CN112197250A - Heat dissipation protection mechanism that LED lamp was used - Google Patents

Heat dissipation protection mechanism that LED lamp was used Download PDF

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Publication number
CN112197250A
CN112197250A CN202011085657.4A CN202011085657A CN112197250A CN 112197250 A CN112197250 A CN 112197250A CN 202011085657 A CN202011085657 A CN 202011085657A CN 112197250 A CN112197250 A CN 112197250A
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CN
China
Prior art keywords
circuit board
bearing plate
cooling
led lamp
mounting seat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011085657.4A
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Chinese (zh)
Inventor
赵之强
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN202011085657.4A priority Critical patent/CN112197250A/en
Publication of CN112197250A publication Critical patent/CN112197250A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/56Cooling arrangements using liquid coolants
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/56Cooling arrangements using liquid coolants
    • F21V29/57Cooling arrangements using liquid coolants characterised by control arrangements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/673Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for intake
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention discloses a heat dissipation protection mechanism for an LED lamp, which comprises a mounting seat, wherein a circuit board for mounting an LED chip is fixedly sleeved at the upper end of the mounting seat, a bearing plate is horizontally welded in the lower end of the mounting seat, and an air cooling mechanism is arranged between the bearing plate and the circuit board. According to the invention, the lower end of the circuit board is rotatably connected with the wind wheel extending out of the mounting seat, the fan impeller corresponding to the air inlet is arranged below the circuit board, and the driving gear and the driven gear which are connected in a meshed manner are utilized to realize the flow of low-temperature air flow into the circuit board, so that cold and hot air flow exchange can be realized in the circuit board with a hollow structure, and air cooling and cooling are realized; set up by the rotatory carousel of fan impeller drive at bearing plate lower extreme position, utilize the circumference of carousel rotatory to make the piston can be at the back-and-forth movement of bent pipe lower extreme to impel the coolant liquid to make a round trip to flow in the bent pipe, utilize the aluminium foil board that has the low temperature attribute to cool down the coolant liquid, thereby utilize microthermal cooling water bag to carry out further water-cooling heat dissipation to the circuit board.

Description

Heat dissipation protection mechanism that LED lamp was used
Technical Field
The invention relates to the technical field of LED lamp application protection, in particular to a heat dissipation protection mechanism for an LED lamp.
Background
Due to the development of scientific technology, the novel LED lamp gradually replaces the traditional incandescent lamp. The LED lamp is an electroluminescent semiconductor material LED chip, is solidified on the bracket by silver glue or white glue, is connected with the LED chip and the circuit board by silver wires or gold wires, and is sealed by epoxy resin at the periphery to play a role in protecting an internal core wire. A light emitting diode is a core component in an LED lamp, which is a solid-state semiconductor device capable of converting electrical energy into visible light, and directly converts electricity into light. The heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, and the other end of the wafer is connected with an anode of a power supply, so that the whole wafer is packaged by epoxy resin. The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes predominate and the other of which is an N-type semiconductor in which electrons predominate. When the two semiconductors are connected, a P-N junction is formed between them. When a current is applied to the wafer through the wire, electrons are pushed into the P-region where they recombine with holes and then emit energy in the form of photons.
In the above process, the operation of wafer and relevant part can make the whole high temperature heat that produces of LED lamp, especially need can lead to the heat to increase rapidly under the high temperature condition at the LED lamp equipment of outdoor installation use, and the heat dissipation treatment to the LED lamp is only through the ventilation space in the increase LED lamp under the prior art, in order to make things convenient for the outer row of high temperature steam, but LED lamp self structure is light and handy compact, although the porosity is great, but singly rely on the self of high temperature hot gas flow to flow outward, make the radiating efficiency extremely low, so, not only can increase the operation burden of wafer and relevant structural part, cause the circuit short circuit in the LED lamp more easily.
Disclosure of Invention
The invention aims to solve the problem that in the prior art, the high-temperature heat generated when an LED lamp is applied is difficult to cool and protect, and provides a heat dissipation protection mechanism for the LED lamp.
In order to achieve the purpose, the invention adopts the following technical scheme:
a heat dissipation protection mechanism for an LED lamp comprises a mounting seat, wherein a circuit board for mounting an LED chip is fixedly sleeved at the upper end of the mounting seat, a bearing plate is horizontally welded in the lower end of the mounting seat, an air cooling mechanism is arranged between the bearing plate and the circuit board, and water cooling mechanisms are arranged in the bearing plate and the circuit board;
the wind cooling mechanism comprises an air outlet and an air inlet which are arranged in the circuit board, a wind wheel is rotatably arranged at the lower end of the circuit board, a fan wheel is rotatably arranged between the bearing plate and the circuit board, a driving gear and a driven gear which are in meshed connection are respectively fixedly sleeved on the wind wheel and the fan wheel, and a through hole corresponding to the air inlet is formed in the bearing plate;
the water-cooling mechanism includes that fixed mounting has the bent pipe of coolant liquid in and the filling of bearing plate and mount pad, and the interior fixed mounting of bent pipe has the aluminium foil board that soaks in the coolant liquid, the bearing plate lower extreme rotates installs the carousel that is connected with fan wheel, the carousel lower extreme rotates and is connected with the traction lever, and the pin shaft is connected with the piston that the slip cap was located in the bent pipe lower extreme on the traction lever, the cooling bath has been seted up to circuit board upper end, and bent pipe upper end fixedly connected with block cover is in the cooling water pocket of cooling bath.
Preferably, the LED chip is fixedly sleeved at the middle end of the circuit board hollow structure, and the bearing plate is positioned under the circuit board.
Preferably, the end of the air outlet and the end of the air inlet, which are positioned in the circuit board, are both communicated with the middle end of the circuit board, which is used for mounting the LED chip.
Preferably, the wind wheel rotates to penetrate through the bearing plate and extends out of the lower end of the mounting seat.
Preferably, the bent pipe is a U-shaped hollow structure which is vertically arranged, the lower end of the bent pipe horizontally corresponds to the turntable, and the upper end of the bent pipe vertically corresponds to the cooling tank.
Preferably, a transmission belt is connected between the rotating disc and the lower end of the bearing plate through which the fan wheel rotates.
Compared with the prior art, the invention has the following advantages:
1. the LED chip is fixedly installed in the circuit board with the hollow structure, the circuit board is provided with the air outlet and the air inlet which are communicated with the LED chip, the lower end of the circuit board is rotatably connected with the wind wheel extending out of the installation base, the fan impeller corresponding to the air inlet is arranged below the circuit board, and the driving gear and the driven gear which are connected in a meshed mode are used for realizing the flowing of low-temperature airflow into the circuit board so as to cool the high temperature generated by the operation of the LED chip in an air cooling mode.
2. The U-shaped structure curved tube is arranged on the bearing plate and the circuit board, the lower end of the bearing plate is provided with the rotary disc which is driven to rotate by the fan impeller, the piston can move back and forth in the lower end of the curved tube by utilizing the circumferential rotation of the rotary disc so as to realize the back and forth flow of the cooling liquid in the curved tube, and the flowing cooling liquid is cooled by utilizing the aluminum foil plate with low temperature property, so that the low temperature cooling liquid is filled and contracted in the cooling water bag for multiple times so as to cool the circuit board provided with the LED chip by water.
In summary, the lower end of the circuit board is rotatably connected with the wind wheel extending out of the mounting seat, the fan impeller corresponding to the air inlet is arranged below the circuit board, and the driving gear and the driven gear which are connected in a meshed manner are used for realizing the flow of low-temperature air flow into the circuit board, so that cold and hot air flow exchange can be realized in the circuit board with a hollow structure, and air cooling and cooling are realized; set up by the rotatory carousel of fan impeller drive at bearing plate lower extreme position, utilize the circumference of carousel rotatory to make the piston can be at the back-and-forth movement of bent pipe lower extreme to impel the coolant liquid to make a round trip to flow in the bent pipe, utilize the aluminium foil board that has the low temperature attribute to cool down the coolant liquid, thereby utilize microthermal cooling water bag to carry out further water-cooling heat dissipation to the circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation protection mechanism for an LED lamp according to the present invention;
fig. 2 is an enlarged schematic view of a part a of a heat dissipation protection mechanism for an LED lamp according to the present invention;
fig. 3 is an enlarged schematic view of a part B of a heat dissipation protection mechanism for an LED lamp according to the present invention;
fig. 4 is a schematic view of a connection structure of a mounting seat and a bearing plate of a heat dissipation protection mechanism for an LED lamp according to the present invention;
fig. 5 is a schematic structural diagram of a circuit board of a heat dissipation protection mechanism for an LED lamp according to the present invention;
fig. 6 is a schematic structural diagram of a curved tube of a heat dissipation protection mechanism for an LED lamp according to the present invention;
fig. 7 is a schematic view of a connection structure of a turntable, a traction rod and a piston of a heat dissipation protection mechanism for an LED lamp according to the present invention.
In the figure: the LED cooling system comprises a mounting seat 1, a circuit board 2, a bearing plate 3, an LED chip 4, an air outlet 5, an air inlet 6, a wind wheel 7, an impeller 8, a driving gear 9, a driven gear 10, a through hole 11, a bent pipe 12, an aluminum foil plate 13, a rotary table 14, a transmission belt 15, a traction rod 16, a piston 17, a cooling groove 18 and a cooling water bag 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-7, a heat dissipation protection mechanism for an LED lamp includes a mounting base 1, the mounting base 1 is made of an insulating material with a bottom end provided with a micro-porous structure to ensure the installation and use safety of the LED lamp and the convection alternation of low-temperature cold airflow, a circuit board 2 for installing an LED chip 4 is fixedly sleeved on the upper end of the mounting base 1, a bearing plate 3 is horizontally welded in the lower end of the mounting base 1, an air cooling mechanism is arranged between the bearing plate 3 and the circuit board 2, and a water cooling mechanism is arranged between the bearing plate 3 and the circuit board 2;
the air cooling mechanism comprises an air outlet 5 and an air inlet 6 which are arranged in the circuit board 2, and a wind wheel 7 is rotatably arranged at the lower end of the circuit board 2, because the LED lamp is arranged and used outdoors, the wind wheel 7 can be influenced by wind power, the wind wheel 7 can rotate continuously under stress, a fan impeller 8 is rotatably arranged between the bearing board 3 and the circuit board 2, a driving gear 9 and a driven gear 10 which are connected in a meshed manner are respectively fixedly sleeved on the wind wheel 7 and the fan impeller 8, the driving gear 9 and the driven gear 10 are flat gears, and a through hole 11 corresponding to the air inlet 6 is formed in the bearing board 3, so that low-temperature airflow in the bottom end of the mounting seat 1 can enter between the bearing board 3 and the lamp board 2 through the through hole 11 because the pressure in;
the water cooling mechanism comprises a curved pipe 12 which is fixedly arranged in a bearing plate 3 and a mounting seat 1 and is filled with cooling liquid, an aluminum foil plate 13 immersed in the cooling liquid is fixedly arranged in the curved pipe 12, the cooling liquid can be conducted at low temperature by utilizing the aluminum foil plate 13, so that the heated cooling liquid can be rapidly cooled in the flowing process, a rotary table 14 connected with a fan wheel 8 is rotatably arranged at the lower end of the bearing plate 3, a draw bar 16 is rotatably connected at the lower end of the rotary table 14, a piston 17 which is slidably sleeved in the lower end of the curved pipe 12 is connected to a pin shaft on the draw bar 16, the draw bar 16 is utilized to draw the piston 17, the piston 17 can be ensured to always keep a linear front-back movement in the lower end of the curved pipe 12, a cooling groove 18 is arranged at the upper end of the circuit board 2, a cooling water sac 19 which is clamped in the cooling groove 18 is fixedly connected at the upper end of the curved pipe 12, and the filled, so as to increase the contact area of the cooling water bag 19 with the circuit board 2 and thereby to perform overall contact heat absorption on the circuit board 2.
The LED chip 4 is fixedly sleeved at the middle end position of the hollow structure of the circuit board 2, and the bearing plate 3 is positioned under the circuit board 2.
It should be noted that the middle end of the circuit board 2 is open for mounting the LED chip 4, and the ends of the air outlet 5 and the air inlet 6 located in the circuit board 2 are both communicated with the middle end of the circuit board 2 for mounting the LED chip 4.
The wind wheel 7 rotatably penetrates through the bearing plate 3 and extends to the outside of the lower end of the mounting seat 1, and the wind wheel 7 rotating due to wind power is utilized to form power for driving the air cooling mechanism and the water cooling mechanism to operate.
Referring to fig. 6 in the specification, the curved tube 12 is a U-shaped hollow structure vertically arranged, the lower end of the curved tube 12 horizontally corresponds to the rotary table 14, the upper end of the curved tube 12 vertically corresponds to the cooling tank 18, and the piston 17 which moves in a telescopic manner enables the cooling liquid to flow back and forth between the curved tube 12 and the cooling water bag 19, so that the cooling liquid at a low temperature can continuously and effectively cool the circuit board 2.
The transmission belt 15 is connected between the rotary table 14 and the lower end of the bearing plate 3 through which the fan impeller 8 rotates, so that the fan impeller 8 can drive the rotary table 14 to rotate synchronously in the rotating process, and the synchronous operation of the air cooling mechanism and the water cooling mechanism is realized.
The invention can be illustrated by the following operating modes:
LED lamp equipment receives the influence of natural wind-force at the operation in-process for 7 atress rotations of wind wheel:
the wind wheel 7 drives the fan impeller 8 to rotate through the driving gear 9 and the driven gear 10 which are connected in a meshed mode, the fan impeller 8 rotates to drive airflow between the bearing plate 3 and the circuit board 2 to flow, low-temperature cold airflow in the inner position and the outer position of the mounting seat 1 enters between the bearing plate 3 and the circuit board 2 through the through hole 11 and then enters into the circuit board 2 through the air inlet 6 to extrude high-temperature hot airflow in the circuit board 2, and the high-temperature hot airflow in the circuit board 2 can be discharged outwards through the air outlet 5;
meanwhile, the rotating fan impeller 8 drives the rotary table 14 to rotate below the bearing plate 3 through the transmission belt 15, the rotary table 14 rotates to enable the traction rod 16 to stretch back and forth, and the piston 17 is driven to move back and forth in the lower end of the curved pipe 12;
the piston 17 moving back and forth enables the cooling liquid to flow up and down in the curved pipe 12 and to be in contact with the aluminum foil plate 13, the low-temperature property of the cooling liquid is guaranteed, the cooling liquid moves into the cooling water sac 19 in the upward moving process, and the cooling water sac 19 is filled in the cooling groove 18 to be in large-area contact with the circuit board 2, so that the circuit board 2 is cooled by water.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (6)

1. A heat dissipation protection mechanism for an LED lamp comprises a mounting seat (1) and is characterized in that a circuit board (2) used for mounting an LED chip (4) is fixedly sleeved at the upper end of the mounting seat (1), a bearing plate (3) is horizontally welded in the lower end of the mounting seat (1), an air cooling mechanism is arranged between the bearing plate (3) and the circuit board (2), and water cooling mechanisms are arranged in the bearing plate (3) and the circuit board (2);
the wind cooling mechanism comprises a wind outlet (5) and a wind inlet (6) which are arranged in a circuit board (2), a wind wheel (7) is rotatably arranged at the lower end of the circuit board (2), a fan impeller (8) is rotatably arranged between a bearing plate (3) and the circuit board (2), a driving gear (9) and a driven gear (10) which are connected in a meshed manner are fixedly sleeved on the wind wheel (7) and the fan impeller (8) respectively, and a through hole (11) corresponding to the wind inlet (6) is formed in the bearing plate (3);
the water-cooling mechanism comprises a bent pipe (12) which is fixedly installed in a bearing plate (3) and a mounting seat (1) and filled with cooling liquid, an aluminum foil plate (13) immersed in the cooling liquid is fixedly installed in the bent pipe (12), a rotary disc (14) connected with a fan impeller (8) is installed at the lower end of the bearing plate (3) in a rotating mode, a traction rod (16) is connected to the lower end of the rotary disc (14) in a rotating mode, a piston (17) which is slidably sleeved in the lower end of the bent pipe (12) is connected to the traction rod (16) in a pin shaft mode, a cooling groove (18) is formed in the upper end of a circuit board (2), and a cooling water bag (19) which is fixedly connected with the upper end of the bent pipe (12) and clamped in the cooling.
2. The heat dissipation protection mechanism for the LED lamp according to claim 1, wherein the LED chip (4) is fixedly sleeved at a middle end position of the hollow structure of the circuit board (2), and the bearing plate (3) is located right below the circuit board (2).
3. The heat dissipation protection mechanism for the LED lamp according to claim 2, wherein the ends of the air outlet (5) and the air inlet (6) located inside the circuit board (2) are both communicated with the middle position of the circuit board (2) for mounting the LED chip (4).
4. The heat dissipation protection mechanism for the LED lamp is characterized in that the wind wheel (7) penetrates through the bearing plate (3) in a rotating mode and extends out of the lower end of the mounting base (1).
5. The heat radiation protection mechanism for the LED lamp is characterized in that the curved tube (12) is a vertically arranged U-shaped hollow structure, the lower end of the curved tube (12) horizontally corresponds to the rotary disc (14), and the upper end of the curved tube (12) vertically corresponds to the cooling groove (18).
6. The heat radiation protection mechanism for the LED lamp is characterized in that a transmission belt (15) is connected between the rotary disc (14) and the lower end of the bearing plate (3) through which the fan wheel (8) rotates.
CN202011085657.4A 2020-10-12 2020-10-12 Heat dissipation protection mechanism that LED lamp was used Pending CN112197250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011085657.4A CN112197250A (en) 2020-10-12 2020-10-12 Heat dissipation protection mechanism that LED lamp was used

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011085657.4A CN112197250A (en) 2020-10-12 2020-10-12 Heat dissipation protection mechanism that LED lamp was used

Publications (1)

Publication Number Publication Date
CN112197250A true CN112197250A (en) 2021-01-08

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ID=74013486

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011085657.4A Pending CN112197250A (en) 2020-10-12 2020-10-12 Heat dissipation protection mechanism that LED lamp was used

Country Status (1)

Country Link
CN (1) CN112197250A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112928669A (en) * 2021-03-01 2021-06-08 雷正福 Outdoor type transformer box assembled in monsoon climate zone
CN113309994A (en) * 2021-07-07 2021-08-27 吴健浓 Energy-saving heat dissipation type LED lamp
CN117927921A (en) * 2024-03-25 2024-04-26 山东华鼎伟业能源科技股份有限公司 Explosion-proof LED work lamp

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112928669A (en) * 2021-03-01 2021-06-08 雷正福 Outdoor type transformer box assembled in monsoon climate zone
CN112928669B (en) * 2021-03-01 2022-11-01 国网浙江省电力有限公司台州供电公司 Outdoor type transformer box assembled in monsoon climate area
CN113309994A (en) * 2021-07-07 2021-08-27 吴健浓 Energy-saving heat dissipation type LED lamp
CN113309994B (en) * 2021-07-07 2023-12-29 鑫元科技(深圳)有限公司 Energy-saving heat dissipation type LED lamp
CN117927921A (en) * 2024-03-25 2024-04-26 山东华鼎伟业能源科技股份有限公司 Explosion-proof LED work lamp

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Application publication date: 20210108

RJ01 Rejection of invention patent application after publication