CN112186544A - Heat dissipation switch board - Google Patents
Heat dissipation switch board Download PDFInfo
- Publication number
- CN112186544A CN112186544A CN202011118661.6A CN202011118661A CN112186544A CN 112186544 A CN112186544 A CN 112186544A CN 202011118661 A CN202011118661 A CN 202011118661A CN 112186544 A CN112186544 A CN 112186544A
- Authority
- CN
- China
- Prior art keywords
- cabinet body
- partition plate
- fixed
- heat dissipation
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 85
- 238000005192 partition Methods 0.000 claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000005057 refrigeration Methods 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 4
- 238000009826 distribution Methods 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
- H02B1/38—Hinged covers or doors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
- H02B1/565—Cooling; Ventilation for cabinets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the field of power distribution cabinets, in particular to a heat-dissipation power distribution cabinet, which comprises a cabinet body, wherein a mounting plate is fixed inside the cabinet body, the mounting plate divides the interior of the cabinet body into an ammeter cavity and a heat dissipation cavity, a plurality of communicating holes penetrating through the mounting plate are uniformly arranged on the mounting plate, a partition plate I, a partition plate II and a partition plate III are sequentially fixed in the heat dissipation cavity from bottom to top, the partition plate I, the partition plate II and two side walls of the cabinet body form a reservoir, the partition plate III, the top of the cabinet body and two side walls of the cabinet body form a water collecting tank which is connected with the reservoir through a plurality of radiating pipes, two water guide plates are symmetrically fixed in the water collecting tank, the reservoir is also connected with the water collecting tank through a water guide pipe, the water distributor is characterized in that a water pump is fixed on the water guide pipe, an outlet at the upper end of the water guide pipe is arranged above the water guide plate, and a plurality of semiconductor refrigerating pieces are uniformly fixed on the partition plate I in the reservoir. The temperature in the cabinet body can be effectively reduced through the radiating pipe.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the field of power distribution cabinets, in particular to a heat-dissipation power distribution cabinet.
[ background of the invention ]
The power distribution cabinet is a power distribution device used for distributing, controlling, metering and connecting cables in an electric power supply system, a common power supply station and a substation use high-voltage switch cabinets, then the high-voltage switch cabinets are led out to a low-voltage power distribution cabinet through the voltage reduction low-voltage side of a transformer, the low-voltage power distribution cabinet is a device of a power distribution device which is integrated with protection devices such as electric meters, switches, circuit breakers, fuses, buttons, indicating lamps, instruments, electric wires and the like to meet the design functional requirements.
And current switch board only sets up the structure of vent usually, because the long-time operation of switch board equipment leads to the inside problem of box too high, hardly dispels the heat, and these heat dissipation problems can't be solved in the setting of vent, and the heat dissipation problem obtains fine solution and then leads to inside potential safety hazard, has caused very big influence to the operational environment of inside spare part, component simultaneously, leads to the emergence of conflagration even.
The invention is provided for overcoming the defects of the prior art.
[ summary of the invention ]
The invention aims to overcome the defects of the prior art and provides a heat dissipation power distribution cabinet with good heat dissipation performance.
The invention can be realized by the following technical scheme:
the invention discloses a heat-dissipation power distribution cabinet, which comprises a cabinet body, wherein a cabinet door hinged with the cabinet body is fixed on the cabinet body, a mounting plate is fixed inside the cabinet body, the mounting plate divides the inside of the cabinet body into a ammeter cavity and a heat dissipation cavity, a plurality of mounting bars for mounting ammeters and elements are uniformly fixed on the mounting plate in the ammeter cavity, a plurality of communicating holes penetrating through the mounting plate are uniformly arranged on the mounting plate, a partition plate I, a partition plate II and a partition plate III are sequentially fixed in the heat dissipation cavity from bottom to top, the partition plate I, the partition plate II and two side walls of the cabinet body form a water storage tank, the partition plate III, the top of the cabinet body and two side walls of the cabinet body form a water collection tank, the water collection tank is connected with a water storage tank through a plurality of heat dissipation tubes, two water guide plates are symmetrically fixed in the water, the water guide pipe is fixed with a water pump, an outlet at the upper end of the water guide pipe is arranged above the water guide plate, a plurality of semiconductor refrigerating pieces are uniformly fixed on a partition plate I inside the reservoir, a heat dissipation aluminum seat connected with the semiconductor refrigerating pieces is further embedded on the partition plate I, heat dissipation fins are further uniformly fixed on the lower end face of the heat dissipation aluminum seat, and exhaust fans are fixed on two sides of the cabinet body below the partition plate I. The ammeter, the switch and various components are arranged on a mounting bar of a mounting plate, pure water is filled in the reservoir, the semiconductor refrigerating sheet works, heat exchange is carried out between water and the semiconductor refrigerating sheet, the water temperature is reduced, low-temperature water passes through the action of a water pump, the low-temperature water reaches the water collecting tank through the water guide pipe, the water guide pipe is discharged through a water outlet above the water guide pipe, two water guide plates which are inclined towards the middle are symmetrically fixed in the water collecting tank, the gap between the water guide plates is small, the water is discharged through the gap between the water guide plates, the water with lower temperature flows downwards through the gap between the water guide plates through the action of the water guide plates, the water reaches the position of the heat dissipation pipe, the water with lower temperature flows downwards along the inner wall of the heat dissipation pipe, the water is subjected to heat transfer with the heat dissipation pipe when flowing on the inner wall of the heat dissipation pipe, the temperature that can effectively reduce cabinet body inside can guarantee cabinet body internal components and parts normal operating to absorb the heat that the semiconductor refrigeration piece produced through radiating fin, an exhaust fan air outlet in two exhaust fans is facing to radiating fin, and another exhaust fan air intake is facing to radiating fin, and the air discharge cabinet body of radiating fin position can be accelerated to two exhaust fan during operation, thereby reduces radiating fin's temperature.
Compared with the prior art, the invention has the following advantages:
1. through the effect of semiconductor refrigeration piece, reduce the temperature degree, discharge the cooling tube top with microthermal water through the water pump, the water of lower temperature flows down along the cooling tube inner wall, water takes place heat transfer with the cooling tube when the cooling tube inner wall flows, the heat of cooling tube is absorbed to water to the heat of the internal portion of cabinet is absorbed to the cooling tube through the lower temperature, the temperature of the internal portion of cabinet can effectively be reduced, can guarantee the internal components and parts normal operating of cabinet.
2. One of the two exhaust fans has an air outlet facing the heat radiating fins, and the other exhaust fan has an air inlet facing the heat radiating fins, so that the two exhaust fans can accelerate the air at the positions of the heat radiating fins to be exhausted out of the cabinet body during working, and the temperature of the heat radiating fins is reduced.
[ description of the drawings ]
The following detailed description of embodiments of the invention is provided in conjunction with the appended drawings, in which:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a cross-sectional view taken at A-A of FIG. 2;
FIG. 4 is a cross-sectional view taken at B-B of FIG. 2;
FIG. 5 is an enlarged view at C of FIG. 4;
in the figure: 1. a cabinet body; 2. a cabinet door; 3. mounting a plate; 4. mounting a bar; 5. a communicating hole; 6. a meter chamber; 7. a heat dissipation cavity; 8. a partition plate I; 9. a partition plate II; 10. a partition plate III; 11. a reservoir; 12. a water collecting tank; 13. a water guide plate; 14. a radiating pipe; 15. a heat dissipation aluminum base; 16. a refrigeration plate; 17. a heat dissipating fin; 18. an exhaust fan; 19. a water conduit; 20. a water pump;
[ detailed description ] embodiments
The embodiments of the present invention will be described in detail below with reference to the accompanying drawings:
as shown in fig. 1 to 5, the invention discloses a heat dissipation power distribution cabinet, which comprises a cabinet body 1, wherein a cabinet door 2 hinged with the cabinet body 1 is fixed on the cabinet body 1, a mounting plate 3 is fixed inside the cabinet body 1, the mounting plate 3 divides the inside of the cabinet body 1 into a meter cavity 6 and a heat dissipation cavity 7, a plurality of mounting bars 4 for mounting meters and elements are uniformly fixed on the mounting plate 3 in the meter cavity 6, a plurality of communication holes 5 penetrating through the mounting plate 3 are uniformly arranged on the mounting plate 3, a partition plate I8, a partition plate II 9 and a partition plate III 10 are sequentially fixed in the heat dissipation cavity 7 from bottom to top, the partition plate I8, the partition plate II 9 and two side walls of the cabinet body 1 form a water storage tank 11, the partition plate III 10 forms a water collection tank 12 with the top of the cabinet body 1 and the two side walls of the cabinet body 1, the water collection tank 12 is connected with the, two water deflectors 13 slope settings, cistern 11 still connects water gathering groove 12 through aqueduct 19, be fixed with water pump 20 on the aqueduct 19, the export setting of aqueduct 19 upper end is in the water deflector 13 top, still evenly be fixed with a plurality of semiconductor refrigeration pieces 16 on the inside division board I8 of cistern 11, still inlay the heat dissipation aluminium seat 15 that links to each other with semiconductor refrigeration piece 16 on division board I8, the terminal surface still evenly is fixed with radiating fin 17 under the heat dissipation aluminium seat 15, the cabinet body 1 both sides of division board I8 below are fixed with exhaust fan 18. The ammeter, the switch and various components are arranged on the mounting bar 4 of the mounting plate 3, pure water is filled in the reservoir 11, the semiconductor refrigeration sheet 16 works, heat exchange is carried out between the water and the semiconductor refrigeration sheet 16, the water temperature is reduced, the low-temperature water is acted by the water pump 20, the low-temperature water reaches the water collecting tank 12 through the water guide pipe 19, the water guide pipe 19 is discharged through a water outlet above the water guide pipe 19, two water guide plates 13 inclined towards the middle are symmetrically fixed in the water collecting tank 12, the gap between the water guide plates 13 is small, the water is discharged through the gap between the water guide plates 13, the water with lower temperature flows downwards through the gap between the water guide plates 13 under the action of the water guide plates 13, the water reaches the position of the radiating pipe 14, the water with lower temperature flows downwards along the inner wall of the radiating pipe 14, the water is in heat transfer with the radiating pipe 14 when flowing on the inner wall, and the heat inside the cabinet body 1 is absorbed by the heat dissipation pipe 14 with a lower temperature, the temperature inside the cabinet body 1 can be effectively reduced, the normal operation of components inside the cabinet body 1 can be ensured, the heat generated by the semiconductor refrigeration sheet 16 is absorbed by the heat dissipation fins 17, one air outlet of one exhaust fan 18 of the two exhaust fans 18 faces to the heat dissipation fins 17, the air inlet of the other exhaust fan 18 faces to the heat dissipation fins 17, and the air at the position of the heat dissipation fins 17 can be accelerated to be discharged out of the cabinet body 1 when the two exhaust fans 18 work, so that the temperature of the heat dissipation fins 17 is reduced.
The above description is only a preferred embodiment of the present invention, and it should be noted that a person skilled in the art can make various changes, modifications, substitutions and alterations to the embodiments without departing from the technical principles of the present invention, and such changes, modifications, substitutions and alterations should also be regarded as the protection scope of the present invention.
Claims (1)
1. The utility model provides a heat dissipation switch board, includes the cabinet body, its characterized in that: the cabinet body is fixed with a cabinet door hinged with the cabinet body, the cabinet body is fixed with a mounting plate, the mounting plate divides the cabinet body into an ammeter cavity and a heat dissipation cavity, a plurality of mounting bars for mounting the ammeter and elements are uniformly fixed on the mounting plate in the ammeter cavity, a plurality of communicating holes penetrating through the mounting plate are uniformly arranged on the mounting plate, a partition plate I, a partition plate II and a partition plate III are sequentially fixed in the heat dissipation cavity from bottom to top, a reservoir is formed by the partition plate I, the partition plate II and two side walls of the cabinet body, a water collecting tank is formed by the partition plate III, the top of the cabinet body and two side walls of the cabinet body, the water collecting tank is connected with the reservoir through a plurality of heat dissipation tubes, two water guide plates are symmetrically fixed in the water collecting tank, the two water guide plates are obliquely arranged, the reservoir is connected with the, the utility model discloses a cabinet, including cistern, baffle I, division board I, aqueduct upper end export setting is in the baffle top, still evenly be fixed with a plurality of semiconductor refrigeration pieces on the inside division board I of cistern, still inlay the heat dissipation aluminium seat that links to each other with the semiconductor refrigeration piece on the division board I, terminal surface still evenly is fixed with radiating fin under the heat dissipation aluminium seat, the cabinet body both sides of division board I below are fixed with the exhaust fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011118661.6A CN112186544A (en) | 2020-10-19 | 2020-10-19 | Heat dissipation switch board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011118661.6A CN112186544A (en) | 2020-10-19 | 2020-10-19 | Heat dissipation switch board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112186544A true CN112186544A (en) | 2021-01-05 |
Family
ID=73950956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011118661.6A Pending CN112186544A (en) | 2020-10-19 | 2020-10-19 | Heat dissipation switch board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112186544A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013102010A (en) * | 2011-11-08 | 2013-05-23 | Orion Mach Co Ltd | Temperature control device |
| CN203504023U (en) * | 2013-10-22 | 2014-03-26 | 周海兵 | Current heat radiation-type outdoor distribution box |
| CN204441750U (en) * | 2015-01-09 | 2015-07-01 | 常州市申宏电力设备有限公司 | GCK low-voltage complete switch equipment |
| CN207398683U (en) * | 2017-11-21 | 2018-05-22 | 朱晓蕾 | A kind of power Transmission transformation cabinet |
| CN207409860U (en) * | 2017-07-31 | 2018-05-25 | 华中国电电力集团有限公司 | A kind of box-type substation |
| CN207475039U (en) * | 2017-11-29 | 2018-06-08 | 昆明湘云衡电气设备有限公司 | A kind of good formula safety high-pressure power distribution cabinet of heat dissipation |
| CN108565725A (en) * | 2018-02-06 | 2018-09-21 | 山东寿光巨能电气有限公司 | A kind of power control cabinet and its assembly method |
| CN109936067A (en) * | 2017-12-17 | 2019-06-25 | 吴校贵 | A kind of control cabinet based on wireless network |
| CN209823133U (en) * | 2019-04-12 | 2019-12-20 | 徐海英 | Multifunctional switch cabinet |
| CN111129990A (en) * | 2020-02-11 | 2020-05-08 | 韦雪 | Electric power device with monitoring electric power input and output |
| CN111404062A (en) * | 2020-04-24 | 2020-07-10 | 冯晓红 | Switch cabinet heat dissipation device for transformer substation in cold area |
| CN211063072U (en) * | 2019-10-16 | 2020-07-21 | 贵州盛祥鸿电气设备有限公司 | Centralized cooling system of KYN28 cabinet group |
-
2020
- 2020-10-19 CN CN202011118661.6A patent/CN112186544A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013102010A (en) * | 2011-11-08 | 2013-05-23 | Orion Mach Co Ltd | Temperature control device |
| CN203504023U (en) * | 2013-10-22 | 2014-03-26 | 周海兵 | Current heat radiation-type outdoor distribution box |
| CN204441750U (en) * | 2015-01-09 | 2015-07-01 | 常州市申宏电力设备有限公司 | GCK low-voltage complete switch equipment |
| CN207409860U (en) * | 2017-07-31 | 2018-05-25 | 华中国电电力集团有限公司 | A kind of box-type substation |
| CN207398683U (en) * | 2017-11-21 | 2018-05-22 | 朱晓蕾 | A kind of power Transmission transformation cabinet |
| CN207475039U (en) * | 2017-11-29 | 2018-06-08 | 昆明湘云衡电气设备有限公司 | A kind of good formula safety high-pressure power distribution cabinet of heat dissipation |
| CN109936067A (en) * | 2017-12-17 | 2019-06-25 | 吴校贵 | A kind of control cabinet based on wireless network |
| CN108565725A (en) * | 2018-02-06 | 2018-09-21 | 山东寿光巨能电气有限公司 | A kind of power control cabinet and its assembly method |
| CN209823133U (en) * | 2019-04-12 | 2019-12-20 | 徐海英 | Multifunctional switch cabinet |
| CN211063072U (en) * | 2019-10-16 | 2020-07-21 | 贵州盛祥鸿电气设备有限公司 | Centralized cooling system of KYN28 cabinet group |
| CN111129990A (en) * | 2020-02-11 | 2020-05-08 | 韦雪 | Electric power device with monitoring electric power input and output |
| CN111404062A (en) * | 2020-04-24 | 2020-07-10 | 冯晓红 | Switch cabinet heat dissipation device for transformer substation in cold area |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210105 |
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| RJ01 | Rejection of invention patent application after publication |