CN112203470B - Three-dimensional heat dissipation plate and processing method thereof - Google Patents
Three-dimensional heat dissipation plate and processing method thereof Download PDFInfo
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- CN112203470B CN112203470B CN202010989549.3A CN202010989549A CN112203470B CN 112203470 B CN112203470 B CN 112203470B CN 202010989549 A CN202010989549 A CN 202010989549A CN 112203470 B CN112203470 B CN 112203470B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/02—Stamping using rigid devices or tools
- B21D22/04—Stamping using rigid devices or tools for dimpling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D26/00—Shaping without cutting otherwise than using rigid devices or tools or yieldable or resilient pads, i.e. applying fluid pressure or magnetic forces
- B21D26/02—Shaping without cutting otherwise than using rigid devices or tools or yieldable or resilient pads, i.e. applying fluid pressure or magnetic forces by applying fluid pressure
- B21D26/021—Deforming sheet bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Fluid Mechanics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
The invention relates to the technical field of heat dissipation plate manufacturing, in particular to a three-dimensional heat dissipation plate and a processing method thereof, wherein the heat dissipation plate comprises the following components: the flow channel plate is characterized in that a recessed area is arranged on one end face of the flow channel plate, at least one first protrusion is arranged in the recessed area, a plurality of stop blocks are uniformly distributed on the recessed area and the first protrusion, and a plurality of through flow channels are formed between every two adjacent stop blocks; the heat dissipation plate comprises a covering plate, wherein a second protrusion corresponding to the first protrusion is arranged on one end face of the covering plate, the top face of each stop block on the runner plate is abutted to one end face of the covering plate, the runner plate and the covering plate are formed through two sets of prefabricated molds, and the heat dissipation plate can perform targeted heat dissipation on different elements in a circuit board through the protruded runners so as to improve the heat dissipation effect of the conventional planar heat dissipation plate.
Description
Technical Field
The invention relates to the technical field of heat dissipation plate manufacturing, in particular to a three-dimensional heat dissipation plate and a processing method thereof.
Background
The heat dissipation plate utilizes a gas-liquid phase change principle to complete heat transfer, and the specific process is that one end of a heat transfer device is heated to evaporate a liquid working medium, steam flows to the other end under a small pressure difference to release heat and condense the heat into liquid, and the liquid flows back to an evaporation section along a pipe wall, and the process is continuously circulated, so that the heat is transferred from one end of the phase change type heat transfer device to the other end.
With the increase of consumer demand and the popularization of national strategy at home and abroad, the requirement of heat dissipation performance is continuously improved, the continuous iterative change of various electronic products leads the research of the heat dissipation type temperature equalization plate to be deep, and the application of the blow molding heat dissipation plate is also greatly popularized.
However, the conventional hot rolling inflation process is limited to inflation molding of a planar heat dissipation plate, when the heat dissipation plate has special purposes and needs to be multi-dimensionally bent or protruded, the hot rolling inflation process can cause blocking and other phenomena of a flow channel of the inflation molded heat dissipation plate, and the heat dissipation performance can not meet related requirements.
Disclosure of Invention
In view of the above problems, embodiments of the present invention are proposed to provide a three-dimensional heat dissipation plate and a method of processing the same that overcome or at least partially solve the above problems.
In order to solve the above problem, an embodiment of the present invention discloses a three-dimensional heat dissipation plate, including:
the flow channel plate is characterized in that a recessed area is arranged on one end face of the flow channel plate, at least one first protrusion is arranged in the recessed area, a plurality of stop blocks are uniformly distributed on the recessed area and the first protrusion, and a plurality of through flow channels are formed between every two adjacent stop blocks;
and a second protrusion corresponding to the first protrusion is arranged on one end face of the covering plate, and the top face of each stop block on the runner plate is abutted to one end face of the covering plate.
Furthermore, a through groove and one of the runners are formed in the runner plate and communicated with the through groove, and a feed inlet is formed in the other end face, communicated with the runner plate, of one end of the through groove.
Furthermore, the flow channels on the end face of the first protrusion are communicated with other flow channels in the recessed area through the flow channels on the peripheral side wall.
Also provided is a method for processing a three-dimensional heat dissipation plate, comprising:
placing a first plane aluminum plate in a preset first mould, and forming at least one first protrusion on the surface of the first plane aluminum plate in the mould closing process of the first mould;
injecting a fluid medium into a closed cavity formed by closing the first mold, and deforming the first plane aluminum plate along a flow channel forming structure in the cavity under the fluid pressure of the fluid medium to obtain a flow channel plate;
placing a second flat aluminum plate in a preset second mold, and forming second protrusions corresponding to the first protrusions on the surface of the second flat aluminum plate in the mold closing process of the second mold to obtain a covering plate;
and connecting one side surface of the runner plate provided with the runner with the covering plate through brazing to obtain the heat dissipation plate, wherein the first protrusion and the second protrusion are correspondingly matched.
Furthermore, the upper dies of the first die and the second die are respectively provided with a female die, and the lower dies of the first die and the second die are respectively provided with a male die corresponding to the female die, so that the first plane aluminum plate and the second plane aluminum plate are respectively extruded to form the first protrusion and the second protrusion in the die assembly process of the first die and the second die.
Furthermore, the bottom of the upper die of the first die is provided with a fluid outlet for the fluid medium to enter, and the outside of the upper die is provided with a fluid inlet communicated with the fluid inlet.
Furthermore, the upper die of the first die is circumferentially provided with a sealing groove for installing a sealing ring, and after the sealing ring is installed, the inside of the first die forms a closed cavity.
Furthermore, the runner forming structure comprises a sunken area forming structure arranged on the lower die end face of the first die, a plurality of stop block forming structures are uniformly arranged inside the sunken area forming structure, and the first plane aluminum plate deforms under the pressure of fluid along the radial direction of the stop block forming structures to form a runner.
The embodiment of the invention has the following advantages:
when a heat dissipation plate with a three-dimensional structure inside is machined, two dies are adopted to respectively carry out single-side blowing machining on two aluminum plates, wherein the three-dimensional structure is preformed in a local compression mode, then one planar aluminum plate is pressed by fluid pressure of a fluid medium to deform along a flow channel forming structure of a cavity, so that the heat dissipation plate with an internal planar flow channel and a three-dimensional flow channel in smooth transition is manufactured, and the heat dissipation plate has the advantages that different elements in a circuit board are subjected to targeted heat dissipation through a raised flow channel, so that the heat dissipation effect of the conventional planar heat dissipation plate is improved.
Drawings
Fig. 1 is a flowchart illustrating steps of an embodiment of a method for manufacturing a three-dimensional heat dissipation plate according to the present invention;
FIG. 2 is a schematic view of the structure of a first mold according to the present invention;
FIG. 3 is a schematic view of the structure of a second mold according to the present invention;
fig. 4 is a schematic view of the structure of the heat dissipating plate of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
One of the core ideas of the embodiment of the invention is that when a heat dissipation plate with a three-dimensional structure inside is processed, two dies are adopted to respectively carry out single-side inflation processing on two aluminum plates, wherein the three-dimensional structure is preformed in a local compression mode, then fluid pressure of a fluid medium is utilized to press one of the planar aluminum plates to enable the planar aluminum plate to deform along a flow channel forming structure of a cavity, so that the heat dissipation plate with smooth transition of an internal planar flow channel and a three-dimensional flow channel is manufactured, and the heat dissipation plate has the advantages that different elements in a circuit board are subjected to targeted heat dissipation through a raised flow channel, so that the heat dissipation effect of the conventional planar heat dissipation plate is improved.
Referring to fig. 4, there is shown a schematic structural view of a three-dimensional flow field plate formed by a unique process, including:
the flow channel comprises a flow channel plate 12, wherein a concave area is arranged on one end surface of the flow channel plate 12, at least one first protrusion 11 is arranged in the concave area, a plurality of stop blocks are uniformly distributed on the concave area and the first protrusion 11, and a plurality of through flow channels 17 are formed between every two adjacent stop blocks;
and a second protrusion 21 corresponding to the first protrusion 11 is arranged on one end surface of the cover plate 22, and the top surface of each stopper on the runner plate 12 abuts against one end surface of the cover plate 22.
In the above embodiment, after the end surface of the flow channel plate 12 having the flow channel 17 is connected to the end surface of the cover plate 22 by soldering, a closed flow channel pipeline is formed inside the flow channel plate, and then a cooling medium, such as a phase change liquid, is injected into the flow channel plate by a machining process such as stamping, and the heat dissipation treatment is performed on the circuit board by the phase change principle of the phase change liquid, so that the phase change liquid is close to the heating element on the circuit board when flowing through the three-dimensional flow channel formed by the first protrusion 11 and the second protrusion 21, and a greater heat dissipation effect can be exerted.
Based on the above embodiment, in this embodiment, the runner plate 12 is provided with a through groove and one of the through grooves, one end of the through groove penetrating through the other end surface of the runner plate is provided with a feed port, and the phase change liquid is injected through the feed port.
Based on the above embodiment, in this embodiment, the flow channels 17 on the end surface of the first protrusion 11 are communicated with the other flow channels 17 in the recessed area through the flow channels 17 on the peripheral side wall.
When the runner plate 12 and the cover plate 22 in the above embodiments are prepared, two sets of molds are prefabricated, a corresponding molding structure is provided inside each set of mold, and the runner plate 12 and the cover plate 22 are preformed through a mold closing process, that is, an aluminum plate deforms along the molding structure inside the mold during the mold closing process.
Referring to fig. 1, a flowchart illustrating steps of an embodiment of a method for processing a three-dimensional heat dissipation plate according to the present invention is shown, and specifically, the method may include the following steps:
s1, placing a first plane aluminum plate in a preset first mold 10, and forming at least one first protrusion 11 on the surface of the first plane aluminum plate in the mold closing process of the first mold 10;
s2, injecting a fluid medium into a closed cavity formed after the first mold 10 is closed, and enabling the first plane aluminum plate to deform along a runner 17 forming structure in the cavity under the fluid pressure of the fluid medium to obtain a runner plate 12;
s3, placing a second flat aluminum plate in a preset second mold 20, and forming a second protrusion 21 corresponding to the first protrusion 11 on the surface of the second flat aluminum plate in the mold closing process of the second mold 20 to obtain a cover plate 22;
and S4, connecting one side surface, provided with the flow channels 17, of the flow channel plate 12 with the cover plate 22 through brazing to obtain a heat dissipation plate, wherein the first protrusions 11 and the second protrusions 21 are correspondingly matched.
Specifically, the first mold 10 is mounted on an oil press, an upper mold of the first mold 10 is mounted on an upper table of the oil press, and a lower mold of the first mold 10 is mounted on a lower table of the oil press. The method comprises the following steps of flatly and straightly placing a first plane aluminum plate into a first die 10, wherein a runner forming structure is arranged inside an upper die and a lower die of the first die 10, an upper die of the first die 10 is provided with a female die, the lower die is provided with a male die, and the male die of the first die is also provided with the runner forming structure; when the first mold 10 is closed, the first planar aluminum plate is deformed between the male mold and the female mold under the direct extrusion force to form a first protrusion 11; after the first mold 10 is closed, a closed cavity is formed inside, and then a fluid medium is injected into the interior through the outside, wherein the fluid is gas or liquid, and if liquid is adopted, the forming pressure is higher due to the fact that the density of the liquid is higher than that of the gas, so that the forming time of the runner plate 12 is shortened, but the mold is not convenient to discharge, and therefore gas is generally adopted to form the fluid pressure; by continuously injecting fluid media, the first flat aluminum plate is deformed along the flow channel molding structure in the cavity under the fluid pressure, a three-dimensional flow channel positioned in the first protrusion and a plane flow channel positioned in the depression area are formed, and the three-dimensional flow channel and the plane flow channel are in smooth transition; after molding, unloading the injected fluid, opening the mold after the pressure in the cavity is recovered to the pressure value during mold closing, and taking out the molded runner plate 12;
the cover plate 22 with the second protrusion 21 is pressed by the second mold 20, and since the cover plate 22 is used to connect with the end face of the runner plate 12, so that the runner 17 of the runner plate 12 is a closed runner pipeline for the cooling medium to flow in the runner 17, it is only necessary to use the second mold 20 to extrude the cover plate during the mold closing process.
The prepared runner plate 12 and the cover plate 22 are subjected to end face welding by brazing to form a heat dissipation plate, and finally, the inside and the outside of the heat dissipation plate are communicated through processes of cutting, blanking and the like at one end of the heat dissipation plate, so that a cooling medium for heat dissipation is conveniently poured.
As shown in fig. 2 and 3, the first protrusion 11 is one, in practice, the first protrusion 11 may be provided in plural numbers as needed, and the heights of the first protrusions may be different; generally, the heat dissipation is specifically performed according to different heat generating elements of the circuit board, so that the first protrusion 11 is as close to the corresponding element as possible to achieve the best heat dissipation effect.
In another embodiment, the upper dies of the first die 10 and the second die 20 are respectively provided with a female die 16, the lower dies of the first die 10 and the second die 20 are respectively provided with a male die 13 corresponding to the female die 16, and the female die 16 and the male die 13 form a protrusion forming structure, so that the first planar aluminum plate and the second planar aluminum plate are respectively extruded to form the first protrusion 11 and the second protrusion 21 during the die assembly of the first die 10 and the second die 20.
In the above, the first protrusion 11 extends in the direction of the end surface of the flow channel plate 12 having the flow channel 17, the second flat aluminum plate is limited and molded by the protrusion molding structure inside the second mold 20, one end surface of the manufactured cover plate 22 is a concave surface, the end surface of the flow channel plate 12 having the flow channel 17 is correspondingly connected to the concave surface of the cover plate 22, and the first protrusion 11 extends inside the second protrusion 21 to form a three-dimensional structure of the flow channel 17 in the heat dissipation plate.
In another embodiment, the bottom of the upper mold of the first mold 10 is provided with a fluid outlet for the fluid medium to enter, and the outside is provided with a fluid inlet 14 communicated with the fluid inlet.
In the embodiment, because the gas medium is more convenient to discharge than the liquid medium, the gas is used as the pressure medium for the first plane aluminum plate, after the first mold 10 is closed, the internal gas pressure is in the range of 6-25 MPa, and the pressure maintaining time is 2-30S; if liquid is used as the medium, the pressure is over 25MPa because the density of the liquid is higher than that of the gas, and the corresponding pressure maintaining time is relatively shortened.
The first planar aluminum plate is placed in the lower die of the first die 10, after die assembly, gas is injected through the fluid inlet 14 outside the upper die, the pressure in the cavity is gradually increased, and the first planar aluminum plate is pressed to be attached to the runner forming structure of the lower die to generate deformation, so that the runner 17 is formed.
In another embodiment, a sealing groove 15 for installing a sealing ring is circumferentially arranged on an upper die of the first die 10, and after the sealing ring is installed, the inside of the first die 10 forms the closed cavity.
The upper die and the lower die of the first die 10 are closed through guiding of the guide columns, the sealing ring is installed in the sealing groove 15 of the upper die or the lower die, the sealing ring is extruded in the closing process, and the side walls of the inner ring of the sealing ring and the upper die and the side walls of the lower die form a closed cavity.
In another embodiment, the flow channel forming structure includes a recessed area forming structure disposed on the lower mold end surface of the first mold 10, a plurality of block forming structures are uniformly disposed inside the recessed area forming structure, as shown in fig. 2, the block forming structures are hexagonal, gaps formed between adjacent block forming structures are communicated, and the first planar aluminum plate deforms under fluid pressure along the radial directions of the plurality of block forming structures to form the flow channel 17.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the true scope of the embodiments of the present invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrases "comprising one of \ 8230; \8230;" does not exclude the presence of additional like elements in a process, method, article, or terminal device that comprises the element.
The three-dimensional heat dissipation plate and the processing method thereof provided by the present invention are described in detail above, and the principle and the implementation of the present invention are explained in the present document by applying a specific example, and the description of the above example is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (6)
1. A three-dimensional heat dissipating plate, comprising:
the flow channel plate is characterized in that a recessed area is arranged on one end face of the flow channel plate, at least one first protrusion is arranged in the recessed area, a plurality of stop blocks are uniformly distributed on the recessed area and the first protrusion, and a plurality of through flow channels are formed between every two adjacent stop blocks; the method comprises the following steps of placing a first plane aluminum plate in a preset first mould, and forming at least one first protrusion on the surface of the first plane aluminum plate in the mould closing process of the first mould; injecting a fluid medium into a closed cavity formed by closing the first mold, and enabling the first planar aluminum plate to deform along a flow channel forming structure in the cavity under the fluid pressure of the fluid medium, wherein the lower mold end surface of the first mold is provided with a recessed area forming structure, a plurality of stop block forming structures are uniformly arranged in the recessed area forming structure, and the first planar aluminum plate deforms along the radial directions of the stop block forming structures under the fluid pressure to form a flow channel; the deformed first plane aluminum plate is the runner plate;
the top surface of each stop block on the runner plate is abutted against one end surface of the covering plate to form a through runner with a protrusion; placing a second flat aluminum plate in a preset second mold, forming a second protrusion corresponding to the first protrusion on the surface of the second flat aluminum plate in the mold closing process of the second mold, wherein the deformed second flat aluminum plate is the covering plate;
and connecting one side surface, provided with the flow channel, of the flow channel plate with the covering plate through brazing to obtain the heat dissipation plate, wherein the first protrusions and the second protrusions are correspondingly matched and have the same direction.
2. The three-dimensional heat dissipation plate as claimed in claim 1, wherein a through groove is formed in the runner plate to communicate with one of the runners, and one end of the through groove is provided with a feed port penetrating through the other end surface of the runner plate.
3. The three-dimensional heat dissipation plate as claimed in claim 1, wherein the flow channels on the end surface of the first protrusion are communicated with other flow channels in the depression through the flow channels on the peripheral side wall.
4. The three-dimensional heat dissipation plate according to claim 1, wherein the upper dies of the first and second dies respectively have female dies, and the lower dies of the first and second dies respectively have male dies corresponding to the female dies, so that the first and second dies respectively press the first and second planar aluminum plates to form the first and second protrusions during the process of closing the first and second dies.
5. The three-dimensional heat dissipation plate according to claim 1, wherein the first mold is provided with a fluid inlet through which the fluid medium enters and a fluid outlet communicating with the fluid inlet.
6. The three-dimensional heat dissipation plate according to claim 1, wherein a sealing groove for installing a sealing ring is circumferentially formed in an upper mold of the first mold, and after the sealing ring is installed, the sealed cavity is formed inside the first mold.
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