CN112207239A - Spherical mould - Google Patents
Spherical mould Download PDFInfo
- Publication number
- CN112207239A CN112207239A CN202011102205.2A CN202011102205A CN112207239A CN 112207239 A CN112207239 A CN 112207239A CN 202011102205 A CN202011102205 A CN 202011102205A CN 112207239 A CN112207239 A CN 112207239A
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- China
- Prior art keywords
- die holder
- semiconductor
- cavity
- lower die
- upper die
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/22—Moulds for peculiarly-shaped castings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention relates to a spherical die, which belongs to the technical field of dies and comprises an upper die holder and a lower die holder, wherein a first installation cavity is formed in one side of the upper die holder, which is close to the lower die holder, a first arc-shaped heat absorption plate is detachably connected in the first installation cavity, an upper forming die is connected to the inner side of the first arc-shaped heat absorption plate, and an upper die cavity is formed in the upper forming die; a second installation cavity is formed in one side, close to the upper die base, of the lower die base, a second arc-shaped heat absorption plate is detachably connected in the second installation cavity, the inner side of the second arc-shaped heat absorption plate is connected with a lower forming die, a lower die cavity is formed in the lower forming die, and the upper die cavity corresponds to the lower die cavity one by one; and the upper die base or the lower die base is respectively provided with a heat carrying device which is used for carrying the heat on the first arc-shaped heat absorbing plate or the second arc-shaped heat absorbing plate to the outside by force. By adopting the scheme, the upper die base and the lower die base can be cooled rapidly and uniformly, and the production efficiency of products is greatly improved.
Description
Technical Field
The invention belongs to the technical field of molds, and particularly relates to a spherical mold.
Background
The mold is a tool used for manufacturing molded articles in industrial production and is composed of various parts, and different molds are composed of different parts. The processing of the appearance of an article is realized mainly through the change of the physical state of a formed material. Depending on the shape of the product, different mold plates are designed with cold or hot water inlet and outlet circuits, which require frequent cooling, especially near the mold cores, cavities and runners. In one working cycle, the area of the mold to be cooled is large, and the time required for cooling is long, which accounts for about 80% of one cycle.
At present, cooling to casting spherical mould is very tricky, and current cooling device only accomplishes the circulation with cold water around the mould, and this kind of heat transfer mode is though can carry out the heat transfer, but heat exchange efficiency is lower relatively, has influenced the shaping effect to a certain extent.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a spherical die which can quickly and uniformly cool an upper die base and a lower die base, so that the production efficiency of products is greatly improved.
In order to achieve the above object, the present invention provides a technical solution as follows:
a spherical die comprises an upper die holder and a lower die holder, wherein a first mounting cavity is formed in one side of the upper die holder, which is close to the lower die holder, a first arc-shaped heat absorbing plate is detachably connected in the first mounting cavity, an upper forming die is connected to the inner side of the first arc-shaped heat absorbing plate, and an upper die cavity is formed in the upper forming die; a second installation cavity is formed in one side, close to the upper die base, of the lower die base, a second arc-shaped heat absorption plate is detachably connected in the second installation cavity, the inner side of the second arc-shaped heat absorption plate is connected with a lower forming die, lower die cavities are formed in the lower forming die, and the upper die cavities correspond to the lower die cavities one to one; and the upper die base or the lower die base is respectively provided with a heat carrying device which is used for carrying the heat on the first arc-shaped heat absorbing plate or the second arc-shaped heat absorbing plate to the outside by force.
Preferably, the upper die holder and the lower die holder are provided with mounting holes, one end of each mounting hole is connected with the outer end, and the other end of each mounting hole is communicated with the first mounting cavity or the second mounting cavity; the mounting holes comprise a first mounting hole communicated with the first mounting cavity or the second mounting cavity and a second mounting hole positioned on one side of the first mounting hole; the heat carrying device comprises a heat conducting plate positioned in the first mounting cavity or the second mounting cavity, a first semiconductor inserted in the first mounting hole, a second semiconductor inserted in the second mounting hole and a power supply, wherein one end of the first semiconductor and one end of the second semiconductor are respectively connected with the heat conducting plate, and the other end of the first semiconductor and the other end of the second semiconductor are positioned outside the mounting holes; one pole of the power supply is connected with the first semiconductor, the other pole of the power supply is connected with the second semiconductor, and the first semiconductor and the second semiconductor are semiconductors made of different materials; the heat conducting plate is made of conducting materials.
Preferably, the first mounting hole penetrates through the middle part of the first mounting cavity or the second mounting cavity, and a plurality of second mounting holes are arranged around the first mounting hole; the second semiconductor is arranged in each second mounting hole, and the other pole of the power supply is connected with each second semiconductor in parallel.
Preferably, the side, away from each other, of the upper die base and the lower die base is provided with a heat dissipation plate respectively, the heat dissipation plates are connected with the first semiconductor and the second semiconductor respectively, and the heat dissipation plates are made of non-conductive materials.
Preferably, a side of the heat dissipation plate away from the first semiconductor or the second semiconductor is provided with a heat dissipation grid.
Preferably, the upper die base and/or the lower die base are/is provided with a heat dissipation channel respectively, and the heat dissipation channel is not communicated with the mounting hole; and the two ends of the heat dissipation channel are connected with heat dissipation devices, and the heat dissipation devices drive heat dissipation media to enter the heat dissipation channel to dissipate heat of the upper die base or the lower die base.
Preferably, the heat dissipation device comprises a quick-connection plug connected to two ends of the heat dissipation channel, a liquid supply pipe connected with one of the quick-connection plugs, a liquid return pipe connected with the other quick-connection plug, a water pump and a liquid collecting tank, the liquid supply pipe is connected with a water outlet end of the water pump, a liquid inlet end of the water pump is connected with the liquid collecting tank, and the liquid return pipe is connected with the liquid collecting tank.
Preferably, the first installation cavity and the second installation cavity are respectively provided with a plurality of cavities, and the first installation cavity and the second installation cavity correspond to each other one by one.
Preferably, a material guide groove communicated with the upper die cavity or/and the lower die cavity is arranged on one side surface of the upper die base and the lower die base, which are close to each other.
Preferably, a connecting piece is arranged between the upper die holder and the lower die holder and controls the upper die holder and the lower die holder to be combined or separated.
According to the spherical die, in the die forming process, the heat in the upper die base and the lower die base can be forcibly conveyed to the outer sides of the upper die base and the lower die base through the arranged heat conveying devices, and compared with the mode of air or heat transfer, the heat dissipation efficiency is greatly improved. Therefore, the product forming time is greatly shortened, and the production efficiency is greatly improved.
Through the heat-conducting plate that sets up, first arc absorber plate and second arc absorber plate, adsorb the heat on the heat-conducting plate through first semiconductor and a plurality of second semiconductor, the heat-conducting plate absorbs the heat on first arc absorber plate or the second arc absorber plate, first arc absorber plate and second arc absorber plate dispel the heat to last moulded die and lower forming die through heat-conducting mode, compare in directly to last moulded die through the heat-conducting plate, the radiating mode of lower forming die, go up moulded die and lower forming die cooling more balanced. Furthermore, the cooling of the products in the upper forming die and the lower forming die is more balanced, and the quality of the products is relatively high during forming.
Through the heat dissipation device, the heat carrying device can be assisted to dissipate heat of the upper die base and the lower die base, so that the upper die base and the lower die base are kept at relatively low temperature in the product forming process, and the product is made to be condensed and formed.
Drawings
FIG. 1 is a schematic structural view of a spherical mold of the present invention;
FIG. 2 is an exploded view of a protruding upper mold base in a spherical mold according to the present invention;
FIG. 3 is a schematic view of a protruded heat sink plate in a spherical mold according to the present invention;
FIG. 4 is a circuit diagram of a protruding heat mover in a spherical mold of the present invention;
FIG. 5 is a schematic view of a protruded heat sink in a spherical mold according to the present invention;
fig. 6 is a schematic view of a protruding connection member in a spherical mold according to the present invention.
Reference numbers in the figures:
100. an upper die holder; 110. a first mounting cavity; 120. a first arc-shaped absorber plate; 130. an upper forming die; 140. an upper mold cavity; 150. a first mounting hole; 160. a second mounting hole; 170. a heat dissipation channel; 180. a material guide chute;
200. a lower die holder; 210. a second mounting cavity; 220. a second arc-shaped absorber plate; 230. a lower forming die; 240. a lower die cavity;
300. a heat transport device; 310. a heat conducting plate; 320. a first semiconductor; 330. a second semiconductor; 340. a power source; 350. a heat dissipation plate; 351. a heat dissipation grid;
400. a heat sink; 410. quickly connecting a plug; 420. a liquid supply tube; 430. a liquid return pipe; 440. a water pump; 450. a liquid collecting tank;
500. a connecting member; 510. a first connection block; 511. a first connection hole; 520. a second connecting block; 521. a second connection hole; 530. locking the screw rod; 540. and locking the nut.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
The invention provides a spherical die, which comprises an upper die holder 100 and a lower die holder 200, wherein a first mounting cavity 110 is formed in one side of the upper die holder 100, which is close to the lower die holder 200, a first arc-shaped heat absorbing plate 120 is detachably connected in the first mounting cavity 110, an upper forming die 130 is connected to the inner side of the first arc-shaped heat absorbing plate 120, and an upper die cavity 140 is formed in the upper forming die 130; a second mounting cavity 210 is formed in one side, close to the upper die holder 100, of the lower die holder 200, a second arc-shaped heat absorbing plate 220 is detachably connected in the second mounting cavity 210, a lower forming die 230 is connected to the inner side of the second arc-shaped heat absorbing plate 220, a lower die cavity 240 is formed in the lower forming die 230, and the upper die cavities 140 correspond to the lower die cavities 240 one by one; the upper die 100 or the lower die 200 is provided with a heat transfer device 300 for forcibly transferring heat from the first arc-shaped heat absorbing plate 120 or the second arc-shaped heat absorbing plate 220 to the outside. Specifically, when using, the upper die base 100 and the lower die base 200 laminate each other, the shaping product between upper die cavity 140 and lower die cavity 240, in the forming process, release a large amount of heats, through setting up the heat handling device 300 on upper die base 100 and lower die base 200, can force the heat transfer of first arc absorber plate 120 and second arc absorber plate 220 to the outside of upper die base 100 and lower die base 200, and then force the heat dissipation, the radiating efficiency of upper die base 100 and lower die base 200 has greatly been improved.
When the mold is a spherical mold, the first mounting cavity 110, the second mounting cavity 210, the first arc-shaped absorber plate 120, the second arc-shaped absorber plate 220, and the upper mold cavity 140 and the lower mold cavity 240 are all hemispherical.
The upper die holder 100 and the lower die holder 200 are respectively provided with a mounting hole, one end of the mounting hole is communicated with the outer end of the upper die holder 100 or the outer end of the lower die holder 200, and the other end of the mounting hole is communicated with the first mounting cavity 110 or the second mounting cavity 210. The mounting holes include a first mounting hole 150 and a second mounting hole 160, wherein the first mounting hole 150 communicates with the middle of the first mounting cavity 110 or the second mounting cavity 210, and the second mounting hole 160 is located outside the first mounting hole 150.
The heat-transporting device 300 includes a heat conductive plate 310 located in the first mounting chamber 110 or the second mounting chamber 210, a first semiconductor 320 inserted in the first mounting hole 150, a second semiconductor 330 inserted in the second mounting hole 160, and a power source 340. One ends of the first semiconductor 320 and the second semiconductor 330 are respectively connected to the heat conductive plate 310, and the other ends are located outside the mounting holes; one pole of the power source 340 is connected to the first semiconductor 320, the other pole of the power source 340 is connected to the second semiconductor 330, and the first semiconductor 320 and the second semiconductor 330 are semiconductors of different materials; the heat conductive plate 310 is made of a conductive material. According to the peltier effect principle, the device can forcibly transfer the heat at the heat conductive plate 310 to the other ends of the first and second semiconductors 320 and 330, thereby achieving heat dissipation to the first and second mounting cavities 110 and 210. Preferably, a control switch for controlling the power source 340 to be turned on or off is provided at the outside.
The heat conducting plate 310 can absorb the heat of the first arc-shaped heat absorbing plate 120 or the second arc-shaped heat absorbing plate 220, and then the first semiconductor 320 and the second semiconductor 330 can carry the heat, and the heat of the upper forming die 130 or the lower forming die 230 can be absorbed more uniformly through the first arc-shaped heat absorbing plate 120 or the second arc-shaped heat absorbing plate 220 and the heat conducting plate 310, and the heat dissipation process is more balanced.
Specifically, the first mounting holes 150 penetrate through the middle of the first mounting cavity 110 or the second mounting cavity 210, and the second mounting holes 160 are arranged around the first mounting holes 150; a second semiconductor 330 is disposed in each second mounting hole 160, and the other pole of the power source 340 is connected in parallel to each second semiconductor 330. Through the plurality of second semiconductors 330 that set up, in the use, every second semiconductor 330 forms closed circuit with first semiconductor 320, can all carry the heat on a plurality of second semiconductors 330, and then can be more even with the high temperature transfer in first installation cavity 110 or the second installation cavity 210 to the outsides of die holder 100 or die holder 200.
Further, heat dissipation plates 350 are respectively disposed on the sides of the upper die base 100 and the lower die base 200 away from each other, the heat dissipation plates 350 are respectively connected to the first semiconductor 320 and the second semiconductor 330, and the heat dissipation plates 350 are made of a non-conductive material. The heat sink 350 absorbs heat from the first and second semiconductors 320 and 330, thereby achieving rapid heat dissipation. Preferably, a heat dissipation grid 351 is disposed on a side of the heat dissipation plate 350 away from the first semiconductor 320 or the second semiconductor 330.
In use, in order to further improve the heat dissipation efficiency of the upper die base 100 and the lower die base 200, the upper die base 100 and the lower die base 200 are respectively provided with the heat dissipation device 400.
Specifically, the upper die holder 100 or the lower die holder 200 is respectively provided with a heat dissipation channel 170, and the heat dissipation channel 170 is not communicated with the mounting hole. The heat sink 400 carries a heat dissipating medium, and drives the heat dissipating medium into the heat dissipating channel 170 to dissipate heat of the upper die 100 or the lower die 200.
The heat dissipating device 400 includes quick plugs 410 connected to both ends of the heat dissipating channel 170, a liquid supply pipe 420 connected to one of the quick plugs 410, a liquid return pipe 430 connected to the other quick plug 410, a water pump 440, and a liquid collecting tank 450, wherein the liquid supply pipe 420 is connected to a water outlet of the water pump 440, the liquid inlet of the water pump 440 is connected to the liquid collecting tank 450, and the liquid return pipe 430 is connected to the liquid collecting tank 450. When heat dissipation is needed, the two quick connectors 410 are respectively connected with the liquid supply pipe 420 and the liquid return pipe 430, then the water pump 440 is started to work, the water pump 440 transfers the cooling medium in the liquid collecting tank 450 into the heat dissipation channel 170, circulation is formed, and heat dissipation is performed on the upper die base 100 or the lower die base 200 in the circulation process.
The first mounting cavity 110 and the second mounting cavity 210 are respectively provided in plurality and are in one-to-one correspondence. A material guide groove 180 communicated with the upper die cavity 140 or/and the lower die cavity 240 is arranged on one side surface of the upper die holder 100 and the lower die holder 200 close to each other. In use, the upper and lower cavities 140 and 240 are filled with raw materials through the material guide chute 180.
A connecting member 500 is arranged between the upper die holder 100 and the lower die holder 200, and the connecting member 500 controls the upper die holder 100 and the lower die holder 200 to be combined or separated. Wherein, the connecting pieces 500 are respectively provided at the sides of the upper die holder 100 and the lower die holder 200 close to each other.
The connecting member 500 includes a first connecting block 510 disposed on the upper die base 100, a second connecting block 520 disposed on the lower die base 200, and a locking screw 530; the first connecting block 510 is provided with a first connecting hole 511, the second connecting block 520 is provided with a second connecting hole 521, the first connecting hole 511 and the second connecting hole 521 are aligned, one end of the locking screw 530 is a nut, the other end of the locking screw passes through the first connecting hole 511 and the second connecting hole 521, and the locking screw 540 is in threaded connection.
The specific working process is as follows: fix upper die base 100 and die holder 200 through using connecting piece 500 for it is fixed between the two, pour into last die cavity 140 and lower die cavity 240 with forming material by baffle box 180 in, at last die cavity 140 and the interior cooling shaping product of lower die cavity 240, in the cooling process, upper die base 100 and die holder 200 temperature are higher relatively, at this moment, dispel the heat to upper die base 100 and die holder 200 through heat handling device 300 and heat abstractor 400, and then accelerated the condensation time of product in last die cavity 140 and the lower die cavity 240, production efficiency is improved.
The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A spherical mould is characterized in that: the die comprises an upper die holder (100) and a lower die holder (200), wherein a first installation cavity (110) is formed in one side, close to the lower die holder (200), of the upper die holder (100), a first arc-shaped heat absorbing plate (120) is detachably connected in the first installation cavity (110), an upper forming die (130) is connected to the inner side of the first arc-shaped heat absorbing plate (120), and an upper die cavity (140) is formed in the upper forming die (130);
a second mounting cavity (210) is formed in one side, close to the upper die holder (100), of the lower die holder (200), a second arc-shaped heat absorbing plate (220) is detachably connected in the second mounting cavity (210), a lower forming die (230) is connected to the inner side of the second arc-shaped heat absorbing plate (220), a lower die cavity (240) is formed in the lower forming die (230), and the upper die cavities (140) and the lower die cavities (240) are in one-to-one correspondence;
and the upper die holder (100) or the lower die holder (200) is respectively provided with a heat carrying device (300) for forcibly carrying the heat on the first arc-shaped heat absorbing plate (120) or the second arc-shaped heat absorbing plate (220) to the outer side.
2. The spherical mold according to claim 1, wherein: mounting holes are formed in the upper die holder (100) and the lower die holder (200), one end of each mounting hole is connected with the outer end, and the other end of each mounting hole is communicated with the first mounting cavity (110) or the second mounting cavity (210); the mounting holes comprise a first mounting hole (150) communicated with the first mounting cavity (110) or the second mounting cavity (210), and a second mounting hole (160) positioned on one side of the first mounting hole (150);
the heat carrying device (300) comprises a heat conducting plate (310) positioned in the first mounting cavity (110) or the second mounting cavity (210), a first semiconductor (320) inserted in the first mounting hole (150), a second semiconductor (330) inserted in the second mounting hole (160), and a power supply (340), wherein one end of the first semiconductor (320) and one end of the second semiconductor (330) are respectively connected with the heat conducting plate (310), and the other end of the first semiconductor (320) and the other end of the second semiconductor (330) are positioned outside the mounting holes;
one pole of the power supply (340) is connected with the first semiconductor (320), the other pole of the power supply (340) is connected with the second semiconductor (330), and the first semiconductor (320) and the second semiconductor (330) are semiconductors with different materials;
the heat conducting plate (310) is made of a conducting material.
3. The spherical mold according to claim 2, wherein: the first mounting holes (150) penetrate through the middle part of the first mounting cavity (110) or the second mounting cavity (210), and a plurality of second mounting holes (160) are formed in the periphery of the first mounting holes (150); the second semiconductor (330) is arranged in each second mounting hole (160), and the other pole of the power supply (340) is connected with each second semiconductor (330) in parallel.
4. The spherical mold according to claim 3, wherein: the side, far away from each other, of the upper die holder (100) and the lower die holder (200) is provided with a heat dissipation plate (350), the heat dissipation plate (350) is connected with the first semiconductor (320) and the second semiconductor (330) respectively, and the heat dissipation plate (350) is made of non-conductive materials.
5. The spherical mold according to claim 3, wherein: a radiating grid (351) is arranged on one side of the radiating plate (350), which is far away from the first semiconductor (320) or the second semiconductor (330).
6. The spherical mold according to claim 2, wherein: the upper die holder (100) and/or the lower die holder (200) are/is respectively provided with a heat dissipation channel (170), and the heat dissipation channels (170) are not communicated with the mounting holes;
the two ends of the heat dissipation channel (170) are connected with heat dissipation devices (400), and the heat dissipation devices (400) drive heat dissipation media to enter the heat dissipation channel (170) to dissipate heat of the upper die holder (100) or the lower die holder (200).
7. The spherical mold of claim 6, wherein: the heat dissipation device (400) comprises quick plugs (410) connected to two ends of the heat dissipation channel (170), a liquid supply pipe (420) connected with one quick plug (410), a liquid return pipe (430) connected with the other quick plug (410), a water pump (440) and a liquid collecting tank (450), wherein the liquid supply pipe (420) is connected with a water outlet end of the water pump (440), a liquid inlet end of the water pump (440) is connected with the liquid collecting tank (450), and the liquid return pipe (430) is connected with the liquid collecting tank (450).
8. The spherical mold according to any of claims 1 to 7, wherein: the first installation cavity (110) and the second installation cavity (210) are respectively provided with a plurality of cavities, and the cavities correspond to one another.
9. The spherical mold according to claim 1, wherein: and a guide chute (180) communicated with the upper die cavity (140) or/and the lower die cavity (240) is arranged on one side surface of the upper die holder (100) and the lower die holder (200) which are close to each other.
10. The spherical mold according to claim 1, wherein: a connecting piece (500) is arranged between the upper die holder (100) and the lower die holder (200), and the connecting piece (500) controls the upper die holder (100) and the lower die holder (200) to be combined or separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011102205.2A CN112207239A (en) | 2020-10-15 | 2020-10-15 | Spherical mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011102205.2A CN112207239A (en) | 2020-10-15 | 2020-10-15 | Spherical mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112207239A true CN112207239A (en) | 2021-01-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011102205.2A Pending CN112207239A (en) | 2020-10-15 | 2020-10-15 | Spherical mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112207239A (en) |
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| CN103286194A (en) * | 2013-06-28 | 2013-09-11 | 苏州唐氏机械制造有限公司 | Intelligent temperature-controlled blanking die |
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| CN108817322A (en) * | 2018-08-12 | 2018-11-16 | 繁昌县亘通智能装备有限公司 | A kind of high thermal effect Metallic Casting Die & Mold |
| CN208390950U (en) * | 2018-05-05 | 2019-01-18 | 佛山市国升五金制品有限公司 | A kind of oven box cover die |
| CN208468969U (en) * | 2018-07-05 | 2019-02-05 | 深圳市海康精密模具有限公司 | A kind of automobile parts injection mold cooling device |
| CN208495770U (en) * | 2018-07-07 | 2019-02-15 | 张家界汽车配件制造有限责任公司 | A kind of cooling equipment of automobile parts casting |
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2020
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| CN103286194A (en) * | 2013-06-28 | 2013-09-11 | 苏州唐氏机械制造有限公司 | Intelligent temperature-controlled blanking die |
| CN207154757U (en) * | 2017-07-17 | 2018-03-30 | 新昌县羽林街道维新机械厂 | A kind of high thermal effect Metallic Casting Die ＆ Mold |
| CN208390950U (en) * | 2018-05-05 | 2019-01-18 | 佛山市国升五金制品有限公司 | A kind of oven box cover die |
| CN208468969U (en) * | 2018-07-05 | 2019-02-05 | 深圳市海康精密模具有限公司 | A kind of automobile parts injection mold cooling device |
| CN208495770U (en) * | 2018-07-07 | 2019-02-15 | 张家界汽车配件制造有限责任公司 | A kind of cooling equipment of automobile parts casting |
| CN108817322A (en) * | 2018-08-12 | 2018-11-16 | 繁昌县亘通智能装备有限公司 | A kind of high thermal effect Metallic Casting Die & Mold |
| CN210940612U (en) * | 2019-09-12 | 2020-07-07 | 佛山市顺德区纳意制冷配件有限公司 | M-shaped tee joint forming die |
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Application publication date: 20210112 |
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| RJ01 | Rejection of invention patent application after publication |