CN112187990A - Production process of high-heat-dissipation PC board rear cover of mobile phone - Google Patents
Production process of high-heat-dissipation PC board rear cover of mobile phone Download PDFInfo
- Publication number
- CN112187990A CN112187990A CN202011099372.6A CN202011099372A CN112187990A CN 112187990 A CN112187990 A CN 112187990A CN 202011099372 A CN202011099372 A CN 202011099372A CN 112187990 A CN112187990 A CN 112187990A
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- China
- Prior art keywords
- layer
- production process
- heat
- mobile phone
- rear cover
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
Abstract
The invention provides a production process of a high-heat-dissipation PC plate rear cover of a mobile phone, which comprises the following steps of: firstly, taking a PC plate as a base layer, and coating a solvent-free coating or a PM solvent on the surface of the base layer to form a surface hardening layer; secondly, spraying a UV curing layer on the surface of the hardened layer, and then curing by adopting ultraviolet light; thirdly, coating an acrylate adhesive layer on the inner surface of the PC board after curing, and then bonding the heat dissipation film; fourthly, spraying a PVD brightening layer on the outer surface of the UV curing layer; and fifthly, covering a release film on the surface of the PVD brightening layer after the PVD brightening layer is dried. This scheme is effectual has improved the feeling of lid behind the cell-phone, improves the life of lid behind the cell-phone simultaneously, reduces the influence of ultraviolet ray high temperature lid behind the cell-phone, and the radiating layer set up effectual radiating effect that has improved, reduces electromagnetic radiation simultaneously to user's influence, the improvement that convenient to use is healthy.
Description
Technical Field
The invention relates to a production technology of a mobile phone rear cover, in particular to a production process of a mobile phone rear cover made of a high-heat-dissipation PC board.
Background
Along with the popularization of electronic products, electronic products such as smart phones are embedded into thousands of households and become an indispensable part of daily life, from the 2G era to the 3G era and then to the 4G era, and 5G communication, the rear cover material of the mobile phone is also from the original plastic to metal, then to glass ceramic, and then to the PC and PMMA composite material with good communication, and the products are continuously innovated.
In the study of the 3D cover plate of the mobile phone, the PC/PMMA composite plate becomes the hot spot. Due to the coming of the 5G era, the 3D cover plate market of the mobile phone is also confronted with the emphasis on shuffling, the glass and the ceramic are on the market, the metal is confronted with the elimination, and the traditional plastic is confronted with the 'regeneration'. The production process of the rear cover of the existing PC + PMMA mobile phone is basically as follows: the PC + PMMA composite board → UV transfer texture → PVD brightening → silk screen printing ink → cutting → hot bending forming → spray coating hardening layer → UV curing → CNC trimming → forming, therefore, the existing processing mode is usually to perform spray coating or dip coating of the hardening material after the PC material is subjected to hot bending forming, but the heat dissipation effect of the final product is affected, the operation speed of the mobile phone is directly affected, and the production cost is correspondingly improved.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a production process of the high-heat-dissipation PC plate mobile phone rear cover, which is convenient to use, has an outstanding wear-resisting effect, is convenient to dissipate heat and reduces the production cost.
The technical scheme of the invention is as follows: a production process of a high-heat-dissipation PC board rear cover of a mobile phone comprises the following steps:
firstly, taking a PC plate as a base layer, and coating a solvent-free coating or a PM solvent on the surface of the base layer to form a surface hardening layer;
secondly, spraying a UV curing layer on the surface of the hardened layer, and then curing by adopting ultraviolet light;
thirdly, coating an acrylate adhesive layer on the inner surface of the PC board after curing, and then bonding the heat dissipation film;
fourthly, spraying a PVD brightening layer on the outer surface of the UV curing layer;
and fifthly, covering a release film on the surface of the PVD brightening layer after the PVD brightening layer is dried.
Further, the UV cured layer is cured using a UV lamp emitting ultraviolet rays having wavelengths of 260, 330, and 365nm in the second step.
Further, the heat dissipation film is a metal thin layer, a PC layer with a honeycomb structure, a natural graphite heat dissipation film, an artificial graphite heat dissipation film and a nano-carbon heat dissipation film.
Further, the metal thin layer is made of aluminum nitride, titanium nitride or titanium carbonitride.
Further, the thickness of the heat dissipation film is 0.01-3 mm.
Further, the thickness of the glue layer is 0.2-1 mm.
Furthermore, the thickness of the PC board layer is 0.1-4mm, and one surface of the PC board is plated with an ultraviolet-resistant UV coating.
Further, the surface hardened layer is a hardened wear-resistant structure with the hardness of 3-9H, which is formed by adopting solvent-free paint or PM solvent to solidify on the surface of the PC board layer, and the water drop angle of the hardened structure is more than or equal to 110 degrees.
Further, the thickness of the surface hardening layer is 21-40 um.
The invention has the following characteristics: this scheme is effectual has improved the feeling of lid behind the cell-phone, improves the life of lid behind the cell-phone simultaneously, reduces the influence of ultraviolet ray high temperature lid behind the cell-phone, and the radiating layer set up effectual radiating effect that has improved, reduces electromagnetic radiation simultaneously to user's influence, the improvement that convenient to use is healthy.
The detailed structure of the present invention will be further described with reference to the accompanying drawings and the detailed description.
Drawings
Fig. 1-is a schematic structural diagram of the rear cover of the mobile phone of the invention.
Detailed Description
As shown in the attached drawings: a production process of a high-heat-dissipation PC board rear cover of a mobile phone comprises the following steps:
firstly, taking a PC plate as a base layer, and coating a solvent-free coating or a PM solvent on the surface of the base layer to form a surface hardening layer by curing; the thickness of the PC board layer is 0.1-4mm, preferably, the thickness of the PC board layer is 1-3.5 mm; more preferably, the PC board layer has a thickness of 1.5/2/2.5 mm; and one surface of the PC plate is plated with an ultraviolet-resistant UV coating, so that the rear cover of the mobile phone is convenient to improve.
In the embodiment, the surface hardened layer is a hardened wear-resistant structure with the hardness of 3-9H and formed by adopting solvent-free paint or PM solvent to be solidified on the surface of the PC board layer, and the water drop angle of the hardened structure is more than or equal to 110 degrees. The hardened layer in this embodiment is an 8H hardened wear resistant structure with a water drop angle of 130 °. Preferably, the thickness of the surface hardened layer is 21-40 um; more preferably, the hardened layer of the surface layer has a thickness of 22/38 um.
Secondly, spraying a UV curing layer on the surface of the hardening layer, and curing by adopting ultraviolet light after spraying, so that the blocking of the mobile phone rear cover to ultraviolet rays is facilitated, the influence of the ultraviolet rays on the service life of the mobile phone rear cover is reduced, the mobile phone rear cover is prevented from yellowing, and the service life of the mobile phone rear cover is prolonged; preferably, after the UV cured layer is sprayed, the UV cured layer is cured by a UV lamp emitting ultraviolet rays with wavelengths of 260, 330 and 365nm, so that the curing effect is improved, the combination between the UV cured layer and the hardened layer is facilitated, the structural strength is improved, the curing and drying effect is improved, the surface leveling is facilitated, and the unevenness or the generation of bubbles is prevented.
Thirdly, coating an acrylate adhesive layer on the inner surface of the PC board after curing, and then bonding the heat dissipation film; the heat dissipation film is a metal thin layer, a PC layer with a honeycomb structure, a natural graphite heat dissipation film, an artificial graphite heat dissipation film and a nano-carbon heat dissipation film. Preferably, the metal thin layer is made of aluminum nitride, titanium nitride or titanium carbonitride; the heat dissipation effect of the heat dissipation layer is improved conveniently, and the influence of high temperature on the service life of the mobile phone rear cover can be reduced; more preferably, the thickness of the heat dissipation film is 0.01-3 mm; most preferably, the heat dissipation film has a thickness of 1/2/2.5 mm. Preferably, the thickness of the glue layer is 0.2-1 mm.
Fourthly, spraying a PVD brightening layer on the outer surface of the UV curing layer; the beautiful effect of the mobile phone rear cover is convenient to improve, and the wear-resistant and waterproof effects are improved.
And fifthly, covering a release film on the surface of the PVD brightening layer after the PVD brightening layer is dried, so that the influence of dust in the air on the surface of the mobile phone rear cover and the smoothness brightness of the mobile phone rear cover before the PVD is completely dried can be prevented.
This scheme is effectual has improved the feeling of lid behind the cell-phone, improves the life of lid behind the cell-phone simultaneously, reduces the influence of ultraviolet ray high temperature lid behind the cell-phone, and the radiating layer set up effectual radiating effect that has improved, reduces electromagnetic radiation simultaneously to user's influence, the improvement that convenient to use is healthy.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be construed as the protection scope of the present invention.
Claims (9)
1. A production process of a high-heat-dissipation PC board rear cover of a mobile phone is characterized by comprising the following steps of:
firstly, taking a PC plate as a base layer, and coating a solvent-free coating or a PM solvent on the surface of the base layer to form a surface hardening layer;
secondly, spraying a UV curing layer on the surface of the hardened layer, and then curing by adopting ultraviolet light;
thirdly, coating an acrylate adhesive layer on the inner surface of the PC board after curing, and then bonding the heat dissipation film;
fourthly, spraying a PVD brightening layer on the outer surface of the UV curing layer;
and fifthly, covering a release film on the surface of the PVD brightening layer after the PVD brightening layer is dried.
2. The production process of the high-heat-dissipation PC board rear cover of the mobile phone as claimed in claim 1, wherein the production process comprises the following steps: in the second step, the UV curable layer was cured using a UV lamp emitting ultraviolet rays having wavelengths of 260, 330, and 365 nm.
3. The production process of the high-heat-dissipation PC board rear cover of the mobile phone as claimed in claim 1, wherein the production process comprises the following steps: the heat dissipation film is a metal thin layer, a PC layer with a honeycomb structure, a natural graphite heat dissipation film, an artificial graphite heat dissipation film and a nano-carbon heat dissipation film.
4. The production process of the high-heat-dissipation PC board rear cover of the mobile phone as claimed in claim 3, wherein the production process comprises the following steps: the metal thin layer is made of aluminum nitride, titanium nitride or titanium carbonitride.
5. The production process of the high-heat-dissipation PC board rear cover of the mobile phone as claimed in claim 3, wherein the production process comprises the following steps: the thickness of the heat dissipation film is 0.01-3 mm.
6. The production process of the high-heat-dissipation PC board rear cover of the mobile phone as claimed in claim 1, wherein the production process comprises the following steps: the thickness of the adhesive layer is 0.2-1 mm.
7. The production process of the high-heat-dissipation PC board rear cover of the mobile phone as claimed in claim 1, wherein the production process comprises the following steps: the PC board layer is 0.1-4mm in thickness, and one side of the PC board is plated with an ultraviolet-resistant UV coating.
8. The production process of the high-heat-dissipation PC board rear cover of the mobile phone as claimed in claim 1, wherein the production process comprises the following steps: the surface hardened layer is a hardened wear-resistant structure with the hardness of 3-9H and formed by adopting solvent-free paint or PM solvent to solidify on the surface of the PC board layer, and the water drop angle of the hardened structure is more than or equal to 110 degrees.
9. The production process of the high-heat-dissipation PC board rear cover of the mobile phone as claimed in claim 1, wherein the production process comprises the following steps: the thickness of the surface hardening layer is 21-40 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011099372.6A CN112187990A (en) | 2020-10-14 | 2020-10-14 | Production process of high-heat-dissipation PC board rear cover of mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011099372.6A CN112187990A (en) | 2020-10-14 | 2020-10-14 | Production process of high-heat-dissipation PC board rear cover of mobile phone |
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| CN112187990A true CN112187990A (en) | 2021-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011099372.6A Pending CN112187990A (en) | 2020-10-14 | 2020-10-14 | Production process of high-heat-dissipation PC board rear cover of mobile phone |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704269A (en) * | 2016-03-04 | 2016-06-22 | 罗建华 | Mobile phone housing having heat dissipation, radiation protection, sterilization and far-infrared physiotherapy functions |
| CN106954370A (en) * | 2017-04-10 | 2017-07-14 | 东莞市万丰纳米材料有限公司 | Radiate hand-set lid and its processing technology |
| CN206932252U (en) * | 2017-07-20 | 2018-01-26 | 苏州新吉海包装有限公司 | A kind of hand-set lid glass |
| CN110062080A (en) * | 2019-05-08 | 2019-07-26 | 衡山县佳诚新材料有限公司 | A kind of PC plate material cell phone rear cover and its production technology |
| CN209562603U (en) * | 2019-05-08 | 2019-10-29 | 衡山县佳诚新材料有限公司 | A kind of PC plate material cell phone rear cover |
| CN210444316U (en) * | 2019-11-18 | 2020-05-01 | 广东彩辰光电科技有限公司 | Lid behind 5G cell-phone 3.5D |
| CN210576329U (en) * | 2019-10-20 | 2020-05-19 | 深圳市祥晖光电有限公司 | Mobile phone bottom shell with heat dissipation function |
-
2020
- 2020-10-14 CN CN202011099372.6A patent/CN112187990A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704269A (en) * | 2016-03-04 | 2016-06-22 | 罗建华 | Mobile phone housing having heat dissipation, radiation protection, sterilization and far-infrared physiotherapy functions |
| CN106954370A (en) * | 2017-04-10 | 2017-07-14 | 东莞市万丰纳米材料有限公司 | Radiate hand-set lid and its processing technology |
| CN206932252U (en) * | 2017-07-20 | 2018-01-26 | 苏州新吉海包装有限公司 | A kind of hand-set lid glass |
| CN110062080A (en) * | 2019-05-08 | 2019-07-26 | 衡山县佳诚新材料有限公司 | A kind of PC plate material cell phone rear cover and its production technology |
| CN209562603U (en) * | 2019-05-08 | 2019-10-29 | 衡山县佳诚新材料有限公司 | A kind of PC plate material cell phone rear cover |
| CN210576329U (en) * | 2019-10-20 | 2020-05-19 | 深圳市祥晖光电有限公司 | Mobile phone bottom shell with heat dissipation function |
| CN210444316U (en) * | 2019-11-18 | 2020-05-01 | 广东彩辰光电科技有限公司 | Lid behind 5G cell-phone 3.5D |
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Application publication date: 20210105 |