CN112230120A

CN112230120A - Multi-platform linkage effect-improving mechanism

Info

Publication number: CN112230120A
Application number: CN202011489734.2A
Authority: CN
Inventors: 杨栓; 关姜维; 刘栋栋
Original assignee: Shanghai Weice Semiconductor Technology Co ltd
Current assignee: Shanghai Weice Semiconductor Technology Co ltd
Priority date: 2020-12-17
Filing date: 2020-12-17
Publication date: 2021-01-15
Anticipated expiration: 2040-12-17
Also published as: CN112230120B

Abstract

The invention provides a multi-platform linkage effect-improving mechanism, which comprises a probe station, at least two testing machines and a control system, wherein the probe station is connected with the at least two testing machines; the control system comprises a signal configuration unit and a path planning unit, wherein the signal configuration unit is independently arranged and is respectively connected with the probe station and the tester through GPIB (general purpose interface bus), so that the signal transmission between the probe station and the tester is realized. By arranging an independent signal configuration unit, signal information of mutual communication between the probe station and the tester is collected on the main control board by using a GPIB port, and signals are split and combined by a program module of a main control chip, so that the tester configuration can be used more flexibly; the path planning unit can generate a path strategy related to the movement path of the probe station for controlling the bearing of the wafer to be tested so as to control the bearing platform of the probe station to execute the path strategy, and the wafer to be tested can move under different positions, so that the testing efficiency is improved.

Description

Multi-platform linkage effect-improving mechanism

Technical Field

The invention relates to the field of semiconductor test equipment, in particular to a multi-platform linkage effect-improving mechanism for signal configuration of a probe station.

Background

In integrated circuit testing, a tester is usually connected to a probe station for testing. At the moment, the tester and the probe station are directly connected, the tester and the probe station communicate with each other through the original communication protocol of the tester and the probe station, the tester asks for a piece of information, and the probe station answers the piece of information and can only access one to one. This test method greatly limits the efficiency of the tester and causes a great waste in test time and layout of the probe card. Since the maximum number of tester configurations is fixed, resulting in fixed test channels that can be supported by a tester, the number of test ports, which can be probe cards, is correspondingly limited, and there is no way to achieve the maximum number required.

To achieve maximum utilization of resources and configurations, certain tester manufacturers may improve and modify their own internal programs, and certain tester models within manufacturers may be connected to the same probe station with two testers. However, the use of this method is very limited, and generally, this operation is a special configuration implemented by a tester manufacturer for a relevant model test, and is strong in pertinence, has no commonality with other testers, and is relatively limited in usability.

For example, in the patent with the publication number CN103777131B, an integrated circuit testing system is disclosed, which is configured to have a signal splitting circuit, which is connected to a testing machine, to transmit the testing signal of a probe station, when one probe station corresponds to a plurality of testing machines; in the patent, the signal sent by the probe station is a multi-path signal, and the technical scheme disclosed in the patent is that a signal circuit is transmitted to a decoder through an inverter, then a plurality of output signals are simultaneously formed through the decoder and are simultaneously transmitted to a tester. Since the test signals finally transmitted to the testers are all formed by the decoders, and the types of the formed test signals are the same, the integrated circuit test system in the patent is often only used for matching a plurality of testers with the same configuration. In other words, if a wafer to be tested is tested by multiple testers at the same time by using the technical solution with the authorization notice number CN103777131B, the configuration of the multiple testers needs to be the same.

In addition, since the position of the probe electrically conducting the wafer to be tested on the testing machine cannot move, and the number of the dies to be tested on the wafer to be tested is much larger than the number of the probes, the carrier on the probe table needs to continuously move with the wafer to be tested during the testing process.

In the testing process of each testing machine, the positions and postures of the wafer to be tested are required to be kept different from each other, so that the time required by the carrier platform bearing the wafer to be tested to convert the wafer to be tested from the position and posture required by one testing machine to the testing position and posture required by the other testing machine determines the testing time required by the wafer to be tested to be finally completed, and the testing efficiency is also influenced. In patent No. CN103777131B, although a plurality of testers can be connected to one probe station, the movement path of the stage of the probe station during movement is the same as the path when the probe station and a single tester are connected. The time saved is only the feeding time of the wafer to be tested on a plurality of testing machines.

Therefore, based on the above technical problems, those skilled in the art will be able to provide a multi-stage linkage effect-improving mechanism for signal configuration of a probe station to solve the foregoing problems.

Disclosure of Invention

The invention aims to solve the technical problem of providing a multi-platform linkage effect-improving mechanism, which splits and integrates signals of a probe station and a plurality of test machines by arranging an independent signal conversion system so as to realize that one probe station is connected with a plurality of test machines.

The technical problem to be solved by the present invention is to provide a multi-platform linkage effect-improving mechanism, wherein the multi-platform linkage effect-improving mechanism is configured to improve the detection efficiency of the wafer to be detected.

The technical problem to be solved by the present invention is to provide a multi-platform linkage effect-improving mechanism, wherein the multi-platform effect-improving mechanism is further capable of automatically planning a moving path of a probe station for bearing a wafer to be tested when a plurality of testers are interconnected to test the wafer to be tested, so as to improve the testing efficiency.

In order to solve the problems, the invention provides a multi-platform linkage effect-improving mechanism which comprises a probe station, at least two testing machines and a control system, wherein the probe station comprises a probe head and a probe head; the control system comprises a signal configuration unit and a path planning unit; the signal configuration unit is independently arranged and is respectively connected with the probe station and the tester through GPIB (general purpose interface bus), so that signal transmission between the probe station and the tester is realized; the path planning unit comprises an information acquisition module, an analysis module, a path strategy generation module and a control module; wherein the information collection module is communicatively connected to the signal configuration unit, the testers and the probe station to collect the number of testers required to test the wafer to be tested, test items and data related to the wafer to be tested, the analysis module is communicatively connected to the information collection module to receive the data collected by the information collection module and form an analysis result related to determining the coordinate of the die commonly required in the test items of the testers and the coordinate of the die individually required to be tested and the coordinate position of the probe card of the probe station, the path policy generation module is configured to generate a path policy related to controlling the moving path of the probe station bearing the wafer to be tested according to the analysis result formed by the analysis module and a preset threshold, and the control module is communicatively connected to the testers, The probe station and the path strategy generation module are used for controlling the loading platform of the probe station to execute the path strategy generated by the path strategy generation module to finish the movement of the wafer to be tested in different positions and controlling the testing machine to test.

Furthermore, the models of the testing machines in one multi-platform linkage effect lifting mechanism are the same.

Further, the signal configuration unit at least comprises a main control board and the GPIB port, the main control board is provided with a main control chip, and the main control chip is connected to the GPIB port and controls the GPIB port to receive and transmit signals from the probe station and the tester.

Furthermore, the main control chip at least comprises a signal receiving module, a signal sending module, a signal splitting module and a signal integrating module; the signal receiving module and the signal sending module are respectively connected with the GPIB port to realize the receiving and sending of signals from the probe station and the tester; the signal splitting module is used for splitting a signal from the probe station; the signal integration module is used for integrating the signals from the tester.

Furthermore, the number of the GPIB ports is at least three, and the number of the GPIB ports is the same as the sum of the numbers of the probe stations and the testers.

Further, when the signal splitting module splits the signal from the probe station, each corresponding signal after splitting is the same.

Further, the number of the signals split by the signal splitting module is the same as the number of the testers.

Furthermore, the main control board is also provided with fixed addresses corresponding to the probe station and the tester so as to realize the sending and receiving of signals.

Furthermore, the probe station and the tester of the multi-platform linkage effect-improving mechanism are both provided with fixed addresses corresponding to those of the signal configuration unit, so as to realize the sending and receiving of signals.

Further, the threshold is implemented as a minimum number of stage movements of the probe stage that carry the wafer.

Further, the threshold is implemented as a minimum total movement distance and a minimum total rotation angle of a stage carrying the wafer on the probe station.

Through implementing the multi-platform linkage effect-improving mechanism provided by the invention, the following technical effects are achieved: according to the technical scheme, an independent signal configuration unit is arranged, a GPIB port is used for collecting signal information of mutual communication between a probe station and a tester to a main control board, and a program module of a main control chip is used for splitting and combining signals, so that the tester configuration can be more flexibly used; the number of the test ends of the probe card is improved, and the tester and the probe card are more effectively utilized; meanwhile, the testing time is greatly shortened, and the productivity is effectively improved.

The multi-platform linkage effect-improving mechanism provided by the invention also has the following technical effects: when a plurality of testers are interconnected to test the wafer to be tested, the path strategy related to the moving path for controlling the probe station to bear the wafer to be tested is generated to control the moving path of the probe station, so that the detection efficiency of the wafer to be tested is improved.

Drawings

The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings to fully understand the objects, the features and the effects of the present invention.

FIG. 1 is a schematic structural view of a multi-platform linkage effect-raising mechanism according to an embodiment of the present invention;

fig. 2 is a signal splitting diagram in fig. 1.

Fig. 3 is a block diagram of the control system.

In the figure:

1. a probe station;

20. a first testing machine; 21. a second testing machine;

3. a signal configuration unit; 30. a main control panel; 31. a GPIB port; 32. a main control chip; 320. a signal receiving module; 321. a signal transmitting module; 322. a signal splitting module; 323. a signal integration module; 400. a control system; 40. a path planning unit; 41. an information acquisition module; 42. an analysis module; 43. a path policy generation module; 44. and a control module.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: in the figure, solid arrows indicate the direction in which signals are sent from the probe station to the tester for reception; the dashed arrows indicate the direction of signals sent by the tester to the probe station for reception.

The technical solution of the present invention will be described in detail with specific embodiments.

Fig. 1-2 show a multi-stage linkage effect-improving mechanism, which at least comprises a probe station 1, a testing machine, and a control system 400, wherein the control system 400 comprises a signal configuration unit 3; the signal configuration unit 3 is independently arranged and is respectively connected with the probe station 1 and the testing machine through a GPIB (general purpose interface bus), so that signal transmission between the probe station 1 and the testing machine is realized.

As shown in fig. 1-2, in the present embodiment, the number of probe stations 1 in a multi-platform linkage effect-improving mechanism is set to be one, the number of testers is set to be two, and the testers are respectively a first tester 20 and a second tester 21, and the first tester 20 and the second tester 21 are the same in model. In actual use, two or more than two of the quantity can be set according to requirements. And uses a communication mode in which one probe station is matched with two testers. Preferably, the models and the types of the testers are the same.

As shown in fig. 1-2, the signal configuration unit 3 at least includes a main control board 30 and a GPIB port 31, the main control board 30 is provided with a main control chip 32, the main control chip 32 is connected to the GPIB port 31, and the GPIB port 31 is controlled to receive and transmit signals from the probe station 1, the first testing machine 20, and the second testing machine 21. As shown in the figure, the number of the GPIB ports 31 is three according to the number of the probe station 1, the first tester 20, and the second tester 21, and when in actual use, the number of the GPIB ports 31 is equal to the sum of the number of the probe station 1 and the number of the testers.

As shown in fig. 1-2, the main control chip 32 at least includes a signal receiving module 320, a signal sending module 321, a signal splitting module 322, and a signal integrating module 323; the signal receiving module 320 and the signal sending module 321 are respectively connected with the three GPIB ports 31 to receive and send signals from the probe station 1, the first testing machine 20 and the second testing machine 21; the signal splitting module 322 is used for splitting a signal from the probe station 1; the signal integration module 323 is used for integrating signals from the first tester 20 and the second tester 21.

The number of signals split by the signal splitting module 322 is the same as the number of testers, and in this embodiment, the original signal from the probe station 1 is split into two identical signals, which are sent to the first tester 20 and the second tester 21, respectively.

In addition, a fixed address A is arranged on the probe station 1, and a fixed address B and a fixed address C are respectively arranged on the first testing machine 20 and the second testing machine 21; the main control board 30 is further provided with a fixed address a, a fixed address B, and a fixed address C corresponding to the probe station 1, the first tester 20, and the second tester 21, so as to transmit and receive corresponding signals.

Based on the above system, as shown in fig. 2, taking an example that a probe station 1 transmits a signal M @ AAAA, the signal of the probe station 1 is transmitted to a signal configuration unit 3 through a GPIB port 31, a signal receiving module 320 of the signal configuration unit 3 receives the signal and transmits the signal to a signal splitting module 322, the signal splitting module 322 splits the signal according to the number of testers, the signal is split into two identical interconnection signals M @ AA and M @ AA as shown in the figure, and the two identical interconnection signals are respectively transmitted to a fixed address B and a fixed address C of a first tester 20 and a second tester 21 through the GPIB port 31 by a signal transmitting module 321; after the first tester 20 and the second tester 21 complete testing, information of the test result is sent back to the signal configuration unit 3 according to the fixed address B and the fixed address C, the signal receiving module 320 of the signal configuration unit 3 receives the signal and then transmits the signal to the signal integration module 323, the signal integration module 323 integrates the two signals from the first tester 20 and the second tester 21, the integrated signal is sent to the fixed address a of the probe station 1 by the signal sending module 321, and signal transmission between the probe station 1 and the first tester 20 and the second tester 21 and interconnection between the probe station 1 and the first tester 20 and the second tester 21 are completed.

Referring to fig. 3, the control system 400 further includes a path planning unit 40, wherein the path planning unit 40 is configured to include an information acquisition module 41. The information collection module 41 is configured to collect data related to the tester, the probe station 1, and at least one wafer to be tested.

Specifically, the information collecting module 41 may be communicatively connected to the signal configuration unit 3, and further determine, according to the signal configured by the signal configuration unit 3 in the tester, the number of the testers which are currently communicatively connected to the probe station 1 and need to provide a test, and data such as test items which can be provided by each tester for the wafer to be tested.

In addition, the information acquisition module 41 is interconnected with the probe station 1, so as to acquire the positions of the dies to be tested on the wafer to be tested and the test items corresponding to each die.

It is worth mentioning that, when the wafer to be tested is tested, the data recorded with the wafer to be tested includes the slot number of the wafer to be tested, the coordinate values of the dies (die) included in the wafer to be tested, and the coordinate values of all the dies to be tested.

In addition, the information collection module 41 can also collect data on the position of the probe mounted on the probe station. As will be appreciated by those skilled in the art, the probe of the tester is used to conduct the die of the wafer to be tested and the tester.

The path planning unit 40 further includes an analysis module 42, a path policy generation module 43, and a control module 44.

The analysis module 42 is communicatively connected to the information collection module 41, and is configured to receive the data collected by the information collection module 41 and analyze the received data.

Specifically, the analysis module 42 is configured to form analysis results related to the coordinates of the die commonly corresponding to the test items of the testers and the coordinates of the die individually required to be tested, respectively, and the probe card coordinate position of the probe station 1 according to the collected data.

The path policy generating module 43 is configured to generate a path policy related to a moving path for controlling the probe station 1 to carry the wafer to be tested according to the analysis result formed by the analyzing module 42 and a preset threshold.

Specifically, in one embodiment, the threshold is implemented as a minimum number of stage movements of the probe station that carry the wafer.

For example, in one example, the probe station 1 is in communication with both a tester a and a tester B. The test items that tester A can provide include A1, A2, and A3. The test items that tester B can provide include B1, B2, and B3. The crystal grains of the wafer to be tested have coordinates of C1, C2 and C3, wherein the test items of the crystal grains with the coordinates of C1 to be tested are A1 and B1, the test items of the crystal grains with the coordinates of C2 to be tested are A2, and the test items of the crystal grains with the coordinates of C3 to be tested are B3.

The analysis module 42 can correlate the coordinate of the to-be-tested crystal grain of the to-be-tested wafer with the position that needs to be held by the probe station 1 according to the acquired data related to the test items of the test machine a and the test machine B, the coordinate of the to-be-tested crystal grain of the to-be-tested wafer, and the position of the to-be-tested wafer relative to the stage of the probe station 1, and analyze the number of times that the stage of the probe station 1 needs to move when testing each test crystal grain of the to-be-tested wafer.

The path policy generation module 43 is configured to determine a final path of stage movement of the probe station 1 according to the analysis result formed by the analysis module 42 and a preset minimum number of stage movement. Subsequently, the control module 44 controls the probe station 1 to move the wafer to be tested according to the path.

In another embodiment of the present invention, the threshold is implemented as a minimum total movement distance and a minimum total rotation angle of a stage carrying the wafer on the probe station.

The control module 44 is communicatively connected to the testing machine and the probe station 1, and communicatively connected to the path strategy generation module 43, so as to control the stage of the probe station 1 to execute the path strategy generated by the path strategy generation module 43 to complete the movement of the wafer to be tested in different positions. Correspondingly, after the platform deck of the probe station 1 carries the wafer to be tested to move, the control module 44 further controls the tester to test the wafer to be tested.

It should be added that, unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which this invention belongs. Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any uses or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the present invention is not limited to the structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. A multi-platform linkage effect-improving mechanism is characterized by comprising a probe station, at least two testing machines and a control system; the control system comprises a signal configuration unit and a path planning unit; the signal configuration unit is independently arranged and is respectively connected with the probe station and the tester through GPIB (general purpose interface bus), so that signal transmission between the probe station and the tester is realized; the path planning unit comprises an information acquisition module, an analysis module, a path strategy generation module and a control module; wherein the information acquisition module is communicatively connected to the signal configuration unit, the testers and the probe station to acquire the number of testers to be tested for a wafer to be tested, test items and data related to the wafer to be tested, the analysis module is communicatively connected to the information acquisition module to receive the data acquired by the information acquisition module and form an analysis result related to determining coordinates of dies commonly required in the test items of the testers and coordinates of the dies individually required to be tested and coordinate positions of probe cards of the probe station, the path policy generation module is configured to generate a path policy related to controlling a moving path of the probe station bearing the wafer to be tested according to the analysis result formed by the analysis module and a preset threshold, and the control module is communicatively connected to the probe station, The testing machine and the path strategy generation module are used for controlling the loading platform of the probe station to execute the path strategy generated by the path strategy generation module, completing the movement of the wafer to be tested in different positions and controlling the testing machine to test.

2. The multi-platform linkage effect-lifting mechanism of claim 1, wherein the models of the testing machines in one multi-platform linkage effect-lifting mechanism are the same.

3. The multi-platform linkage effect-lifting mechanism according to claim 1, wherein the signal configuration unit at least comprises a main control board and the GPIB port, the main control board is provided with a main control chip, and the main control chip is connected to the GPIB port and controls the GPIB port to receive and transmit signals from the probe station and the tester.

4. The multi-platform linkage effect-improving mechanism according to claim 3, wherein the main control chip at least comprises a signal receiving module, a signal sending module, a signal splitting module and a signal integrating module; the signal receiving module and the signal sending module are respectively connected with the GPIB port to realize the receiving and sending of signals from the probe station and the tester; the signal splitting module is used for splitting a signal from the probe station; the signal integration module is used for integrating the signals from the tester.

5. The multi-platform linkage effect-lifting mechanism according to claim 3, wherein the number of GPIB ports is at least three, and the number of GPIB ports is the same as the sum of the number of the probe stations and the number of the testers.

6. The multi-platform linkage effect-improving mechanism according to claim 4, wherein when the signal splitting module splits the signals from the probe station, each of the split signals is the same.

7. The multi-platform linkage effect-lifting mechanism according to claim 6, wherein the number of signals split by the signal splitting module is the same as the number of the testers.

8. The multi-platform linkage effect-improving mechanism according to claim 7, wherein a fixed address corresponding to the probe station and the tester is further provided on the main control board to realize the transmission and reception of signals.

9. The multi-platform linkage effect-improving mechanism according to claim 8, wherein the probe station and the tester of the multi-platform linkage effect-improving mechanism are provided with fixed addresses corresponding to those of the signal configuration unit, so as to transmit and receive signals.

10. The multi-stage linkage lift mechanism of claim 1, wherein the threshold is implemented as a minimum number of stage movements of the probe stage that carry the wafer.

11. The multi-stage linkage lift mechanism of claim 1, wherein the threshold is implemented as a minimum total movement distance and a minimum total rotation angle of a stage on the probe stage that carries the wafer.