CN112216617B - Bottom sealing glue filling control method and device, electronic equipment and medium - Google Patents

Bottom sealing glue filling control method and device, electronic equipment and medium Download PDF

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Publication number
CN112216617B
CN112216617B CN202010923822.2A CN202010923822A CN112216617B CN 112216617 B CN112216617 B CN 112216617B CN 202010923822 A CN202010923822 A CN 202010923822A CN 112216617 B CN112216617 B CN 112216617B
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China
Prior art keywords
information
primer
product
sealing glue
glue
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CN202010923822.2A
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CN112216617A (en
Inventor
潘浴宇
张巍
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Suzhou Tongfu Chaowei Semiconductor Co ltd
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Suzhou Tongfu Chaowei Semiconductor Co ltd
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Priority to CN202010923822.2A priority Critical patent/CN112216617B/en
Publication of CN112216617A publication Critical patent/CN112216617A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67294Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers

Abstract

The application provides a method, a device, electronic equipment and a medium for controlling the filling of a primer, which are used for comparing primer material information with product information in real time and monitoring the effective period of the primer, so that the problems of product abnormality and reliability failure caused by mixed use, misuse and overdue use of the primer are avoided, and the reliability of the primer sealing equipment is ensured.

Description

Bottom sealing glue filling control method and device, electronic equipment and medium
Technical Field
The present application relates generally to the field of semiconductor manufacturing, and in particular, to a method and apparatus for controlling underfill filling, an electronic device, and a medium.
Background
In the manufacturing process of the semiconductor product, the semiconductor product needs to be filled with the underfill in the gap between the device and the substrate by using the underfill technology, so that the reliability of the semiconductor product is improved, and the service life of the device is prolonged.
However, with the increase of the variety of products and the improvement of the reliability requirement, the types of underfill are also increasing, different underfill have different characteristics, and the mixing of the underfill can cause the abnormality of the quality of the products and the reliability failure.
Disclosure of Invention
In view of the foregoing drawbacks or shortcomings in the prior art, it is desirable to provide a method, apparatus, electronic device, and medium for controlling underfill filling.
In a first aspect, the application discloses a control method for filling a primer, which comprises the following steps:
obtaining product information, wherein the product information comprises the model of a product to be processed;
acquiring first information of the primer, wherein the first information comprises material information of the primer filled in the primer sealing equipment;
determining whether the product to be processed is matched with the current primer or not according to the corresponding relation between the model of the product and the primer material information;
if the two types of the base seal glue are matched, the base seal glue filling work is carried out, otherwise, the base seal glue filling work is not carried out.
Further, before the obtaining the product information, the method further comprises:
acquiring second information of the primer, wherein the second information comprises taking-out time information of the primer taken out of the refrigerating chamber;
and if the bottom sealing glue in the glue sealing equipment passes the preset time from the taking-out time, not performing the bottom sealing glue filling work or stopping the bottom sealing glue filling work.
Further, the first information further includes first batch information of the underfill disposed inside the underfill encapsulation apparatus, the second information includes second batch information of the underfill taken out from the refrigerating chamber, whether the first batch information and the second batch information are matched or not is compared, if so, the taking-out time of the underfill disposed inside the underfill encapsulation apparatus is obtained, and if not, no underfill filling operation is performed.
Further, the second information further comprises second material information of the primer taken out of the refrigerating chamber; the step of obtaining the product information and the step of obtaining the first information of the primer further comprises the following steps:
determining whether the primer taken out of the refrigerating chamber is matched with a product to be processed according to the corresponding relation between the model of the product and the primer material information;
if the two types of sealing glue are matched, carrying out temperature returning treatment on the bottom sealing glue, and filling the bottom sealing glue into sealing glue equipment after the temperature returning treatment; otherwise, the bottom sealing glue is replaced.
In a second aspect, the present application provides a underfill filling control apparatus, comprising:
the first acquisition module is used for acquiring product information, wherein the product information comprises the model of a product to be processed;
the second acquisition module is used for acquiring first information of the primer arranged inside the equipment, wherein the first information comprises material information of the primer inside the equipment;
and the comparison module is used for determining whether the product to be processed is matched with the current primer according to the corresponding relation between the product model and the primer material information, if so, performing primer filling work, otherwise, not performing primer filling work.
Further, the refrigerator further comprises a third acquisition module, wherein the third acquisition module is used for acquiring the time information of taking out the primer from the refrigerating chamber and transmitting the information to the comparison module;
and if the bottom sealing glue in the equipment is in a preset time period from the time of taking out, not performing the bottom sealing glue filling work or stopping the bottom sealing glue filling work.
Further, the first information further comprises first batch information of the primer arranged in the equipment; and the second information comprises second batch information of the primer taken out of the refrigerating chamber, whether the first batch information and the second batch information are matched or not is compared, when the first batch information and the second batch information are matched, the taking-out time of the primer arranged in the equipment is obtained, and if the first batch information and the second batch information are not matched, the primer filling work is not carried out.
Further, the second information further comprises second material information of the primer taken out of the refrigerating chamber; the step of obtaining the product information and the step of obtaining the first information of the primer further comprises the following steps:
determining whether the primer taken out of the refrigerating chamber is matched with a product to be processed according to the corresponding relation between the model of the product and the primer material information;
if the two types of the sealing glue are matched, carrying out temperature return treatment on the bottom sealing glue, and filling the bottom sealing glue into equipment after the temperature return treatment; otherwise, the bottom sealing glue is replaced.
In a third aspect, the application provides an electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing a method as claimed in any one of the preceding claims when executing the computer program.
In a fourth aspect, the present application provides a readable storage medium storing a computer program which when executed implements a method as claimed in any one of the preceding claims.
Advantageous effects
The application provides a method, a device, electronic equipment and a medium for controlling the filling of a primer, which are used for comparing primer material information with product information in real time and monitoring the effective period of the primer, so that the problems of product abnormality and reliability failure caused by mixed use, misuse and overdue use of the primer are avoided, and the reliability of the primer sealing equipment is ensured.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic flow chart of an embodiment of a underfill control method according to the present application;
FIG. 2 is a schematic diagram of a underfill control apparatus according to the present application;
fig. 3 is a schematic view of a underfill dispensing control apparatus according to another embodiment of the present application.
Detailed Description
The application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be noted that, for convenience of description, only the portions related to the application are shown in the drawings.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
In general, the filling of the bottom sealing glue on the products is carried out in glue sealing equipment, the products to be processed are arranged in the equipment, the bottom sealing glue is arranged in the equipment, and the glue sealing equipment automatically completes the filling work of the bottom sealing glue, but the materials of the bottom sealing glue are different, the flow parameters, the glass transition temperature, the curing conditions and the like of each bottom sealing glue are different, and the corresponding sealing glue is used for each model of the products; if the packaging glue is mixed or misused, the quality of the product is abnormal or the product fails.
In a first aspect, referring to fig. 1, the application discloses a control method for filling a primer, which includes:
s10, obtaining product information, wherein the product information comprises the model of a product to be processed.
In the actual production process, the product to be processed is generally disposed in the material boxes, each material box is provided with a material card, the material cards are recorded with information of the product, the information generally includes information of a model of the product, a batch of the product and the like, referring to fig. 2 and 3, the information obtained by the bar code or the two-dimensional code on the material cards is obtained through the first obtaining module 21, so as to obtain at least the model of the product to be processed, and the first obtaining module 22 can select a code scanner.
S20, acquiring first information of the primer, wherein the first information comprises material information of the primer arranged inside the equipment.
Generally, in the actual production process, an electronic tag is disposed outside each piece of packaging adhesive, information on the electronic tag is acquired through a second acquiring module 22 disposed in the adhesive sealing device 40, the second acquiring module 22 may, but is not limited to, select a code scanner, and scan the electronic tag on the primer in the current device through the code scanner to acquire first information of the primer in the current device, where the first information includes material information of the primer.
S30, determining whether a product to be processed is matched with the current primer or not according to the corresponding relation between the model of the product and the primer material information;
if the two types of the base seal glue are matched, the base seal glue filling work is carried out, otherwise, the base seal glue filling work is not carried out.
The sealing device 40 is connected with a comparison module 23, a BOM table is preset on the comparison module 23, the content of the BOM table comprises the corresponding relation between the product model and the sealing material, and the comparison module 22 judges whether the current product is matched with the sealing material currently arranged in the device or not based on the preset BOM information by receiving the first information and the product information so as to control the sealing device 40. Specifically, when matching, the control device operates to perform underfill filling operation on the product, and if not, the control device does not operate, so that an operator can conveniently discharge faults and feedback information can be sent out at the same time.
Further, before the obtaining the product information, the method further comprises:
and obtaining second information of the primer, wherein the second information comprises the taking-out time information of the primer taken out of the refrigerating chamber.
And if the bottom sealing glue in the equipment is in a preset time period from the time of taking out, not performing the bottom sealing glue filling work or stopping the bottom sealing glue filling work.
Further, the first information further includes first batch information of the primer disposed inside the device, the second information includes second batch information of the primer taken out from the refrigerating chamber, whether the first batch information and the second batch information are matched or not is compared, if so, the taking time of the primer disposed inside the device is obtained, and if not, no primer filling work is performed.
In the actual production process, the bottom sealing glue is stored in the refrigerating chamber, and is taken out from the refrigerating chamber to be warmed when needed, and the bottom sealing glue is installed in the sealing equipment after the temperature is warmed. Specifically, the comparison module 23 is connected with the third acquisition module 24, when the underfill is taken out in the device, the second information of the underfill is acquired through the third acquisition module 24, the second information includes the taken-out time of the underfill from the refrigerating chamber, when the taken-out time of the underfill exceeds a preset value, the comparison module 23 controls the underfill device 40 to send out an instruction, when the underfill device 40 is working, the operation of the underfill device 40 is stopped, when the current underfill device 40 is in a stopped state, the operation of the underfill device 40 is controlled to be not working when the current underfill device is started again, and feedback information is sent out, the current underfill is displayed to be out of date, and an operator is reminded of replacing the underfill.
A specific control method for the expiration date of the underfill will be described below by way of example, and the second batch information of the underfill is acquired by the third acquisition module 24 after the underfill is taken out from the refrigerating chamber. Specifically, the third obtaining module 24 is a code scanning device, and the electronic tag set on the primer is scanned, so that the second batch information is obtained by obtaining the electronic tag set on the primer, and the second batch information is bound with the take-out time information, so as to obtain the take-out time of the primer in the corresponding batch. Then, the second obtaining module 22 obtains the first batch information of the underfill disposed inside the underfill encapsulation apparatus 40 through the code scanning, so as to obtain the corresponding take-out time through the corresponding batch information, when the first batch information is not identical to the second batch information, that is, the underfill in the apparatus is not the underfill of the input system, the possibility of misuse of the underfill may occur, and at this time, the control apparatus is not operated, and can send feedback information, so that an operator can check the underfill, and prevent misuse of the underfill.
Further, the second information further comprises second material information of the primer taken out of the refrigerating chamber; the step of obtaining the product information and the step of obtaining the first information of the primer further comprises the following steps:
determining whether the primer taken out of the refrigerating chamber is matched with a product to be processed according to the corresponding relation between the model of the product and the primer material information;
if the two types of the base seal glue are matched, filling the base seal glue; otherwise, the bottom sealing glue filling work is not carried out.
Specifically, in the actual working process, in order to prevent the taken-out primer from being unmatched with a product to be processed currently, material information of the primer is also acquired when the primer is taken out from the refrigerating chamber, whether the primer taken out from the refrigerating chamber is matched with the product to be processed or not is determined according to preset BOM information, when the primer is matched with the product to be processed, equipment performs the next working procedure, and when the primer is unmatched, the primer is processed in time, for example, the primer is put into the refrigerating chamber again for refrigerating and preserving, so that the quality of the packaging adhesive is ensured.
In a second aspect, the present application provides a underfill filling control apparatus, referring to fig. 2, comprising:
a first obtaining module 21, configured to obtain product information, and send the product information to a comparison module 23, where the product information includes a model of a product to be processed;
a second obtaining module 22, configured to obtain first information of the primer disposed inside the device, and send the first information to the comparing module 23, where the first information includes material information of the primer inside the device;
and the comparison module 23 is used for determining whether the product to be processed is matched with the current primer according to the corresponding relation between the product model and the primer material information, if so, performing primer filling work, otherwise, not performing primer filling work.
Further, referring to fig. 3, the device further includes a third obtaining module 24, where the third obtaining module 24 is configured to obtain the extraction time information of the primer from the refrigerating chamber, and transmit the information to the comparing module 23;
and if the bottom sealing glue in the equipment is in a preset time period from the time of taking out, not performing the bottom sealing glue filling work or stopping the bottom sealing glue filling work.
Further, the first information further comprises first batch information of the primer arranged in the equipment; and the second information comprises second batch information of the primer taken out of the refrigerating chamber, whether the first batch information and the second batch information are matched or not is compared, when the first batch information and the second batch information are matched, the taking-out time of the primer arranged in the equipment is obtained, and if the first batch information and the second batch information are not matched, the primer filling work is not carried out.
Further, the second information further comprises second material information of the primer taken out of the refrigerating chamber; the step of obtaining the product information and the step of obtaining the first information of the primer further comprises the following steps:
determining whether the primer taken out of the refrigerating chamber is matched with a product to be processed according to the corresponding relation between the model of the product and the primer material information;
if the two types of the base seal glue are matched, filling the base seal glue; otherwise, the bottom sealing glue filling work is not carried out.
Specifically, with reference to fig. 2 and 3, the whole working process of the underfill filling control device will be described: the comparison module 23 may be an OTA system, in which BOM information and a temperature return time and a shelf life of the underfill are preset, where the BOM information includes a correspondence between a product model and an underfill material, that is, what type of underfill should be used for what type of product.
The first acquiring module 21, the second acquiring module 22 and the third acquiring module 24 are connected to the OTA system, and the first acquiring module 21, the second acquiring module 22 and the third acquiring module 24 can be code scanning devices, wherein the first acquiring module 22 is arranged close to the glue sealing equipment 40, and the processing product is arranged in the glue sealing equipment by scanning information on a material card and transmitting the information to the OTA system so as to acquire the model information of the current product to be processed.
Taking out the primer in the refrigerator according to the model of the product to be processed, sweeping an electronic code on the primer through a third acquisition module 24 to acquire material information and batch information of the primer, transmitting the information to an OTA system, and recording the taking-out time of the primer in the current batch according to the current time by the OTA system; it should be noted that, since the underfill is only used after being taken out from the refrigerating chamber and after being heated, the underfill is generally taken out from the refrigerating chamber in batches in advance according to production requirements. At this time, the OTA system compares whether the primer taken out from the refrigerating chamber is matched with the current product to be processed according to the preset BOM information, if so, the primer is installed in the primer sealing equipment, and the equipment is opened to enable the equipment to operate.
The sealing equipment 40 operates, at this time, a second acquisition module 22 arranged in the sealing equipment 40 is triggered to scan the primer arranged in the equipment to acquire the material information and the batch information of the primer in the equipment; since the primer is taken out, the mixed use may occur in the actual use process, so that it is determined whether the primer in the current device is the primer recorded in the information by the third acquisition unit 34 by acquiring the batch information, that is, whether the first batch information and the second batch information are matched, if not, the primer misuse phenomenon may occur, the sealant device 40 is controlled to stop working, if the device is in a stop state, the device does not work when the device is started again, and alarm information can be fed back on the display screen for facilitating the operation of eye investigation. If the first batch information is matched with the second batch information, the time for taking out the primer in the current primer sealing device 40 is obtained according to the batch information, the service time of the primer is monitored, and when the primer is out of date, the primer sealing device 40 is controlled to stop working or the device is not working.
The OTA system further compares the material information acquired by the second acquisition module 22 with the signal information of the previous product again according to the preset BOM information, and when the material information is matched with the signal information, the glue sealing equipment 40 is controlled to work, the bottom sealing glue filling work is performed on the current product, and if the material information is not matched with the signal information, the glue sealing equipment stops working.
The method has the advantages that the primer information and the product information are compared in real time, and the validity period of the primer is monitored in real time, so that misuse, mixed use and overdue use of the primer are prevented, and the filling reliability of the primer is effectively guaranteed.
In a third aspect, the present application provides an electronic device, including a memory, a processor, and a computer program stored on the memory and executable on the processor, where the processor implements the method as set forth in any one of the preceding claims when executing the computer program, so as to monitor an effective period of the underfill and a type of the underfill, and prevent the packaging device from misusing the underfill and expiring the use of the underfill.
In a fourth aspect, the present application provides a readable storage medium storing a computer program which when executed implements a method as claimed in any one of the preceding claims.
The above description is only illustrative of the preferred embodiments of the present application and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the application referred to in the present application is not limited to the specific combinations of the technical features described above, but also covers other technical features formed by any combination of the technical features described above or their equivalents without departing from the inventive concept. Such as the above-mentioned features and the technical features disclosed in the present application (but not limited to) having similar functions are replaced with each other.

Claims (8)

1. The bottom sealing glue filling control method is characterized by comprising the following steps of:
obtaining product information, wherein the product information comprises the model of a product to be processed;
acquiring first information of the primer, wherein the first information comprises material information of the primer filled in the primer sealing equipment;
determining whether the product to be processed is matched with the current primer or not according to the corresponding relation between the model of the product and the primer material information;
if the two types of the base seal glue are matched, the base seal glue filling work is carried out, otherwise, the base seal glue filling work is not carried out;
wherein, before obtaining the product information, the method further comprises:
acquiring second information of the primer, wherein the second information comprises taking-out time information of the primer taken out of the refrigerating chamber;
and if the bottom sealing glue in the glue sealing equipment passes the preset time from the taking-out time, not performing the bottom sealing glue filling work or stopping the bottom sealing glue filling work.
2. The method of claim 1, wherein the first information further comprises first batch information of the underfill disposed inside the underfill encapsulation apparatus, the second information comprises second batch information of the underfill taken out from the refrigerator compartment, the first batch information and the second batch information are compared to determine whether they match, if so, the take-out time of the underfill disposed inside the underfill apparatus is obtained, and if not, no underfill filling operation is performed.
3. The method of claim 2, wherein the second information further comprises second material information of the primer removed from the refrigerated compartment; the step of obtaining the product information and the step of obtaining the first information of the primer further comprises the following steps:
determining whether the primer taken out of the refrigerating chamber is matched with a product to be processed according to the corresponding relation between the model of the product and the primer material information;
if the two types of sealing glue are matched, carrying out temperature returning treatment on the bottom sealing glue, and filling the bottom sealing glue into sealing glue equipment after the temperature returning treatment; otherwise, the bottom sealing glue is replaced.
4. The utility model provides a bottom seal glue fills controlling means which characterized in that includes:
the first acquisition module is used for acquiring product information, wherein the product information comprises the model of a product to be processed;
the second acquisition module is used for acquiring first information of the primer arranged inside the glue sealing equipment, wherein the first information comprises material information of the primer inside the glue sealing equipment;
the comparison module is used for determining whether the product to be processed is matched with the current primer according to the corresponding relation between the product model and the primer material information, if so, the primer filling work is carried out, otherwise, the primer filling work is not carried out;
the third acquisition module is used for acquiring the taking-out time information of the bottom sealing adhesive taken out of the refrigerating chamber;
and if the bottom sealing glue in the glue sealing equipment passes the preset time from the taking-out time, not performing the bottom sealing glue filling work or stopping the bottom sealing glue filling work.
5. The control device of claim 4, wherein the first information further comprises first lot information of a primer disposed inside the primer apparatus; the second information comprises second batch information of the bottom sealing glue taken out of the refrigerating chamber, whether the first batch information and the second batch information are matched or not is compared, when the first batch information and the second batch information are matched, the taking-out time of the bottom sealing glue arranged inside the sealing glue equipment is obtained, and if the first batch information and the second batch information are not matched, the bottom sealing glue filling work is not carried out.
6. The control device of claim 5, wherein the second information further comprises second material information of the primer taken out of the refrigerating chamber; the step of obtaining the product information and the step of obtaining the first information of the primer further comprises the following steps:
determining whether the primer taken out of the refrigerating chamber is matched with a product to be processed according to the corresponding relation between the model of the product and the primer material information;
if the two types of sealing glue are matched, carrying out temperature returning treatment on the bottom sealing glue, and filling the bottom sealing glue into sealing glue equipment after the temperature returning treatment; otherwise, the bottom sealing glue is replaced.
7. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the method of any of claims 1-3 when executing the computer program.
8. A readable storage medium storing a computer program, characterized in that the computer program when executed implements the method of any one of claims 1-3.
CN202010923822.2A 2020-09-04 2020-09-04 Bottom sealing glue filling control method and device, electronic equipment and medium Active CN112216617B (en)

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CN112216617B true CN112216617B (en) 2023-09-15

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CN113304968B (en) * 2021-04-30 2022-06-14 深圳市世宗自动化设备有限公司 Pressure compensation automatic glue filling method and device, computer equipment and storage medium thereof

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JP2007194403A (en) * 2006-01-19 2007-08-02 Sony Corp Apparatus and method for manufacturing electronic device, and for inspecting underfill material filling state
CN103299407A (en) * 2011-01-11 2013-09-11 诺信公司 Methods for vacuum assisted underfilling

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Publication number Priority date Publication date Assignee Title
JPH1056035A (en) * 1996-08-12 1998-02-24 Nec Corp Wire bonding device
US6225144B1 (en) * 1999-03-01 2001-05-01 Motorola, Inc. Method and machine for underfilling an assembly to form a semiconductor package
US6484113B1 (en) * 1999-06-03 2002-11-19 Taiwan Semiconductor Manufacturing Co., Ltd Container inspection system and method of using in semiconductor manufacturing
JP2007194403A (en) * 2006-01-19 2007-08-02 Sony Corp Apparatus and method for manufacturing electronic device, and for inspecting underfill material filling state
CN103299407A (en) * 2011-01-11 2013-09-11 诺信公司 Methods for vacuum assisted underfilling

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