CN112203396A - Product stacking method - Google Patents
Product stacking method Download PDFInfo
- Publication number
- CN112203396A CN112203396A CN202010959965.9A CN202010959965A CN112203396A CN 112203396 A CN112203396 A CN 112203396A CN 202010959965 A CN202010959965 A CN 202010959965A CN 112203396 A CN112203396 A CN 112203396A
- Authority
- CN
- China
- Prior art keywords
- steel sheet
- product
- pad point
- reinforced steel
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 24
- 239000010959 steel Substances 0.000 claims abstract description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 229910001294 Reinforcing steel Inorganic materials 0.000 abstract description 12
- 241000251468 Actinopterygii Species 0.000 description 4
- 239000012528 membrane Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a product stacking method which effectively avoids the direct contact between a reinforcing steel sheet and a pad point, thereby avoiding the friction of a sharp corner to the pad point caused by the shaking of the stacked steel sheets and solving the scratch phenomenon. The lower surface of a reinforced steel sheet of a product is compounded with a release film, the release film covers the whole surface area of the lower surface of the reinforced steel sheet, after the product is stacked, the upper surface of a corresponding pad point corresponds to the lower surface area of the release film of the reinforced steel sheet of an upper layer product, and the pad point is not directly contacted with the reinforced steel sheet.
Description
Technical Field
The invention relates to the technical field of membrane layer separation, in particular to a product stacking method.
Background
Present cross cutting printing equipment is accomplished product, the pin position of its product is provided with the reinforcement steel sheet, one of them surface of reinforcement steel sheet structure is provided with the pad point of a plurality of isolations and epirelief, in-process that the product piles up, the product that corresponds is the stack from bottom to top respectively, make the lower surface and the pad point direct contact of reinforcement steel sheet, in the transportation, the reinforcement steel sheet after the pile causes sharp-pointed corner to rub the pad point because of rocking, make the pad point have the fish tail, the stereoplasm gilding on the surface of pad point can be by the fish tail, and then make pad point expose nickel or expose copper, influence the performance of its whole product.
Disclosure of Invention
Aiming at the problems, the invention provides a product stacking method which effectively avoids the direct contact between a reinforcing steel sheet and a pad point, thereby avoiding the friction of a sharp corner to the pad point caused by the shaking of the stacked steel sheets and solving the scratch phenomenon.
A method of stacking products, comprising: the lower surface of a reinforced steel sheet of a product is compounded with a release film, the release film covers the whole surface area of the lower surface of the reinforced steel sheet, after the product is stacked, the upper surface of a corresponding pad point corresponds to the lower surface area of the release film of the reinforced steel sheet of an upper layer product, and the pad point is not directly contacted with the reinforced steel sheet.
It is further characterized in that:
the pad points are obtained by a nickel-gold electroplating process, a hard gold process is adopted, the thickness of a surface gold layer is more than or equal to 0.15 mu m, and the thickness of an internal nickel layer is 3.0-8.0 mu m.
By adopting the method, the direct contact between the reinforced steel sheet and the PAD point is effectively avoided, so that the phenomenon that the PAD point is rubbed by a sharp corner caused by shaking of the stacked reinforced steel sheets is avoided, the scratch phenomenon is avoided, and the steel sheets are effectively prevented from being stained by dust and dirt because the reinforced steel sheets are covered by the release film; if when taking place the dislocation phenomenon, the pad point can with from type membrane direct contact, its effectual reinforcing steel sheet of having avoided and the direct contact of pad point to avoided piling up the back steel sheet because of rocking and cause sharp-pointed corner friction to the pad point, solved the fish tail phenomenon.
Detailed Description
A method of product stacking: the lower surface of a reinforcing steel sheet of a product is compounded with a release film, the release film covers the whole surface area of the lower surface of the reinforcing steel sheet, after the product is stacked, the upper surface of a corresponding pad point corresponds to the lower surface area of the release film of the reinforcing steel sheet of an upper layer product, and the pad point is not directly contacted with the reinforcing steel sheet.
The pad points are obtained by a nickel-gold electroplating process, a hard gold process is adopted, the thickness of the surface gold layer is more than or equal to 0.15um, and the thickness of the internal nickel layer is 3.0-8.0 um.
The working principle is as follows: the direct contact between the reinforced steel sheet and the PAD point is effectively avoided, so that the phenomenon that the PAD point is rubbed by a sharp corner caused by shaking of the stacked reinforced steel sheet is avoided, the scratch phenomenon is avoided, and the steel sheet is effectively prevented from being stained by dust because the release film covers the reinforced steel sheet; if when taking place the dislocation phenomenon, the pad point can with from type membrane direct contact, its effectual reinforcing steel sheet of having avoided and the direct contact of pad point to avoided piling up the back steel sheet because of rocking and cause sharp-pointed corner friction to the pad point, solved the fish tail phenomenon.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (2)
1. A method of stacking products, comprising: the lower surface of a reinforced steel sheet of a product is compounded with a release film, the release film covers the whole surface area of the lower surface of the reinforced steel sheet, after the product is stacked, the upper surface of a corresponding pad point corresponds to the lower surface area of the release film of the reinforced steel sheet of an upper layer product, and the pad point is not directly contacted with the reinforced steel sheet.
2. A method of stacking products as claimed in claim 1, wherein: the pad points are obtained by a nickel-gold electroplating process, a hard gold process is adopted, the thickness of a surface gold layer is more than or equal to 0.15 mu m, and the thickness of an internal nickel layer is 3.0-8.0 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010959965.9A CN112203396A (en) | 2020-09-14 | 2020-09-14 | Product stacking method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010959965.9A CN112203396A (en) | 2020-09-14 | 2020-09-14 | Product stacking method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112203396A true CN112203396A (en) | 2021-01-08 |
Family
ID=74014873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010959965.9A Pending CN112203396A (en) | 2020-09-14 | 2020-09-14 | Product stacking method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112203396A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56108248A (en) * | 1980-02-01 | 1981-08-27 | Nec Corp | Arranging apparatus for semiconductor device |
| JPH08148814A (en) * | 1994-11-16 | 1996-06-07 | Toshiba Chem Corp | Manufacture of flexible printed wiring board provided with coverlays |
| JP2001044220A (en) * | 1999-07-27 | 2001-02-16 | Dainippon Printing Co Ltd | Protection material for stacking plate material |
| KR20100134338A (en) * | 2009-06-15 | 2010-12-23 | (주)인터플렉스 | Reinforcement plate and printed circuit board comprising the same |
| KR20160149752A (en) * | 2015-06-19 | 2016-12-28 | 우영관 | Method and apparatus for stacking sheet type product |
| CN107466154A (en) * | 2017-07-21 | 2017-12-12 | 深圳市景旺电子股份有限公司 | The method and FPC of FPC steel discs reinforcement compacting |
| CN207706504U (en) * | 2017-12-19 | 2018-08-07 | 广东深越光电技术有限公司 | Reinforcement steel disc |
| CN110677999A (en) * | 2019-10-12 | 2020-01-10 | 珠海景旺柔性电路有限公司 | Alignment and lamination method for FPC (Flexible printed Circuit) adhered reinforced steel sheet |
-
2020
- 2020-09-14 CN CN202010959965.9A patent/CN112203396A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56108248A (en) * | 1980-02-01 | 1981-08-27 | Nec Corp | Arranging apparatus for semiconductor device |
| JPH08148814A (en) * | 1994-11-16 | 1996-06-07 | Toshiba Chem Corp | Manufacture of flexible printed wiring board provided with coverlays |
| JP2001044220A (en) * | 1999-07-27 | 2001-02-16 | Dainippon Printing Co Ltd | Protection material for stacking plate material |
| KR20100134338A (en) * | 2009-06-15 | 2010-12-23 | (주)인터플렉스 | Reinforcement plate and printed circuit board comprising the same |
| KR20160149752A (en) * | 2015-06-19 | 2016-12-28 | 우영관 | Method and apparatus for stacking sheet type product |
| CN107466154A (en) * | 2017-07-21 | 2017-12-12 | 深圳市景旺电子股份有限公司 | The method and FPC of FPC steel discs reinforcement compacting |
| CN207706504U (en) * | 2017-12-19 | 2018-08-07 | 广东深越光电技术有限公司 | Reinforcement steel disc |
| CN110677999A (en) * | 2019-10-12 | 2020-01-10 | 珠海景旺柔性电路有限公司 | Alignment and lamination method for FPC (Flexible printed Circuit) adhered reinforced steel sheet |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |