CN112243190A - Ultrathin double-directional electret microphone - Google Patents
Ultrathin double-directional electret microphone Download PDFInfo
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- CN112243190A CN112243190A CN202011396807.3A CN202011396807A CN112243190A CN 112243190 A CN112243190 A CN 112243190A CN 202011396807 A CN202011396807 A CN 202011396807A CN 112243190 A CN112243190 A CN 112243190A
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- copper
- clad
- pcb
- vibrating diaphragm
- gasket
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
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- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention provides an ultrathin bidirectional electret microphone, which comprises a metal protective shell, and a vibration diaphragm, a gasket component and a PCBA component which are arranged in the metal protective shell, and is characterized in that: the metal protection shell is one end open-ended tubbiness structure, the metal protection shell is equipped with the arc buckle, the metal protection shell passes through the arc buckle with the PCBA subassembly and is connected, the metal protection shell is inside to be connected with the gasket subassembly, the gasket subassembly is connected with the cooperation of vibrating diaphragm. Through changing the inner structure of traditional electret microphone, the volume of product can be further dwindled, the height of product is reduced, reduction in production cost avoids causing the defective rate loss because of part cooperation tolerance problem, has overcome because of the high limitation that brings the use scene of traditional structure because of the product.
Description
Technical Field
The invention relates to the field of electret microphones, in particular to an ultrathin double-directional electret microphone.
Background
The electret microphone is a capacitance microphone made of electret materials, and is widely applied to the aspects of speech pickup, sound signal detection and the like, and the electret microphone transmits a signal on a back plate and a signal on a vibration diaphragm to a circuit board in a way that a polar plate is matched with the vibration diaphragm, so that the back plate and the vibration diaphragm are used as the positive electrode and the negative electrode of a parallel-plate capacitor of the electret microphone.
The traditional electret microphone adopts a loop structure formed by assembling a plastic ring, a metal ring and a polar plate, and an FET is attached in the electret microphone, on one hand, the traditional structure of the electret microphone is higher due to the fact that the whole components are too many and the element mounting positions are too high, on the other hand, an electret of the traditional structure mainly adopts a loop structure formed by matching and mounting the plastic ring, the metal ring and the polar plate, so that the requirement on the whole matching tolerance of the plastic ring, the metal ring and the polar plate is too high, and the production and mounting difficulty is large and complex.
Disclosure of Invention
The invention aims to overcome the defects of the traditional technology and provides the ultrathin bidirectional electret microphone which is simple in structure and convenient and fast to install.
The aim of the invention is achieved by the following technical measures:
the utility model provides an ultra-thin two directional electret microphones, includes metal protective housing, vibrating diaphragm and PCBA subassembly, its characterized in that: the metal protective housing includes annular periphery portion and income sound tip, the PCBA subassembly covers copper PCB board and FET module including covering, cover copper PCB board and install on the annular periphery portion of metal protective housing, it has the transaudient vibration cavity to cover copper PCB board and metal protective housing constitution, the vibration diaphragm is settled in transaudient vibration cavity, the unsettled setting of middle vibration part of vibration diaphragm, the vibration diaphragm is connected with the metal protective housing, cover copper PCB board including first copper facing and the second copper facing that covers, first copper facing and vibration diaphragm parallel arrangement cover, the FET module is installed on the second copper facing, the input of FET module covers the copper facing respectively with first copper facing and is connected with the vibration diaphragm electricity.
As an improvement: the sound inlet end part is provided with at least one first sound inlet hole, and a dust guard is arranged outside the first sound inlet hole.
As an improvement: the edge of metal protective housing opening one end is equipped with the arc buckle, the fixed copper PCB board that covers of arc buckle.
As an improvement: the copper-clad PCB is provided with at least one second sound inlet, the inner wall of the second sound inlet is printed with a connecting circuit coating, the second copper-clad surface is etched with an upper circuit, the first copper-clad surface is etched with a lower circuit, and the upper circuit and the lower circuit are connected through the second sound inlet.
As an improvement: the edge of the sound entering end of the metal protective shell is provided with an annular boss, the annular boss protrudes into the metal protective shell, and the annular boss is connected with the annular peripheral portion and the sound entering end.
As an improvement: the copper-clad PCB is an FR4 epoxy resin copper-clad PCB, the copper-clad PCB is a multilayer copper-clad PCB, and an annular PCB is arranged at the lower end of the copper-clad PCB.
As an improvement: the lower end face of the annular PCB is in contact connection with the vibrating diaphragm, the lower end face of the annular PCB is not covered with a copper layer, and a first copper covering face is arranged between the annular PCB and the copper-clad PCB.
As an improvement: and a gasket is arranged on the periphery of at least one end face of the vibrating diaphragm and is a conductive gasket or an insulating gasket.
As an improvement: the gasket that sets up between vibrating diaphragm and the metal protective housing is electrically conductive gasket.
As an improvement: and the gasket arranged between the vibrating diaphragm and the copper-clad PCB is an insulating gasket.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the advantages that:
through changing the inner structure of traditional electret microphone, can be further reduce the volume of product, with the high reduction of product, reduced manufacturing material, reduce material cost and cost of labor, effectively improve technology operating efficiency, reduce the influence of material cooperation factor to producing the performance, effectively avoid the assembly abnormal problem that brings because of the tolerance between plastic ring, becket and the polar plate three again simultaneously, reduce the defective rate loss because of the bad cause of spare part cooperation, overcome traditional structure and brought the limitation of use place because of the high problem.
The invention is further described with reference to the following figures and detailed description.
Drawings
FIG. 1 is a schematic cross-sectional structure of the present invention.
Fig. 2 is a schematic sectional view of the protective metal shell of fig. 1.
Figure 3 is a cross-sectional view of the PCBA assembly of figure 1.
FIG. 4 is a schematic sectional view showing the structure of example 2.
FIG. 5 is a schematic sectional view showing the structure of example 3.
FIG. 6 is a schematic sectional view showing the structure of example 4.
Fig. 7 is a schematic sectional structure view of a conventional structure.
In the figure: 1-protective metal shell: 2-vibrating the diaphragm: 3-PCBA component: 11-annular peripheral portion: 12-sound entry end: 13-dust guard: 14-first sound entrance hole: 15-annular boss: 16-arc buckle: 31-copper clad PCB board: 32-FET Module: 33 second copper-clad surface: 34-first copper-clad surface: 35-second sound entrance hole: 36-annular PCB board: 4-conductive gasket: 5-insulating spacer: 61-metal ring: 62-plastic ring: 63-polar plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: as shown in fig. 1 to 3, an ultra-thin bi-directional electret microphone comprises a metal protective shell 1, a vibrating diaphragm 2 and a PCBA assembly 3, and is characterized in that: the metal protection shell 1 comprises an annular peripheral portion 11 and a sound entrance end portion 12, the PCBA assembly 3 comprises a copper-clad PCB 31 and an FET module 32, the copper-clad PCB 31 is installed on the annular peripheral portion 11 of the metal protection shell 1, the copper-clad PCB 31 and the metal protection shell 1 form a sound transmission vibration cavity, the vibration diaphragm 2 is arranged in the sound transmission vibration cavity, the middle vibration portion of the vibration diaphragm 2 is arranged in a suspension mode, the vibration diaphragm 2 is electrically connected with the metal protection shell 1, the copper-clad PCB 31 comprises a first copper-clad surface 34 and a second copper-clad surface 33, the first copper-clad surface 34 and the vibration diaphragm 2 are arranged in parallel, the FET module 32 is installed on the second copper-clad surface 33, and the input end of the FET module 32 is respectively electrically connected with the first copper-clad surface 34 and the vibration diaphragm 2.
The copper-clad PCB is etched from the middle part of the copper-clad PCB 31 to the first copper-clad surface 34 through an etching technology, so that the edge of the first copper-clad surface 34 of the copper-clad PCB 31 is provided with a protrusion, and the copper-clad PCB 31 is made of an FR4 epoxy resin plate made of an insulating material, so that the protrusion at the edge of the first copper-clad surface 34 can separate the first copper-clad surface 34 from the vibrating diaphragm 2.
As shown in fig. 2, at least one first sound inlet hole 14 is formed in the sound inlet end portion 12, sound enters the vibration cavity through the first sound inlet hole 14 to drive the vibration diaphragm 2 to vibrate, a dust guard 13 is connected to the outer side of the first sound inlet hole 14, and external dust can be prevented from entering the first sound inlet hole 14 and then entering the vibration cavity through the dust guard 13 to affect normal vibration of the vibration diaphragm 2.
As shown in fig. 3, at least one second sound inlet hole 35 is formed in the copper-clad PCB 31, a connection circuit coating is printed on an inner wall of the second sound inlet hole 35, and the first copper-clad surface 34 and the second copper-clad surface 33 are connected through the connection circuit coating printed on an inner wall of the second sound inlet hole 35. The sound can be transmitted through the first sound inlet hole 14 and the second sound inlet hole 35, so that the purpose of double direction is achieved.
As shown in fig. 2, the edge of the opening end of the metal protection shell 1 is provided with the arc buckle 16, the arc buckle 16 fixes the copper-clad PCB 31, the metal buckle can better fix the copper-clad PCB 31, and the copper-clad PCB 31 can be fixed in a fixing mode without the buckle or in a gluing and fixing mode, so that the copper-clad PCB 31 cannot fall off and separate.
As shown in fig. 2, an annular boss is provided at an edge of the sound inlet end portion 12 of the metal protective case 1, the annular boss protrudes into the metal protective case 1, and the annular boss connects the annular peripheral portion 11 and the sound inlet end portion 12. Through cyclic annular boss on the one hand can be unsettled the setting with vibrating diaphragm 2, on the other hand can directly carry out signal transmission through the electric conductivity of metal protective housing 1.
As shown in fig. 3, the copper-clad PCB 31 is an FR4 epoxy resin copper-clad PCB 31, the copper-clad PCB 31 is a multilayer copper-clad PCB 31, and the lower end of the copper-clad PCB 31 is etched by an etching technique to etch the central portion of at least one layer of the copper-clad PCB 31 of the multilayer copper-clad PCB 31 and expose the first copper-clad surface 34, so that an annular PCB 36 is formed below the copper-clad PCB 31 and the lower end surface of the annular PCB 36 is not covered with the copper surface.
As shown in fig. 1, the lower end surface of the annular PCB 36 is in contact connection with the diaphragm 2, the lower end surface of the annular PCB 36 is not covered with a copper layer, and a first copper-covered surface 34 is arranged between the annular PCB 36 and the copper-covered PCB 31.
As shown in fig. 7, the conventional electret microphone mainly uses a conductive gasket 4 and an insulating gasket 5 to fix a vibrating diaphragm 2, the insulating gasket is connected with a metal ring 61, a plastic ring 62 and a pole plate 63, the metal ring transmits a signal on the pole plate to a copper-clad PCB 31, the plastic ring 62 plays a role of supporting the pole plate 63 and the copper-clad PCB 31, and the requirement on the tolerance matching of the plastic ring 62, the metal ring 61 and the pole plate 63 is high.
Example 2: as shown in fig. 4, the inner side of the sound entering end portion 12 of the metal protective shell 1 is connected with a conductive gasket 4, the conductive gasket 4 is in contact connection with the vibrating diaphragm 2, a gasket hole is formed in the conductive gasket 4, the gasket hole can enable the middle vibrating portion of the vibrating diaphragm 2 to be suspended, the conductive gasket 4 is made of a conductive material, the conductive gasket 4 can transmit signals to the metal protective shell 1, the metal protective shell 1 continues to transmit signals, the copper-clad PCB 31 exposes the first copper-clad surface 34 by adopting an etching technology, and the middle vibration of the vibrating diaphragm 2 is opposite to the first copper-clad surface 34.
Other structural aspects are the same as those of embodiment 1.
Example 3: as shown in fig. 5, the gasket disposed between the vibrating diaphragm 2 and the copper-clad PCB 31 is an insulating gasket 5, the insulating gasket 5 can make a certain gap between the vibrating diaphragm 2 and the first copper-clad surface 34 and keep parallel, the edge of the sound-entering end 12 of the metal protective case 1 is provided with a raised annular boss inside the metal protective case 1, the vibrating diaphragm 2 is disposed on the annular boss, the vibrating diaphragm 2 is suspended through the annular boss, and signal transmission is directly performed through the metal protective case 1.
The other structure is the same as embodiment 1.
Example 4: as shown in fig. 6, the peripheries of the two end faces of the vibrating diaphragm 2 are provided with gaskets, and the gaskets are conductive gaskets 4 or insulating gaskets 5.
A conductive gasket 4 is arranged between the vibrating diaphragm 2 and the metal protective shell 1, a gasket hole is formed in the conductive gasket 4, the gasket hole can enable the middle vibrating part of the vibrating diaphragm 2 to be suspended, the conductive gasket 4 is made of a conductive material, the conductive gasket can transmit signals to the metal protective shell 1, and then the metal protective shell 1 continues to transmit the signals;
the gasket arranged between the vibrating diaphragm 2 and the copper-clad PCB 31 is the insulating gasket 5, on one hand, the insulating gasket 5 can enable a certain gap to be reserved between the vibrating diaphragm 2 and the first copper-clad surface 34 and keep the gap parallel, and on the other hand, the insulating gasket 5 can enable no signal exchange to be generated between the first copper-clad surface 34 and the vibrating diaphragm 2.
The other structure is the same as embodiment 1.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The utility model provides an ultra-thin two directional electret microphones, includes metal protective housing (1), vibrating diaphragm (2) and PCBA subassembly (3), its characterized in that: the metal protective shell (1) comprises an annular peripheral part (11) and a sound inlet end part (12), the PCBA assembly (3) comprises a copper-clad PCB (31) and an FET module (32), the copper-clad PCB (31) is arranged on the annular periphery (11) of the metal protective shell (1), the copper-clad PCB (31) and the metal protective shell (1) form a sound transmission vibration cavity, the vibrating diaphragm (2) is arranged in the sound transmission vibrating cavity, the middle vibrating part of the vibrating diaphragm (2) is arranged in a suspension way, the vibrating diaphragm (2) is connected with the metal protective shell (1), the copper-clad PCB (31) comprises a first copper-clad surface (34) and a second copper-clad surface (33), the first copper-clad surface (34) is arranged in parallel with the vibrating diaphragm (2), the FET module (32) is arranged on the second copper-clad surface (33), the input end of the FET module (32) is electrically connected with the first copper-coated surface (34) and the vibrating diaphragm (2) respectively.
2. The ultra-thin dual-directional electret microphone of claim 1, wherein: the sound inlet end part (12) is provided with at least one first sound inlet hole (14), and a dust guard (13) is arranged outside the first sound inlet hole (14).
3. The ultra-thin dual-directional electret microphone of claim 1, wherein: the edge of one end of the opening of the metal protective shell (1) is provided with an arc-shaped buckle (16), and the copper-clad PCB (31) is fixed by the arc-shaped buckle (16).
4. The ultra-thin dual-directional electret microphone of claim 1, wherein: the copper-clad PCB is characterized in that at least one second sound inlet hole (35) is formed in the copper-clad PCB (31), a connecting circuit coating is printed on the inner wall of the second sound inlet hole (35), an upper layer circuit is etched on the second copper-clad surface (33), a lower layer circuit is etched on the first copper-clad surface (34), and the upper layer circuit and the lower layer circuit are connected through the second sound inlet hole (35).
5. The ultra-thin dual-directional electret microphone of claim 1, wherein: the edge of the sound inlet end part (12) of the metal protective shell (1) is provided with an annular boss, the annular boss protrudes into the metal protective shell (1), and the annular boss is connected with the annular peripheral part (11) and the sound inlet end part (12).
6. The ultra-thin dual-directional electret microphone of claim 1, wherein: copper-clad PCB board (31) is FR4 epoxy resin copper-clad PCB board (31), copper-clad PCB board (31) is multilayer structure copper-clad PCB board (31), copper-clad PCB board (31) lower extreme is equipped with annular PCB board (36).
7. The ultra-thin dual-directional electret microphone of claim 6, wherein: the lower end face of the annular PCB (36) is in contact connection with the vibrating diaphragm (2), the lower end face of the annular PCB (36) is not coated with a copper layer, and a first copper coating face (34) is arranged between the annular PCB (36) and the copper-coated PCB (31).
8. The ultra-thin dual-directional electret microphone of claim 1, wherein: the periphery of at least one terminal surface of vibrating diaphragm (2) is equipped with the gasket, the gasket is electrically conductive gasket (4) or insulating pad (5).
9. The ultra-thin dual-directional electret microphone of claim 8, wherein: the gasket arranged between the vibrating diaphragm (2) and the metal protective shell (1) is a conductive gasket (4).
10. The ultra-thin dual-directional electret microphone of claim 8, wherein: and a gasket arranged between the vibrating diaphragm (2) and the copper-clad PCB (31) is an insulating gasket (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011396807.3A CN112243190B (en) | 2020-12-04 | 2020-12-04 | Ultrathin double-directional electret microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011396807.3A CN112243190B (en) | 2020-12-04 | 2020-12-04 | Ultrathin double-directional electret microphone |
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| CN112243190A true CN112243190A (en) | 2021-01-19 |
| CN112243190B CN112243190B (en) | 2021-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011396807.3A Active CN112243190B (en) | 2020-12-04 | 2020-12-04 | Ultrathin double-directional electret microphone |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007007928A1 (en) * | 2005-07-08 | 2007-01-18 | Bse Co., Ltd. | Electret microphone include washer spring |
| CN2896767Y (en) * | 2006-04-29 | 2007-05-02 | 潍坊怡通工电子有限公司 | Super-thin high-stability capacitor type microphone |
| CN101466060A (en) * | 2009-01-10 | 2009-06-24 | 宁波鑫丰泰电器有限公司 | Electret condenser microphone |
| CN102075838A (en) * | 2011-03-03 | 2011-05-25 | 深圳市豪恩声学股份有限公司 | Electret microphone |
| CN104113811A (en) * | 2014-07-21 | 2014-10-22 | 美律电子（惠州）有限公司 | Micro electro mechanical system microphone packaging structure with three-dimensional base plate and manufacturing process thereof |
| CN207939731U (en) * | 2018-02-28 | 2018-10-02 | 深圳捷力泰科技开发有限公司 | Two fingers are to electret microphone |
| CN111741418A (en) * | 2020-07-21 | 2020-10-02 | 山东新港电子科技有限公司 | Miniature vibration sensor |
| CN211792037U (en) * | 2020-01-06 | 2020-10-27 | 深圳市国邦电子科技有限公司 | Double-directional electret microphone |
-
2020
- 2020-12-04 CN CN202011396807.3A patent/CN112243190B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007007928A1 (en) * | 2005-07-08 | 2007-01-18 | Bse Co., Ltd. | Electret microphone include washer spring |
| CN2896767Y (en) * | 2006-04-29 | 2007-05-02 | 潍坊怡通工电子有限公司 | Super-thin high-stability capacitor type microphone |
| CN101466060A (en) * | 2009-01-10 | 2009-06-24 | 宁波鑫丰泰电器有限公司 | Electret condenser microphone |
| CN102075838A (en) * | 2011-03-03 | 2011-05-25 | 深圳市豪恩声学股份有限公司 | Electret microphone |
| CN104113811A (en) * | 2014-07-21 | 2014-10-22 | 美律电子（惠州）有限公司 | Micro electro mechanical system microphone packaging structure with three-dimensional base plate and manufacturing process thereof |
| CN207939731U (en) * | 2018-02-28 | 2018-10-02 | 深圳捷力泰科技开发有限公司 | Two fingers are to electret microphone |
| CN211792037U (en) * | 2020-01-06 | 2020-10-27 | 深圳市国邦电子科技有限公司 | Double-directional electret microphone |
| CN111741418A (en) * | 2020-07-21 | 2020-10-02 | 山东新港电子科技有限公司 | Miniature vibration sensor |
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| CN112243190B (en) | 2021-04-09 |
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