CN112194382B

CN112194382B - Tempered coated glass and tempering treatment method thereof

Info

Publication number: CN112194382B
Application number: CN202011043190.7A
Authority: CN
Inventors: 刘莹; 吕宜超; 王�琦
Original assignee: Shenzhen Csg Applied Technology Co ltd; CSG Holding Co Ltd
Current assignee: Shenzhen Csg Applied Technology Co ltd; CSG Holding Co Ltd
Priority date: 2020-09-28
Filing date: 2020-09-28
Publication date: 2023-10-03
Anticipated expiration: 2040-09-28
Also published as: CN112194382A

Abstract

The embodiment of the application provides toughened coated glass and a toughening treatment method of the toughened coated glass; the toughened coated glass comprises: a glass substrate; the low-radiation film layer is arranged on the glass substrate; the radiation denaturation film layer is arranged on one surface of the low-radiation film layer, which is far away from the glass substrate; wherein, the emissivity of the radiation denatured film layer after being toughened is smaller than the emissivity of the glass substrate; the radiation denatured film layer is made of one or more of aluminum zinc oxide, antimony tin oxide and indium tin oxide. The method can solve the problems that the Low-E coated glass is difficult to be heated by radiation due to Low emissivity of the coated surface, so that the upper surface and the lower surface are heated unevenly, and deformation and even cracking are caused.

Description

Tempered coated glass and tempering treatment method thereof

Technical Field

The application relates to the technical field of glass, in particular to toughened coated glass and a toughening treatment method of the toughened coated glass.

Background

Low-E (Low emissivity) glass, i.e., coated glass with Low emissivity, is increasingly being used in modern housing, public buildings due to its remarkable energy saving effect and rich adjustable color tone on building doors and windows.

In general, a physical tempering method is used for strengthening glass, which is to heat flat glass in a heating furnace to a temperature close to the softening temperature of the glass, then remove the flat glass from the heating furnace, blow high-pressure cold air to two sides of the glass by using a multi-head nozzle, so that the glass is rapidly and uniformly cooled to room temperature, and finally, a stress state with the inside pulled and the outside pressed is formed, so that the strength of the glass body is increased, and the glass is also called as physical tempered glass. Once broken, the glass strengthened by the method can form countless small obtuse angle fragments, and the small fragments have no sharp edges and corners, so that people are not easy to hurt. Therefore, tempered glass is also one of safety glasses, and its application is very wide.

As known, the emissivity of the upper surface and the lower surface of the common uncoated glass is the same, usually about 0.84, the heat absorption performance is basically the same, and the heat absorption of the upper surface and the lower surface is symmetrical when the glass is tempered and heated, so that the deformation is not easy to occur, while the Low-E coated glass, such as double-silver glass (the emissivity of the film surface is 0.03-0.08), and triple-silver glass (the emissivity of the film surface is less than 0.03), has high reflection property on infrared radiation due to the Low emissivity of the film surface, and reflects a large amount of heat radiation when the glass is physically tempered, so that the glass is difficult to heat by radiation, and the lower surface is heated by direct contact conduction with a roller way, so that the upper surface and the lower surface of the glass are heated unevenly, the expansion degree is inconsistent, the warp deformation is easy to cause, and even the glass is burst. Therefore, how to realize the Low-emissivity function of the Low-E coated glass and avoid the uneven heating of the upper surface and the lower surface caused by the difference of the emissivity of the upper surface and the lower surface during the tempering treatment is a current problem to be solved urgently.

Disclosure of Invention

Therefore, the embodiment of the application provides toughened coated glass and a toughening treatment method of the toughened coated glass, which can solve the problems of deformation and even cracking caused by uneven heating of the upper surface and the lower surface when the Low-E coated glass is toughened.

Specifically, an embodiment of the present application provides a tempered coated glass, including: a glass substrate; the low-radiation film layer is arranged on the glass substrate; the radiation denaturation film layer is arranged on one surface of the low-radiation film layer, which is far away from the glass substrate; wherein the emissivity of the radiation denatured film layer is less than the emissivity of the glass substrate; the radiation denaturation film layer is made of one or more of aluminum zinc oxide, antimony tin oxide, indium tin oxide and titanium zinc oxide.

In one embodiment of the present application, the radiation range after the radiation denatured film layer is toughened is 0.001-0.5, more preferably 0.005-0.3, and most preferably 0.01-0.15.

In one embodiment of the present application, the thickness of the radiation denatured film layer ranges from 1 to 1000nm, more preferably from 5 to 500 nm, and most preferably from 10 to 300 nm.

In one embodiment of the application, the low-emissivity film layer contains an element or alloy of silver, aluminum, gold, copper as a functional layer.

In one embodiment of the present application, the low-emissivity film layer includes 1 to 5 layers, more preferably 1 to 4 layers, and most preferably 2 to 3 layers of the functional layer.

In one embodiment of the present application, the thickness of each of the functional layers ranges from 1 to 50 nm, more preferably from 2 to 40 nm, and most preferably from 3 to 30 nm, and the emissivity of the low emissivity film layer ranges from 0.001 to 0.15, more preferably from 0.001 to 0.08, and most preferably from 0.001 to 0.03.

In one embodiment of the present application, the low-emissivity film layer further comprises: the radiation-modified glass comprises a functional layer, a glass substrate, a dielectric layer and a protective layer, wherein the dielectric layer is positioned between the functional layer and the glass substrate, the protective layer is positioned between the low-radiation functional layer and the radiation-modified film layer, the dielectric layer is adjacent to the glass substrate, and the protective layer is adjacent to the radiation-modified film layer.

In addition, the embodiment of the application provides a tempering treatment method for tempered coated glass, which comprises the following steps: providing coated glass to be tempered, wherein the coated glass to be tempered comprises: a glass substrate; the low-radiation film layer is arranged on the glass substrate; the radiation denaturation film layer is arranged on one surface of the low-radiation film layer, which is far away from the glass substrate; wherein the emissivity of the low emissivity film layer is less than the emissivity of the glass substrate and the emissivity of the radiation denatured film layer; and tempering the coated glass to be tempered to obtain tempered coated glass, wherein the emissivity of the radiation denatured film layer after tempering is smaller than the emissivity of the radiation denatured film layer before tempering.

In one embodiment of the present application, the emissivity of the radiation denatured film layer is greater than 0.3 and less than or equal to 0.9, the emissivity range of the radiation denatured film layer after the tempering treatment is reduced to 0.001-0.3, and the tempering treatment is physical tempering.

In one embodiment of the present application, the material of the radiation denatured film layer is one or more of aluminum zinc oxide, antimony tin oxide, indium tin oxide, titanium zinc oxide.

In one embodiment of the present application, the low-emissivity film layer includes: the first dielectric layer, the first seed layer, the first protective layer, the first functional layer, the second protective layer and the second dielectric layer are sequentially formed on the glass substrate, the second dielectric layer is adjacent to the radiation denaturation film layer, and the first dielectric layer is adjacent to the glass substrate.

In one embodiment of the present application, the materials of the first dielectric layer and the second dielectric layer include one or more of silicon, aluminum nitride, oxide, or oxynitride; the seed layer is made of a composite material comprising one or more of zinc oxide, aluminum oxide, tin oxide and titanium oxide; the materials of the first protective layer and the second protective layer comprise one or more of simple substances, alloys, oxides or nitrides of nickel, chromium, molybdenum, titanium, zinc, tin and aluminum; the material of the first functional layer comprises simple substances or alloys of silver, aluminum, copper and gold.

From the above, the technical features of the present application can have the following beneficial effects: the radiation denaturation film layer made of the aluminum zinc oxide, the antimony tin oxide and the indium tin oxide is arranged on one surface of the low-radiation film layer of the coated glass, which is far away from the glass substrate, the radiation rate of the radiation denaturation film layer before tempering is more than 0.3 and less than 0.9, the radiation rate range after tempering is 0.001-0.3, the low-radiation film layer can be protected from oxidation or pollutants, meanwhile, the radiation rate of the coated surface is improved before tempering, the uneven heating of the tempered coated glass during tempering due to the radiation rate difference of the two opposite surfaces is avoided, the radiation rate of the coated surface is reduced after tempering, and the influence of the radiation denaturation film layer on the functions of the low-radiation film layer is avoided.

Other aspects of the features of the application will become apparent from the following detailed description, which refers to the accompanying drawings. It is to be understood, however, that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the application. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

fig. 1 is a schematic structural view of a tempered coated glass according to a first embodiment of the present application;

FIG. 2 is a schematic diagram of a low emissivity film layer in accordance with a first embodiment of the application;

FIG. 3 is a schematic view of a low emissivity film layer in accordance with a first embodiment of the application;

FIG. 4 is a schematic view of a structure of a low emissivity film layer in accordance with a first embodiment of the application;

fig. 5 is a flowchart of a tempering treatment method for tempered coated glass according to a second embodiment of the present application;

fig. 6 is a schematic flow chart of a tempering treatment procedure according to a second embodiment of the present application.

Description of the reference numerals

10: tempering coated glass; 11: a glass substrate; 12: a low-emissivity film layer; 13: a radiation denatured film layer; 111: a first face; 112: a second face;

121: a first dielectric layer; 122: a first seed layer; 123: a first functional layer; 124: a first protective layer; 125: a second dielectric layer; 126: a second seed layer; 127: a second functional layer; 128: a second protective layer; 129: a third dielectric layer; 1210: a third seed layer; 1211: a third functional layer; 1212: a third protective layer;

s31 to S33: a tempering treatment method of tempered coated glass.

Detailed Description

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described below with reference to the accompanying drawings in combination with embodiments.

In order to enable those skilled in the art to better understand the technical solutions of the present application, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments of the embodiments are all within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and in the above figures are applicable to distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, it is possible to provide a device for the treatment of a disease. The terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

[ first embodiment ]

As shown in fig. 1, a first embodiment of the present application provides a tempered coated glass, wherein a tempered coated glass 10 comprises: a glass substrate 11, a low-emissivity film layer 12, and a radiation-denatured film layer 13. Wherein the glass substrate 10 includes a first face 111 and a second face 112 opposite the first face 111; the low-emissivity film layer 12 is arranged on the second surface 112 of the glass substrate 11; the radiation modifying film layer 13 is provided on a side of the low-radiation film layer 12 remote from the glass substrate 11.

The glass substrate 11 is, for example, a common flat glass, and the main material is, for example, silicon oxide, silicate or the like, and the thickness thereof is, for example, in the range of 3 to 22mm. The surface emissivity of the glass substrate 11 is about 0.84. Typically, emissivity refers to the ability of the surface of an object to release energy in the form of radiation, the emissivity of an object being equal to the ratio of the energy radiated by the object at a certain temperature to the blackbody radiation energy at the same temperature, the emissivity of a blackbody being equal to 1, the emissivity of other objects being between 0 and 1. That is, the stronger the object's ability to radiate energy, the closer its emissivity is to 1; the weaker the object's ability to radiate energy, the closer its emissivity is to 0.

The LOW-emissivity coating 12 is, for example, a coating on LOW-E glass (Low Emissivity Glass), and the LOW-emissivity coating 12 has high transmittance of visible light and high reflectance of far-infrared light. Compared with common glass and traditional coated glass for building, the LOW-E glass has excellent heat insulation effect and good light transmittance. In the present embodiment, the emissivity of the low emissivity layer 12 is, for example, in the range of 0.001 to 0.3.

For example, as shown in fig. 2, the low-emissivity film layer 12 includes, for example, a first dielectric layer 121, a first seed layer 122, a first functional layer 123, and a first protective layer 124 sequentially stacked on the second surface 112 of the glass substrate 11. The first dielectric layer 121 is adjacent to the glass substrate and the first protective layer 124 is adjacent to the radiation denatured film layer 13. Wherein the first dielectric layer 121 is used for preventing sodium in the glass substrate 10 from diffusing into the low-radiation film layer 12 during tempering, and the material of the first dielectric layer comprises silicon oxide (SiO) ₂ ) Silicon nitride (Si) ₃ N ₄ ) Alumina (Al) ₂ O ₃ ) One or more of aluminum nitride (AlN), silicon oxynitride (SiON), or aluminum oxynitride (AlON). The first functional layer 123 has a high transmittance to visible light and a high reflectance to far infrared light, i.e., a low emissivity, and the material thereof includes, for example, simple substances or alloys of copper (Cu), aluminum (AL), silver (Ag), and gold (Au). The first seed layer 122 has a smooth characteristic, which can make the upper film layer more uniform, and improve the performance of the first functional layer 123, and the material thereof is, for example, a composite material including one or more of zinc oxide (ZnO), aluminum oxide (Al 2O 3), tin oxide (SnO), and titanium oxide (TiO 2). The material of the first protection layer 124 is, for example, one or more of simple substances, alloys, nitrides or oxides of materials such as nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), zinc (Zn), tin (Sn), aluminum (Al), etc., for protecting the first functional layer 123 from oxygen and other pollutants during the tempering process.

It should be noted that, in other embodiments of the present application, the low-emissivity film layer 12 may also be a multi-functional layer structure, such as a dual-silver structure, as shown in fig. 3, and the low-emissivity film layer 12 further includes, for example, a second dielectric layer 125, a second seed layer 126, a second functional layer 127, and a second protective layer 128 sequentially formed on the first protective layer 124. Wherein the second protective layer 128 is adjacent to the radiation denatured film layer 13, and the second dielectric layer 125 is adjacent to the first protective layer 124.

Of course, in other embodiments of the present application, the low-emissivity film layer 12 may also have a three-silver structure, as shown in fig. 4, for example, the low-emissivity film layer 12 further includes a third dielectric layer 129, a third seed layer 1210, a third functional layer 1211, and a third protective layer 1212 sequentially formed on the second protective layer 128. Wherein the third protective layer 1212 is adjacent to the radiation denatured film layer 13 and the third dielectric layer 129 is adjacent to the second protective layer 128.

Meanwhile, the LOW-emissivity coating 12 may be a coating of the existing LOW-E glass, and the combination mode and the material composition of each coating are freely selected according to the requirement, which is not limited in the present application. In one embodiment of the present application, the number of the functional layers of the low-emissivity layer 12 is, for example, 1 to 5, and in order to achieve a better low-emissivity effect and control the cost, the number of the functional layers of the low-emissivity layer 12 is more preferably 1 to 4, and most preferably 2 to 3.

Further, in the low-emissivity film layer 12, the thickness of each of the functional layers is, for example, in the range of 1 to 50 nm, more preferably 2 to 40 nm, and most preferably 3 to 30 nm. The emissivity of the low emissivity layer 12 is, for example, in the range of 0.001 to 0.15, more preferably 0.001 to 0.08, and most preferably 0.001 to 0.03.

Specifically, the LOW-emissivity coating 12 is, for example, a coating of LOW-E glass with a single silver structure, and its emissivity is generally 0.09-0.15; the low-emissivity film 12 is, for example, a double silver structure, and its emissivity is generally 0.03-0.08; the low emissivity layer 12 is, for example, a three silver structure, and the emissivity is generally less than 0.03, while the emissivity of the glass substrate 11 is generally about 0.84. Since the emissivity of the low emissivity coating 12 is far lower than that of the glass substrate 11, the low emissivity coating 12 has a high reflection characteristic for infrared radiation, and a large amount of heat radiation is reflected during physical tempering, so that the second surface 112 is difficult to be heated by radiation, and the first surface 111 is heated faster due to direct contact and conduction heating with the roller table, so that the second surface 112 and the first surface 111 of the glass substrate 11 are heated unevenly, have inconsistent expansion degrees, and are easy to cause buckling deformation and even burst.

As shown in fig. 1, a radiation modifying film layer 13 is further coated on a surface of the low-emissivity film layer 12 far from the glass substrate 11, and in one implementation manner of this embodiment, the radiation modifying film layer 13 is made of a semiconductor material, for example, one or more of AZO (Aluminum Zink Oxide, aluminum zinc Oxide), ATO (Antimony Tin Oxide ), ITO (Indium Tin Oxide) and TZO (Titanium Zink Oxide, titanium zinc Oxide), which has a high emissivity characteristic before the tempering treatment, and can improve the emissivity of the coated surface of the glass substrate 11, specifically, the emissivity of the radiation modifying film layer 13 before the tempering treatment is in a range of 0.3-0.9, for example. Preferably, the emissivity of the radiation denatured film layer 13 is 0.84, which is the same as the surface emissivity of the first side 111 of the glass substrate 11, so that the first side 111 and the second side 112 absorb heat to be balanced at the time of tempering and heating. The thickness of the radiation denatured film layer 13 is, for example, 1 to 1000nm, and in order to achieve the effect of change in emissivity better, the thickness of the radiation denatured film layer 13 is more preferably 5 to 500 nm, and most preferably 10 to 300 nm.

Meanwhile, when the glass substrate 11 is toughened, the material AZO, ATO, ITO of the radiation denatured film 13 undergoes oxidation-reduction reaction after being subjected to high-temperature heating treatment, the crystal structure of the material is changed, the surface emissivity is correspondingly reduced, and the conductivity is enhanced. Specifically, the surface emissivity of the radiation denatured film layer 13 is changed after the high temperature heat treatment, for example, reduced to be smaller than the emissivity of the glass substrate 11. Specifically, the range of emissivity of the radiation denatured film layer 13 after tempering is, for example, between 0.001 and 0.5, which is similar to the range of emissivity of the low emissivity film layer 12, and in order to achieve an effect of being closer to the emissivity of the low emissivity film layer 12, the range of emissivity of the radiation denatured film layer 13 after tempering is more preferably between 0.005 and 0.3, and most preferably between 0.01 and 0.15. In this way, the emissivity of the radiation denatured film layer 13 is reduced after the tempering treatment, and the influence on the function of the low-emissivity film layer is avoided.

In addition, since the tempered coated glass may undergo storage, transportation, cutting, edging or other processing steps before tempering, the low-emissivity coating 12 is easily scratched, etc. on the surface of the coating, which causes loss, and the material of the first functional layer 124 in the low-emissivity coating 12 includes simple substances or alloys of silver, copper and gold, which is easily oxidized. Therefore, the radiation denatured film layer 13 having wear resistance, weather resistance and good machining performance can be provided to further protect the low-radiation film layer 12 from being damaged during the tempering process.

In summary, according to the toughened coated glass provided by the first embodiment of the present application, the radiation denaturation film layer made of aluminum zinc oxide, antimony tin oxide, indium tin oxide or titanium zinc oxide is disposed on the surface of the low-radiation film layer, far away from the glass substrate, of the toughened coated glass, so that the emissivity of the coated surface can be improved before the toughening treatment, the problem that the toughened coated glass is subjected to warpage deformation and even cracking due to uneven heating during the toughening treatment is avoided, and meanwhile, the radiation denaturation film layer of the toughened coated glass undergoes oxidation-reduction reaction after the toughening treatment, the emissivity is reduced to such an extent that the effect of reducing far infrared radiation of the existing low-radiation glass can be achieved, and the radiation denaturation film layer is further provided to protect the low-radiation film layer 12 from being damaged before the toughening treatment.

[ second embodiment ]

As shown in fig. 5, a second embodiment of the present application proposes a tempering treatment method for tempered coated glass, which includes steps S31 and S33, for example.

Step S31: providing coated glass to be tempered, wherein the coated glass to be tempered comprises: a glass substrate; the low-radiation film layer is arranged on the glass substrate; the radiation denaturation film layer is arranged on one surface of the low-radiation film layer, which is far away from the glass substrate; wherein the emissivity of the low emissivity film layer is less than the emissivity of the glass substrate and the emissivity of the radiation denatured film layer;

step S33: and tempering the coated glass to be tempered to obtain tempered coated glass, wherein the emissivity of the radiation denatured film layer after tempering is smaller than the emissivity of the radiation denatured film layer before tempering.

Specifically, in step S31, the coated glass to be tempered is provided, for example, as the coated glass before tempering the tempered glass 10 in the foregoing first embodiment.

In this embodiment, the emissivity of the low emissivity coating of the coated glass to be tempered is less than the emissivity of the glass substrate and the emissivity of the radiation denatured coating. For example, the emissivity of the glass substrate of the coated glass to be tempered is 0.84, the emissivity of the low-emissivity film layer is 0.001-0.3, and the emissivity of the radiation denatured film layer before tempering is more than 0.3 and less than or equal to 0.9.

Specifically, the material of the radiation denatured film layer of the coated glass to be tempered is one of semiconductor materials such as AZO, ATO, ITO, TZO, and the material has the characteristic of variable emissivity, for example, the emissivity before tempering treatment is more than 0.3 and less than or equal to 0.9, so that the emissivity of the coated surface of the glass substrate 11 can be improved. Preferably, the emissivity of the radiation denatured film layer is 0.84, which is the same as the surface emissivity of the glass substrate 11, so that the opposite sides of the glass substrate 11 absorb heat to be balanced during high temperature heat treatment, thereby avoiding the problem of uneven heating.

In step S33, for example, the coated glass to be tempered is tempered to obtain tempered coated glass. Specifically, the tempering treatment mode is, for example, a physical tempering mode, and includes, for example, a pretreatment step, a tempering treatment step and a cooling step.

As shown in fig. 6, in the pretreatment step, for example, steps such as cutting, edging, cleaning, etc. are performed on the coated glass to be tempered. In the tempering treatment step, pretreated coated glass to be tempered is sent into a convection tempering furnace through a roller way for high-temperature heating treatment. The convection tempering furnace is provided with a preheating section, a heating section and an annealing section in sequence, wherein the temperature of the preheating section is 300-450 ℃, the preheating time is 1-10 minutes, the heating section is 620-720 ℃, the heating time is 1-20 minutes, the annealing section is 400-650 ℃, and the annealing time is 1-30 minutes. In the cooling step, the coated glass after the tempering treatment is cooled, for example, the coated glass is sent to an air grid to be cooled back and forth, and is cooled to the normal temperature.

According to the above, the emissivity of the radiation denaturation film layer of the toughened coated glass after the toughening treatment is smaller than that of the glass substrate. For example, the emissivity of the glass substrate is 0.84, and the emissivity of the radiation denatured film layer after tempering treatment is, for example, in the range of 0.001 to 0.3.

Specifically, in the tempering treatment step, the radiation denatured film layer undergoes oxidation-reduction reaction after being subjected to high-temperature heating treatment, the crystal structure of the material is changed, the surface emissivity is correspondingly reduced, and the conductivity is enhanced. Therefore, the emissivity of the radiation denaturation film layer is reduced after the tempering treatment, the effect of reducing far infrared radiation of the existing low-emissivity glass can be achieved, and the influence on the functions of the low-emissivity film layer is avoided.

Further, the low-emissivity film layer is, for example, the low-emissivity film layer 12 in the foregoing first embodiment, and the specific structure and function are as described in the first embodiment, and will not be described herein.

In summary, according to the tempering treatment method for the tempered coated glass provided by the second embodiment of the present application, by disposing the radiation denatured film layer of the material such as aluminum zinc oxide, antimony tin oxide, and indium tin oxide on the surface of the low-radiation film layer of the coated glass far away from the glass substrate, the emissivity of the coated surface can be improved before the tempering treatment, the problem that the toughened coated glass is deformed and even cracked due to uneven heating during the tempering treatment due to the difference of the emissivity of the opposite surfaces is avoided, meanwhile, the radiation denatured film layer of the tempered coated glass undergoes oxidation-reduction reaction after the tempering treatment, the emissivity is reduced, the effect of reducing far infrared radiation of the existing low-radiation glass can be achieved, and the radiation denatured film layer is further provided to protect the low-radiation film layer from being damaged before the tempering treatment.

In addition, it should be understood that the foregoing embodiments are merely exemplary illustrations of the present application, and the technical solutions of the embodiments may be arbitrarily combined and matched without conflict in technical features, contradiction in structure, and departure from the purpose of the present application.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A tempered coated glass, comprising:

a glass substrate;

the low-radiation film layer is arranged on the glass substrate; and

the radiation denaturation film layer is arranged on one surface of the low-radiation film layer, which is far away from the glass substrate;

wherein, the emissivity of the radiation denatured film layer after being toughened is smaller than the emissivity of the glass substrate; the material of the radiation denaturation film layer is one or more of aluminum zinc oxide, antimony tin oxide, indium tin oxide and titanium zinc oxide, the emissivity of the radiation denaturation film layer before tempering is 0.84, the emissivity range of the radiation denaturation film layer after tempering is 0.01-0.15, and the emissivity range of the low-emissivity film layer is 0.001-0.03.

2. The toughened coated glass as claimed in claim 1, wherein the thickness of the radiation-modified film layer is in the range of 10 to 300 nm.

3. The tempered coated glass as claimed in claim 1, wherein the low emissivity film layer contains a simple substance or an alloy of silver, aluminum, gold, copper as a functional layer.

4. The tempered coated glass according to claim 3, wherein the low-emissivity coating layer comprises 2-3 functional layers.

5. The toughened coated glass as claimed in claim 4, wherein each of said functional layers has a thickness in the range of 3 to 30 nm.

6. A tempered coated glass as claimed in claim 3 wherein the low emissivity film layer comprises: the radiation-modified glass comprises a functional layer, a glass substrate, a dielectric layer and a protective layer, wherein the dielectric layer is positioned between the functional layer and the glass substrate, the protective layer is positioned between the functional layer and the radiation-modified film, the dielectric layer is adjacent to the glass substrate, and the protective layer is adjacent to the radiation-modified film.

7. The tempering treatment method of the tempered coated glass is characterized by comprising the following steps of:

providing coated glass to be tempered, wherein the coated glass to be tempered comprises:

a glass substrate;

the low-radiation film layer is arranged on the glass substrate; and

the radiation denaturation film layer is arranged on one surface of the low-radiation film layer, which is far away from the glass substrate; wherein the emissivity of the low emissivity film layer is less than the emissivity of the glass substrate and the emissivity of the radiation denatured film layer;

tempering the coated glass to be tempered to obtain tempered coated glass, wherein the emissivity of the radiation denatured film layer after tempering is smaller than the emissivity of the radiation denatured film layer before tempering; the emissivity of the radiation denatured film layer before tempering is 0.84, the emissivity of the radiation denatured film layer after tempering is 0.01-0.15, and the emissivity of the low-emissivity film layer is 0.001-0.03.

8. The tempering treatment method according to claim 7, wherein the tempering treatment is physical tempering.

9. The method according to claim 7, wherein the material of the radiation denatured film layer is one or more of aluminum zinc oxide, antimony tin oxide, indium tin oxide, titanium zinc oxide.