, the smaller the voltage output of the power amplifier is required when the low-frequency sound with the same sound pressure level is emitted, so that the performance requirement on the power amplifier can be reduced, the cost is reduced, the power consumption of the electronic equipment is reduced, and the endurance time of the electronic equipment is prolonged. In addition, after the coupling property of the coupling back cavity of the loudspeaker module and the internal space of the electronic equipment is increased, the acoustic impedance of the whole loudspeaker module can be reduced, so that under the condition that the whole system has the same input signal, the acoustic impedance of the loudspeaker module is smaller, more sound is output, the cost can be reduced, the power consumption of the electronic equipment is reduced, and the endurance time of the electronic equipment is increased. In addition, through setting up the bass tube to make the bass tube pass through the inner space intercommunication of second phonate hole and electronic equipment, can increase the coupling nature of the coupling back cavity of speaker module and electronic equipment inner space like this, thereby restrain the amplitude of speaker module under certain frequency point, for example amplitude under the resonant frequency, make this frequency channel be difficult to trigger the amplitude protection of intelligent power amplifier, intelligent power amplifier can not restrict holistic voltage output yet like this, performance of performance speaker module that so can bigger degree.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of a speaker module according to an embodiment of the invention;
fig. 2 is an exploded view of the speaker module shown in fig. 1;
fig. 3 is a schematic structural diagram of a front cover of the speaker module shown in fig. 2;
FIG. 4 is a top view of the speaker module shown in FIG. 1;
FIG. 5 is a cross-sectional view A-A of the speaker module of FIG. 4;
FIG. 6 is a schematic structural diagram of an electronic device according to an embodiment of the invention;
FIG. 7 is a schematic diagram of the internal structure of the electronic device shown in FIG. 6;
FIG. 8 is a power-to-sound analog diagram of a speaker module according to an embodiment of the present invention;
fig. 9 is a diagram illustrating the acoustic performance of the speaker module according to an embodiment of the present invention.
Description of reference numerals:
10. a housing; 11. a front cover; 111. a cover plate; 112. a base plate; 1121. an accommodating hole; 1122. a first step portion; 1123. a groove; 113. a side plate; 1131. a second step portion; 12. a rear cover; 13. an accommodating chamber; 131. a sound guide front cavity; 132. a rear coupling cavity; 14. a first sound outlet; 15. a second sound outlet; 16. an installation part; 161. mounting holes; 20. a sound emitting unit; 30. a bass tube; 40. an electronic device; 41. an apparatus body; 411. and a sound outlet hole.
[ detailed description ] embodiments
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Referring to fig. 2, 5 and 7, fig. 2 is an exploded view showing the speaker module shown in fig. 1, fig. 5 is a sectional view of the speaker module shown in fig. 4 taken along a-a, and fig. 7 is a schematic view showing the internal structure of the electronic device shown in fig. 6. The speaker module according to an embodiment of the present invention includes a housing 10, a sound unit 20, and a bass tube 30. The housing 10 has a housing chamber 13, and the sound generating unit 20 is disposed in the housing chamber 13 and divides the housing chamber 13 into a sound guide front chamber 131 and a coupling rear chamber 132. The bass tube 30 is disposed within the back coupling chamber 132 and communicates with the back coupling chamber 132. The housing 10 is provided with a first sound outlet 14 and a second sound outlet 15, the first sound outlet 14 is used for communicating the sound guide front cavity 131 with the external space of the electronic device 40, and the second sound outlet 15 is used for communicating the bass tube 30 with the internal space of the electronic device 40.
It should be noted that the electronic device may be an electronic product such as a mobile phone, an earphone, a computer, and the like. The internal space of the electronic device 40 refers to an internal space of the electronic device 40 on a physical structure, that is, an internal space surrounded by a housing of the electronic device 40. The external space of the electronic device 40 is an external space of the electronic device 40 on a physical structure, that is, a space contacted by an outer surface of the electronic device 40, for example, an atmospheric environmental space.
Above-mentioned speaker module sets up bass pipe 30 in coupling back chamber 132, and bass pipe 30 communicates through the inner space of second phonate hole 15 with electronic equipment 40, and cavity 132 and the coupling nature of electronic equipment 40 inner space behind the coupling of multiplicable speaker module like this have been equivalent to the coupling back chamber 132 that has enlarged speaker module, so can improve speaker module's low frequency sensitivity, and then promote whole tone quality to promote product property ability. Because the low-frequency sensitivity of the speaker module is improved, the smaller the voltage output of the power amplifier is required when the low-frequency sound with the same sound pressure level is emitted, so that the performance requirement on the power amplifier can be reduced, the cost is reduced, the power consumption of the electronic equipment 40 is reduced, and the endurance time of the electronic equipment 40 is prolonged. Furthermore, the acoustic impedance of the speaker module can be reduced by increasing the coupling between the rear coupling cavity 132 of the speaker module and the internal space of the electronic device 40, so that the acoustic impedance of the speaker module is smaller and the output of the obtained sound is more under the condition that the whole system has the same input signal, thereby reducing the cost, reducing the power consumption of the electronic device 40 and increasing the endurance time of the electronic device 40. In addition, through setting up bass pipe 30 to make bass pipe 30 pass through the inner space intercommunication of second phonate hole 15 with electronic equipment 40, can increase the coupling nature of coupling back cavity 132 and the inner space of electronic equipment 40 of speaker module like this, thereby restrain the amplitude of speaker module under certain frequency point, for example the amplitude under the resonant frequency, make this frequency channel be difficult to trigger the amplitude protection of intelligent power amplifier, intelligent power amplifier also can not restrict holistic voltage output like this, performance that so can bigger degree's performance of performance speaker module.
It should be noted that, referring to fig. 3, 4 and 5, the bass tube 30 has a certain cross-sectional area and length. The sectional area and length of the bass tube 30 are determined according to the sizes of the sound generating unit 20 and the rear coupling cavity 132, and specifically, different parameters are designed to maximize the driving force distributed between the two ends of the speaker module, referring to the power-sound analogy diagram of the speaker module in fig. 8.
Specifically, in the present embodiment, the length, width and height of the sound unit 20 are 12mm, 16mm and 2.5mm, respectively, the size of the back coupling cavity 132 is 0.6cc, and the length, width and height of the bass tube 30 are 2mm, 3mm and 9mm, respectively.
In one embodiment, referring to fig. 1, 3 and 5, the first sound outlet hole 14 and the second sound outlet hole 15 are respectively disposed on two side walls of the housing 10 opposite to each other. It is understood that the first sound outlet hole 14 is disposed opposite to the second sound outlet hole 15, for example, the first sound outlet hole 14 is disposed opposite to and staggered from the second sound outlet hole 15. Thus, the coupling between the rear coupling cavity 132 of the speaker module and the internal space of the electronic device 40 can be effectively improved, so that the acoustic impedance of the speaker module can be effectively reduced, and the acoustic impedance of the speaker module is smaller and the obtained sound can be more output under the condition that the whole system has the same input signal.
Specifically, in the present embodiment, the first sound outlet 14 and the second sound outlet 15 are arranged opposite to each other and staggered.
In one embodiment, referring to fig. 2, 3 and 5, the housing 10 is a split structure. Specifically, the housing 10 includes a front cover 11 and a rear cover 12, and the rear cover 12 covers the front cover 11 and encloses an accommodating chamber 13 together with the front cover 11. The front cover 11 includes a cover plate 111, a bottom plate 112, and a side plate 113 disposed around the bottom plate 112, and the first sound outlet 14 and the second sound outlet 15 are disposed on the side plate 113. The bottom plate 112 has a receiving hole 1121, the sound unit 20 is disposed in the receiving hole 1121, the cover plate 111 is correspondingly disposed under the receiving hole 1121, and the sound guide front cavity 131 is formed between the sound unit 20 and the cover plate 111 at an interval. The rear cover 12 covers the front cover 11 on the side away from the cover plate 111, and the rear cover 12, the side plate 113, the bottom plate 112 and the sound unit 20 enclose the coupling rear cavity 132. Therefore, the loudspeaker module can be formed, and is simple in structure and convenient to produce and process. Of course, in other embodiments, the housing 10 may be a unitary structure.
Further, referring to fig. 2 and 5, the bottom plate 112 is provided with a sound guiding groove corresponding to the second sound outlet 15, the sound guiding groove is communicated with the coupling rear cavity 132, and the wall of the sound guiding groove and the rear cover 12 are surrounded to form the bass tube 30. Therefore, additional components are not required to be arranged, the structure is simple, and production and processing are convenient.
In one embodiment, referring to fig. 2, 3 and 5, the hole wall of the receiving hole 1121 has a first step portion 1122 extending toward the opposite side. Specifically, the size of the first step portion 1122 may be set according to the size of the sound emitting unit 20, and is not particularly limited herein. By providing the first step portion 1122, the first step portion 1122 can support the sound unit 20, so that the sound unit 20 is easily mounted in the housing 10, and the speaker module is quickly assembled.
Further, the bottom edge of the sound unit 20 is connected to the first step portion 1122 by ultrasonic welding, or the bottom edge of the sound unit 20 is connected to the first step portion 1122 by gluing, so that the sound unit 20 is hermetically fixed in the casing 10, and the accommodating cavity 13 of the casing 10 is divided into the sound guide front cavity 131 and the coupling rear cavity 132 which are not communicated with each other. Of course, in other embodiments, the bottom edge of the sound unit 20 may be connected to the first step portion 1122 in other manners, which is not limited to this.
In one embodiment, referring to fig. 2, 3 and 5, the hole wall of the receiving hole 1121 is provided with a groove 1123 recessed away from the receiving hole 1121, and a space is formed between the groove wall of the groove 1123 and the sound emitting unit 20. Therefore, fingers can be inserted into the groove 1123, so that the sound production unit 20 can be conveniently taken out from the accommodating hole 1121, the structure is simple, and the use is convenient.
It should be noted that, referring to fig. 3, the number of the grooves 1123 may be set according to the use requirement, for example, one or more than two grooves 1123 are provided. The position of the groove 1123 may also be set according to the usage requirement, for example, the groove 1123 may be disposed on a certain edge of the receiving hole 1121, or the groove 1123 may be disposed at a corner of the receiving hole 1121.
Further, referring to fig. 3 and 5, the sidewalls of the groove 1123 are arcuate. In this way, the sound emitting unit 20 can be easily taken out from the receiving hole 1121 of the housing 10 without damaging the fingers. Of course, in other embodiments, the sidewalls of the recess 1123 may be other shapes.
Specifically, in the present embodiment, the receiving hole 1121 is square. The side wall of the groove 1123 is arc-shaped; four grooves 1123 are provided, and the four grooves 1123 are respectively provided at four corners of the square accommodation hole 1121. In this way, the sound unit 20 can be easily taken out from the receiving hole 1121.
In one embodiment, referring to fig. 2, 3 and 5, an end of the side plate 113 of the front cover 11 away from the cover plate 111 has a second step portion 1131 extending inward. By providing the second stepped portion 1131, the second stepped portion 1131 can support the rear cover 12, which facilitates the installation of the rear cover 12 on the front cover 11, and thus, the assembly of the speaker module is quickly achieved.
Further, the bottom edge of the rear cover 12 is connected to the second step portion 1131 by ultrasonic welding, or the bottom edge of the rear cover 12 is connected to the second step portion 1131 by gluing, so that the rear cover 12 can be sealed and fixed on the front cover 11 to form the accommodating cavity 13. Of course, in other embodiments, the bottom edge of the back cover 12 may be connected to the second step portion 1131 in other manners, which is not limited to this.
In one embodiment, referring to fig. 1 and 7, the housing 10 is provided with a mounting portion 16 for mounting inside the electronic device 40, and the mounting portion 16 is provided with a mounting hole 161. Specifically, the mounting portion 16 is provided protruding from a side plate 113 of the front cover 11. When the speaker module is installed, the speaker module is placed in the electronic device 40, and fasteners such as screws are inserted into the mounting holes 161, so that the speaker module can be installed and fixed in the electronic device 40. Of course, in other embodiments, the mounting portion 16 of the speaker module may be soldered within the electronic device 40, or the speaker module may be glued within the electronic device 40.
Further, referring to fig. 3, 5 and 7, at least two mounting portions 16 are provided, wherein two mounting portions 16 are oppositely arranged, and the mounting portions 16 are located at two adjacent side portions of the first sound outlet 14. Therefore, on one hand, the first sound outlet hole 14 of the speaker module can be arranged close to the sound outlet hole 411 of the electronic device 40, so that the sound generating unit 20 can quickly radiate sound to the outside of the electronic device through the first sound outlet hole 14 and the sound outlet hole 411, the coupling between the sound guiding front cavity 131 of the speaker and the internal space of the electronic device 40 is reduced, and the sound quality effect is ensured; on the other hand, the speaker module can be firmly installed in the electronic device 40, and the installation stability of the speaker module is ensured.
In the present embodiment, referring to fig. 3, 5 and 7, six mounting portions 16 are provided, two of the mounting portions 16 are disposed at intervals on a side wall of the casing 10 opposite to the first sound outlet 14, two of the mounting portions 16 are disposed at intervals on a left side wall of the side wall where the first sound outlet 14 is located, and two of the mounting portions 16 are disposed at intervals on a right side wall of the side wall where the first sound outlet 14 is located. Therefore, the loudspeaker module can be firmly installed in the electronic equipment 40, and the installation stability of the loudspeaker module is ensured.
In one embodiment, the sound generating unit 20 is at least one of a moving coil speaker, a MEMS (Micro-Electro-Mechanical System) speaker, a moving coil, and a moving-iron earphone core. The sound generating unit 20 may be one of the above-mentioned types, but is not limited to the above-mentioned speaker type, and the sound generating unit 20 may be capable of generating sound.
Specifically, in this embodiment, the sound generating unit 20 of the speaker module is a moving-coil micro speaker, the sound generating unit 20 is square, and the length, the width and the height of the square sound generating unit 20 are 12mm, 16mm and 2.5mm, respectively. Of course, the sound generating unit 20 may have other shapes, such as a circular shape, and the size of the sound generating unit 20 may be set according to actual requirements, which is not limited thereto.
Referring to fig. 2, 5, 6 and 7, the electronic device provided by the present invention includes a device body 41 and the speaker module of any of the embodiments, where the speaker module is disposed in the device body 41. The device body 41 is provided with a sound outlet 411, the first sound outlet 14 of the speaker module is correspondingly arranged with the sound outlet 411, the sound guiding front cavity 131 of the speaker module is communicated with the external space of the device body 41 through the first sound outlet 14 and the sound outlet 411, and the coupling rear cavity 132 of the speaker module is communicated with the internal space of the device body 41 through the second sound outlet 15.
When the electronic device 40 uses the external radiation function, the sound guide front chamber 131 of the speaker module communicates with the external space of the electronic device 40 through the first sound outlet hole 14 and the sound outlet hole 411, the bass tube 30 communicates with the internal space of the electronic device 40 through the second sound outlet hole 15, and the internal space and the external space of the electronic device 40 are isolated by the device body 41.
The bass tube 30 is arranged in the coupling rear cavity 132 of the electronic equipment, and the bass tube 30 is communicated with the inner space of the electronic equipment 40 through the second sound outlet hole 15, so that the coupling of the coupling rear cavity 132 of the loudspeaker module and the inner space of the electronic equipment 40 can be increased, namely the coupling rear cavity 132 of the loudspeaker module is enlarged, so that the low-frequency sensitivity of the loudspeaker module can be improved, the integral tone quality is further improved, and the product performance is improved. Because the low-frequency sensitivity of the speaker module is improved, the smaller the voltage output of the power amplifier is required when the low-frequency sound with the same sound pressure level is emitted, so that the performance requirement on the power amplifier can be reduced, the cost is reduced, the power consumption of the electronic equipment 40 is reduced, and the endurance time of the electronic equipment 40 is prolonged. Furthermore, the acoustic impedance of the speaker module can be reduced by increasing the coupling between the rear coupling cavity 132 of the speaker module and the internal space of the electronic device 40, so that the acoustic impedance of the speaker module is smaller and the output of the obtained sound is more under the condition that the whole system has the same input signal, thereby reducing the cost, reducing the power consumption of the electronic device 40 and increasing the endurance time of the electronic device 40. In addition, through setting up bass pipe 30 to make bass pipe 30 pass through the inner space intercommunication of second phonate hole 15 with electronic equipment 40, can increase the coupling nature of coupling back cavity 132 and the inner space of electronic equipment 40 of speaker module like this, thereby restrain the amplitude of speaker module under certain frequency point, for example the amplitude under the resonant frequency, make this frequency channel be difficult to trigger the amplitude protection of intelligent power amplifier, intelligent power amplifier also can not restrict holistic voltage output like this, performance that so can bigger degree's performance of performance speaker module.
In one embodiment, the electronic device 40 is a cellular telephone. Specifically, the device body 41 is a cell phone case provided with a sound outlet hole 411. The speaker module of any of the above embodiments is installed in the mobile phone case, and the first sound outlet 14 of the speaker module is disposed corresponding to the sound outlet 411 of the mobile phone case, so that the sound guiding front cavity 131 of the speaker module is communicated with the external space of the mobile phone case through the first sound outlet 14 and the sound outlet 411. Of course, in other embodiments, the electronic device 40 may also be a headset, a computer, or the like.
Referring to fig. 9, fig. 9 shows a graph of the acoustic performance of the speaker module of the present invention. The acoustic performance curve is a comparison of frequency response curves at a distance of 10cm from the sound outlet hole 411 under the same input voltage condition. Without the bass tube 30, the bass sensitivity of the speaker module is low and the amplitude protection of the smart power amplifier is easily triggered at the place of the resonance frequency, resulting in a reduction of the overall volume. Under the condition of the bass tube 30, the low-frequency sensitivity of the loudspeaker module is obviously improved, the preset working amplitude and the output sound pressure level can be achieved under the condition of lower voltage, and the energy consumption is saved; and at resonant frequency department, the amplitude of miniature speaker module has been restrained for this frequency channel is difficult to trigger the amplitude protection of intelligent power amplifier, performance of the performance acoustic device of bigger degree.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A speaker module, comprising:
the sound box comprises a shell, a sound box body and a sound box, wherein the shell is provided with an accommodating cavity and is provided with a first sound outlet hole and a second sound outlet hole;
the sound production unit is arranged in the accommodating cavity, the accommodating cavity is divided into a sound guide front cavity and a coupling rear cavity by the sound production unit, and the sound guide front cavity is communicated with the external space of the electronic equipment through the first sound outlet; and
the bass tube is arranged in the coupling back cavity and communicated with the coupling back cavity, and the bass tube is communicated with the inner space of the electronic equipment through the second sound outlet hole.
2. The speaker module as claimed in claim 1, wherein the first sound outlet and the second sound outlet are disposed opposite to each other on two sidewalls of the housing.
3. The speaker module as claimed in claim 1, wherein the housing comprises a front cover and a rear cover, the front cover comprises a cover plate, a bottom plate and a side plate surrounding the bottom plate, and the first sound outlet is disposed in the side plate; the bottom plate is provided with an accommodating hole, the sounding unit is arranged in the accommodating hole, the cover plate is correspondingly covered below the accommodating hole, and the sound guide front cavity is formed between the sounding unit and the cover plate at intervals; the rear cover is arranged on one side, far away from the cover plate, of the front cover, and the rear cover, the side plates, the bottom plate and the sound generating unit are arranged in a surrounding mode to form the coupling rear cavity.
4. The speaker module as claimed in claim 3, wherein a sound guiding groove is formed on the bottom plate corresponding to the second sound outlet, the sound guiding groove is communicated with the coupling rear cavity, and a groove wall of the sound guiding groove and the rear cover are enclosed to form the bass tube.
5. The speaker module as claimed in claim 3, wherein the hole wall of the receiving hole has a first step portion extending toward the opposite side, and the bottom edge of the sound generating unit is connected to the first step portion.
6. The speaker module as claimed in claim 3, wherein the wall of the receiving hole has a recess recessed toward a side away from the receiving hole, and a space is formed between a wall of the recess and the sound generating unit.
7. The speaker module as claimed in claim 3, wherein the side plate of the front cover has a second step portion extending inward at an end thereof away from the cover plate, and the bottom edge of the rear cover is connected to the second step portion.
8. The speaker module as recited in claim 1, wherein the housing is provided with a mounting portion for mounting inside the electronic device, the mounting portion being provided with a mounting hole.
9. The speaker module as claimed in claim 8, wherein the number of the mounting portions is at least two, two of the mounting portions are disposed opposite to each other, and the mounting portions are disposed on two side walls adjacent to the first sound outlet.
10. The speaker module of any one of claims 1-9, wherein the sound generating unit is at least one of a moving coil speaker, a MEMS speaker, a moving coil, and a moving-iron earphone core.
11. An electronic device, comprising a device body and the speaker module according to any one of claims 1 to 9, wherein the speaker module is disposed in the device body; the equipment body is provided with a sound outlet hole, a first sound outlet hole of the loudspeaker module is arranged corresponding to the sound outlet hole, a sound guide front cavity of the loudspeaker module is communicated with the external space of the equipment body through the first sound outlet hole and the sound outlet hole, and a coupling rear cavity of the loudspeaker module is communicated with the internal space of the equipment body through the second sound outlet hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011145431.9A CN112261543A (en) | 2020-10-23 | 2020-10-23 | Electronic equipment and speaker module thereof |
| PCT/CN2020/125863 WO2022082852A1 (en) | 2020-10-23 | 2020-11-02 | Electronic device and speaker module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011145431.9A CN112261543A (en) | 2020-10-23 | 2020-10-23 | Electronic equipment and speaker module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112261543A true CN112261543A (en) | 2021-01-22 |
Family
ID=74264347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011145431.9A Pending CN112261543A (en) | 2020-10-23 | 2020-10-23 | Electronic equipment and speaker module thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112261543A (en) |
| WO (1) | WO2022082852A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113766053A (en) * | 2021-09-06 | 2021-12-07 | Oppo广东移动通信有限公司 | Speaker module, electronic device and control method |
| CN113949959A (en) * | 2021-10-14 | 2022-01-18 | 维沃移动通信有限公司 | Wireless earphone and audio signal processing method |
| CN114125113A (en) * | 2021-10-09 | 2022-03-01 | 维沃移动通信有限公司 | Sound production module, electronic device, control method, device and medium |
| CN116684787A (en) * | 2022-10-31 | 2023-09-01 | 荣耀终端有限公司 | Electronic equipment |
| CN116684507A (en) * | 2022-09-29 | 2023-09-01 | 荣耀终端有限公司 | Electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117714949A (en) * | 2023-06-13 | 2024-03-15 | 荣耀终端有限公司 | Sounding component, electronic equipment and assembling method |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080025547A1 (en) * | 2006-07-28 | 2008-01-31 | Samsung Electronics Co., Ltd. | Speaker device for mobile terminal |
| CN101170311A (en) * | 2006-10-25 | 2008-04-30 | Lg电子株式会社 | Mobile communication device |
| KR20080058735A (en) * | 2006-12-22 | 2008-06-26 | 엘지전자 주식회사 | Mobile communication terminal |
| CN101588521A (en) * | 2008-05-23 | 2009-11-25 | 富准精密工业(深圳)有限公司 | Sound box structure |
| CN103945299A (en) * | 2014-03-21 | 2014-07-23 | 山东共达电声股份有限公司 | Miniature loudspeaker system and electronic equipment |
| CN103957486A (en) * | 2014-04-29 | 2014-07-30 | 歌尔声学股份有限公司 | Loudspeaker module applied inside terminal |
| CN104540080A (en) * | 2014-12-26 | 2015-04-22 | 歌尔声学股份有限公司 | Loudspeaker module |
| US20170318383A1 (en) * | 2016-05-02 | 2017-11-02 | Dolby International Ab | Sealed pipe-loaded loudspeaker for improving low frequency response in portable devices |
| CN210053554U (en) * | 2019-12-31 | 2020-02-11 | 江西联创宏声电子股份有限公司 | Miniature loudspeaker box and electronic equipment |
| CN110971732A (en) * | 2019-11-28 | 2020-04-07 | 歌尔股份有限公司 | Electronic terminal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107547974B (en) * | 2017-07-04 | 2019-10-22 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
| CN210609693U (en) * | 2019-12-30 | 2020-05-22 | 歌尔科技有限公司 | Speaker module and electronic equipment |
-
2020
- 2020-10-23 CN CN202011145431.9A patent/CN112261543A/en active Pending
- 2020-11-02 WO PCT/CN2020/125863 patent/WO2022082852A1/en active Application Filing
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080025547A1 (en) * | 2006-07-28 | 2008-01-31 | Samsung Electronics Co., Ltd. | Speaker device for mobile terminal |
| CN101170311A (en) * | 2006-10-25 | 2008-04-30 | Lg电子株式会社 | Mobile communication device |
| KR20080058735A (en) * | 2006-12-22 | 2008-06-26 | 엘지전자 주식회사 | Mobile communication terminal |
| CN101588521A (en) * | 2008-05-23 | 2009-11-25 | 富准精密工业(深圳)有限公司 | Sound box structure |
| CN103945299A (en) * | 2014-03-21 | 2014-07-23 | 山东共达电声股份有限公司 | Miniature loudspeaker system and electronic equipment |
| CN103957486A (en) * | 2014-04-29 | 2014-07-30 | 歌尔声学股份有限公司 | Loudspeaker module applied inside terminal |
| CN104540080A (en) * | 2014-12-26 | 2015-04-22 | 歌尔声学股份有限公司 | Loudspeaker module |
| US20170318383A1 (en) * | 2016-05-02 | 2017-11-02 | Dolby International Ab | Sealed pipe-loaded loudspeaker for improving low frequency response in portable devices |
| CN110971732A (en) * | 2019-11-28 | 2020-04-07 | 歌尔股份有限公司 | Electronic terminal |
| CN210053554U (en) * | 2019-12-31 | 2020-02-11 | 江西联创宏声电子股份有限公司 | Miniature loudspeaker box and electronic equipment |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113766053A (en) * | 2021-09-06 | 2021-12-07 | Oppo广东移动通信有限公司 | Speaker module, electronic device and control method |
| CN114125113A (en) * | 2021-10-09 | 2022-03-01 | 维沃移动通信有限公司 | Sound production module, electronic device, control method, device and medium |
| CN113949959A (en) * | 2021-10-14 | 2022-01-18 | 维沃移动通信有限公司 | Wireless earphone and audio signal processing method |
| CN116684507A (en) * | 2022-09-29 | 2023-09-01 | 荣耀终端有限公司 | Electronic equipment |
| CN116684507B (en) * | 2022-09-29 | 2024-03-15 | 荣耀终端有限公司 | Electronic equipment |
| CN116684787A (en) * | 2022-10-31 | 2023-09-01 | 荣耀终端有限公司 | Electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022082852A1 (en) | 2022-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112261543A (en) | Electronic equipment and speaker module thereof | |
| US10567868B2 (en) | Sound generator | |
| US8259985B2 (en) | Speaker set for portable electronic device | |
| US20200213741A1 (en) | Speaker box | |
| US20090190783A1 (en) | Speaker set for portable electronic device | |
| CN216960110U (en) | Loudspeaker box | |
| CN214901292U (en) | Loudspeaker module and electronic equipment | |
| US20130016867A1 (en) | Earpiece having multiple audio chambers | |
| CN108632729A (en) | Microphone device and portable terminal | |
| CN112839276B (en) | Microphone and loudspeaker combination module, earphone and terminal equipment | |
| US20140119591A1 (en) | Micro-speaker | |
| US20120170791A1 (en) | Micro-speaker | |
| US20040017919A1 (en) | Receiver unit | |
| US9467759B2 (en) | Speaker box | |
| KR101534629B1 (en) | Speaker with acoustically excited panel | |
| US10820078B2 (en) | Speaker box | |
| KR101470983B1 (en) | Micro speaker | |
| CN112468908A (en) | Loudspeaker enclosure and method of assembling the same | |
| WO2023051005A1 (en) | Coil-iron loudspeaker assembly and earphone | |
| CN114257919B (en) | Sound producing device and electronic equipment | |
| CN112312246B (en) | Sound production device | |
| CN203352747U (en) | Improved portable loudspeaker box | |
| TWI321960B (en) | Speaker set and portable electronic device incorporating the same | |
| EP3525480A1 (en) | Extension system of woofer and design method thereof | |
| CN217693621U (en) | Bluetooth mini sound box with double passive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210122 |
|
| RJ01 | Rejection of invention patent application after publication |