CN112185689A - Method for manufacturing filter including sealing structure - Google Patents
Method for manufacturing filter including sealing structure Download PDFInfo
- Publication number
- CN112185689A CN112185689A CN201910602093.8A CN201910602093A CN112185689A CN 112185689 A CN112185689 A CN 112185689A CN 201910602093 A CN201910602093 A CN 201910602093A CN 112185689 A CN112185689 A CN 112185689A
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- coil
- electrical contacts
- substrate
- filter
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/127—Encapsulating or impregnating
Abstract
The invention discloses a manufacturing method of a filter comprising a sealing structure, which comprises the following steps: arranging a substrate, and forming a plurality of electric contacts at two ends of the substrate; placing the coil on a substrate and pulling a plurality of leads of the coil to a plurality of electrical contacts; welding a plurality of wires to a plurality of electrical contacts by laser welding; arranging a mould to cover the coil, forming a colloid in the mould, and covering the coil by the colloid to expose the plurality of electrical contacts; and removing the mold to form a filter module including the sealing structure.
Description
Technical Field
The present invention relates to a method for manufacturing a filter including a sealing structure, and more particularly, to a method for manufacturing a filter capable of forming a filter structure by automatic welding.
Background
The filter is a common component of an electronic communication device or a network transmission device, and generally, when manufacturing the filter component, the manufacturing process requires a lot of manpower, and the processes such as winding on the coil, welding the coil and the substrate are all performed manually. Under the trend of miniaturization of parts of the electronic devices, the electronic components manufactured by manual methods have low production efficiency and the quality of the manufacturing process is difficult to guarantee. For example, in manual soldering, the color of the wire needs to be inspected with a magnifying glass and soldered to the corresponding contact, and since the operating area is very limited, slight deviation may cause poor soldering or soldering position error.
On the other hand, filters have various specifications according to the design of coil size, winding and the like, and the filters manufactured by the manual method are difficult to adjust various coil combinations, and are difficult to distinguish the specifications in the manufacturing process. Moreover, the conventional filter assembly cannot be integrated into a production line for automated production, and when the filter is to be mounted on other electronic devices, the filter assembly still needs to be manually welded, which makes it difficult to improve the overall process efficiency.
In summary, the present invention provides a filter manufacturing method including a sealing structure, which is designed to overcome the shortcomings of the prior art and improve the industrial application.
Disclosure of Invention
In view of the above-mentioned problems in the prior art, an object of the present invention is to provide a method for manufacturing a filter including a sealing structure, so as to solve the problems of the prior art that a lot of labor is required and the efficiency and quality of the manufacturing process are difficult to be improved.
According to an aspect of the present invention, a method for manufacturing a filter including a sealing structure is provided, which includes the steps of: arranging a substrate, forming a plurality of electric contacts at two ends of the substrate, and arranging the electric contacts at intervals and penetrating through the substrate; placing the coil on a substrate and pulling a plurality of leads of the coil to a plurality of electrical contacts; welding a plurality of wires to a plurality of electrical contacts by laser welding; arranging a mould to cover the coil, forming a colloid in the mould, and covering the coil by the colloid to expose the plurality of electrical contacts; and removing the mold to form the filter module containing the colloid.
Preferably, the substrate may comprise a printed circuit board having a plurality of recesses formed at both ends thereof, and a metal layer plated in the plurality of recesses to form a plurality of electrical contacts.
Preferably, the substrate may comprise a ceramic substrate, and the ceramic substrate is connected with a plurality of metal bumps at two ends to form a plurality of electrical contacts.
Preferably, the disposing of the coil may include placing a first coil and a second coil in parallel on the substrate, the wires of the first coil and the second coil being connected to each other and respectively drawn to a plurality of electrical contacts at both ends of the substrate.
Preferably, the substrate may be provided with a plurality of filter units, and the plurality of coils may be provided in the plurality of filter units, respectively, to form a plurality of filter modules arranged in parallel.
Preferably, the method for manufacturing a filter including the sealing structure may further include a cutting process of cutting the plurality of filter modules to form a plurality of filter units of a predetermined size.
Preferably, the plurality of filter units are electrically connected to the control circuit through the exposed plurality of electrical contacts. The filter module can be electrically connected with the control circuit through the exposed plurality of electrical contacts.
Preferably, the laser welding method can emit laser light to the overlapping position of the plurality of wires and the plurality of electrical contacts through the laser welding head, so that the plurality of wires are automatically welded to the plurality of electrical contacts.
According to another object of the present invention, there is provided a filter manufacturing method including a sealing structure, including the steps of: arranging a box body, forming a plurality of electric contacts at two ends of the upper edge of the box body, wherein the electric contacts are arranged at intervals; placing the coil in the box body, and drawing a plurality of leads of the coil to a plurality of electrical contacts; welding a plurality of wires to a plurality of electrical contacts by laser welding; and forming a colloid in the box body, wherein the colloid covers the coil and exposes the plurality of electrical contacts to form the filter module.
Preferably, the positioning of the coil may include placing the first coil and the second coil in parallel in the case, and the wires of the first coil and the second coil are connected to each other and respectively drawn to a plurality of electrical contacts at both ends of the case.
Preferably, the filter manufacturing method including the sealing structure may further include the steps of: an upper cover is arranged on the box body, and the upper cover covers the box body and the colloid to expose a part of the plurality of electrical contacts.
Preferably, the laser welding method can emit laser light to the overlapping position of the plurality of wires and the plurality of electrical contacts through the laser welding head, so that the plurality of wires are automatically welded to the plurality of electrical contacts.
In view of the above, the method for manufacturing a filter including a sealing structure according to the present invention may have one or more of the following advantages:
(1) the manufacturing method of the filter with the sealing structure can weld the lead and the electric contact in an automatic welding mode, avoids deviation caused by manual welding, further improves production efficiency and reduces product reject ratio.
(2) The manufacturing method of the filter with the sealing structure can increase the protection of the filter component through the sealing structure, avoid damaging a coil or a lead in the subsequent processing and reduce the probability of defective products.
(3) The filter manufacturing method comprising the sealing structure can directly install the filter module on a printed circuit board or a machine board of an electronic device through the electric contact without connecting a control circuit through manual welding, thereby improving the compatibility of process automation.
Drawings
In order to make the technical features, contents and advantages of the present invention, and the effects achieved thereby, more obvious, the present invention will be described in detail with reference to the accompanying drawings, and in the following embodiments:
fig. 1 is a flowchart of a method of manufacturing a filter including a sealing structure according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a filter substrate according to an embodiment of the invention.
FIG. 3 is a schematic diagram of laser welding according to an embodiment of the present invention.
Fig. 4 is a schematic view of a sealing structure of an embodiment of the present invention.
Fig. 5 is a flowchart of a method of manufacturing a filter including a sealing structure according to another embodiment of the present invention.
Fig. 6 is a flowchart of a method of manufacturing a filter including a sealing structure according to still another embodiment of the present invention.
Fig. 7 is a flowchart of a method of manufacturing a filter including a sealing structure according to still another embodiment of the present invention.
Description of the reference numerals
10: printed circuit board
11: groove
12: metal layer
15: ceramic substrate
16: metal salient point
20: laser welding head
21: laser light
22: substrate
23: welding position
30: semi-finished product
31: die set
32: colloid
Detailed Description
For the purpose of understanding the technical features, contents and advantages of the present invention and the effects achieved thereby, the present invention will be described in detail with reference to the accompanying drawings and embodiments, and the drawings used therein are for illustrative and supplementary purposes only and are not necessarily true to scale and precise arrangements after the present invention is implemented, and therefore, the scope of the present invention in practical implementation should not be read and limited by the scale and arrangement of the drawings.
In the drawings, the thickness or width of layers, films, panels, regions, light guides, etc. is exaggerated for clarity. Like reference numerals refer to like elements throughout the specification. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected," may refer to physical and/or electrical connections. Further, "electrically connected" or "coupled" may mean that there are additional elements between the two elements. Further, it will be understood that, although the terms "first," "second," and "third" may be used herein to describe various components, features, regions, layers and/or sections, they are used to distinguish one component, feature, region, layer and/or section from another component, feature, region, layer and/or section. Therefore, they are used for descriptive purposes only and not to be construed as indicating or implying relative importance or order relationships thereof.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1 is a flow chart of a method for manufacturing a filter including a sealing structure according to an embodiment of the present invention. As shown in the figure, the filter manufacturing method including the sealing structure includes the following steps (S01 to S05):
step S01: the substrate is arranged, a plurality of electric contacts are formed at two ends of the substrate, and the electric contacts are arranged at intervals and penetrate through the substrate. Fixing a substrate on the working base, wherein the type of the substrate can comprise a printed circuit board or a ceramic substrate, pre-cutting the substrate to the size of the single filter module, and arranging a plurality of electrical contacts at two ends of the substrate. Generally, the number of contacts is determined according to the filter specification, and usually, 3 to 4 contacts are provided at a single end. The electrical contacts are spaced apart and penetrate the substrate, in other words, both the upper and lower surfaces of the substrate can be used as terminals for connecting the electrical contacts, and in the subsequent steps, the wires of the coil can be connected to one surface of the substrate, while the contacts on the other surface are connected to a circuit or a board of an electronic device.
Please refer to fig. 2, which is a diagram illustrating a filter substrate according to an embodiment of the invention. As shown in the figure, for the printed circuit board 10, the electrical contacts may use the original circuit on the printed circuit board, or 3 grooves 11 are formed at two ends of the printed circuit board 10, respectively, and metal layers 12 are plated in the grooves 11 and extend to the upper and lower surfaces of the printed circuit board 10 to serve as the contacts. In addition, the ceramic substrate 15 may be provided with 3 metal bumps 16 connected to both ends of the electrical contact, and the metal bumps 16 may have the same thickness as the ceramic substrate 15 so that the ceramic substrate 15 has contacts for conduction on both the upper and lower surfaces thereof.
Step S02: the coil is placed on the substrate and the plurality of leads of the coil are pulled to the plurality of electrical contacts. In the embodiment, the coil can be matched with an automatic winding machine to complete winding in advance, and the types of connected wires are distinguished, so that when the coil wound with wires is placed on the substrate, each wire can be pulled to the corresponding electrical contact points at the two ends of the substrate.
Step S03: the plurality of wires are welded to the plurality of electrical contacts by laser welding. After the coil and the substrate are fixed, the wires are welded on the corresponding electrical contacts by a laser welding method, and the working machine can be provided with more than one laser welding head and simultaneously aligned with the overlapped part of the wires at two ends and the electrical contacts to emit laser light for laser welding. Alternatively, a single laser welding head may be provided to sequentially weld each electrical contact.
Please refer to fig. 3, which is a schematic diagram of laser welding according to an embodiment of the present invention. As shown in the figure, the laser welding head 20 can simultaneously emit two laser beams 21 to irradiate the substrate 22, and align the wires of the coil with the welding sites 23 of the electrical contacts, so that the wires are welded to the corresponding electrical contacts. The laser welding can effectively improve the welding precision and the yield of the manufacturing process, and the phenomenon that the output of the subsequent manufacturing process is influenced by the defective products generated by manual welding is avoided.
Step S04: and arranging a mold to cover the coil, forming a colloid in the mold, and covering the coil by the colloid to expose the plurality of electrical contacts. After the welding of the wires and the electrical contacts is completed, the semi-finished product is covered by a mold, for example, an upper cover slightly higher than the height of the coil is designed to cover the semi-finished product, and only the electrical contacts at two ends are exposed. And injecting the liquid thermosetting sealant into the mold, coating and covering the coil, and curing the material to form a sealed colloid by heating or irradiating ultraviolet light so as to complete the sealing structure.
Step S05: and removing the mold to form the filter module containing the colloid. And after the colloid is solidified, removing the mold to form the filter module containing the sealed colloid structure. The filter module can be directly used as a Surface Mount Technology (SMT) or installed on a printed circuit board by utilizing an automatic plug-in unit, for example, on a machine board of a communication device or a network device, due to the fact that the filter module is provided with an electric contact on the other surface of the substrate, the filter module can be produced by matching with an automatic production line without consuming too much labor, and further production efficiency and product yield are improved.
Please refer to fig. 4, which is a schematic diagram of a sealing structure according to an embodiment of the present invention. As shown, when the welded semi-finished product 30 is completed, it is covered by a mold 31, and a sealant is injected therein, and the mold is removed after the tape is cured, thereby forming a sealed gel 32 structure. The sealing structure manufactured by the embodiment can prevent the filter module from being damaged in subsequent processes, for example, when a plurality of filter modules are welded on an electronic device substrate by laser welding, the coil or the lead can be prevented from being damaged by laser light, or the filter module is installed on a printed circuit board by a Surface Mount Technology (SMT), and when the filter module needs to be baked by a tin furnace, the circuit damage caused by high temperature can be avoided.
Fig. 5 is a flow chart of a method for manufacturing a filter including a sealing structure according to another embodiment of the present invention. As shown in the figure, the filter manufacturing method including the sealing structure includes the following steps (S11 to S15): step S11: arranging a substrate, forming a plurality of electric contacts at two ends of the substrate, and arranging the electric contacts at intervals and penetrating through the substrate; step S12: placing a first coil and a second coil on a substrate in parallel, wherein leads of the first coil and the second coil are connected with each other and respectively pulled to a plurality of electrical contacts at two ends of the substrate; step S13: welding a plurality of wires to a plurality of electrical contacts by laser welding; step S14: arranging a mould to cover the coil, forming a colloid in the mould, and covering the coil by the colloid to expose the plurality of electrical contacts; and step S15: and removing the mold to form the filter module containing the colloid.
Here, steps S11, S13 to S15 are the same as steps S01, S03 to S05 of the foregoing embodiment, and therefore, description thereof is not repeated, and only the difference portion (step S12) is explained in the present embodiment. In the present embodiment, step S12: the first coil and the second coil are placed on the substrate in parallel, and leads of the first coil and the second coil are connected with each other and respectively pulled to a plurality of electrical contacts at two ends of the substrate. The difference from the foregoing embodiments is that different numbers of coils may be disposed on the board of each filter module, and in this embodiment, the first coil and the second coil are taken as an example, but the number of coils in the present invention is not limited to 2, and a single filter module may also include more than 2 induction coils. Aiming at the arrangement of a plurality of coils, the connection of the coils and the wires among the coils can be finished in the winding process, and further, the electric contact points are arranged on the wires to be welded only by pulling, so that the filter modules with different coil numbers can be formed by following the subsequent steps.
Fig. 6 is a flowchart illustrating a method for manufacturing a filter having a sealing structure according to another embodiment of the present invention. As shown in the figure, the filter manufacturing method including the sealing structure includes the following steps (S21 to S26): step S21: the filter comprises a substrate, a plurality of filter units and a plurality of filter units, wherein a plurality of electric contacts are formed at two ends of the substrate and penetrate through the substrate at intervals; step S22: respectively arranging a plurality of coils on the plurality of filter units, and respectively pulling the leads of the plurality of coils to a plurality of electrical contacts at two ends of the substrate; step S23: welding a plurality of wires to a plurality of electrical contacts by laser welding; step S24: arranging a mould to cover the coil, forming a colloid in the mould, and covering the coil by the colloid to expose the plurality of electrical contacts; step S25: removing the mold to form a filter module containing colloid; and step S26: a cutting process is performed to cut the plurality of filter modules to form a plurality of filter units with a default size.
Here, steps S23 to S25 are the same as steps S03 to S05 of the foregoing embodiment, and therefore, description thereof will not be repeated, and only the differences (steps S21 to S22, S26) will be described in this embodiment. In the present embodiment, step S21: the filter comprises a substrate, a plurality of electric contacts formed at two ends of the substrate, a plurality of filter units arranged on the substrate, and a plurality of filter units arranged on the substrate. The multiple filter units are disposed on the substrate to increase the throughput, and the size of a single filter module is usually small, so that cutting the substrate in advance may cause extra processes or waste of cost. Therefore, a plurality of filter units are arranged on a larger machine plate at the same time, so that the filter units are manufactured on the same machine plate and are cut into required sizes after a subsequent sealing structure is finished.
Step S22: the plurality of coils are respectively arranged on the plurality of filter units, and the leads of the plurality of coils are respectively pulled to the plurality of electrical contacts at the two ends of the substrate. Since a plurality of filter units are formed by providing a large number of coils on a substrate, the positions of lead wires are also complicated, and generally, the arrangement is a parallel arrangement in which a plurality of electric contacts at both ends of the substrate are maintained, a plurality of filter units are arranged in parallel, the lead wires are pulled to the corresponding electric contacts at both ends, and then, steps such as automatic soldering, manufacturing of a sealing structure, and the like are performed.
S26: a cutting process is performed to cut the plurality of filter modules to form a plurality of filter units with a default size. When the fabrication of the sealing structure is completed, the substrate may contain a plurality of filter units, which may be shipped directly to a downstream manufacturer for cutting when needed. Or the filter module can be directly divided into single filter modules according to the size of the filter module, and then the subsequent processing is continued. The subsequent process includes mounting the filter module on a printed circuit board or a control substrate, and connecting the filter module with a control circuit to serve as a filter component of the electronic device.
Fig. 7 is a flowchart illustrating a method for manufacturing a filter having a sealing structure according to still another embodiment of the present invention. As shown in the figure, the filter manufacturing method including the sealing structure includes the following steps (S31 to S36): step S31: arranging a box body, forming a plurality of electric contacts at two ends of the upper edge of the box body, wherein the electric contacts are arranged at intervals; step S32: placing a first coil and a second coil in parallel in a box body, wherein leads of the first coil and the second coil are mutually connected and respectively pulled to a plurality of electrical contacts at two ends of the box body; step S33: welding a plurality of wires to a plurality of electrical contacts by laser welding; step S34: forming a colloid in the box body, wherein the colloid covers the coil and exposes the plurality of electrical contacts; and step S35: an upper cover is arranged on the box body, and the upper cover covers the box body and the colloid to expose a part of the plurality of electrical contacts.
The greatest difference between the step S31 and the foregoing embodiments is that the supporting member of the filter is changed from a substrate to a box structure, the box structure can be square or rectangular, the box structure has an accommodating space therein, and a plurality of electrical contacts are disposed at two ends of the upper edges of two sides of the box structure. In another embodiment, the electrical contacts may extend to the side surface of the housing, increasing the ease of installation in subsequent processes. In step S32, the coils are placed in the box body, in this embodiment, the first coil and the second coil are placed in the accommodating space of the box body, but the invention is not limited thereto, and the coils may be single coils or multiple groups of coils, and the specification of the box body used is further adjusted by the number and size of the coils. After the coil is placed in the box and the wires are pulled to the corresponding electrical contacts, the wires are automatically soldered to the electrical contacts in step S33, and the laser soldering method is similar to that of the previous embodiment and will not be described again.
In step S34, due to the structure of the containing space of the box body, a liquid thermosetting sealant can be directly injected therein to coat the coil and the wires, and the material is cured by heating or irradiating ultraviolet light to form a sealed colloid. As in the previous embodiment, the encapsulant also exposes the electrical contacts for subsequent automated process installation. In addition, in order to further protect the filter structure, the upper cover of the case may be disposed by step S35, and the case and the adhesive may be covered with the upper cover to expose only a portion of the plurality of electrical contacts. The upper cover can be made of the same material as the box body, and the size of the upper cover can be slightly smaller than the outer diameter of the box body, so that the electric contact points on the upper edge part of the box body are still partially exposed to be used as contact points connected with other circuits. Or the cover may completely cover the case and be connected to other circuits through electrical contacts on the side surfaces.
The foregoing is by way of example only, and not limiting. It is intended that all equivalent modifications or variations not departing from the spirit and scope of the present invention be included in the claims.
Claims (10)
1. A method of manufacturing a filter including a hermetically sealed structure, comprising the steps of:
arranging a substrate, forming a plurality of electric contacts at two ends of the substrate, wherein the electric contacts are arranged at intervals and penetrate through the substrate;
placing a coil on the substrate and pulling a plurality of wires of the coil to the plurality of electrical contacts;
welding the plurality of wires to the plurality of electrical contacts by laser welding;
arranging a mould to coat the coil, and forming colloid in the mould, wherein the colloid covers the coil and exposes the plurality of electrical contacts; and
and removing the mold to form the filter module containing the colloid.
2. The method of manufacturing a filter including a sealing structure according to claim 1, wherein the substrate includes a printed circuit board having a plurality of recesses formed at both ends thereof, and a metal layer is plated on the plurality of recesses to form the plurality of electrical contacts.
3. A method of manufacturing a filter comprising a sealing structure according to claim 1, wherein said substrate comprises a ceramic substrate having a plurality of metal bumps attached at both ends thereof to form said plurality of electrical contacts.
4. The method of manufacturing a filter including a sealing structure according to claim 1, wherein the disposing the coil includes placing a first coil and a second coil side by side on the substrate, the wires of the first coil and the second coil being connected to each other and drawn to the plurality of electrical contacts at both ends of the substrate, respectively.
5. The method for manufacturing a filter including a sealing structure according to claim 1, wherein a plurality of filter cells are provided on the substrate, and a plurality of coils are provided on the plurality of filter cells, respectively, to form a plurality of filter modules arranged in parallel.
6. The method for manufacturing a filter including a sealing structure according to claim 1, wherein the laser welding is performed by irradiating laser light to the overlapping portion of the plurality of conductive wires and the plurality of electrical contacts by a laser welding head so that the plurality of conductive wires are automatically welded to the plurality of electrical contacts.
7. A method of manufacturing a filter including a hermetically sealed structure, comprising the steps of:
arranging a box body, forming a plurality of electric contacts at two ends of the upper edge of the box body, wherein the electric contacts are arranged at intervals;
placing a coil within the case and pulling a plurality of wires of the coil to the plurality of electrical contacts;
welding the plurality of wires to the plurality of electrical contacts by laser welding; and
and forming colloid in the box body, wherein the colloid covers the coil and exposes the plurality of electrical contacts to form the filter module.
8. The method of manufacturing a filter including a sealing structure according to claim 7, wherein the disposing the coil includes disposing a first coil and a second coil in the case in parallel, the wires of the first coil and the second coil being connected to each other and drawn to the plurality of electrical contacts at both ends of the case, respectively.
9. The method of manufacturing a filter including a sealing structure according to claim 7, further comprising the steps of:
and arranging an upper cover on the box body, wherein the upper cover covers the box body and the colloid to expose a part of the plurality of electrical contacts.
10. The method for manufacturing a filter including a sealing structure according to claim 7, wherein the laser welding is performed by irradiating laser light to the overlapping portion of the plurality of conductive wires and the plurality of electrical contacts by a laser welding head so that the plurality of conductive wires are automatically welded to the plurality of electrical contacts.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910602093.8A CN112185689A (en) | 2019-07-05 | 2019-07-05 | Method for manufacturing filter including sealing structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910602093.8A CN112185689A (en) | 2019-07-05 | 2019-07-05 | Method for manufacturing filter including sealing structure |
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| CN112185689A true CN112185689A (en) | 2021-01-05 |
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| CN2404301Y (en) * | 1999-11-30 | 2000-11-01 | 台达电子工业股份有限公司 | Assembling apparatus for electric circuit component |
| CN103228111A (en) * | 2013-03-06 | 2013-07-31 | 涌德电子股份有限公司 | Filtering element and printed circuit board soldering method and structure |
| CN103383891A (en) * | 2012-05-04 | 2013-11-06 | 陈建兴 | Inductor manufacturing method and inductor |
| CN105378860A (en) * | 2013-07-02 | 2016-03-02 | 脉冲电子股份有限公司 | Methods and apparatus for terminating wire wound electronic components to a header assembly |
| CN105874595A (en) * | 2014-12-09 | 2016-08-17 | 英特尔公司 | Three dimensional structures within mold compound |
| CN106415746A (en) * | 2014-04-23 | 2017-02-15 | 沃思电子埃索斯有限责任两合公司 | Method for producing an induction component, and induction component |
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2019
- 2019-07-05 CN CN201910602093.8A patent/CN112185689A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2404301Y (en) * | 1999-11-30 | 2000-11-01 | 台达电子工业股份有限公司 | Assembling apparatus for electric circuit component |
| CN103383891A (en) * | 2012-05-04 | 2013-11-06 | 陈建兴 | Inductor manufacturing method and inductor |
| CN103228111A (en) * | 2013-03-06 | 2013-07-31 | 涌德电子股份有限公司 | Filtering element and printed circuit board soldering method and structure |
| CN105378860A (en) * | 2013-07-02 | 2016-03-02 | 脉冲电子股份有限公司 | Methods and apparatus for terminating wire wound electronic components to a header assembly |
| CN106415746A (en) * | 2014-04-23 | 2017-02-15 | 沃思电子埃索斯有限责任两合公司 | Method for producing an induction component, and induction component |
| CN105874595A (en) * | 2014-12-09 | 2016-08-17 | 英特尔公司 | Three dimensional structures within mold compound |
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