CN112205099B - Electronic component holding device - Google Patents
Electronic component holding device Download PDFInfo
- Publication number
- CN112205099B CN112205099B CN201980036493.5A CN201980036493A CN112205099B CN 112205099 B CN112205099 B CN 112205099B CN 201980036493 A CN201980036493 A CN 201980036493A CN 112205099 B CN112205099 B CN 112205099B
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- CN
- China
- Prior art keywords
- electronic component
- holding
- lead
- main body
- holding device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/08—Gripping heads and other end effectors having finger members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
Abstract
An electronic component holding device is a holding device for an electronic component with a lead, and is provided with: a base; a holding portion provided in the base portion and holding a main body portion of the electronic component; and a guide portion for supporting the lead of the electronic component held by the holding portion. The holding portion holds the main body portion of the electronic component in a state of being inclined with respect to a longitudinal direction of the lead wire supported by the guide portion.
Description
Technical Field
The present invention relates to a holding device for holding an electronic component with a lead.
Background
Electronic components include a so-called "lead component" in which a lead wire is connected to an electrode of an electronic component main body. Such an electronic component is fixed to an electronic substrate by inserting a lead wire into a through hole provided in the electronic substrate and soldering the electronic component from the back surface of the electronic substrate. Conventionally, there is known an apparatus for automatically mounting an electronic component on an electronic substrate by inserting a lead into a through hole of the electronic substrate.
Patent document 1 discloses an apparatus for assembling an electronic component. The device is provided with: a holding claw for holding a terminal (lead) of an electronic component; an abutting member that moves forward and backward with respect to the electronic component held by the holding claw; and an electronic component swing prevention unit which prevents the electronic component from swinging by moving the contact member and contacting the electronic component held by the holding claw.
Patent document 2 discloses an insertion device for electronic components. The device is provided with: a component holder holding a main body of an electronic component; and a lead holder for holding a lead of the electronic component held by the component holder.
Patent document 1 Japanese patent laid-open No. 2003-179394
Patent document 2 Japanese patent laid-open publication No. 2017-216347
However, the electronic component assembling apparatus of patent document 1 is configured to grip the lead wire of the electronic component with the gripping claw. Therefore, the posture of the held electronic component is likely to become unstable. Further, interference between the other components mounted on the substrate and the holding claws is likely to occur, and the application range is limited.
The electronic component insertion apparatus of patent document 2 holds the main body of the electronic component by the gripper of one arm of the two-arm robot, and holds the lead by the gripper of the other arm. Since the electronic component is held by the two holding members in cooperation, the structure and control become complicated.
Disclosure of Invention
The present invention has been made to solve the above-described problems, and an object thereof is to provide a device capable of reliably holding an electronic component with a lead with a simple structure.
In order to achieve the above object, an electronic component holding device according to an aspect of the present invention is a holding device for an electronic component with a lead, including: a base; a holding portion provided in the base portion and holding a main body portion of the electronic component; and a guide portion that supports the lead wire of the electronic component held by the holding portion, wherein the holding portion holds the main body portion of the electronic component in a state inclined with respect to a longitudinal direction of the lead wire supported by the guide portion.
According to the above configuration, the main body of the electronic component is held by the holding portion in a state of being inclined with respect to the longitudinal direction of the lead wire supported by the guide portion. Since the contact point where the guide portion and the lead (intermediate portion) contact each other serves as a fulcrum, the lead end of the electronic component held thereby is less likely to bend. Thereby, the leading end position of the wire is stabilized. The electronic component can be stably held by a simple structure.
The holding portion may include a pair of holding members configured to hold the main body portion of the electronic component from both sides, and an abutting surface of the holding member abutting against a side surface of the main body portion of the electronic component may be inclined with respect to a plane perpendicular to a holding direction.
According to the above configuration, since the holding portion includes the pair of gripping members configured to grip the main body portion of the electronic component from both sides, and the contact surface of the gripping member that is in contact with the side surface of the main body portion of the electronic component is inclined with respect to the plane perpendicular to the gripping direction, the force is applied to the side of the conductive wire supported by the guide portion only by driving the pair of gripping members in the gripping direction. Thereby, the main body of the electronic component is held in a state of being inclined with respect to the longitudinal direction of the lead wire supported by the guide portion.
The guide portion may have a groove, and the groove may be configured to receive a lead of the electronic component.
According to the above configuration, since the lead of the electronic component is fitted into the groove provided in the guide portion, a contact point (fulcrum) where the guide portion contacts the intermediate portion of the lead is less likely to be displaced, and the leading end position of the lead is stabilized.
The guide portion may be integrally formed at a distal end of one of the pair of gripping members.
According to the above configuration, since the guide portion is integrally formed at the distal end of one of the pair of gripping members, the electronic component can be stably held with a simple configuration.
The electronic component holding device may further include a moving unit that moves the base portion provided with the holding portion relative to a substrate provided with a through hole into which a lead of the electronic component is inserted.
According to the above configuration, the base portion provided with the holding portion is relatively moved with respect to the substrate by the moving means, whereby the lead of the electronic component can be inserted into the through hole provided in the substrate.
The moving means may be a robot arm that is movable relative to the base.
According to the above configuration, the mounting work of the electronic component on the substrate can be performed by the robot.
The present invention has the above-described structure, and can reliably hold an electronic component with a lead wire with a simple structure.
Drawings
Fig. 1 is a side view showing an electronic component holding apparatus according to an embodiment of the present invention.
Fig. 2 is a sectional view of the electronic component holding device of fig. 1.
Fig. 3 is a perspective view showing an example of the operation of the electronic component holding device.
Fig. 4 is a perspective view showing another example of the operation of the electronic component holding device.
Fig. 5 is a front view showing an example of a two-arm robot constituting the electronic component holding apparatus.
Fig. 6 is a perspective view showing an example of the structure of the left and right arms of the two-arm robot of fig. 5.
Detailed Description
Hereinafter, preferred embodiments will be described with reference to the drawings. In the following, the same or corresponding elements are denoted by the same reference numerals throughout the drawings, and redundant description thereof will be omitted. In addition, the drawings schematically show the respective constituent elements for easy understanding.
Fig. 1 is a side view showing an electronic component holding apparatus 10 according to an embodiment of the present invention. As shown in fig. 1, the electronic component holding device 10 is a holding device for an electronic component 40 with a wire. The electronic component with lead (hereinafter simply referred to as "electronic component") 40 is a radial lead type electronic component including a main body portion 41 and a lead 42 connected to the main body portion 41 in a radial direction of the main body portion 41. Here, the electronic component 40 is an aluminum electrolytic capacitor, and two lead wires 42 are connected to the main body portion 41.
The electronic component holding device 10 includes: a base 20; a holding portion 21 provided to the base portion 20; a guide portion 22 provided in the holding portion 21; and a control device 14.
The base portion 20 extends in the Y-axis direction, and includes an actuator (not shown) for driving the holding portion 21 therein.
The holding portion 21 is configured to hold the main body portion 41 of the electronic component 40. The holding portion 21 includes a pair of gripping members 23, and the pair of gripping members 23 are configured to grip the body portion 41 of the electronic component 40 from both sides. The pair of gripping members 23 are driven by an actuator of the base 20 so as to approach or separate from each other in the Y-axis direction (hereinafter, also referred to as "gripping direction"). The holding member 23 includes: an abutment surface 23a abutting against an upper side surface of the main body 41 of the electronic component 40; and an abutment surface 23b that abuts against a lower side surface of the main body 41 of the electronic component 40. Each of the four contact surfaces 23a and 23b is inclined with respect to a plane (XZ plane) perpendicular to the gripping direction (Y-axis direction) of the gripping member 23. Fig. 2 (a) is a cross-sectional view of the holding portion 21 (the pair of gripping members 23) of fig. 1 taken along the line a-a. As shown in fig. 2 (a), the main body 41 of the electronic component 40 has a substantially cylindrical shape, and both upper side surfaces of the main body 41 are held in contact with the contact surfaces 23a of the pair of gripping members 23.
The guide portion 22 supports the lead wire 42 of the electronic component 40 held by the holding portion 21. The guide portion 22 is integrally formed at one distal end of the pair of gripping members 23 (see fig. 1). Fig. 2 (B) is a sectional view of the guide portion 22 of fig. 1 taken along line B-B. As shown in fig. 2B, the guide portion 22 is provided with two grooves 22a into which the two lead wires 42 (intermediate portions) of the electronic component 40 are fitted.
The control device 14 controls the operation of the actuator that drives the holding portion 21. In the present embodiment, the electronic component holding device 10 further includes: and a moving unit 13 for moving the base 20 relative to a substrate (not shown). The moving unit 13 is, for example, a robot arm configured to be movable relative to the base, and the base 20 is attached to a tip of the robot arm. The control device 14 is configured to control the operation of the robot arm as well. Thus, the electronic component holding apparatus 10 of the present embodiment mounts the electronic component 40 on the substrate by holding and transferring the electronic component 40 and mounting the electronic component at a mounting position on the substrate (not shown).
Next, the operation of the electronic component holding apparatus 10 will be described. Before the operation of the electronic component holding apparatus 10, the lead wire 42 of each electronic component 40 is cut by a predetermined length by an electronic component supply apparatus (not shown), and thereafter, the electronic component 40 is on standby at a predetermined position, for example, with the main body 41 at the top and the lead wire 42 at the bottom.
First, the controller 14 controls the operation of the base 20 (actuator) so that the pair of gripping members 23 of the holding portion 21 are separated from each other. Then, the controller 14 controls the operation of the moving unit 13 to move the base 20 to the vicinity directly above the body 41 of the electronic component 40 so that the body 41 of the electronic component 40 is positioned between the pair of gripping members 23.
Next, as shown in fig. 1, the controller 14 drives the pair of gripping members 23 of the holding portion 21 in the gripping direction (Y-axis direction) so as to approach each other. Thereby, the contact surfaces 23a and 23b of the pair of holding members 23 contact both side surfaces of the main body 41 of the electronic component 40 (see fig. 2 a). Since the contact surfaces 23a and 23b are inclined with respect to a plane (XZ plane) perpendicular to the gripping direction (Y-axis direction), a force is applied to the side (Y-axis positive direction) of the lead wire 42 supported by the guide portion 22 only by driving the pair of gripping members 23 in the gripping direction. Thereby, the main body 41 of the electronic component 40 is held in a state of being inclined with respect to the longitudinal direction of the lead wire 42 supported by the guide portion 22. The contact point where the guide portion 22 contacts the intermediate portion of the lead wire 42 serves as a fulcrum, and the tip of the lead wire 42 of the held electronic component 40 is less likely to bend. Thereby, the front end position of the wire 42 is stabilized. In addition, since the groove 22a is provided in the guide portion 22 in order to improve the stability of the tip position of the lead wire 42 as shown in fig. 2 (B), the lead wire 42 of the electronic component 40 is fitted into the groove 22a, and a contact point (fulcrum) where the guide portion 22 contacts the intermediate portion of the lead wire 42 is not likely to be displaced. The electronic component 40 can be stably held by a simple structure.
As shown in fig. 3, the electronic component holding apparatus 10 of the present embodiment holds and transfers the electronic component 40 and mounts the electronic component 40 at a mounting position on the substrate 100, thereby mounting the electronic component 40 on the substrate 100. The control device 14 controls the operation of the robot arm 13 to move the base 20 attached to the tip of the robot arm 13 relative to the substrate 100. Since the main body of the electronic component 40 is held by the pair of holding members 23 and the two lead wires 42 are supported in a stable state by the guide portion 22, the leading ends of the lead wires 42 are easily positioned in the through-holes 100a (mounting position) on the substrate 100. Further, since the lead wire 42 is supported only by the guide portion 22, not by the pair of gripping members 23, interference with another adjacent member (not shown) attached to the board 100 is less likely to occur at the time of insertion. The insertion operation becomes easy.
In the electronic component holding device 10 of the present embodiment, the contact surfaces 23a and 23b of the holding member 23 that contact the side surface of the main body portion 41 of the electronic component 40 are inclined with respect to the surface perpendicular to the holding direction, but the contact surfaces 23a and 23b may not be inclined. For example, after the main body 41 is held by the pair of gripping members 23, the main body 41 and/or the lead wire 42 may be tilted by driving the pair of gripping members 23 and/or the guide portion 22. Thereby, the main body 41 of the electronic component 40 is held in a state of being inclined with respect to the longitudinal direction of the lead wire 42 supported by the guide portion 22.
The electronic component 40 of the present embodiment is an aluminum electrolytic capacitor, but is not limited to this as long as it is an electronic component with a lead wire (radial lead type electronic component). Fig. 4 is a diagram showing another example of the operation of the electronic component holding apparatus 10. As shown in fig. 4, the electronic component 40 is a bypass capacitor, but in such a case, the electronic component 40 can be reliably held as in the present embodiment.
The electronic component holding apparatus 10 of the present embodiment is configured by a single-arm robot, but may be configured by a double-arm robot. Fig. 5 is a front view showing an example of a two-arm robot constituting the electronic component holding apparatus 10. A two-arm robot (10) is provided with: a base 12; and a pair of robot arms (hereinafter, may be simply referred to as "arms") 13 and 13 configured to be movable with respect to the base 12. Hereinafter, the direction in which the pair of arms (13, 13) are opened is referred to as the left-right direction, the direction parallel to the axis of the base shaft is referred to as the up-down direction, and the direction orthogonal to the left-right direction and the up-down direction is referred to as the front-back direction. Various units of the robot such as the control device 14 are housed in the base 12. Each arm (13) is provided with an arm part (15) and a wrist part (17). The arm (13) is constituted by a horizontal articulated arm, but may be constituted by a vertical articulated arm. The left and right arms (13, 13) may have substantially the same structure. The left and right arms (13, 13) can be operated independently or in association with each other. A mechanical interface 17a is provided at the tip of the wrist 17, and an end effector (not shown) can be attached thereto.
Fig. 6 is a perspective view showing an example of the configuration of the right and left arms of the two-arm robot (10) of fig. 5. An end effector 18 is attached to the front end (mechanical interface 17a) of each arm 17 of the left and right arms (13, 13). Here, the end effector 18 has the same structure from left to right. Each end effector 18 has a rotation mechanism, and 8 holding portions 21 are attached at equal intervals (45 degrees) in the radial direction from the center of the rotation mechanism. The end effector 18 is configured to be rotatable by a turning mechanism in a state where the electronic components 40 are held by the holding portions 21, and to be capable of adjusting the intervals of the leads 42 of the electronic components 40 to be equal intervals. Since the holding portion 21 has a simple structure and is simple to operate, a plurality of holding portions 21 can be attached to each end effector 18.
The electronic component holding apparatus 10 of the present embodiment is configured by a single-arm robot or a double-arm robot, but may be configured by another apparatus as long as the apparatus is configured to allow the base 20 provided with the holding portion 21 to move relative to the substrate 100 and to allow the electronic component 40 (lead wire 42) held by the holding portion 21 to be positioned relative to the mounting position (through hole) of the substrate 100.
Many modifications and other embodiments of the invention will come to mind to one skilled in the art to which this invention pertains having the benefit of the teachings presented in the foregoing descriptions. Accordingly, the foregoing description is to be construed as illustrative only and is for the purpose of teaching those skilled in the art the best mode of carrying out the invention. The details of the structure and/or function of the present invention can be substantially changed without departing from the spirit of the present invention.
Industrial applicability of the invention
The present invention is applied to mounting work of electronic components on an electronic substrate.
Description of the reference numerals
An electronic component holding device; a robot; a base; an arm (moving unit); a wrist; an end effector; a base; a holding portion; a guide portion; a guide slot; a holding member; 23a, 23b.. the abutment surface; an electronic component; a main body portion; a wire; a substrate; a through hole.
Claims (6)
1. An electronic component holding device is a holding device for an electronic component with a lead, and is characterized by comprising:
a base;
a holding portion that is provided in the base portion and holds a main body portion of the electronic component; and
a guide portion for supporting the lead of the electronic component held by the holding portion,
the holding portion holds the main body portion of the electronic component in a state of being inclined with respect to a longitudinal direction of the lead wire supported by the guide portion,
the holding portion has a pair of gripping members configured to grip a main body portion of the electronic component from both sides,
the contact surface of the holding member that contacts the side surface of the main body of the electronic component is inclined with respect to a plane perpendicular to the holding direction.
2. The electronic component holding device according to claim 1,
the guide portion has a groove configured to allow a wire of the electronic component to be embedded therein.
3. The electronic component holding device according to claim 1,
the guide portion is integrally formed at a front end of one of the pair of gripping members.
4. The electronic component holding device according to claim 2,
the guide portion is integrally formed at a front end of one of the pair of gripping members.
5. The electronic component holding device according to any one of claims 1 to 4,
the electronic component mounting apparatus further includes a moving unit that moves the base portion provided with the holding portion relative to a substrate provided with a through hole into which a lead of the electronic component is inserted.
6. The electronic component holding device according to claim 5,
the moving unit is a robot arm that is movable relative to the base.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-104343 | 2018-05-31 | ||
| JP2018104343A JP7306797B2 (en) | 2018-05-31 | 2018-05-31 | Electronic component holding device |
| PCT/JP2019/021687 WO2019230940A1 (en) | 2018-05-31 | 2019-05-31 | Electronic component holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112205099A CN112205099A (en) | 2021-01-08 |
| CN112205099B true CN112205099B (en) | 2022-04-05 |
Family
ID=68698959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980036493.5A Active CN112205099B (en) | 2018-05-31 | 2019-05-31 | Electronic component holding device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7306797B2 (en) |
| CN (1) | CN112205099B (en) |
| TW (1) | TWI756541B (en) |
| WO (1) | WO2019230940A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01187900A (en) * | 1988-01-22 | 1989-07-27 | Hitachi Ltd | Inserting device for electronic part |
| JPH04142799A (en) * | 1990-10-03 | 1992-05-15 | Sharp Corp | Electronic component automatic mounting device |
| CN103379818A (en) * | 2012-04-13 | 2013-10-30 | Juki株式会社 | Holding nozzle and electric component installation apparatus |
| CN103974609A (en) * | 2013-01-25 | 2014-08-06 | Juki株式会社 | Electronic component mounting apparatus and electronic component mounting method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252200A (en) * | 1986-04-25 | 1987-11-02 | 株式会社日立製作所 | Electronic parts inserter |
| JPH0637492A (en) * | 1992-07-15 | 1994-02-10 | Matsushita Electric Ind Co Ltd | Electronic parts inserter |
| JP6088838B2 (en) * | 2013-02-13 | 2017-03-01 | Juki株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP6741414B2 (en) * | 2015-11-27 | 2020-08-19 | 川崎重工業株式会社 | Component mounting robot system |
| JP6738621B2 (en) * | 2016-03-11 | 2020-08-12 | 川崎重工業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP6764259B2 (en) * | 2016-05-31 | 2020-09-30 | 川崎重工業株式会社 | Electronic component insertion device |
-
2018
- 2018-05-31 JP JP2018104343A patent/JP7306797B2/en active Active
-
2019
- 2019-05-31 CN CN201980036493.5A patent/CN112205099B/en active Active
- 2019-05-31 TW TW108118934A patent/TWI756541B/en active
- 2019-05-31 WO PCT/JP2019/021687 patent/WO2019230940A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01187900A (en) * | 1988-01-22 | 1989-07-27 | Hitachi Ltd | Inserting device for electronic part |
| JPH04142799A (en) * | 1990-10-03 | 1992-05-15 | Sharp Corp | Electronic component automatic mounting device |
| CN103379818A (en) * | 2012-04-13 | 2013-10-30 | Juki株式会社 | Holding nozzle and electric component installation apparatus |
| CN103974609A (en) * | 2013-01-25 | 2014-08-06 | Juki株式会社 | Electronic component mounting apparatus and electronic component mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019230940A1 (en) | 2019-12-05 |
| JP7306797B2 (en) | 2023-07-11 |
| CN112205099A (en) | 2021-01-08 |
| JP2019212650A (en) | 2019-12-12 |
| TWI756541B (en) | 2022-03-01 |
| TW202005515A (en) | 2020-01-16 |
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