CN112226798A - Anti-corrosion circuit PCB pattern electroplating device and electroplating method thereof - Google Patents

Anti-corrosion circuit PCB pattern electroplating device and electroplating method thereof Download PDF

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Publication number
CN112226798A
CN112226798A CN202011097802.0A CN202011097802A CN112226798A CN 112226798 A CN112226798 A CN 112226798A CN 202011097802 A CN202011097802 A CN 202011097802A CN 112226798 A CN112226798 A CN 112226798A
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China
Prior art keywords
electroplating
pcb
fixedly connected
rod
jacket
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Withdrawn
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CN202011097802.0A
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Chinese (zh)
Inventor
陆叶
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Guangzhou Tiancheng Technology Co ltd
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Guangzhou Tiancheng Technology Co ltd
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Priority to CN202011097802.0A priority Critical patent/CN112226798A/en
Publication of CN112226798A publication Critical patent/CN112226798A/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention relates to the technical field of circuits and discloses an anti-corrosion circuit PCB pattern electroplating device and an electroplating method thereof. According to the anti-corrosion circuit PCB pattern electroplating device and the electroplating method thereof, the bevel gear rotating rod is driven to rotate by the starting motor, so that the threaded stirring device and the stirring rod rotate in the use process, and the electroplating solution precipitated at the bottom of the electroplating tank can be driven to stir in the use process, so that the movement of the electroplating solution inside the solution is accelerated in the use process, the mixing of the solution inside the solution is accelerated, and the phenomenon of uneven concentration is reduced.

Description

Anti-corrosion circuit PCB pattern electroplating device and electroplating method thereof
Technical Field
The invention relates to the technical field of circuits, in particular to an anti-corrosion circuit PCB pattern electroplating device and an electroplating method thereof.
Background
Before the printed circuit boards appear, the interconnection among electronic components is formed into a complete circuit by means of direct connection of electric wires, in the current generation, a circuit panel only exists as an effective experimental tool, the printed circuit boards already occupy an important position in the electronic industry, but the phenomenon that the patterns of the PCB are corroded and damaged occurs in the production and manufacturing processes of the PCB, so that the existing patterns of the PCB need to be electroplated in the using process, and an anti-corrosion circuit PCB pattern electroplating device and an electroplating method thereof are developed.
In the prior anti-corrosion circuit PCB pattern electroplating device and the electroplating method thereof, the phenomenon that the outer jacket of the PCB has different gaps in the installation process is generated, so that the phenomenon of inconvenience exists in the clamping process, and the phenomenon of uneven distribution of the concentration of the internal electroplating solution can occur in the process of adding the electroplating solution.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the anti-corrosion circuit PCB pattern electroplating device and the electroplating method thereof, which have the advantages of uniform concentration improvement and convenience in clamping the PCBs with different sizes, and solve the problems in the background technology.
The invention provides the following technical scheme: an anti-corrosion circuit PCB graphic electroplating device comprises a first washing tank, wherein one side of the first washing tank is fixedly connected with a first oil removing tank, one side of the first oil removing tank is fixedly connected with an electroplating tank, one side of the electroplating tank is fixedly connected with a second washing tank, one side of the second washing tank is fixedly connected with a second oil removing tank, the upper part of the first washing tank is fixedly connected with a back supporting plate, the middle part of the inner wall of the back supporting plate is fixedly connected with a movable rod, the outer part of the movable rod is sleeved with a jacket, one side of the inner part of the jacket is fixedly connected with a movable wheel supporting rod, the lower part of the movable wheel supporting rod is movably connected with a movable wheel, the inner part of the jacket is movably connected with a limit push rod, one side of the limit push rod is fixedly connected with a first spring, the upper part of the limit push rod is, the lower part of the stretching diagonal rod is movably connected with an upper clamping device cross rod, the lower part of the upper clamping device cross rod is fixedly connected with a side clamping device supporting rod, the lower part of the side clamping device supporting rod is fixedly connected with a first L-shaped jacket, the lower part of the first L-shaped jacket is movably connected with a threaded rod, the lower part of the threaded rod is movably connected with a second L-shaped jacket, the inner part of one side of the first L-shaped jacket is movably connected with a threaded column, the lower part of the threaded column is movably connected with a clamping gasket, the outer jacket of a PCB is placed on the lower part of the clamping gasket, the PCB is clamped in the outer jacket of the PCB, the inner part of the outer jacket of the PCB is fixedly connected with the PCB jacket, the surface of the PCB is fixedly connected with a graphic circuit, one side of the first L-shaped jacket is movably connected with, the utility model discloses a copper sheet, including copper sheet, upper portion fixedly connected with screw thread clamping device, the middle part fixedly connected with power box on back backup pad upper portion, one side fixedly connected with power transmission line of power box, the opposite side fixedly connected with who presss from both sides tight gasket electroplates the piece, the upper portion fixedly connected with concentration detection device at the electroplating box back, the inside fixedly connected with plating solution pipeline of electroplating box one side, the opposite side fixedly connected with motor of electroplating box lower part, the inside swing joint of electroplating box lower part one side has the helical gear, one side fixedly connected with helical gear dwang of helical gear, the outside swing joint of helical gear dwang has screw thread agitating unit, the puddler is installed to one side of screw thread agitating unit.
Preferably, the upper part and the lower part of the inside of the jacket are respectively and fixedly connected with a movable wheel supporting rod and a movable wheel, the number of the movable wheel supporting rods and the number of the movable wheels are respectively two on the upper part and the lower part of the first water washing tank, and one end of the upper part of the movable rod is sleeved inside the movable wheel by the movable wheels.
Preferably, the inside of the upper part of the upper cross rod of the clamping device and the inside of the lower part of the jacket are movably connected with a limiting push rod, the first spring is clamped between the limiting push rod and the middle part of the inside of the upper cross rod of the clamping device, the stretching inclined rods are formed by two same devices, and a movable rod is arranged in the middle of each stretching inclined rod.
Preferably, the outside of screw thread clamping device is equipped with the screw thread, the opposite side fixedly connected with circuit of power box, the thread bush is installed to the lower part of circuit, the thread bush is connected with screw thread clamping device threaded fit each other, the length of circuit is adjustable.
Preferably, the lower part of the threaded rod is provided with threads, the threaded rod is sleeved in the L-shaped jacket II in a threaded manner, the threaded rod is provided with two clamping sleeves between the L-shaped jacket I and the L-shaped jacket II, supporting legs are arranged at four corners of the lower part of the clamping gasket, supporting rods are arranged on two sides of the clamping gasket, the supporting rods penetrate through the L-shaped jacket I, the L-shaped jacket I and the L-shaped jacket II are L-shaped, and the PCB is clamped between the L-shaped jacket I and the L-shaped jacket II.
Preferably, the copper sheet is I-shaped, the upper part and the lower part of the copper sheet protrude, the lower part of the copper sheet protrudes to be in contact with a graphic circuit, the spring II is clamped on the lower part of one side of the L-shaped clamping sleeve and a supporting baffle on the outer side of the lower part of the copper sheet, and the connecting line penetrates through one side of the upper cross rod of the clamping device and is connected with the threaded clamping device.
Preferably, the plating solution conveying pipeline is clamped at one side in the electroplating tank, the other side of the plating solution conveying pipeline is fixedly connected to the plating solution conveying pipeline, and a valve is mounted outside the other side of the plating solution conveying pipeline.
Preferably, the helical gear is installed on the upper portion of motor, helical gear and the mutual helical gear cooperation of helical gear on the motor are connected, helical gear dwang centre gripping is in the lower part of electroplating tank, the helical gear dwang is at the inside opposite side swing joint of electroplating tank, screw thread agitating unit is the screw thread type, the puddler is the narrow upper portion width in lower part, puddler and electroplating tank's bottom have certain distance.
A method for pattern plating of an anti-corrosion circuit PCB board is characterized in that; the pattern electroplating method of the PCB comprises the following steps;
the first step is as follows: and clamping the PCB on the clamping device, and fixing the clamping device through the clamping device.
The second step is that: the clamped PCB is moved to the inside of the cleaning pool through the pulley and the telescopic device to be cleaned, and the troubleshooting table plate is moved to the inside of the oil removal pool to be subjected to oil removal treatment after cleaning.
The third step: the PCB board after will deoiling can be with the dust on surface clean, dries the processing simultaneously.
The fourth step: move the PCB board to the upper portion of electroplating bath, carry out the circular telegram on the PCB board and remove to electroplating bath inside simultaneously and carry out electroplating treatment, detect the solubility of inside solution through concentration detection device, accessible infusion tube passes through solution to electroplating bath inside simultaneously, and the starter motor accelerates inside solution to mix.
The fifth step: and (4) carrying out oil removal treatment and cleaning on the PCB after the electroplating is finished.
And a sixth step: and drying the surface of the PCB by using a drying device, and taking out the PCB.
Preferably, the PCB board jacket is in contact with the position, which is not in contact with the graphic circuit, of the thin wall on the PCB board, and a drying device is arranged outside the integral device.
Compared with the prior anti-corrosion circuit PCB pattern electroplating device and the electroplating method thereof, the invention has the following beneficial effects:
1. according to the anti-corrosion circuit PCB graphic electroplating device and the electroplating method thereof, the threaded rod is rotated to enable the threads at the lower part of the threaded rod to be in threaded fit connection with the L-shaped jacket II, the effect of the size between the L-shaped jacket I and the L-shaped jacket II of the device can be changed, the PCB external jackets with different sizes can be clamped, the clamping gasket is driven to move downwards through threaded motion by rotating the threaded column, the four corners of the lower part of the clamping gasket can be driven to extrude the PCB external jacket, the tightness degree between the PCB external jackets is changed, electroplating liquid is prevented from leaking to the position where the PCB jacket is in contact with a PCB, and the phenomenon of corrosion damage to the PCB is caused.
2. According to the anti-corrosion circuit PCB pattern electroplating device and the electroplating method thereof, the bevel gear rotating rod is driven to rotate by the starting motor, so that the threaded stirring device and the stirring rod rotate in the use process, and the electroplating solution precipitated at the bottom of the electroplating tank can be driven to stir in the use process, so that the movement of the electroplating solution inside the solution is accelerated in the use process, the mixing of the solution inside the solution is accelerated, and the phenomenon of uneven concentration is reduced.
Drawings
FIG. 1 is a schematic front view of the structure of the present invention;
FIG. 2 is a partially enlarged view of the structure of the present invention;
FIG. 3 is an enlarged view of the structure A of the present invention;
fig. 4 is an enlarged view of the structure B of the present invention.
In the figure: 1. a first water washing tank; 2. a first de-oiling tank; 3. electroplating box; 4. a second water washing tank; 5. a second oil removal tank; 6. a back support plate; 7. a movable rod; 8. a jacket; 9. a movable wheel support rod; 10. a movable wheel; 11. a limit push rod; 12. a first spring; 13. stretching the diagonal rods; 14. a cross bar is arranged on the clamping device; 15. A clamping device side support rod; 16. an L-shaped jacket I; 17. a threaded rod; 18. an L-shaped jacket II; 19. a threaded post; 20. clamping the gasket; 21. the PCB board is externally jacketed; 22. a PCB board; 23. a PCB board jacket; 24. A graphics circuit; 25. a copper sheet; 26. a second spring; 27. a connecting wire; 28. a thread clamping device; 29. A power supply box; 30. a power transmission line; 31. electroplating the sheet; 32. a concentration detection device; 33. an electroplating solution delivery pipe; 34. a motor; 35. a helical gear; 36. a bevel gear rotating rod; 37. a threaded stirring device; 38. A stirring rod.
Detailed description of the invention
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an anti-corrosion circuit PCB pattern electroplating device comprises a first washing tank 1, a first oil removing tank 2 fixedly connected to one side of the first washing tank 1, an electroplating tank 3 fixedly connected to one side of the first oil removing tank 2, a second washing tank 4 fixedly connected to one side of the electroplating tank 3, a second oil removing tank 5 fixedly connected to one side of the second washing tank 4, a back support plate 6 fixedly connected to the upper portion of the first washing tank 1, a movable rod 7 fixedly connected to the middle portion of the inner wall of the back support plate 6, a jacket 8 movably sleeved on the outer portion of the movable rod 7, a movable wheel support rod 9 fixedly connected to one side of the inside of the jacket 8, a movable wheel 10 movably connected to the lower portion of the movable wheel support rod 9, a limit push rod 11 movably connected to the inside of the jacket 8, a first spring 12 fixedly connected to one side of the limit push rod 11, and a tensile inclined rod 13 movably connected to the upper, the lower part of the stretching diagonal rod 13 is movably connected with a clamping device upper cross rod 14, the lower part of the clamping device upper cross rod 14 is fixedly connected with a clamping device side supporting rod 15, the lower part of the clamping device side supporting rod 15 is fixedly connected with an L-shaped jacket I16, the lower part of the L-shaped jacket I16 is movably connected with a threaded rod 17, the lower part of the threaded rod 17 is movably connected with an L-shaped jacket II 18, the inner part of one side of the L-shaped jacket I16 is movably connected with a threaded column 19, the lower part of the threaded column 19 is movably connected with a clamping gasket 20, the lower part of the clamping gasket 20 is provided with a PCB outer jacket 21, a PCB 22 is clamped inside the PCB outer jacket 21, the inner part of the PCB outer jacket 21 is fixedly connected with a PCB jacket 23, the surface of the PCB 22 is fixedly connected with a graphic circuit 24, one side of the L-shaped jacket I16, the upper portion fixedly connected with connecting wire 27 of copper sheet 25, the upper portion fixedly connected with screw thread clamping device 28 of connecting wire 27, middle part fixedly connected with power box 29 on back backup pad 6 upper portion, one side fixedly connected with power transmission line 30 of power box 29, the opposite side fixedly connected with of clamping shim 20 electroplates piece 31, the upper portion fixedly connected with concentration detection device 32 at the electroplating box 3 back, the inside fixedly connected with plating solution pipeline 33 of electroplating box 3 one side, the opposite side fixedly connected with motor 34 of electroplating box 3 lower part, the inside swing joint of electroplating box 3 lower part one side has helical gear 35, one side fixedly connected with helical gear dwang 36 of helical gear 35, the outside swing joint of helical gear dwang 36 has screw thread agitating unit 37, puddler 38 is installed to one side of screw thread agitating.
Wherein, the upper part and the lower part inside the jacket 8 are respectively fixedly connected with a movable wheel supporting rod 9 and a movable wheel 10, the upper part and the lower part of the first water washing box 1 are respectively provided with two movable wheel supporting rods 9 and two movable wheels 10, the movable wheel 10 sleeves one end of the upper part of the movable rod 7 inside the movable wheel 10, in the using process, the phenomenon of inconvenient movement exists in the fixing process of the clamping device, therefore, in the using process, two movable wheel supporting rods 9 and two movable wheels 10 are respectively arranged on the upper part and the lower part inside the jacket 8, in the using process, the movable wheel 10 is supported and fixed through the movable wheel supporting rod 9, meanwhile, the movable wheel 10 is contacted with the movable rod 7, in the moving process, the jacket 8 is driven to move on the movable rod 7 by pushing the clamping device, in the using process, the movable wheels 10 on the upper part and the lower part are clamped on the movable rod 7, when the device is used, the movable wheel 10 can roll around the movable wheel supporting rod 9, so that the movable wheel 10 of the device can be driven to roll on the movable rod 7 in the use process, the friction resistance of the device in the use process can be reduced, the function of convenient movement of the device in the use process is increased in the use process, and the flexibility of the device in the use process is increased.
Wherein, the inside of the upper part of the upper cross bar 14 of the clamping device and the inside of the lower part of the jacket 8 are movably connected with a limit push rod 11, a first spring 12 is clamped between the limit push rod 11 and the middle part of the inside of the upper cross bar 14 of the clamping device, a stretching inclined bar 13 is formed by two same devices, a movable bar is arranged in the middle part of the two stretching inclined bars 13, in the using process, the stretching inclined bars 13 are mutually crossed and connected, so that the stretching inclined bars 13 can move around the middle connecting bar in the using process, so that a lever principle is formed, in the using process, the to-be-determined limit push rod 11 can move in the inner parts of the upper cross bar 14 of the clamping device and the jacket 8, so that in the using process, the lower part of the upper cross bar 14 of the clamping device can be conveniently moved to the inner part of the electroplating pool, meanwhile, under the elastic action of the, the device can be driven to be recycled, so that the stretching inclined rod 13 is stretched, and the stability of the device during lifting in use is facilitated in the using process.
Wherein, the outside of screw thread clamping device 28 is equipped with the screw thread, the opposite side fixedly connected with circuit of power box 29, the thread bush is installed to the lower part of circuit, the thread bush is connected with screw thread clamping device 28 mutual screw-thread fit, the length of circuit is adjustable, in the use, through being connected with the connecting wire with the other one side of device power box 29, the connecting wire department of connecting at device power box 29 opposite side simultaneously contacts with screw thread clamping device 28, but make things convenient for the device to drive the clamp cover of the connecting wire department of screw thread clamping device 28 and power box 29 opposite side in the use and carry out threaded connection in the electroplating process, make conveniently switch on electroplating device inside in the use, for this reason flexibility and practicality when increasing the device in the use.
Wherein, the lower part of the threaded rod 17 is provided with threads, the threaded rod 17 is sleeved in the L-shaped jacket II 18 in a threaded manner, two threaded rods 17 are arranged between the L-shaped jacket I16 and the L-shaped jacket II 18, supporting legs are arranged at four corners of the lower part of the clamping gasket 20, supporting rods are arranged at two sides of the clamping gasket 20 and penetrate through the L-shaped jacket I16, the L-shaped jacket I16 and the L-shaped jacket II 18 are L-shaped, a PCB external jacket 21 is clamped between the L-shaped jacket I16 and the L-shaped jacket II 18, in the using process, in order to protect the external part of the external circuit of the PCB 22 to be contacted with electroplating solution, therefore, the PCB 22 is clamped through the PCB external jacket 21, but in the using process, the PCB external jacket 21 has different gaps in the mounting process, so that the clamping process has inconvenience, therefore, in the using process, the threaded rod 17 is movably sleeved on the L-shaped jacket I16, when in use, the threaded rod 17 is rotated to drive the threads at the lower part of the threaded rod 17 to be in threaded fit connection with the L-shaped jacket II 18, therefore, in the use process, the effect of the size between the L-shaped jacket I16 and the L-shaped jacket II 18 can be changed, so that the PCB external jackets 21 with different sizes can be clamped in the use process, and meanwhile, in the use process, the threaded column 19 is rotated, so that in the use process, the clamping gasket 20 is driven to move downwards through the threaded motion, therefore, in the use process, four corners at the lower part of the clamping gasket 20 can be driven to extrude the PCB external jacket 21, the tightness degree between the PCB external jackets 21 is changed, electroplating solution is prevented from leaking to the position where the PCB jacket 23 is in contact with the PCB 22, and the phenomenon of corrosion damage to the PCB is caused, therefore, in the using process, the device can be fastened when in use, and meanwhile PCBs with different sizes can be clamped in the using process, so that the flexibility of the device in use is improved.
The copper sheet 25 is I-shaped, the upper part and the lower part of the copper sheet 25 are protruded, the lower part of the copper sheet 25 is protruded to be in contact with the graphic circuit 24, the spring II 26 is clamped on the lower part of one side of the L-shaped jacket I16 and a supporting baffle plate on the outer side of the lower part of the copper sheet 25, the connecting wire 27 penetrates through one side of the upper cross rod 14 of the clamping device and is connected with the threaded clamping device 28 through the connecting wire 27, the copper sheet 25 is I-shaped in the use process, the spring II 26 is clamped between the lower part of one side of the L-shaped jacket I16 and the copper sheet 25, and in the use process, the lower part of the copper sheet 25 can be pushed to be in contact with the graphic circuit 24 under the elastic action of the spring II 26, so that when the device is used, the convex plate on the lower part of the copper sheet 25 is pushed to be in contact.
Wherein, plating solution pipeline 33 centre gripping is in the inside one side of electroplating tank 3, the opposite side fixed connection of plating solution pipeline 33 is on plating solution pipeline, the externally mounted of plating solution pipeline 33 opposite side has the valve, in the use, through installing plating solution pipeline 33 in one side of the inside of electroplating tank 3 one side, make in the use when the solution of electroplating tank 3 inside appears the concentration not enough, through rotating the valve of plating solution pipeline 33 opposite side, make in the use, can be to the effect of the inside transport plating solution of electroplating tank 3, for this can increase the homogeneity that the device kept inside solution when using in the use.
Wherein, the helical gear is installed on the upper portion of the motor 34, the helical gear on the motor 34 is connected with the helical gear 35 in a mutual helical gear matching manner, the helical gear rotating rod 36 is clamped at the lower portion of the electroplating tank 3, the helical gear rotating rod 36 is movably connected at the other side inside the electroplating tank 3, the thread stirring device 37 is of a thread type, the stirring rod 38 is narrow at the lower portion and wide at the upper portion, a certain distance exists between the stirring rod 38 and the bottom of the electroplating tank 3, the phenomenon of uneven distribution of concentration of internal electroplating solution can occur during the process of adding electroplating solution in the using process, therefore, in the using process, the helical gear rotating rod 36 is driven to rotate by starting the motor 34, therefore, in the using process, the threaded stirring device 37 and the stirring rod 38 are connected to rotate, in the using process, the electroplating solution precipitated at the bottom of the electroplating tank 3 can be driven to stir, so that the movement of the, so as to accelerate the concentration of the internal solution and reduce the phenomenon of uneven concentration.
A method for electroplating the PCB pattern with anticorrosion function includes such steps as electroplating the PCB pattern;
the first step is as follows: and clamping the PCB on the clamping device, and fixing the clamping device through the clamping device.
The second step is that: the clamped PCB is moved to the inside of the cleaning pool through the pulley and the telescopic device to be cleaned, and the troubleshooting table plate is moved to the inside of the oil removal pool to be subjected to oil removal treatment after cleaning.
The third step: the PCB board after will deoiling can be with the dust on surface clean, dries the processing simultaneously.
The fourth step: move the PCB board to the upper portion of electroplating bath, carry out the circular telegram on the PCB board and remove to electroplating bath inside simultaneously and carry out electroplating treatment, detect the solubility of inside solution through concentration detection device, accessible infusion tube passes through solution to electroplating bath inside simultaneously, and the starter motor accelerates inside solution to mix.
The fifth step: and (4) carrying out oil removal treatment and cleaning on the PCB after the electroplating is finished.
And a sixth step: and drying the surface of the PCB by using a drying device, and taking out the PCB.
Wherein, the PCB board presss from both sides the cover 23 and the contactless position contact of thin wall and graphic circuit 24 on the PCB board 22, the outside of whole device is equipped with drying device, in the use, through the contactless position contact of thin wall and graphic circuit 24 on PCB board 23 and the PCB board 22, make can guarantee in the use that the plating solution reduces the outside part that does not need the electroplating that gets into graphic circuit 24 and seals, make prevent that the plating solution from causing the phenomenon of damage to the thin wall on the PCB board 22, simultaneously there is drying device at the device externally mounted, make in the use increase device acceleration when using give off of moisture, reduce the effect of dust in the moisture adsorption of air, make the neatness when increasing the device and using.
The working principle is as follows: when the device is used, the PCB 22 is clamped in the PCB outer jacket 21, the PCB outer jacket 21 seals the position of the PCB 22 which does not need to be electroplated, the PCB outer jacket 21 is clamped between the L-shaped jacket I16 and the L-shaped jacket II 18, the threaded rod 17 is rotated to adjust the distance between the L-shaped jacket I16 and the L-shaped jacket II 18, the threaded column 19 is rotated to drive the clamping gasket 20 to press downwards, so that the clamping force of the PCB outer jacket 21 on the PCB 22 is increased, the device jacket 8 is moved at the same time, the PCB 22 is driven to move to the upper part of the first washing tank 1, the PCB 22 can be moved to the inside of the first washing tank 1 through the stretching inclined rod 13, the PCB 22 can be washed by water and moved to the inside of the first oil removal tank 2, so that the surface of the PCB 22 can be deoiled when the device is used, and the PCB 22 is moved to the inside of the electroplating tank 3 when the device is used, the connecting line of power supply box 29 opposite side and screw thread clamping device 28 contact, make the circular telegram, carry out electroplating treatment to PCB board 22 for this reason, make and cover one deck film at graphic circuit 24's surface, start motor 34 simultaneously, make and drive puddler 38 and screw thread agitating unit 37 and rotate, make and accelerate the inside solubility of electroplating box 3 and mix, simultaneously in the use, provide the plating solution through plating solution pipeline 33 to the inside of electroplating box 3, after electroplating, remove PCB board 22 to second washing case 4 and the inside that the oil tank 5 was removed to the second, make and wash the surface to PCB board 22, and carry out drying process with PCB board 22 after electroplating.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. The utility model provides a circuit PCB board figure electroplating device of anticorrosion, includes first washing case (1), its characterized in that: one side of the first water washing tank (1) is fixedly connected with a first oil removing tank (2), one side of the first oil removing tank (2) is fixedly connected with an electroplating tank (3), one side of the electroplating tank (3) is fixedly connected with a second water washing tank (4), one side of the second water washing tank (4) is fixedly connected with a second oil removing tank (5), the upper part of the first water washing tank (1) is fixedly connected with a back supporting plate (6), the middle part of the inner wall of the back supporting plate (6) is fixedly connected with a movable rod (7), a jacket (8) is movably sleeved on the outer part of the movable rod (7), one side of the inner part of the jacket (8) is fixedly connected with a movable wheel supporting rod (9), the lower part of the movable wheel supporting rod (9) is movably connected with a movable wheel (10), the inner part of the jacket (8) is movably connected with a limit push rod (11), one side of the limit push rod (11) is, the upper part of the limiting push rod (11) is movably connected with a stretching inclined rod (13), the lower part of the stretching inclined rod (13) is movably connected with a clamping device upper cross rod (14), the lower part of the clamping device upper cross rod (14) is fixedly connected with a clamping device side supporting rod (15), the lower part of the clamping device side supporting rod (15) is fixedly connected with an L-shaped jacket I (16), the lower part of the L-shaped jacket I (16) is movably connected with a threaded rod (17), the lower part of the threaded rod (17) is movably connected with an L-shaped jacket II (18), the inner part of one side of the L-shaped jacket I (16) is movably connected with a threaded column (19), the lower part of the threaded column (19) is movably connected with a clamping gasket (20), the lower part of the clamping gasket (20) is placed with a PCB outer jacket (21), and the PCB (22) is clamped inside the PCB outer jacket, the inner part of the PCB outer jacket (21) is fixedly connected with a PCB jacket (23), the surface of the PCB (22) is fixedly connected with a graphic circuit (24), one side of the L-shaped jacket (16) is movably connected with a copper sheet (25), the outer part of the lower part of the copper sheet (25) is movably connected with a spring II (26), the upper part of the copper sheet (25) is fixedly connected with a connecting wire (27), the upper part of the connecting wire (27) is fixedly connected with a thread clamping device (28), the middle part of the upper part of the back supporting plate (6) is fixedly connected with a power supply box (29), one side of the power supply box (29) is fixedly connected with a power transmission line (30), the other side of the clamping gasket (20) is fixedly connected with an electroplating sheet (31), the upper part of the back of the electroplating box (3) is fixedly connected with a concentration detection device (32), the inner part of one, the utility model discloses a electroplating box, including electroplating box (3), the inside swing joint of electroplating box (3) lower part one side has helical gear (35), one side fixedly connected with helical gear dwang (36) of helical gear (35), the outside swing joint of helical gear dwang (36) has screw thread agitating unit (37), puddler (38) are installed to one side of screw thread agitating unit (37).
2. The apparatus of claim 1, wherein: the upper portion and the lower portion of the interior of the jacket (8) are respectively and fixedly connected with a movable wheel supporting rod (9) and a movable wheel (10), the upper portion and the lower portion of the first water washing tank (1) are respectively provided with two movable wheel supporting rods (9) and two movable wheels (10), and one end of the upper portion of each movable rod (7) is sleeved inside the corresponding movable wheel (10) through the corresponding movable wheel (10).
3. The apparatus of claim 1, wherein: the clamping device is characterized in that a limiting push rod (11) is movably connected to the inner portion of the upper cross rod (14) of the clamping device and the inner portion of the lower portion of the clamping sleeve (8), the first spring (12) is clamped between the limiting push rod (11) and the middle portion of the inner portion of the upper cross rod (14) of the clamping device, the stretching inclined rods (13) are formed by two same devices, and a movable rod is mounted in the middle of each stretching inclined rod (13).
4. The apparatus of claim 1, wherein: the outside of screw thread clamping device (28) is equipped with the screw thread, the opposite side fixedly connected with circuit of power box (29), the thread bush is installed to the lower part of circuit, the thread bush is connected with screw thread clamping device (28) screw-thread fit each other, the length of circuit is adjustable.
5. The apparatus of claim 1, wherein: the lower part of threaded rod (17) is equipped with the screw thread, threaded rod (17) screw sleeve connects in the inside that L type pressed from both sides cover two (18), threaded rod (17) press from both sides the cover one (16) and L type at the L type and press from both sides and install two between the cover two (18), the supporting legs is installed at the four corners of pressing from both sides tight gasket (20) lower part, the bracing piece is installed to the both sides that press from both sides tight gasket (20), the bracing piece passes the inside that L type pressed from both sides cover one (16), L type presss from both sides cover one (16) and L type and presss from both sides cover two (18) and be the L type, the PCB board outside of pressing from both sides between cover one (16) and L type press from.
6. The apparatus of claim 1, wherein: the shape of the copper sheet (25) is I-shaped, the upper part and the lower part of the copper sheet (25) protrude, the lower part of the copper sheet (25) protrudes to be in contact with the graphic circuit (24), the second spring (26) is clamped on the lower part of one side of the L-shaped jacket I (16) and a supporting baffle on the outer side of the lower part of the copper sheet (25), the connecting wire (27) penetrates through one side of the upper cross rod (14) of the clamping device, and the connecting wire (27) is connected with the threaded clamping device (28).
7. The apparatus of claim 1, wherein: the electroplating solution conveying pipeline (33) is clamped at one side in the electroplating box (3), the other side of the electroplating solution conveying pipeline (33) is fixedly connected to the electroplating solution conveying pipeline, and a valve is mounted outside the other side of the electroplating solution conveying pipeline (33).
8. The apparatus of claim 1, wherein: the utility model discloses a screw thread stirring device, including motor (34), helical gear and helical gear (35), helical gear rotating rod (36) centre gripping is in the lower part of electroplating box (3), helical gear rotating rod (36) are at the inside opposite side swing joint of electroplating box (3), screw thread agitating unit (37) are the screw thread type, puddler (38) are the narrow upper portion width in lower part, puddler (38) and the bottom of electroplating box (3) exist certain distance.
9. A method for pattern plating of an anti-corrosion circuit PCB board is characterized in that; the pattern electroplating method of the PCB comprises the following steps;
the first step is as follows: clamping the PCB on the clamping device, and fixing the clamping device through the clamping device;
the second step is that: moving the clamped PCB to the inside of a cleaning pool through a pulley and a telescopic device for cleaning, and moving the inspection table plate to the inside of an oil removal pool for oil removal treatment after cleaning;
the third step: the deoiled PCB can clean dust on the surface and carry out air drying treatment at the same time;
the fourth step: moving the PCB to the upper part of the electroplating pool, electrifying the PCB, moving the PCB to the inner part of the electroplating pool for electroplating treatment, detecting the solubility of the solution in the electroplating pool by a concentration detection device, passing the solution in the electroplating pool by a liquid conveying pipeline, and starting a motor to accelerate the mixing of the solution in the electroplating pool;
the fifth step: carrying out oil removal treatment and cleaning on the PCB after the electroplating is finished;
and a sixth step: and drying the surface of the PCB by using a drying device, and taking out the PCB.
10. The method of claim 9, wherein the step of electroplating comprises the steps of: the PCB board jacket (23) is in contact with the position where the thin wall on the PCB board (24) is not in contact with the graphic circuit (24), and a drying device is arranged outside the whole device.
CN202011097802.0A 2020-10-14 2020-10-14 Anti-corrosion circuit PCB pattern electroplating device and electroplating method thereof Withdrawn CN112226798A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011097802.0A CN112226798A (en) 2020-10-14 2020-10-14 Anti-corrosion circuit PCB pattern electroplating device and electroplating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011097802.0A CN112226798A (en) 2020-10-14 2020-10-14 Anti-corrosion circuit PCB pattern electroplating device and electroplating method thereof

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CN112226798A true CN112226798A (en) 2021-01-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114959853A (en) * 2022-06-07 2022-08-30 恩森(台州)化学有限公司 Perpendicular continuous PCB nickel plating gilding system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114959853A (en) * 2022-06-07 2022-08-30 恩森(台州)化学有限公司 Perpendicular continuous PCB nickel plating gilding system

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