CN112186343A - Dynamic inductance patch antenna, wireless device and preparation method - Google Patents
Dynamic inductance patch antenna, wireless device and preparation method Download PDFInfo
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- CN112186343A CN112186343A CN202010734315.4A CN202010734315A CN112186343A CN 112186343 A CN112186343 A CN 112186343A CN 202010734315 A CN202010734315 A CN 202010734315A CN 112186343 A CN112186343 A CN 112186343A
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- 230000005855 radiation Effects 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims description 28
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 229910021389 graphene Inorganic materials 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052794 bromium Inorganic materials 0.000 claims description 12
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 11
- 238000001259 photo etching Methods 0.000 claims description 8
- 230000008054 signal transmission Effects 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 150000004820 halides Chemical class 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 125000001246 bromo group Chemical group Br* 0.000 claims 1
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- 239000010453 quartz Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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Abstract
The invention discloses a dynamic inductance patch antenna, wireless equipment and a preparation method. The patch antenna includes: the antenna comprises a dielectric substrate, a radiation patch, a ground plate and a feed microstrip line, wherein the radiation patch is positioned on the surface of one side of the dielectric substrate and is provided with a dynamic inductor when transmitting signals; the grounding plate is positioned on the surface of the other side of the dielectric substrate; the feed microstrip line is electrically connected with the radiation patch. The invention is suitable for application scenes needing a miniaturized patch antenna.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a dynamic inductance patch antenna, wireless equipment and a preparation method.
Background
The antenna is an important component of a wireless mobile communication system and is responsible for receiving and transmitting wireless signals. Microstrip antennas are widely used for their advantages of small size, light weight, and ease of integration with integrated circuit devices.
With the development of communication technology, antenna design is also changed from a single antenna in a beam-fixed working mode to a beam-formable antenna array, but the requirement of communication devices such as mobile terminals and the like on the integration level of a front-end chip is continuously increased, and millimeter-wave microstrip antennas and antenna arrays thereof still face the urgent need of miniaturization.
Disclosure of Invention
The invention provides a dynamic inductance patch antenna, wireless equipment and a preparation method, which are used for meeting the miniaturization requirement of a microstrip antenna.
The invention provides a dynamic inductance patch antenna, which comprises:
a dielectric substrate;
the radiation patch is positioned on the surface of one side of the dielectric substrate and is provided with a dynamic inductor when transmitting signals;
the grounding plate is positioned on the other side surface of the dielectric substrate; and
and the feed microstrip line is electrically connected with the radiation patch.
The invention also provides a preparation method of the patch antenna, which comprises the following steps:
step 1, photoetching one side surface of a dielectric substrate to form a radiation patch with dynamic inductance during signal transmission and a feed microstrip line electrically connected with the radiation patch;
and 2, arranging a grounding plate on the other side surface of the dielectric substrate.
The invention also provides a preparation method of the patch antenna, which comprises the following steps:
and 20, arranging a feed microstrip line to be electrically connected with the radiation patch and arranging a ground plate on the other side surface of the dielectric substrate.
The invention also provides wireless equipment which comprises a signal receiving and transmitting device, wherein the signal receiving and transmitting device comprises the patch antenna.
The patch antenna provided by the invention solves the problem that the millimeter wave antenna is difficult to be further miniaturized on a chip by introducing the dynamic inductance, and the higher the transmission signal frequency is, the smaller the antenna size is. The invention integrates the material properties into the antenna design by establishing a reasonable physical model and an analysis method, so that the antenna is further miniaturized, and the invention has important significance for the miniaturization integration of high-speed and high-frequency on-chip millimeter wave antennas such as 5G antennas.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1a is a schematic structural diagram of a patch antenna according to this embodiment, and fig. 1b is a cross-sectional view of a geometric structure of a microstrip line;
fig. 2 is a cross-sectional view of the patch antenna of fig. 1a along the length of the microstrip line;
FIG. 3 is a schematic diagram of a transmission line model of the patch antenna of FIG. 1 a;
fig. 4 is a flowchart of a method for manufacturing a patch antenna according to an embodiment of the present invention;
FIG. 5 is a flow chart illustrating the specific fabrication of the radiation patch of FIG. 4;
FIGS. 6 a-6 c are schematic views of the structures formed in the various steps of FIG. 5;
fig. 7 is a flowchart of another method for manufacturing a patch antenna according to an embodiment of the present invention;
FIG. 8 is a graph showing a variation curve of the difference in patch length before and after adding the dynamic inductor at different frequencies/the length of a patch without adding the dynamic inductor in the embodiment of the present invention;
fig. 9 is a graph comparing the change in patch antenna gain before and after the addition of the dynamic inductor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the technical solution of the present invention clearer, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Fig. 1a is a schematic structural diagram of a patch antenna provided in this embodiment, fig. 1b is a cross-sectional view of a geometric structure of a microstrip line, fig. 2 is a cross-sectional view of the patch antenna in fig. 1a along a length direction of the microstrip line, and fig. 3 is a schematic transmission line model diagram of the patch antenna in fig. 1a, as shown in fig. 1a to fig. 3, the patch antenna includes: the antenna comprises a radiation patch 10, a dielectric substrate 20, a feed microstrip line 30 and a ground plate 40, wherein the radiation patch 10 is positioned on the surface of one side of the dielectric substrate 20, and the radiation patch 10 has dynamic inductance when transmitting signals; the grounding plate 40 is positioned on the other side surface of the dielectric substrate, and is generally a metal thin layer attached to the dielectric substrate; the feed microstrip line 30 is electrically connected to the radiation patch, and is configured to transmit a signal to the radiation patch or transmit a signal received by the radiation patch, and perform impedance matching of the signal.
The radiation patch in the embodiment is made of a conductive material having a dynamic inductance when a signal is transmitted, instead of a metal commonly used in the prior art, the dynamic inductance is represented by an inertial mass of a mobile charge carrier in an alternating electric field as an equivalent series inductance, and the dynamic inductance is an induced impedance per unit length of a conductor in a Drude model of alternating current conductance, and is equivalent to increasing the inductance of the antenna patch by introducing the dynamic inductance, so that the inductance is more obvious when the signal frequency increases, and the miniaturization of a high-frequency signal antenna is more facilitated. Because of the dynamic inductance during signal transmission, which is equivalent to adding the additional inductance during signal transmission, the patch size of the antenna can be significantly reduced when the signal frequency is increased, and a transmission line model is established and detailed theoretical analysis is performed.
First, theoretical analysis is carried out: the patch antenna can be regarded as a special microstrip transmission line with an open circuit at the terminal, starting from a transmission line model of a rectangular patch antenna, which is shown in fig. 3.
The radiation patch can also be in other shapes such as a circle, an ellipse, other polygons, and the like, and in the embodiment of the present invention, a rectangular microstrip patch is taken as an example for modeling analysis, and a rectangular microstrip patch antenna is shown in fig. 1 a. The size of the rectangular microstrip patch is a multiplied by b, the thickness h of the substrate is less than lambda, and lambda is the wavelength of a signal on the microstrip line. The patch can be regarded as a microstrip transmission line with width a and length b, and b is generally equal to λ/2. The microstrip line structure is shown in fig. 1 b. The patch antenna is equivalent to a microstrip transmission line, wherein the width W of the microstrip line is equivalent to the width a of the patch antenna, and the thickness d of the base of the microstrip line is equivalent to the thickness h of the base of the patch antenna.
The complex propagation constant can be known from the transmission line theory
The total inductance is the sum of the dynamic inductance and the inductance caused by electromagnetic induction, i.e., L ═ LK+LM，LKFor dynamic inductance, LMThe inductance generated by electromagnetic induction is equivalent to the additional inductance added when the inductance is calculated.
First, a lossless transmission model, i.e., R ═ 0 and G ═ 0, is analyzed, so that it can be concluded that equation (1) is
α is 0, so that
Knowledge of microstrip lines
Wherein c is the speed of light, and c is the speed of light,eeffective dielectric constant, in turn, of the sum of the wavelengthsThe relationship between β and the dynamic inductance can be found as λ 2 π/β
Wherein the capacitance C is represented by
Wherein0Is the dielectric constant of air;ris the relative dielectric constant of the microstrip line substrate, and w is the substrate width of the microstrip line.
The dynamic inductance is expressed as
Wherein u is the electron mobility, EFIs Fermi level shift, ρ is resistivity, μ is permeability, VFIs the fermi velocity and f is the antenna operating frequency.
The wavelength-frequency relationship obtained by the formulas (1) to (7) is
Finally, the relation between the length of the patch and the wavelength b is lambda/2-delta L, and the relation between the length of the patch and the frequency f can be obtained as the formula (9)
Wherein Δ L is a gap effect parameter, and it can be known from the above equation (9) that when the frequency f increases, the patch length b can be significantly reduced compared with the case without dynamic inductance, so that the antenna miniaturization requirement can be realized by reasonably designing the patch size.
The above calculation analysis is based on a lossless transmission model, and in practical high-frequency antenna applications, when the signal frequency in the transmission line is high, i.e. f (ω ═ 2 π f) is high, the influence of R and G on the complex propagation constant γ is negligible, so that the above lossless transmission model and the analysis process result are also applicable to the patch antenna of the present invention.
In order to realize that the radiation patch can generate dynamic inductance during signal transmission, the invention adopts a low-dimensional material as the patch material, and the dynamic inductance introduced by the low-dimensional material is a material attribute and has obvious dynamic inductance in a millimeter wave frequency band, so that the low-dimensional material can replace the traditional metal materials such as copper and the like as a conductive material of the patch antenna. According to the analysis, the problem that the millimeter wave antenna is difficult to be further miniaturized on a chip is solved by introducing dynamic inductance, and the antenna size is smaller as the transmission signal frequency is higher. The embodiment of the invention integrates the material properties into the antenna design by establishing a reasonable physical model and an analysis method, so that the antenna is further miniaturized, and the method has important significance for the miniaturization integration of high-speed and high-frequency on-chip millimeter wave antennas such as 5G antennas.
The low-dimensional material in the embodiment of the invention can be two-dimensional material graphene and the like, the graphene is used as a patch conductive material to generate inductance caused by electromagnetic induction and also dynamic inductance in signal transmission, the graphene is used as a low-dimensional material and can also be used as an intercalation host material to form an intercalation compound with an intercalation guest material such as bromine and the like, and the conductivity of the graphene is lower, so that the conductivity of the patch can be further improved by adding the intercalation guest material, and the dynamic inductance is also increased.
In embodiments of the invention, the material that is the intercalation guest may be an alkali metal, halogen, or halide, such as bromine, iron chloride (Fecl)3) Etc. bromine as an intercalation is more favorable for the formation of intercalation complexes due to its lower processing temperature, shorter processing time and deeper diffusion into the intercalated host multilayer graphene (MLG), and the tighter lattice match of the bromine intercalation and MLG, Br2The gaseous molecules can diffuse into the gaps between graphene layers to form intercalationRemain stable, producing bands with high density states below the dirac point (and intrinsic fermi level) of the graphene layer.
The embodiment of the invention adopts the radiation patch with dynamic inductance to replace a metal patch when transmitting signals, and realizes further miniaturization of the patch antenna by introducing the dynamic inductance as the material attribute.
Fig. 4 is a flowchart of a method for manufacturing a patch antenna according to an embodiment of the present invention, fig. 5 is a flowchart of a specific manufacturing method of a radiation patch in fig. 4, and fig. 6a to 6c are schematic diagrams of structures formed in steps in fig. 5, as shown in fig. 4, fig. 5, and fig. 6a to 6c, the method for manufacturing a patch antenna according to the embodiment includes:
step 101, photoetching one side surface of a dielectric substrate to form a radiation patch with dynamic inductance during signal transmission and a feed microstrip line electrically connected with the radiation patch;
in this embodiment, the radiation patch and the feed microstrip line are formed simultaneously by using the same material to simplify the manufacturing process, in other embodiments, the feed microstrip line and the radiation patch may be made of different materials respectively, may not be formed simultaneously, or may be located on both sides of the dielectric substrate respectively, which is not limited in the embodiments of the present invention.
And 102, arranging a grounding plate on the other side surface of the dielectric substrate.
The manufacture of the patch antenna is completed after the radiation patch, the feed microstrip line and the ground plate are formed on the dielectric substrate, and only the signal line of a signal transceiver in the wireless equipment needs to be electrically connected with the feed microstrip line in application.
The step 101 specifically includes:
as shown in fig. 6a, Highly Oriented Pyrolytic Graphite (HOPG) sheets, a novel graphite with properties close to those of single crystal graphite, are attached to a dielectric substrate, and are easily processed into a sheet structure for graphene fabrication.
1013, exposing the sample to bromine gas for a preset time to form a bromine insertion layer graphene paster material layer;
the generating device of the step is a high vacuum diffusion pump, and when the step is implemented, a two-zone steam transmission method is used for heating liquid Br2It was volatilized into a gas, and then introduced into the glass tube by transport together with nitrogen gas. The sample was exposed to bromine gas and nitrogen gas for 90 minutes at room temperature to form a layer of bromine intercalated graphene (Br-MLG) patch material, as shown in fig. 6 b.
And 1014, photoetching the patch material layer, and patterning into a preset radiation patch shape and a feed microstrip line.
As shown in fig. 6c, the shape of the radiation patch is rectangular, and in other embodiments, the shape of the radiation patch may be circular, oval or other polygonal structures, which is not limited by the present invention.
The patch antenna of the embodiment shown in fig. 1 can be prepared by the preparation method of the embodiment of the invention, and the antenna patch material is made of an intercalation material with dynamic inductance, such as bromine intercalation graphene, so that the patch antenna is miniaturized, and the antenna used for transmitting high-frequency signals is more remarkably miniaturized.
In other embodiments, the feed microstrip line and the radiation patch may be fabricated at different times, or may not be fabricated on the same side, or may be fabricated in different materials, in order to take other factors such as structure or performance into consideration.
Fig. 7 is a flowchart of a manufacturing method of another patch antenna according to an embodiment of the present invention, and as shown in fig. 7, the manufacturing method of the embodiment includes:
The difference between this embodiment and the embodiment shown in fig. 4 is that the feed microstrip line and the radiating patch are not formed at the same time, and they are mainly used to be prepared separately when special structure and performance are required. The method for manufacturing the radiation patch in this embodiment is similar to that in fig. 4, and will not be described in detail here, so that the present embodiment can also realize the miniaturization of the patch antenna.
The embodiment of the invention also provides wireless equipment which comprises a signal receiving and transmitting device, wherein the signal receiving and transmitting device comprises the patch antenna. In the wireless device in this embodiment, such as a mobile terminal, since the patch antenna employs the radiation patch having dynamic inductance during signal transmission, the size of the radiation patch can be significantly reduced, and the radiation patch can be manufactured by a semiconductor process which has high precision and is easy to mass produce, the radiation patch is very suitable for being integrated in a miniaturized product mobile terminal with high device integration level.
Fig. 8 is a graph showing a variation curve of a difference value between lengths of patches before and after adding a dynamic inductor and a length of a patch without adding the dynamic inductor in the embodiment of the present invention, and fig. 9 is a comparison graph of variation of gains of the patch antenna before and after adding the dynamic inductor, and it can be seen from fig. 8 that the degree of miniaturization that can be realized by the patch antenna is higher with an increase of a transmission signal frequency, and it can be seen from fig. 9 that the difference of the gains of the two is not large at the same frequency, so that the gain is not greatly affected, but the size can be made smaller by introducing the dynamic inductor, that is, the miniaturization of the patch.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (11)
1. A dynamic inductive patch antenna, comprising:
a dielectric substrate;
the radiation patch is positioned on the surface of one side of the dielectric substrate and is provided with a dynamic inductor when transmitting signals;
the grounding plate is positioned on the other side surface of the dielectric substrate; and
and the feed microstrip line is electrically connected with the radiation patch.
2. A patch antenna according to claim 1, wherein said radiating patch is of low dimensional material.
3. A patch antenna according to claim 1, wherein said radiating patch is an intercalated complex of a two-dimensional material with an alkali metal, halogen or halide in an intercalated structure.
4. A patch antenna according to claim 3, wherein the intercalated complex is bromine intercalated graphene.
5. A patch antenna according to any one of claims 1 to 4, wherein the dielectric substrate is silicon, quartz, FR4 or Rogers 5880.
6. A patch antenna according to any one of claims 1 to 4, wherein the radiating patch is a rectangular microstrip patch, the patch length b ═ λ/2- Δ L, λ is the wavelength of the transmitted signal, and Δ L is the slot effect parameter.
7. A method for manufacturing a patch antenna, comprising:
step 1, photoetching one side surface of a dielectric substrate to form a radiation patch with dynamic inductance during signal transmission and a feed microstrip line electrically connected with the radiation patch;
and 2, arranging a grounding plate on the other side surface of the dielectric substrate.
8. The method of claim 7, wherein the radiation patch is bromine-intercalated graphene.
9. The method of claim 8, wherein step 1 comprises:
arranging a highly oriented pyrolytic graphite sheet on a medium substrate as a sample and placing the highly oriented pyrolytic graphite sheet in a glass tube;
vacuumizing to a preset pressure, and exposing the sample to bromine gas for a preset time to form a bromine insertion layer graphene paster material layer;
and photoetching the patch material layer, and patterning the patch material layer into a preset radiation patch shape and a feed microstrip line.
10. A method for manufacturing a patch antenna, comprising:
step 10, photoetching one side surface of a dielectric substrate to form a radiation patch with dynamic inductance when transmitting signals;
and 20, arranging a feed microstrip line to be electrically connected with the radiation patch and arranging a ground plate on the other side surface of the dielectric substrate.
11. A wireless device comprising a signal transceiver device, the signal transceiver device comprising a patch antenna according to any one of claims 1 to 6.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113380697A (en) * | 2021-05-07 | 2021-09-10 | 北京大学 | Preparation method of carbon-based device and circuit structure based on bromine intercalation multilayer graphene or graphite film |
| CN113745788A (en) * | 2021-09-06 | 2021-12-03 | 合肥工业大学 | Dynamic inductance microstrip delay line and preparation method thereof |
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| US20080206124A1 (en) * | 2007-02-22 | 2008-08-28 | Jang Bor Z | Method of producing nano-scaled graphene and inorganic platelets and their nanocomposites |
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2020
- 2020-07-29 CN CN202010734315.4A patent/CN112186343A/en active Pending
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| US20080206124A1 (en) * | 2007-02-22 | 2008-08-28 | Jang Bor Z | Method of producing nano-scaled graphene and inorganic platelets and their nanocomposites |
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| Title |
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| GAURAV TEWARI等: "‘GMPA’- A Comparative Study of Graphene Based Patch for Performance and Parameters Enhancement of Antenna at Terahertz Frequency for Wireless Communications", 《AMITY JOURNAL OF COMPUTATIONAL SCIENCES (AJCS)》 * |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113380697A (en) * | 2021-05-07 | 2021-09-10 | 北京大学 | Preparation method of carbon-based device and circuit structure based on bromine intercalation multilayer graphene or graphite film |
| CN113745788A (en) * | 2021-09-06 | 2021-12-03 | 合肥工业大学 | Dynamic inductance microstrip delay line and preparation method thereof |
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