CN112259484A - Integrated circuit packaging device based on SiP technology - Google Patents
Integrated circuit packaging device based on SiP technology Download PDFInfo
- Publication number
- CN112259484A CN112259484A CN202011034099.9A CN202011034099A CN112259484A CN 112259484 A CN112259484 A CN 112259484A CN 202011034099 A CN202011034099 A CN 202011034099A CN 112259484 A CN112259484 A CN 112259484A
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- CN
- China
- Prior art keywords
- conveying mechanism
- fixedly connected
- mounting box
- cover plate
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Abstract
The invention discloses an integrated circuit packaging device based on a Silicon (SiP) technology, which comprises a cover plate conveying mechanism, wherein a mounting box conveying mechanism is arranged outside the right side of the cover plate conveying mechanism, a cover plate and a mounting box are respectively and movably placed on the cover plate conveying mechanism and the mounting box conveying mechanism, the cover plate conveying mechanism and the mounting box conveying mechanism are mutually vertical, a packaging mechanism is arranged above the cover plate conveying mechanism and the mounting box conveying mechanism, the cover plate conveying mechanism comprises a conveying belt, the top of the conveying belt is fixedly connected with a guide assembly, the mounting box conveying mechanism comprises a conveying belt, and the invention relates to the technical field of integrated circuit production equipment. This integrated circuit packaging hardware based on SiP technique through being provided with apron conveying mechanism, mounting box conveying mechanism, can realize the automatic transport of apron and mounting box to realize automatic encapsulation through packaging mechanism, whole processing process is unified orderly, and degree of automation is high, has reduced operating personnel's intensity of labour.
Description
Technical Field
The invention relates to the technical field of integrated circuit production equipment, in particular to an integrated circuit packaging device based on a silicon on package (SiP) technology.
Background
SiP (System in Package) is an integrated circuit packaging technology developed on the basis of a System on chip (SoC) design concept, and refers to a circuit System with certain functions formed by packaging a plurality of chips or a single chip and passive components such as resistors, capacitors, connectors, crystal oscillators, antennas and the like together.
The existing chip is usually processed by adopting a separated procedure when being packaged, the packaging process is slow, an operator is required to transfer and convey workpieces, a large amount of time and manpower are wasted, the processing efficiency is low, and the automation degree of the whole packaging process is low.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an integrated circuit packaging device based on the SiP technology, which solves the problems that the packaging process is slow, an operator is required to transfer and convey workpieces, a large amount of time and manpower are wasted, the processing efficiency is low, and the automation degree of the whole packaging process is low.
In order to achieve the purpose, the invention is realized by the following technical scheme: an integrated circuit packaging device based on the SiP technology comprises a cover plate conveying mechanism, wherein a mounting box conveying mechanism is arranged outside the right side of the cover plate conveying mechanism, a cover plate and a mounting box are respectively and movably placed on the cover plate conveying mechanism and the mounting box conveying mechanism, the cover plate conveying mechanism and the mounting box conveying mechanism are mutually perpendicular, a packaging mechanism is arranged above the cover plate conveying mechanism and the mounting box conveying mechanism, the cover plate conveying mechanism comprises a conveying belt, the top of the conveying belt is fixedly connected with a guide assembly, the rear side of the top of the conveying belt is fixedly connected with a material blocking assembly and an induction probe, the mounting box conveying mechanism comprises a conveying belt, the right side of the top of the conveying belt is fixedly connected with a guide assembly, the left side of the top of the conveying belt is fixedly connected with a material blocking assembly and an induction probe, the left upper side of, and a material discharging assembly is arranged between the glue brushing assembly and the induction probe and positioned at the top of the conveying belt.
Preferably, the packaging mechanism includes the backup pad, the bottom fixedly connected with slip table of backup pad, the inside swing joint of slip table has the slide, the bottom fixedly connected with of slide is along the first hydraulic stem that vertical direction distributes, two vacuum chuck of mounting panel fixedly connected with are passed through to the output of first hydraulic stem, two vacuum chuck run through the mounting panel and with mounting panel fixed connection, two vacuum chuck is the symmetric distribution about the straight line at first hydraulic stem output axis place, the backup pad passes through the top of support fixed connection between apron conveying mechanism and mounting box conveying mechanism.
Preferably, the direction subassembly includes two fixed plates that are parallel to each other, two vertical direction fixed connection is followed respectively at the top of conveyer belt both sides wall to the fixed plate, the both sides of fixed plate are movable respectively and are run through there are the guide arm, two fixed connection limiting plate between the inner of guide arm, the middle part of fixed plate is run through there is the screw rod, screw rod and fixed plate threaded connection, and the inner of screw rod is connected through rotating seat and limiting plate rotation, the outer end fixed mounting of screw rod has the hand wheel.
Preferably, the brush is glued the subassembly and is included two curb plates that are parallel to each other, two the equal fixedly connected with in the outside of curb plate is two along the stand that vertical direction distributes, two the curb plate all through two stands respectively with the top fixed connection of conveyer belt both sides wall, two glue the box through two support bar fixedly connected with between the curb plate, the top of gluing the box inboard is provided with the rubber roll, the upper right side of rubber roll is provided with the driving roller, the right side below of driving roller is provided with the brush roll, rubber roll, driving roller and brush roll rotate through three drive gear and connect between two curb plates, and two adjacent drive gear intermeshing.
Preferably, it includes the mount pad to arrange the material subassembly, the top fixedly connected with second hydraulic stem of mount pad, the output fixedly connected with push pedal of second hydraulic stem, the output of push pedal perpendicular to second hydraulic stem, mount pad fixed connection is at the top of a lateral wall of conveyer belt, the discharge chute that the top of another lateral wall of conveyer belt and corresponding department fixedly connected with edge slope direction of second hydraulic stem distribute.
Preferably, the material blocking assembly comprises two fixing rods distributed along the vertical direction, the inner walls of the fixing rods are fixedly connected with baffles through two connectors, and rubber gaskets are fixedly connected to the outer sides of the baffles.
Preferably, the two induction probes are positioned on the outer side of one side of the baffle on which the rubber gasket is arranged.
Preferably, the top wall of the mounting box is higher than the top wall of the limit plate.
The invention provides an integrated circuit packaging device based on SiP technology, which has the following beneficial effects compared with the prior art:
(1) this integrated circuit packaging hardware based on SiP technique through being provided with apron conveying mechanism, mounting box conveying mechanism, can realize the automatic transport of apron and mounting box to realize automatic encapsulation through packaging mechanism, whole processing process is unified orderly, and degree of automation is high, has reduced operating personnel's intensity of labour, has improved encapsulation efficiency.
(2) This integrated circuit packaging hardware based on SiP technique through being provided with the direction subassembly, and operating personnel can carry out the adjustment of distance between two limiting plates according to specific packaging material's size and specification to the specific processing requirement of adaptation has improved the flexibility of using, and operating personnel uses more conveniently.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of the cover plate conveying mechanism of the present invention;
FIG. 3 is a schematic structural view of the mounting box conveying mechanism of the present invention;
FIG. 4 is a schematic structural view of a guide assembly of the present invention;
FIG. 5 is a schematic structural view of a brush assembly according to the present invention;
FIG. 6 is a schematic view of a discharge assembly of the present invention;
fig. 7 is a schematic structural view of the material blocking assembly of the present invention;
FIG. 8 is a schematic structural view of the packaging mechanism of the present invention;
in the figure: 1. a cover plate conveying mechanism; 2. a cover plate; 3. mounting a box conveying mechanism; 4. mounting a box; 5. a packaging mechanism; 6. a conveyor belt; 7. a guide assembly; 8. the material blocking component; 9. an inductive probe; 10. brushing a glue component; 11. a discharge assembly; 12. a support plate; 13. a support; 14. a sliding table; 15. a slide base; 16. a first hydraulic lever; 17. mounting a plate; 18. a vacuum chuck; 19. a fixing plate; 20. a guide bar; 21. a limiting plate; 22. a screw; 23. a rotating seat; 24. a hand wheel; 25. a side plate; 26. a column; 27. a supporting strip; 28. a glue box; 29. a rubber roller; 30. a driving roller; 31. a brush roll; 32. a transmission gear; 33. a mounting seat; 34. a second hydraulic rod; 35. pushing the plate; 36. a discharge chute; 37. fixing the rod; 38. a connector; 39. a baffle plate; 40. a rubber gasket.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-8, the present invention provides a technical solution: an integrated circuit packaging device based on a silicon technology comprises a cover plate conveying mechanism 1, a mounting box conveying mechanism 3 is arranged outside the right side of the cover plate conveying mechanism 1, a cover plate 2 and a mounting box 4 are respectively and movably placed on the cover plate conveying mechanism 1 and the mounting box conveying mechanism 3, the cover plate conveying mechanism 1 and the mounting box conveying mechanism 3 are mutually perpendicular, a packaging mechanism 5 is arranged above the cover plate conveying mechanism 1 and the mounting box conveying mechanism 3, the cover plate conveying mechanism 1 comprises a conveying belt 6, a guide assembly 7 is fixedly connected to the top of the conveying belt 6, a material blocking assembly 8 and an inductive probe 9 are fixedly connected to the rear side of the top of the conveying belt 6, the mounting box conveying mechanism 3 comprises a conveying belt 6, a guide assembly 7 is fixedly connected to the right side of the top of the conveying belt 6, a material blocking assembly 8 and an inductive probe 9 are fixedly connected to the left side of the top of the conveying, a material discharging component 11 is arranged between the glue brushing component 10 and the inductive probe 9 and positioned at the top of the conveyer belt 6, the packaging mechanism 5 comprises a support plate 12, the bottom of the support plate 12 is fixedly connected with a sliding table 14, the inside of the sliding table 14 is movably connected with a sliding seat 15, the bottom of the sliding seat 15 is fixedly connected with a first hydraulic rod 16 which is distributed along the vertical direction, the output end of the first hydraulic rod 16 is fixedly connected with two vacuum suckers 18 through a mounting plate 17, the two vacuum suckers 18 penetrate through the mounting plate 17 and are fixedly connected with the mounting plate 17, the two vacuum suckers 18 are symmetrically distributed about the straight line of the output end axis of the first hydraulic rod 16, the support plate 12 is fixedly connected above the space between the cover plate conveying mechanism 1 and the mounting box conveying mechanism 3 through a bracket 13, the guide component 7 comprises two fixing plates 19 which are parallel to each other, guide rods 20 are movably penetrated through two sides of a fixed plate 19 respectively, a limit plate 21 is fixedly connected between the inner ends of the two guide rods 20, a screw rod 22 is penetrated through the middle part of the fixed plate 19, the screw rod 22 is in threaded connection with the fixed plate 19, the inner end of the screw rod 22 is rotatably connected with the limit plate 21 through a rotating seat 23, a hand wheel 24 is fixedly installed at the outer end of the screw rod 22, a glue brushing assembly 10 comprises two side plates 25 which are parallel to each other, two upright columns 26 which are distributed along the vertical direction are fixedly connected to the outer sides of the two side plates 25, the two side plates 25 are respectively and fixedly connected with the top parts of two side walls of a conveying belt 6 through the two upright columns 26, a glue box 28 is fixedly connected between the two side plates 25 through two supporting bars 27, a glue roller 29 is arranged at the top part of the inner side of the glue box 28, a driving roller 30 is arranged above the right of the glue roller, and two adjacent transmission gears 32 are meshed with each other, the discharging assembly 11 comprises a mounting seat 33, a second hydraulic rod 34 is fixedly connected to the top of the mounting seat 33, a push plate 35 is fixedly connected to the output end of the second hydraulic rod 34, the push plate 35 is perpendicular to the output end of the second hydraulic rod 34, the mounting seat 33 is fixedly connected to the top of one side wall of the conveying belt 6, a discharge chute 36 which is distributed along the inclined direction is fixedly connected to the top of the other side wall of the conveying belt 6 and corresponds to the second hydraulic rod 34, the material blocking assembly 8 comprises two fixing rods 37 which are distributed along the vertical direction, a baffle 39 is fixedly connected to the inner wall of the two fixing rods 37 through two connectors 38, a rubber gasket 40 is fixedly connected to the outer side of the baffle 39, the two inductive probes 9 are both positioned on the outer side of the baffle 39, the top wall of the mounting box 4 is higher, The mounting box conveying mechanism 3 can realize automatic conveying of the cover plate 2 and the mounting box 4, automatic packaging is realized through the packaging mechanism 5, the whole processing process is uniform and orderly, the automation degree is high, the labor intensity of operators is reduced, and the packaging efficiency is improved.
During operation, the cover plate 2 is conveyed along the cover plate conveying mechanism 1, the mounting box 4 is conveyed along the mounting box conveying mechanism 3, the cover plate 2 is limited on the cover plate conveying mechanism 1 through the material blocking component 8, meanwhile, after the sensing probe 9 detects the cover plate 2, the cover plate conveying mechanism 1 stops running, on the mounting box conveying mechanism 3, the mounting box 4 moves to the left side of the conveying belt 6 along the guide component 7, when the mounting box passes through the glue brushing component 10, under the action of the three transmission gears 32, the glue roller 29 rotates to carry glue in the glue box 28 to be transmitted to the brush roller 31 through the transmission roller 30, the brush roller 31 coats the glue on the top of the mounting box 4, then the mounting box 4 continues to move along the conveying belt 6 until the glue blocking component 8 is touched, meanwhile, the sensing probe 9 detects the mounting box 4, the conveying belt 6 stops running, an operator controls the sliding table 14 to realize left movement of the sliding seat 15, the output end of the first hydraulic rod 16 extends outwards to enable the two vacuum suckers 18 to adsorb the cover plate 2, then the output end of the first hydraulic rod 16 is controlled to retract and move the sliding seat 15 to the right, the sliding seat 15 is located above the mounting box 4, then the output end of the first hydraulic rod 16 is controlled to extend outwards to enable the cover plate 2 to be clamped with the top of the mounting box 4 and fixed mounting is completed under the action of glue, then an operator controls the output end of the second hydraulic rod 34 to extend outwards to discharge the packaged workpiece through the discharge chute 36 under the action of the push plate 35, after the cover plate 2 is adsorbed by the vacuum suckers 18 and separated from the cover plate conveying mechanism 1, the induction probe 9 is inducted to lose efficacy, the conveying belt 6 can continue to operate until the next cover plate 2 conveyed along with the conveying belt 6 is inducted, and under the action of the discharge assembly 11, the induction probe 9 cannot induct the mounting box 4, the conveyor belt 6 can continue to run until the sensing probe 9 senses the next mounting box 4, so that automatic packaging is realized.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. An integrated circuit packaging device based on SiP technology, including apron conveying mechanism (1), its characterized in that: the mounting box conveying mechanism (3) is arranged outside the right side of the cover plate conveying mechanism (1), the cover plate (2) and the mounting box (4) are respectively and movably placed on the cover plate conveying mechanism (1) and the mounting box conveying mechanism (3), the cover plate conveying mechanism (1) and the mounting box conveying mechanism (3) are mutually perpendicular, a packaging mechanism (5) is arranged above the cover plate conveying mechanism (1) and the mounting box conveying mechanism (3), the cover plate conveying mechanism (1) comprises a conveying belt (6), a guide assembly (7) is fixedly connected to the top of the conveying belt (6), a material blocking assembly (8) and an inductive probe (9) are fixedly connected to the rear side of the top of the conveying belt (6), the mounting box conveying mechanism (3) comprises a conveying belt (6), a guide assembly (7) is fixedly connected to the right side of the top of the conveying belt (6), a material blocking assembly (8) and an inductive probe (9) are, the top fixedly connected with brush glue subassembly (10) that direction subassembly (7) left top just is located conveyer belt (6), the top that just is located conveyer belt (6) between brush glue subassembly (10) and inductive probe (9) is provided with row material subassembly (11).
2. An integrated circuit package arrangement based on SiP technology according to claim 1, characterized in that: packaging mechanism (5) includes backup pad (12), the bottom fixedly connected with slip table (14) of backup pad (12), the inside swing joint of slip table (14) has slide (15), the bottom fixedly connected with of slide (15) is along first hydraulic stem (16) that vertical direction distributes, the output of first hydraulic stem (16) passes through two vacuum chuck (18), two of mounting panel (17) fixedly connected with vacuum chuck (18) run through mounting panel (17) and with mounting panel (17) fixed connection, two vacuum chuck (18) are the symmetric distribution about the straight line at first hydraulic stem (16) output axis place, backup pad (12) are through support (13) fixed connection in the top between apron conveying mechanism (1) and mounting box conveying mechanism (3).
3. An integrated circuit package arrangement based on SiP technology according to claim 1, characterized in that: direction subassembly (7) include two fixed plate (19) that are parallel to each other, two fixed plate (19) are respectively along the top of vertical direction fixed connection at conveyer belt (6) both sides wall, the both sides of fixed plate (19) are movable respectively and are run through guide arm (20), two fixed connection limiting plate (21) between the inner of guide arm (20), the middle part of fixed plate (19) is run through has screw rod (22), screw rod (22) and fixed plate (19) threaded connection, and the inner of screw rod (22) is connected with limiting plate (21) rotation through rotating seat (23), the outer end fixed mounting of screw rod (22) has hand wheel (24).
4. An integrated circuit package arrangement based on SiP technology according to claim 1, characterized in that: brush gluey subassembly (10) includes two curb plate (25) that are parallel to each other, two equal fixedly connected with in the outside of curb plate (25) two stand (26) along vertical direction distribution, two curb plate (25) all through two stand (26) respectively with the top fixed connection of conveyer belt (6) both sides wall, two glue box (28) through two support bar (27) fixedly connected with between curb plate (25), the top of gluing box (28) inboard is provided with rubber roll (29), the upper right side of rubber roll (29) is provided with driving roller (30), the right side below of driving roller (30) is provided with brush roller (31), rubber roll (29), driving roller (30) and brush roller (31) rotate through three drive gear (32) and connect between two curb plate (25), and two adjacent drive gear (32) intermeshing.
5. An integrated circuit package arrangement based on SiP technology according to claim 1, characterized in that: arrange material subassembly (11) and include mount pad (33), top fixedly connected with second hydraulic stem (34) of mount pad (33), output fixedly connected with push pedal (35) of second hydraulic stem (34), the output of push pedal (35) perpendicular to second hydraulic stem (34), mount pad (33) fixed connection is at the top of a lateral wall of conveyer belt (6), the discharge chute (36) that the top of another lateral wall of conveyer belt (6) just located fixedly connected with along the incline direction and distribute with second hydraulic stem (34) corresponding.
6. An integrated circuit package arrangement based on SiP technology according to claim 1, characterized in that: keep off material subassembly (8) including two dead levers (37) that distribute along vertical direction, two the inner wall of dead lever (37) is through two connectors (38) fixedly connected with baffle (39), the outside fixedly connected with rubber gasket (40) of baffle (39).
7. An integrated circuit package arrangement based on SiP technology according to claim 6, characterized in that: the two induction probes (9) are positioned on the outer side of one side of the baffle (39) where the rubber gasket (40) is installed.
8. An integrated circuit package arrangement based on SiP technology according to claim 3, characterized in that: the top wall of the mounting box (4) is higher than that of the limiting plate (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011034099.9A CN112259484A (en) | 2020-09-27 | 2020-09-27 | Integrated circuit packaging device based on SiP technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011034099.9A CN112259484A (en) | 2020-09-27 | 2020-09-27 | Integrated circuit packaging device based on SiP technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112259484A true CN112259484A (en) | 2021-01-22 |
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ID=74233855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011034099.9A Withdrawn CN112259484A (en) | 2020-09-27 | 2020-09-27 | Integrated circuit packaging device based on SiP technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112259484A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115367194A (en) * | 2022-07-07 | 2022-11-22 | 四川西南联盛通讯技术有限公司 | A energy-saving baling equipment for producing cell-phone |
-
2020
- 2020-09-27 CN CN202011034099.9A patent/CN112259484A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115367194A (en) * | 2022-07-07 | 2022-11-22 | 四川西南联盛通讯技术有限公司 | A energy-saving baling equipment for producing cell-phone |
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Application publication date: 20210122 |