CN112248331B - Chip glue spreading constant-temperature turnover device and method - Google Patents
Chip glue spreading constant-temperature turnover device and method Download PDFInfo
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- CN112248331B CN112248331B CN202011513465.9A CN202011513465A CN112248331B CN 112248331 B CN112248331 B CN 112248331B CN 202011513465 A CN202011513465 A CN 202011513465A CN 112248331 B CN112248331 B CN 112248331B
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- 239000003292 glue Substances 0.000 title claims abstract description 77
- 238000003892 spreading Methods 0.000 title claims abstract description 42
- 230000007306 turnover Effects 0.000 title claims abstract description 29
- 230000007480 spreading Effects 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 238000005096 rolling process Methods 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 230000003111 delayed effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 239000002305 electric material Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000000181 anti-adherent effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/36—Removing moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to a chip glue spreading constant-temperature turnover device which comprises an upper die and a lower die which are hemispherical, wherein the upper die and the lower die form a complete sphere when being clamped and connected; the chip glue-spreading constant-temperature turnover device also comprises a feeding assembly, a manipulator and a conveying belt; the feeding assembly comprises two guide rail strips and a pushing mechanism which are transversely arranged side by side, and positioning grooves are respectively arranged on two sides of the outer surface of the lower die; the conveying belt is obliquely arranged at an angle smaller than 30 degrees, the upper surface of the conveying belt moves from low to high, and an electric striker plate is arranged at the lower end of the conveying belt; the lower die is provided with a glue filling cavity and a constant temperature heating unit, and the constant temperature heating unit comprises a spiral heating wire sleeved outside the glue filling cavity; the upper die is provided with a sealing cover part; not only can be in batches spread the encapsulation of gluing to the chip and carry out the delayed cooling processing of heating, still adopt the transmission band to drive the spheroid and carry out the roll of random direction simultaneously and make the deposit of inside glue distribute very evenly at the in-process that solidifies.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a chip glue spreading constant-temperature turnover device and method.
Background
The chip needs to be spread with glue and packaged during processing, most of the conventional packaging molds adopted at present only adapt to glue spreading action, glue is waited to solidify after glue spreading, and precipitates in the glue are distributed at the bottom during processing in the mode, so that the distribution is extremely uneven, and the packaging effect is influenced.
Disclosure of Invention
The invention aims to solve the technical problem of providing a chip glue spreading constant-temperature turnover device and method aiming at the defects in the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the chip glue spreading constant-temperature turnover device comprises an upper die and a lower die which are hemispherical, wherein a plurality of buckles are arranged on the edge of the lower end of the upper die, a plurality of bayonets corresponding to the buckles are arranged on the edge of the upper end of the lower die, and the upper die and the lower die form a complete sphere when being clamped and connected; the chip glue-spreading constant-temperature turnover device further comprises a feeding assembly for feeding the lower die, a manipulator for feeding the upper die and a conveying belt; the feeding assembly comprises two guide rail strips and a pushing mechanism which are transversely arranged side by side, positioning grooves corresponding to the guide rail strips are respectively arranged on two sides of the outer surface of the lower die, and the pushing mechanism is used for pushing the lower die to translate on the two guide rail strips; the conveying belt is positioned right below one end of the guide rail bar for discharging and is obliquely arranged at an angle smaller than 30 degrees, the upper surface of the conveying belt moves from low to high, baffles are arranged on two sides of the conveying belt, and an electric striker plate is arranged at the lower end of the conveying belt; the lower die is provided with a glue filling cavity for placing glue for a chip and a constant-temperature heating unit for heating the glue filling cavity at constant temperature, and the constant-temperature heating unit comprises a spiral heating wire sleeved outside the glue filling cavity; jacks corresponding to the chip pins are arranged in the glue filling cavity; the upper die is provided with a sealing cover part for sealing the glue filling cavity when being connected with the lower die; the chip glue spreading constant-temperature turnover device further comprises a glue pouring machine for pouring glue into the lower die.
The chip glue spreading constant-temperature turnover device is characterized in that a glue inlet preventing sleeve is arranged in each jack; the inner wall of the glue filling cavity and the surface of the sealing cover part are provided with anti-sticking coatings.
The chip glue spreading constant-temperature turnover device is characterized in that the sealing cover part is made of a copper plate or a stainless steel plate.
The chip glue spreading constant-temperature turnover device is characterized in that a sealing ring sleeved on the periphery of an opening of the glue pouring cavity and an annular mounting groove body for mounting the sealing ring are arranged on the surface of the lower die.
The chip glue-spreading constant-temperature turnover device is characterized in that a stripping thimble and a pushing assembly for driving the stripping thimble to move to strip a workpiece in a glue-pouring cavity are arranged in the lower die.
The chip glue-spreading constant-temperature turnover device comprises a pushing assembly, a lower die and a lower die, wherein the pushing assembly comprises a guide pillar, the lower end of the lower die is provided with an opening for the guide pillar to move, and a return spring for moving and resetting the guide pillar is arranged in the opening; in an initial state, the lower end of the guide pillar is located in the open hole, and the upper end of the guide pillar is connected with the lower end of the stripping thimble.
The chip glue-spreading constant-temperature turnover device provided by the invention is characterized in that the constant-temperature heating unit further comprises a power supply battery and a control switch for controlling the on-off of the heating wire.
A chip glue spreading constant-temperature overturning method comprises the following steps of:
the chip is placed in the glue filling cavity of the lower die, and pins of the chip are correspondingly inserted into the jacks; under the positioning of the two guide rail bars and the two positioning grooves on the lower die, the lower die with the chips placed thereon is penetrated from the feeding ends of the two guide rail bars in batches;
opening the constant-temperature heating unit on the lower die, after the glue-pouring machine pours glue into the glue-pouring cavities on the lower dies one by one or in batches, placing the upper dies on the lower dies one by one or in batches by the manipulator and providing downward pressure to clamp the upper dies and the lower dies, and sealing the glue-pouring cavities by the sealing cover part;
the ball formed by combining the upper dies and the lower dies is pushed down from the discharging ends of the two guide rail bars by the material pushing mechanism, falls on the conveying belt, rolls downwards along the conveying belt and is finally blocked by the electric striker plate; the transmission belt drives the ball to rotate in random directions in the process of rolling down the ball and/or moving obliquely upwards after rolling down the ball;
and when the set glue spreading cooling time is reached, the electric striker plate is controlled to be opened, the transmission belt continues to run, the ball rolls for blanking, and the upper die and the lower die are opened to take out the glue spreading rear chip.
The invention has the beneficial effects that: the chip is placed in the glue filling cavity of the lower die, and pins of the chip are correspondingly inserted into the jacks; under the positioning of the two guide rail bars and the two positioning grooves on the lower die, the lower die with the chips placed thereon is penetrated from the feeding ends of the two guide rail bars in batches; opening the constant-temperature heating unit on the lower die, after the glue-pouring machine pours glue into the glue-pouring cavities on the lower dies one by one or in batches, placing the upper dies on the lower dies one by one or in batches by the manipulator and providing downward pressure to clamp the upper dies and the lower dies, and sealing the glue-pouring cavities by the sealing cover part; the ball formed by combining the upper dies and the lower dies is pushed down from the discharging ends of the two guide rail bars by the material pushing mechanism, falls on the conveying belt, rolls downwards along the conveying belt and is finally blocked by the electric striker plate; the transmission belt drives the ball to rotate in random directions in the process of rolling down the ball and/or moving obliquely upwards after rolling down the ball; the set glue spreading cooling time is reached, the electric material baffle plate is controlled to be opened, the conveying belt continues to run, the ball body rolls for blanking, and the upper die and the lower die are opened to take out the glue spread chips; adopt the mould of this application, not only can be in batches spread gluey encapsulation and heat and postpone cooling treatment to the chip, still adopt the transmission band to drive the spheroid and carry out the roll of random direction simultaneously and make the precipitate of inside glue very even at the in-process that solidifies, and then improve the encapsulation effect by a wide margin, machining efficiency also need be higher than current shop gluey automatic cooling equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
FIG. 1 is a sectional view of a chip glue-spreading constant-temperature turnover device according to a preferred embodiment of the present invention;
fig. 2 is a top view of the chip glue-spreading constant-temperature turnover device according to the preferred embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
As shown in fig. 1 and also shown in fig. 2, the chip glue-spreading constant-temperature turnover device according to the preferred embodiment of the invention comprises an upper die 1 and a lower die 2 which are hemispherical, wherein a plurality of buckles 11 are arranged on the edge of the lower end of the upper die 1, a plurality of bayonets 26 corresponding to the buckles are arranged on the edge of the upper end of the lower die, and the upper die 1 and the lower die 2 form a complete sphere when being clamped and connected; the chip glue-spreading constant-temperature turnover device also comprises a feeding assembly for feeding the lower die 2, a manipulator for feeding the upper die 1 and a conveying belt 5; the feeding assembly comprises two guide rail strips 30 and a material pushing mechanism 31 (which can be conventional linear mechanisms such as an air cylinder and the like) which are transversely arranged side by side, positioning grooves 27 corresponding to the guide rail strips 30 are respectively arranged on two sides of the outer surface of the lower die 2, and the material pushing mechanism 31 is used for pushing the lower die to translate on the two guide rail strips 30; the conveying belt 5 is positioned right below one end of the guide rail bar 30 for discharging and is obliquely arranged at an angle smaller than 30 degrees, the upper surface of the conveying belt 5 moves from low to high, the two sides of the conveying belt 5 are provided with baffle plates 51, and the lower end of the conveying belt 5 is provided with an electric striker plate 50; the lower die 2 is provided with a glue filling cavity 20 for placing glue on the chip 6 and a constant temperature heating unit for heating the glue filling cavity at constant temperature, and the constant temperature heating unit comprises a spiral heating wire 21 sleeved outside the glue filling cavity; a jack 22 corresponding to the chip pin is arranged in the glue filling cavity 20; the upper die 1 is provided with a sealing cover part 10 for sealing the glue filling cavity when being connected with the lower die 2; the chip glue-spreading constant-temperature turnover device also comprises a glue-pouring machine for pouring glue into the lower die 2;
the chip 6 is placed in the glue filling cavity 20 of the lower die, and pins of the chip 6 are correspondingly inserted into the jacks 22; under the positioning of the two guide rail bars and the two positioning grooves on the lower die, the lower die with the chips placed thereon is penetrated from the feeding ends of the two guide rail bars in batches; opening the constant-temperature heating unit on the lower die, after the glue-pouring machine pours glue into the glue-pouring cavities on the lower dies one by one or in batches, placing the upper dies on the lower dies one by one or in batches by the manipulator and providing downward pressure to clamp the upper dies and the lower dies, and sealing the glue-pouring cavities by the sealing cover part; the ball formed by combining the upper dies and the lower dies is pushed down from the discharging ends of the two guide rail bars by the material pushing mechanism, falls on the conveying belt, rolls downwards along the conveying belt and is finally blocked by the electric striker plate; the transmission belt drives the ball to rotate in random directions in the process of rolling down the ball and/or moving obliquely upwards after rolling down the ball; the set glue spreading cooling time is reached, the electric material baffle plate is controlled to be opened, the conveying belt continues to run, the ball body rolls for blanking, and the upper die and the lower die are opened to take out the glue spread chips; adopt the mould of this application, not only can be in batches spread gluey encapsulation and heat and postpone cooling treatment to the chip, still adopt the transmission band to drive the spheroid and carry out the roll of random direction simultaneously and make the precipitate of inside glue very even at the in-process that solidifies, and then improve the encapsulation effect by a wide margin, machining efficiency also need be higher than current shop gluey automatic cooling equipment.
Preferably, a glue-feeding-preventing sleeve 220 is arranged in the jack 22; the inner wall of the glue filling cavity 20 and the surface of the sealing cover part 10 are provided with anti-sticking coatings; the positioning reliability is guaranteed, and meanwhile, the pins are prevented from contacting glue; the adhesion can be avoided by the anti-adhesive coating.
Preferably, the capping portion 10 is made of a copper plate or a stainless steel plate; the flatness is easy to control, and the stripping is convenient.
Preferably, the surface of the lower die 2 is provided with a sealing ring 24 sleeved on the periphery of the opening of the glue filling cavity 20 and an annular mounting groove body 25 for mounting the sealing ring; the sealing performance when the upper die and the lower die are connected is convenient to ensure.
Preferably, a stripping thimble 23 and a pushing assembly for driving the stripping thimble to move to strip the workpiece in the glue pouring cavity are arranged in the lower die 2; the pushing assembly comprises a guide post 280, the lower end of the lower die 2 is provided with an opening for the guide post to move, and a return spring 281 for moving and resetting the guide post is arranged in the opening; in the initial state, the lower end of the guide post is positioned in the open hole, and the upper end of the guide post 280 is connected with the lower end of the stripping thimble 23; the inner chip is conveniently ejected out in a mode of externally jacking the guide pillar, and the material stripping operation is convenient.
Preferably, the constant temperature heating unit further comprises a power supply battery and a control switch for controlling the on-off of the heating wire; the operation and control are convenient; the control switch may be wired or wireless.
A chip glue spreading constant-temperature overturning method comprises the following steps of:
the chip is placed in the glue filling cavity of the lower die, and pins of the chip are correspondingly inserted into the jacks; under the positioning of the two guide rail bars and the two positioning grooves on the lower die, the lower die with the chips placed thereon is penetrated from the feeding ends of the two guide rail bars in batches;
opening the constant-temperature heating unit on the lower die, after the glue-pouring machine pours glue into the glue-pouring cavities on the lower dies one by one or in batches, placing the upper dies on the lower dies one by one or in batches by the manipulator and providing downward pressure to clamp the upper dies and the lower dies, and sealing the glue-pouring cavities by the sealing cover part;
the ball formed by combining the upper dies and the lower dies is pushed down from the discharging ends of the two guide rail bars by the material pushing mechanism, falls on the conveying belt, rolls downwards along the conveying belt and is finally blocked by the electric striker plate; the transmission belt drives the ball to rotate in random directions in the process of rolling down the ball and/or moving obliquely upwards after rolling down the ball;
the set glue spreading cooling time is reached, the electric material baffle plate is controlled to be opened, the conveying belt continues to run, the ball body rolls for blanking, and the upper die and the lower die are opened to take out the glue spread chips;
adopt the mould of this application, not only can be in batches spread gluey encapsulation and heat and postpone cooling treatment to the chip, still adopt the transmission band to drive the spheroid and carry out the roll of random direction simultaneously and make the precipitate of inside glue very even at the in-process that solidifies, and then improve the encapsulation effect by a wide margin, machining efficiency also need be higher than current shop gluey automatic cooling equipment.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (8)
1. A chip glue spreading constant-temperature turnover device is characterized by comprising an upper die and a lower die which are hemispherical, wherein the edge of the lower end of the upper die is provided with a plurality of buckles, the edge of the upper end of the lower die is provided with a plurality of bayonets corresponding to the buckles, and the upper die and the lower die form a complete sphere when being clamped and connected; the chip glue-spreading constant-temperature turnover device further comprises a feeding assembly for feeding the lower die, a manipulator for feeding the upper die and a conveying belt; the feeding assembly comprises two guide rail strips and a pushing mechanism which are transversely arranged side by side, positioning grooves corresponding to the guide rail strips are respectively arranged on two sides of the outer surface of the lower die, and the pushing mechanism is used for pushing the lower die to translate on the two guide rail strips; the conveying belt is positioned right below one end of the guide rail bar for discharging and is obliquely arranged at an angle smaller than 30 degrees, the upper surface of the conveying belt moves from low to high, baffles are arranged on two sides of the conveying belt, and an electric striker plate is arranged at the lower end of the conveying belt; the lower die is provided with a glue filling cavity for placing glue for a chip and a constant-temperature heating unit for heating the glue filling cavity at constant temperature, and the constant-temperature heating unit comprises a spiral heating wire sleeved outside the glue filling cavity; jacks corresponding to the chip pins are arranged in the glue filling cavity; the upper die is provided with a sealing cover part for sealing the glue filling cavity when being connected with the lower die; the chip glue spreading constant-temperature turnover device further comprises a glue pouring machine for pouring glue into the lower die.
2. The chip glue-spreading constant-temperature turnover device according to claim 1, wherein a glue-entering prevention sleeve is arranged in the insertion hole; the inner wall of the glue filling cavity and the surface of the sealing cover part are provided with anti-sticking coatings.
3. The chip spreading constant-temperature turnover device of claim 1, wherein the cover part is made of a copper plate or a stainless steel plate.
4. The chip glue-spreading constant-temperature turnover device as claimed in claim 1, wherein a sealing ring sleeved on the periphery of the opening of the glue-pouring chamber and an annular mounting groove body for mounting the sealing ring are arranged on the surface of the lower die.
5. The chip glue-spreading constant-temperature turnover device according to any one of claims 1 to 4, wherein a stripping thimble and a pushing assembly for driving the stripping thimble to move to strip a workpiece in the glue-pouring cavity are arranged in the lower die.
6. The chip glue-spreading constant-temperature turnover device according to claim 5, wherein the pushing assembly comprises a guide post, an opening for the guide post to move is formed in the lower end of the lower die, and a return spring for moving and returning the guide post is arranged in the opening; in an initial state, the lower end of the guide pillar is located in the open hole, and the upper end of the guide pillar is connected with the lower end of the stripping thimble.
7. The chip spreading glue constant-temperature turnover device according to any one of claims 1-4, wherein the constant-temperature heating unit further comprises a power supply battery and a control switch for controlling the on-off of the heating wire.
8. A chip glue-spreading constant-temperature overturning method, the chip glue-spreading constant-temperature overturning device according to any one of claims 1 to 7, characterized by comprising the following steps:
the chip is placed in the glue filling cavity of the lower die, and pins of the chip are correspondingly inserted into the jacks; under the positioning of the two guide rail bars and the two positioning grooves on the lower die, the lower die with the chips placed thereon is penetrated from the feeding ends of the two guide rail bars in batches;
opening the constant-temperature heating unit on the lower die, after the glue-pouring machine pours glue into the glue-pouring cavities on the lower dies one by one or in batches, placing the upper dies on the lower dies one by one or in batches by the manipulator and providing downward pressure to clamp the upper dies and the lower dies, and sealing the glue-pouring cavities by the sealing cover part;
the ball formed by combining the upper dies and the lower dies is pushed down from the discharging ends of the two guide rail bars by the material pushing mechanism, falls on the conveying belt, rolls downwards along the conveying belt and is finally blocked by the electric striker plate; the transmission belt drives the ball to rotate in random directions in the process of rolling down the ball and/or moving obliquely upwards after rolling down the ball;
and when the set glue spreading cooling time is reached, the electric striker plate is controlled to be opened, the transmission belt continues to run, the ball rolls for blanking, and the upper die and the lower die are opened to take out the glue spreading rear chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011513465.9A CN112248331B (en) | 2020-12-21 | 2020-12-21 | Chip glue spreading constant-temperature turnover device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011513465.9A CN112248331B (en) | 2020-12-21 | 2020-12-21 | Chip glue spreading constant-temperature turnover device and method |
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| Publication Number | Publication Date |
|---|---|
| CN112248331A CN112248331A (en) | 2021-01-22 |
| CN112248331B true CN112248331B (en) | 2021-03-16 |
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| CN202011513465.9A Active CN112248331B (en) | 2020-12-21 | 2020-12-21 | Chip glue spreading constant-temperature turnover device and method |
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| CN113270527B (en) * | 2021-05-17 | 2022-06-03 | 深圳极光王科技股份有限公司 | Mini-LED packaging and cooling device and method |
| CN115872096B (en) * | 2022-11-23 | 2023-11-28 | 苏州锐杰微科技集团有限公司 | Full-automatic feeding equipment and feeding method for chip packaging production line |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168533A (en) * | 1982-03-31 | 1983-10-04 | Meisei Kogyo Kk | Foam-molding method of tubular heat insulating material |
| JPH04292450A (en) * | 1991-03-20 | 1992-10-16 | Kubota Corp | Casting of slip of ceramics into molded article by centrifugal force |
| JPH04294104A (en) * | 1991-03-25 | 1992-10-19 | Suzuki Motor Corp | Composite ceramic and method for preparation thereof |
| JP3651698B2 (en) * | 1995-04-28 | 2005-05-25 | 株式会社アサヒオプティカル | Manufacturing method of plastic lens |
| IT248840Y1 (en) * | 1999-05-21 | 2003-02-20 | Stocchiero Franco | MIXER FOR THE PREPARATION OF DYES TO BE USED PREFERABLY IN THE COLORING OF PRINTED ARTICLES IN PLASTIC MATERIAL. |
| CN108237655B (en) * | 2018-01-19 | 2020-05-19 | 太仓法斯特汽车配件有限公司 | Intelligent control's flexible injection molding car light mould of electromagnetism |
| CN110281441A (en) * | 2018-03-19 | 2019-09-27 | 江苏威瑞医疗器械有限公司 | One kind is enlarged the bosom with silicone production mould |
| CN209240335U (en) * | 2018-12-17 | 2019-08-13 | 深圳市勇创塑胶有限公司 | A kind of vibration moulding mechanism for vehicle-mounted panel mold |
| CN212097149U (en) * | 2020-04-03 | 2020-12-08 | 苏州克莱尔精密模具有限公司 | Mechanical die with cooling function |
| CN111844643A (en) * | 2020-07-28 | 2020-10-30 | 叶强 | Injection mold is used in production of disposable cutlery box |
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2020
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