CN112242362A - Combined chip for connecting module assembly - Google Patents

Combined chip for connecting module assembly Download PDF

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Publication number
CN112242362A
CN112242362A CN201910643149.4A CN201910643149A CN112242362A CN 112242362 A CN112242362 A CN 112242362A CN 201910643149 A CN201910643149 A CN 201910643149A CN 112242362 A CN112242362 A CN 112242362A
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CN
China
Prior art keywords
chip
limiting
shell
sides
fixedly connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201910643149.4A
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Chinese (zh)
Inventor
周全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhenjiang Quancheng Electric Technology Co ltd
Original Assignee
Zhenjiang Quancheng Electric Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhenjiang Quancheng Electric Technology Co ltd filed Critical Zhenjiang Quancheng Electric Technology Co ltd
Priority to CN201910643149.4A priority Critical patent/CN112242362A/en
Publication of CN112242362A publication Critical patent/CN112242362A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fuses (AREA)

Abstract

The invention discloses a chip for connecting a combined module assembly, which comprises a shell and a chip, wherein two first through holes are formed in the two horizontal sides of the shell, a second through hole is formed in the center of the top of the shell, and two supporting springs are fixedly connected to the two sides of the inner bottom surface wall of the shell. According to the invention, one end of the limiting spring is provided with the limiting block, the first baffle and the second baffle are respectively arranged on the vertical two sides of the limiting spring, and the limiting grooves are arranged on the two sides of the chip, so that the design has the advantages that: firstly, the limiting block can be clamped in the limiting groove to play a role in fixing the chip, and meanwhile, the locking block is clamped in the locking hole to play a role in fixing the sliding block, so that the stability of the chip is further improved; secondly, when the chip is disassembled, the locking block is pressed to be separated from the locking hole, and the sliding block can drive the limiting block to be separated from the limiting groove under the action of the elastic force of the limiting spring, so that the chip can be quickly released from a limiting state.

Description

Combined chip for connecting module assembly
Technical Field
The invention relates to the technical field of chips, in particular to a chip for connecting a combined module assembly.
Background
Integrated Circuits (ICs) are known as microcircuits, microchips, chips/chips, and are one way to miniaturize circuits in electronics, and are often fabricated on the surface of a semiconductor wafer.
Firstly, the existing connecting chip is not provided with a limiting mechanism, so that the chip is not firmly fixed, and meanwhile, the chip is complex in disassembly and assembly process and slow in installation speed, and the improvement of the working efficiency is not facilitated; secondly, the inside of the existing connection chip is not provided with a circuit for protecting the chip, so that the chip is easy to damage due to overlarge current impact at the moment of electrifying the chip, and the cost is increased.
Disclosure of Invention
The invention aims to: the chip for connecting the combined module component is provided for solving the problems that the existing chip for connecting does not have a limiting and fixing mechanism and a chip protection circuit.
In order to achieve the purpose, the invention adopts the following technical scheme:
a chip for connecting a combined module component comprises a shell and a chip, wherein two first through holes are formed in the two horizontal sides of the shell, a second through hole is formed in the center of the top of the shell, two supporting springs are fixedly connected to the two sides of the bottom surface wall inside the shell, two lifting rods are arranged on the two sides of each supporting spring, the bottoms of the four lifting rods are fixedly connected with the shell, the top of each supporting spring and the top of each lifting rod are fixedly connected with a same supporting plate, a sliding block is slidably connected to the top of each supporting plate, a locking block is fixedly connected to the top of each sliding block, a limiting spring is fixedly connected to one side, close to the chip, of each sliding block, one end, far away from the corresponding sliding block, of each limiting spring is fixedly connected with a limiting block, a first baffle and an L-shaped second baffle are respectively arranged on the two vertical sides of each limiting spring, and the first, two locking holes are formed in two sides of the top of the shell.
As a further description of the above technical solution:
a limiting groove is formed in the side surface wall of the chip, and a plug is arranged at the bottom of the chip.
As a further description of the above technical solution:
the inside bottom surface wall of casing is provided with chip protection module, and chip protection module's top is provided with the slot to chip protection module's bottom is provided with the contact.
As a further description of the above technical solution:
the chip protection module is characterized in that a fuse, a light emitting diode and a piezoresistor are arranged inside the chip protection module, the fuse, the light emitting diode and the piezoresistor are communicated with the slot and the contact through wires, the fuse piezoresistor is connected in series, and the light emitting diode is connected with the fuse and the piezoresistor in parallel.
As a further description of the above technical solution:
the limiting blocks and the limiting grooves are arranged in a plurality of forms, and the limiting blocks and the limiting grooves are arranged in an equiangular circle by taking the center of the bottom surface wall of the shell as the circle center.
As a further description of the above technical solution:
the supporting plate is connected with the second baffle in a sliding mode, and the top of the locking block is connected with the first through hole in a sliding mode.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. according to the invention, a chip is arranged in a shell, a chip hole and a locking hole are formed in the top of the shell, first through holes are formed in two sides of the shell, a supporting spring is arranged on the inner bottom surface wall of the shell, lifting rods are arranged on two sides of the supporting spring, a supporting plate is arranged on the top of the supporting spring and the top of the lifting rod, a sliding block is arranged on the top of the supporting plate, a locking block is arranged on the top of the sliding block, a limiting spring is arranged on one horizontal side of the sliding block, a limiting block is arranged at one end of the limiting spring, a first baffle and a second baffle are respectively arranged on two vertical sides of the limiting spring, limiting grooves are formed in two sides of the chip, and the design has the advantages: firstly, the limiting block can be clamped in the limiting groove to play a role in fixing the chip, and meanwhile, the locking block is clamped in the locking hole to play a role in fixing the sliding block, so that the stability of the chip is further improved; secondly, when the chip is disassembled, the locking block is pressed to be separated from the locking hole, and the sliding block can drive the limiting block to be separated from the limiting groove under the action of the elastic force of the limiting spring, so that the chip can be quickly released from a limiting state.
2. In the invention, the bottom of the chip is provided with the plug, the shell is internally provided with the chip protection module, and the chip protection module is internally provided with the fuse, the light-emitting diode and the piezoresistor, so that the design has the advantages that: firstly, at the moment of electrifying the chip, if the current is larger, the impact of the current on the chip can be reduced through the piezoresistor, and when the current exceeds the threshold value of the piezoresistor, the fuse can be disconnected, so that the chip is prevented from being damaged; and secondly, when the circuit is reversely connected, the light emitting diode can be electrified to emit light to remind an installer of reinstallation.
Drawings
Fig. 1 is a schematic view of a front view of the inside of a housing of a chip for connecting a combined module assembly according to the present invention;
FIG. 2 is a schematic view of a top view of the interior of the housing of the chip for connecting the combined module assembly according to the present invention;
fig. 3 is a schematic diagram of an internal circuit structure of a chip protection module of a chip for connecting a combined module component according to the invention.
Illustration of the drawings:
1. a housing; 2. a chip; 3. a support spring; 4. a lifting rod; 5. a support plate; 6. a slider; 7. a locking block; 8. a limiting spring; 9. a limiting block; 10. a first baffle plate; 11. a second baffle; 12. a locking hole; 13. a first through hole; 14. a limiting groove; 15. a plug; 16. a chip protection module; 1601. a fuse; 1602. a light emitting diode; 1603. a voltage dependent resistor; 17. a slot; 18. a contact; 19. a second via.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a chip for connecting a combined module component comprises a shell 1 and a chip 2, wherein two horizontal sides of the shell 1 are provided with two first through holes 13, the top center of the shell 1 is provided with a second through hole 19, two sides of the inner bottom surface wall of the shell 1 are fixedly connected with two supporting springs 3, two sides of the two supporting springs 3 are respectively provided with two lifting rods 4, the bottoms of the four lifting rods 4 are respectively and fixedly connected with the shell 1, the tops of the supporting springs 3 and the lifting rods 4 are respectively and fixedly connected with a same supporting plate 5, the top of the supporting plate 5 is in sliding connection with a sliding block 6, the top of the sliding block 6 is fixedly connected with a locking block 7, one side of the sliding block 6, which is close to the chip 2, is fixedly connected with a limiting spring 8, one end of the limiting spring 8, which is far away from the sliding block 6, is fixedly connected with a limiting block 9, and the vertical two sides, and first baffle 10 and second baffle 11 all with slider 6 fixed connection, two locking holes 12 have been seted up to the top both sides of casing 1.
Specifically, as shown in fig. 1, a side surface wall of the chip 2 is provided with a limiting groove 14, and the bottom of the chip 2 is provided with a plug 15, wherein the plug 15 facilitates circuit connection of the chip 2.
Specifically, as shown in fig. 1, the inner bottom surface wall of the housing 1 is provided with a chip protection module 16, the top of the chip protection module 16 is provided with a slot 17, and the bottom of the chip protection module 16 is provided with contacts 18, the contacts 18 enabling the chip 2 to connect different module components.
Specifically, as shown in fig. 3, a fuse 1601, a light emitting diode 1602 and a varistor 1603 are arranged inside the chip protection module 16, the fuse 1601, the light emitting diode 1602 and the varistor 1603 are all communicated with the slot 17 and the contact 18 through wires, the fuse 1601 and the varistor 1603 are all connected in series, the light emitting diode 1602 is connected in parallel with the fuse 1601 and the varistor 1603, the chip 2 is prevented from being damaged by the chip protection module 16, and the service life of the chip protection module is prolonged.
Specifically, as shown in fig. 2, the limiting block 9 and the limiting groove 14 are provided in a plurality of numbers, and the limiting block 9 and the limiting groove 14 are arranged in an equiangular circumference manner with the center of the bottom surface wall of the housing 1 as the center of a circle, so that the stability of the chip 2 is improved.
Specifically, as shown in fig. 1, the supporting plate 5 is slidably connected to the second blocking plate 11, and the top of the locking block 7 is slidably connected to the first through hole 13, so that the detaching speed of the chip 2 is increased.
The working principle is as follows: when the chip mounting structure is used, firstly, the chip 2 is placed into the shell 1 from the second through hole 19, so that the plug 15 is aligned with the slot 17, the plug 15 is inserted into the slot 17, then the sliding block 6 is pushed until the supporting spring 3 releases elasticity to drive the locking block 7 to be clamped in the locking hole 12, at the moment, the limiting spring 8 is compressed, and the limiting block 9 is clamped in the limiting groove 14, so that the chip 2 is mounted and limited; secondly, the contact 18 is connected with the combined module to electrify the chip 2, the chip protection module 16 is electrified firstly, the fuse 1601 and the piezoresistor 1603 can prevent the chip 2 from being damaged by large current and impact current, and the light-emitting diode 1602 emits light when the power supply is reversely connected to prompt the reverse connection of the chip 2; finally, when the chip 2 is detached, the locking block 7 is pressed to be separated from the locking hole 12, meanwhile, the sliding block 6 drives the limiting block 9 to be separated from the limiting groove 14, at the moment of separation, the limiting spring 8 releases elastic force to push the sliding block 6 to slide on the supporting plate 5, the chip 2 is in a limiting-free state, and at the moment, the supporting spring 3 is in a compression state.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (6)

1. The chip for connecting the combined module component comprises a shell (1) and a chip (2), wherein two first through holes (13) are formed in two horizontal sides of the shell (1), and a second through hole (19) is formed in the center of the top of the shell (1), and is characterized in that two supporting springs (3) are fixedly connected to two sides of the inner bottom surface wall of the shell (1), two lifting rods (4) are arranged on two sides of each supporting spring (3), the bottoms of the four lifting rods (4) are fixedly connected with the shell (1), the tops of the supporting springs (3) and the lifting rods (4) are fixedly connected with a same supporting plate (5), a sliding block (6) is slidably connected to the top of the supporting plate (5), a locking block (7) is fixedly connected to the top of the sliding block (6), and a limiting spring (8) is fixedly connected to one side, close to the chip (2), of the sliding block (6), and the one end fixedly connected with stopper (9) of slider (6) is kept away from in spacing spring (8), the vertical both sides of spacing spring (8) are provided with first baffle (10) and second baffle (11) of "L" shape respectively, and just first baffle (10) and second baffle (11) all with slider (6) fixed connection, two locking holes (12) have been seted up to the top both sides of casing (1).
2. The chip for connecting the combined module component as claimed in claim 1, wherein the side surface wall of the chip (2) is provided with a limiting groove (14), and the bottom of the chip (2) is provided with a plug (15).
3. A combined module assembly connecting chip according to claim 1, wherein the inner bottom surface wall of the housing (1) is provided with a chip protection module (16), the top of the chip protection module (16) is provided with a slot (17), and the bottom of the chip protection module (16) is provided with a contact (18).
4. A chip for connecting a combined module assembly according to claim 3, wherein a fuse (1601), a light emitting diode (1602) and a voltage dependent resistor (1603) are arranged inside the chip protection module (16), the fuse (1601), the light emitting diode (1602) and the voltage dependent resistor (1603) are all communicated with the slot (17) and the contact (18) through wires, the fuse (1601) and the voltage dependent resistor (1603) are all connected in series, and the light emitting diode (1602) is connected with the fuse (1601) and the voltage dependent resistor (1603) in parallel.
5. The chip for connecting the combined module assembly according to claim 1, wherein the plurality of limiting blocks (9) and the plurality of limiting grooves (14) are provided, and the limiting blocks (9) and the limiting grooves (14) are arranged circumferentially at equal angles around the center of the bottom surface wall of the housing (1).
6. The combined module assembly connecting chip according to claim 1, wherein the supporting plate (5) is slidably connected with the second baffle (11), and the top of the locking block (7) is slidably connected with the first through hole (13).
CN201910643149.4A 2019-07-17 2019-07-17 Combined chip for connecting module assembly Withdrawn CN112242362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910643149.4A CN112242362A (en) 2019-07-17 2019-07-17 Combined chip for connecting module assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910643149.4A CN112242362A (en) 2019-07-17 2019-07-17 Combined chip for connecting module assembly

Publications (1)

Publication Number Publication Date
CN112242362A true CN112242362A (en) 2021-01-19

Family

ID=74166985

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910643149.4A Withdrawn CN112242362A (en) 2019-07-17 2019-07-17 Combined chip for connecting module assembly

Country Status (1)

Country Link
CN (1) CN112242362A (en)

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Application publication date: 20210119

WW01 Invention patent application withdrawn after publication