CN112180142B - Alternating voltage detection device - Google Patents
Alternating voltage detection device Download PDFInfo
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- CN112180142B CN112180142B CN202010939114.8A CN202010939114A CN112180142B CN 112180142 B CN112180142 B CN 112180142B CN 202010939114 A CN202010939114 A CN 202010939114A CN 112180142 B CN112180142 B CN 112180142B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0084—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring voltage only
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
Abstract
The invention provides an alternating voltage detection device which comprises a first substrate, a second substrate and a first insulating isolation layer, wherein the first substrate and the second substrate are arranged in parallel, and the first insulating isolation layer is positioned between the first substrate and the second substrate; the lower surface of the first substrate is provided with at least one measuring head sensing electrode; the upper surface of the second substrate is provided with at least one tested lead electrode; each measuring head induction electrode and one measured lead electrode are insulated and isolated through the first insulation isolation layer to form a capacitor, the upper surface of the first substrate and the lower surface of the second substrate jointly form a shielding body, and the capacitor is shielded from external electromagnetic interference. The invention greatly improves the precision of the alternating voltage detection device and greatly improves the stability of non-contact alternating voltage detection by utilizing the advantages of high mechanical processing precision, stable internal structure, high processing efficiency and low cost of the printed circuit board.
Description
Technical Field
The invention relates to the field of voltage detection, in particular to an alternating current voltage detection device.
Background
At present, the detection of alternating voltage is mainly realized by an alternating voltage sensor, and the existing alternating voltage sensors sample a voltage signal to be detected in a direct contact mode and then send the voltage signal to a subsequent processing circuit;
the used sampling mode of current voltage sensor mainly is resistance partial pressure and voltage transformer (PT) mode, no matter be resistance partial pressure mode or PT transformer mode, all be with the alternating voltage on the circuit under test through direct contact sampling after convert the low pressure that follow-up circuit can be handled, this kind of mode has advantages such as convenient detection, simple structure, low cost, detection precision height, but these two kinds of modes have the security problem that can not return and keep away under its failure mode: the divider resistor may be broken down to cause short circuit, the voltage transformer may have turn-to-turn short circuit, and the like, and these faults are common in the use process, and finally the input impedance of the sensor is reduced, even the voltage transformer is short-circuited, so that the normal work of the tested line or system is influenced. For the fields with high requirements on safety, such as railways, chemical industry, coal, military and the like, the influence caused by the short circuit can bring serious consequences and even threaten the safety of life and property. In order to reduce the failure rate of the alternating voltage sampling device, the sampling device needs to implement severe device production, quality control process and a large number of screening experiments before use, and needs to be regularly maintained and checked after use, which consumes a large amount of manpower and material resources, but still cannot completely avoid the influence on a system to be tested after the sampling device fails.
In order to improve safety, a non-contact ac voltage detection device has been proposed. As shown in fig. 1, the ac voltage detecting apparatus includes an insulating housing 11 and a detecting electrode, wherein the detecting electrode is located in the insulating housing 11, the insulating housing 11 has a wire hole 13 for a cable to be detected to run, and the detecting electrode is disposed adjacent to the wire hole 13 (an inner space of the wire hole 13 is separated from the detecting electrode by an insulating layer). When the insulating housing 11 is assembled to the cable to be tested through the wire hole 13 (i.e. the cable to be tested passes through the wire hole 13), the detection electrode and the cable to be tested form a non-polar capacitor (the detection electrode and the cable to be tested each form an electrode of the capacitor), and the alternating voltage on the cable to be tested is converted into a detection signal through electric field coupling between the capacitor electrodes (i.e. the alternating voltage on the cable to be tested is coupled to the detection electrode through the electric field between the capacitor electrodes), thereby realizing auxiliary detection of the voltage of the cable to be tested.
However, due to the differences of the sectional area, the outer diameter and the material of the insulation sheath of the tested lead, the inconsistency of the gap between the tested lead and the wiring hole 13, the consistency of the manual assembly process of the detection device and the like, the structure between the tested lead and the detection device is unstable, and the detection precision is greatly influenced. Moreover, the detection device has a complex internal structure and is difficult to process.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a new ac voltage detection device, aiming at the problems of low detection precision and high processing difficulty of the non-contact ac voltage detection device due to the structure and process.
In order to solve the above technical problems, an embodiment of the present invention provides an ac voltage detection apparatus, including a first substrate, a second substrate, and a first insulating isolation layer, where the first substrate and the second substrate are arranged in parallel, a lower surface of the first substrate is opposite to an upper surface of the second substrate, and the first insulating isolation layer is located between the first substrate and the second substrate;
the first substrate is provided with at least one first bonding pad used for being connected with a radio frequency connector, and the second substrate is provided with at least one second bonding pad used for being connected with a tested lead;
the lower surface of the first substrate is provided with at least one measuring head sensing electrode, and each measuring head sensing electrode is electrically connected with one first bonding pad; the lower surface of the second substrate is provided with at least one tested lead electrode, and each tested lead electrode is electrically connected with one second bonding pad; each measuring head induction electrode and one measured lead electrode are insulated and isolated through the first insulation isolation layer to form a capacitor.
Preferably, the upper surface of the first substrate has a first copper-clad layer, the lower surface of the second substrate has a second copper-clad layer, and the first copper-clad layer and the second copper-clad layer are electrically connected through the pad through hole to form a shielding layer.
Preferably, the probe sensing electrode is located in an orthographic projection area of the first copper-clad layer and the second copper-clad layer on the lower surface of the first substrate, and the measured lead electrode is located in an orthographic projection area of the first copper-clad layer and the second copper-clad layer on the upper surface of the second substrate.
Preferably, the thickness of the first insulation isolation layer between each measuring head sensing electrode and the corresponding measured lead electrode is 0.05-3 mm, and the isolation withstand voltage between each measuring head sensing electrode and the corresponding measured lead electrode is not less than the withstand voltage requirement of the field on non-contact detection.
Preferably, a capacitance value of a capacitance formed by each of the probe sensing electrodes and the corresponding measured lead electrode is less than or equal to 200pF, and a size of an area of an orthogonal projection overlapping region of each of the probe sensing electrodes and the corresponding measured lead electrode on the first substrate or the second substrate is determined according to the capacitance value of the capacitance formed by the probe sensing electrode and the corresponding measured lead electrode.
Preferably, the alternating voltage detection device includes two first substrates, two second substrates, and two first insulation isolation layers, and each first substrate is parallel to one second substrate and is insulated and isolated by one first insulation isolation layer to form a probe assembly; each first pad on the first substrate of one of the probe assemblies is electrically connected with one first pad on the first substrate of the other of the probe assemblies, and each second pad on the second substrate of one of the probe assemblies is electrically connected with one second pad on the second substrate of the other of the probe assemblies.
The embodiment of the invention also provides an alternating voltage detection device, which comprises a first substrate, a second substrate, a third substrate, a first insulating isolation layer and a second insulating isolation layer, wherein the first substrate, the second substrate and the third substrate are arranged in parallel, the lower surface of the first substrate is opposite to the upper surface of the second substrate, the upper surface of the third substrate is opposite to the lower surface of the second substrate, the first insulating isolation layer is positioned between the first substrate and the second substrate, and the second insulating isolation layer is positioned between the second substrate and the third substrate;
the first substrate is provided with at least one first bonding pad used for being connected with a radio frequency connector, and the third substrate is provided with at least one second bonding pad used for being connected with a tested lead;
the lower surface of the first substrate is provided with at least one first measuring head sensing electrode, and each first measuring head sensing electrode is electrically connected with one first bonding pad; the upper surface of the second substrate is provided with at least one first tested lead electrode, and each first tested lead electrode is electrically connected with one second bonding pad; each first measuring head induction electrode and one first measured lead electrode are insulated and isolated through the first insulation isolation layer to form a first capacitor;
the upper surface of the third substrate is provided with at least one second measuring head sensing electrode, and each second measuring head sensing electrode is electrically connected with one first bonding pad; the lower surface of the second substrate is provided with at least one second tested lead electrode, and each second tested lead electrode is electrically connected with one second bonding pad; each second measuring head induction electrode and one second measured lead electrode are insulated and isolated through the second insulation isolation layer to form a second capacitor, and the first measuring head induction electrode and the second measuring head induction electrode which are connected to the same first bonding pad are respectively opposite to the first measured lead electrode and the second measured lead electrode which are connected to the same second bonding pad.
Preferably, the upper surface of the first substrate has a first copper-clad layer, the lower surface of the third substrate has a second copper-clad layer, and the first copper-clad layer and the second copper-clad layer are electrically connected through the pad through hole to form a shielding layer.
Preferably, the first probe sensing electrode is located in an orthographic projection area of the first copper-clad layer and the second copper-clad layer on the lower surface of the first substrate, the first measured lead electrode and the second measured lead electrode are respectively located in an orthographic projection area of the first copper-clad layer and the second copper-clad layer on the upper surface and the lower surface of the second substrate, and the second probe sensing electrode is located in an orthographic projection area of the first copper-clad layer and the second copper-clad layer on the upper surface of the third substrate.
Preferably, the sum of the area of the region where each first probe sensing electrode overlaps with the orthographic projection of the corresponding first measured lead electrode on the first substrate or the second substrate and the area of the region where the second probe sensing electrode connected to the same first pad overlaps with the orthographic projection of the corresponding second measured lead electrode on the second substrate or the third substrate is not less than 0.1 square centimeter.
According to the alternating voltage detection device provided by the embodiment of the invention, the electrodeless capacitor formed by the measuring head induction electrode and the measured lead electrode is packaged in the printed circuit board, and the advantages of high machining precision, stable internal structure, high machining efficiency and low cost of the printed circuit board are utilized, so that the precision of the alternating voltage detection device is greatly improved, and the stability of non-contact alternating voltage detection is greatly improved. In addition, by arranging the shielding layer, the same frequency interference can be shielded, so that the lower measurement limit can reach 50mV, and the measurement range is greatly improved.
Drawings
FIG. 1 is a schematic structural diagram of a non-contact AC voltage detecting device;
fig. 2 is a schematic structural diagram of an ac voltage detecting apparatus according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of an ac voltage detecting apparatus according to a second embodiment of the present invention;
FIG. 4 is a schematic view of the structure of the lower surface of the first substrate in the AC voltage detecting device of FIG. 3;
FIG. 5 is a schematic structural diagram of an upper surface of a second substrate in the AC voltage detecting device of FIG. 3;
fig. 6 is a schematic structural diagram of an ac voltage detecting apparatus according to a third embodiment of the present invention;
FIG. 7 is a schematic structural diagram of an upper surface of a first substrate in the AC voltage detecting device of FIG. 6;
FIG. 8 is a schematic view of the structure of the lower surface of the second substrate in the AC voltage detecting device of FIG. 6;
fig. 9 is a schematic structural diagram of an ac voltage detection apparatus according to a fourth embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Fig. 2 is a schematic structural diagram of an ac voltage detection apparatus according to an embodiment of the present invention, which can detect an ac voltage of a module or a terminal related to a device in a non-contact manner. The ac voltage detecting apparatus of the present embodiment includes a first substrate 21, a second substrate 22 and a first insulating layer 23, wherein the first substrate 21 and the second substrate 22 are disposed in parallel, a lower surface of the first substrate 21 is opposite to an upper surface of the second substrate 22, and the first insulating layer 23 is located between the first substrate 21 and the second substrate 22, that is, the first substrate 21, the second substrate 22 and the first insulating layer 23 form a multi-layer Printed Circuit Board (PCB) structure. The first substrate 21 and the second substrate 22 may be rigid printed circuit boards or flexible printed circuit boards, depending on the application. In practical applications, the first substrate 21 and the second substrate 22 may be separated from each other and stacked with the first insulating layer 23 being spaced apart from each other.
The first substrate 21 has a first pad 212 for connecting to an rf connector, the first pad 212 may be located on the upper surface of the first substrate 21, and each first pad 212 may be connected to an rf connector; the second substrate 22 has a second bonding pad 222 for connecting a wire to be tested, the second bonding pad 222 can be located on the lower surface of the second substrate 22, and each second bonding pad 222 can be used for connecting a wire to be tested.
The lower surface of the first substrate 21 has a probe sensing electrode 211, and the probe sensing electrode 211 is electrically connected to the first pad 212. The lower surface of the second substrate 22 has a tested wire electrode 221, and the tested wire electrode 221 is electrically connected to the second pad 222. Specifically, the probe sensing electrode 211 and the lead electrode 221 to be measured may be respectively formed of copper foils coated on the corresponding surfaces of the first substrate 21 and the second substrate 22, and in order to increase the strength of the detection signal and to realize high-precision detection, the probe sensing electrode 211 and the lead electrode 221 to be measured may have a large surface area, respectively.
In the present embodiment, the probe sensing electrode 211 and the lead electrode 221 to be measured are insulated and isolated by the first insulating isolation layer 23 to form a capacitor. That is, the orthogonal projections of the probe sensing electrode 211 and the lead electrode 221 to be measured on the first substrate 21 or the second substrate 22 are at least partially overlapped (preferably, all of them are overlapped). Thus, the probe sensing electrode 211 converts the alternating voltage on the tested wire into a detection signal through the electric field coupling between the capacitor electrodes under the action of the tested wire electrode 221 electrically connected with the tested wire (namely, the alternating voltage on the tested wire is coupled to the probe sensing electrode 211 through the electric field between the capacitor electrodes), and outputs the detection signal to the radio frequency connector through the corresponding first pad 212, and then transmits the detection signal to the back-end processing module through the radio frequency connector and the radio frequency wire for measurement and conversion, so that the voltage of the tested wire can be obtained.
According to the alternating voltage detection device, the electrodeless capacitor formed by the measuring head induction electrode 211 and the measured lead electrode 221 packaged in the printed circuit board can convert alternating voltage on a measured lead into a detection signal so as to realize detection of the alternating voltage on the measured lead, and as the detection process is not in direct contact with a measured system, the whole measurement process has no influence on the measured lead and related systems, and the safety is high. Meanwhile, by utilizing the advantages of high machining precision, stable internal structure, high machining efficiency and low cost of the printed circuit board, the alternating voltage detection device can greatly reduce the influence of uncontrollable factors (such as different sectional areas and outer diameters of wires, different materials and thicknesses of insulating skins, inconsistent gaps between the wires and the measuring head, inconsistent manual assembly processes of the measuring head and the like) on non-contact alternating voltage detection in the scheme shown in the attached drawing 1, and greatly improves the precision and stability of the non-contact alternating voltage detection.
Referring to fig. 3-5, in another embodiment of the present invention, the first substrate 21 has two first pads 212 for connecting rf connectors, and each first pad 212 is connected to one rf connector; the second substrate 22 has two second pads 222 for connecting to the wire under test, and each second pad 222 can be used for connecting to a wire under test (for example, two second pads 222 can be connected to live and neutral wires).
The lower surface of the first substrate 21 has a pair of first detecting elements, the pair of first detecting elements includes two probe sensing electrodes 211 insulated from each other (e.g., isolated withstand voltage greater than 10000VAC), and each probe sensing electrode 211 is electrically connected to one first pad 212. The lower surface of the second substrate 22 has a pair of second detecting parts, which include two tested wire electrodes 221 insulated from each other (e.g., having an isolation withstand voltage greater than 2500VAC), and each tested wire electrode 221 is electrically connected to one second pad 222.
Similarly, the probe sensor electrode 211 and the lead electrode 221 to be measured may be respectively formed of copper foils coated on the corresponding surfaces of the first substrate 21 and the second substrate 22, and in order to enhance the strength of the detection signal and to achieve high-precision detection, the probe sensor electrode 211 and the lead electrode 221 to be measured may have a large surface area, respectively.
In the present embodiment, each of the probe sensing electrodes 211 and one of the lead electrodes 221 to be tested are insulated and isolated by the first insulating isolation layer 23 to form a capacitor. That is, the orthographic projection of each probe sensing electrode 211 and a corresponding lead electrode 221 to be tested on the first substrate 21 or the second substrate 22 at least partially coincide (preferably completely coincide). Thus, under the action of the measured lead electrode 221 electrically connected to the measured lead, the two probe sensing electrodes 211 of each pair of first detecting elements respectively convert the ac voltage on the measured lead into a detection signal through the electric field coupling between the capacitive electrodes (i.e., the ac voltage on the measured lead is coupled to the probe sensing electrodes 211 through the electric field between the capacitive electrodes), and output the detection signal to the radio frequency connector through the corresponding first pad 212, and transmit the detection signal to the back-end processing module through the radio frequency connector and the radio frequency wire for measurement and conversion, thereby obtaining the voltage of the measured lead. The voltage between the live and neutral lines can be measured, for example, when two second pads 212 are connected to the live and neutral lines, respectively.
In practical applications, the first substrate 21 may have more first pads 212 and more probe-sensing electrodes 211 thereon, and correspondingly, the second substrate 22 may have more second pads 222 and more driven wire electrodes 221 thereon, so as to form a plurality of measurement channels, thereby realizing multi-path voltage detection.
Referring to fig. 6, in another embodiment of the ac voltage detecting apparatus of the present invention, the first substrate 21 has a first copper-clad layer 214 on an upper surface thereof (the first copper-clad layer 214 may have an insulating layer thereon), the second substrate 22 has a second copper-clad layer 224 on a lower surface thereof (the second copper-clad layer 224 may have an insulating layer thereon), and the first copper-clad layer 214 and the second copper-clad layer 224 are electrically connected to form a shielding layer through a pad via. Through above-mentioned shielding layer, can shield external interference signal for alternating voltage detection device's measurement lower limit can reach 50mV, has improved the detection precision greatly.
Specifically, the first copper-clad layer 214 and the second copper-clad layer 224 may correspond to the respective stylus sensing electrodes 211 and the lead electrode 221 to be tested, respectively, that is, a plurality of first copper-clad layers 214 insulated from each other are disposed on the upper surface of the first substrate 21, as shown in fig. 7 to 8. Each probe sensing electrode 211 is located in an orthographic projection area of one first copper-clad layer 214 and one second copper-clad layer 224 on the lower surface of the first substrate 21, and each tested lead electrode 221 is located in an orthographic projection area of one first copper-clad layer 214 and one second copper-clad layer 224 on the upper surface of the second substrate 22 (for example, the orthographic projection of each first copper-clad layer 214 on the lower surface of the second substrate 22 is overlapped with the area of the second copper-clad layer 224).
In addition, a first copper-clad layer 214 with a larger area may be disposed on the upper surface of the first substrate 21, a second copper-clad layer 224 with a larger area may be disposed on the lower surface of the second substrate 22, and all the probe sensing electrodes 211 on the first substrate 21 and all the tested lead electrodes 221 on the second substrate 22 are located between the same first copper-clad layer 214 and the same second copper-clad layer 224.
In order to ensure that the probe induction electrodes 211 can form induction voltage under the action of the measured lead electrodes 221, the distance between each probe induction motor 211 and the corresponding measured lead electrode 221 is 0.1-3 mm. And in order to ensure that the probe sensing electrode 211 can be insulated between the measured lead electrodes 221, the isolation withstand voltage between the probe sensing electrode 211 and the corresponding measured lead electrode 221 is not less than 2500 VAC.
In order to ensure safety, the capacitance value of the capacitance formed by each probe sensing electrode 211 and the corresponding measured lead electrode 221 is less than or equal to 200pF, and the size of the area where the orthographic projection of each probe sensing electrode and the corresponding measured lead electrode on the first substrate or the second substrate is overlapped is determined according to the capacitance value of the capacitance formed by the probe sensing electrode 211 and the corresponding measured lead electrode 221. In order to ensure the measurement accuracy, the area of the region where the orthographic projections of each of the probe sensing electrodes 211 and the corresponding lead electrode under test 221 on the first substrate 21 or the second substrate 22 overlap (i.e., the region where the probe sensing electrode 211 and the corresponding lead electrode under test 221 oppose each other) is not less than 0.1 square centimeter.
As shown in fig. 9, an ac voltage detecting apparatus is further provided in an embodiment of the present invention, the ac voltage detecting apparatus includes a first substrate 91, a second substrate 92, a third substrate 93, a first insulating isolation layer 94 and a second insulating isolation layer 95, the first substrate 91, the second substrate 92 and the third substrate 93 are disposed in parallel, a lower surface of the first substrate 91 is opposite to an upper surface of the second substrate 92, an upper surface of the third substrate 93 is opposite to a lower surface of the second substrate 92, the first insulating isolation layer 94 is located between the first substrate 91 and the second substrate 92, and the second insulating isolation layer 95 is located between the second substrate 92 and the third substrate 93, that is, the first substrate 91, the second substrate 92, the third substrate 93, the first insulating isolation layer 94 and the second insulating isolation layer 95 constitute a multi-layer printed circuit board structure. Similarly, the first substrate 91, the second substrate 92, and the third substrate 93 may be rigid printed circuit boards or flexible printed circuit boards.
In this embodiment, the first substrate 91 has at least two first pads 912 (e.g., on the upper surface of the first substrate 91) for connecting to rf connectors, and the third substrate 93 has at least two second pads 932 (e.g., on the lower surface of the third substrate 93) for connecting to wires to be tested.
The lower surface of the first substrate 91 has at least one pair of first detecting elements, each pair of first detecting elements includes two first probe sensing electrodes 911 insulated from each other, and each first probe sensing electrode 911 is electrically connected to one first pad 912; the upper surface of the second substrate 92 has at least one pair of second detecting elements, each pair of second detecting elements includes two first tested lead electrodes 921 insulated from each other, and each first tested lead electrode 921 is electrically connected to one second bonding pad 932; each of the first probe sensing electrodes 911 and one of the first wire electrodes 921 to be tested are insulated and isolated by the first insulating and isolating layer 94 to form a first capacitor.
The upper surface of the third substrate 93 has at least one pair of third detecting elements, each pair of third detecting elements includes two second probe sensing electrodes 931 insulated from each other, and each second probe sensing electrode 931 is electrically connected to one first pad 912; the lower surface of the second substrate 92 has at least a pair of fourth detecting elements, each pair of fourth detecting elements includes two second tested wire electrodes 922 insulated from each other, and each second tested wire electrode 922 is electrically connected to one second pad 932; each of the second probe sensing electrodes 931 and one of the second lead electrodes 922 are isolated by the second insulating isolation layer 95 to form a second capacitor, and the first probe sensing electrode 911 and the second probe sensing electrode 931 connected to the same first pad 912 are respectively opposite to the first lead electrode 921 and the second lead electrode 922 connected to the same second pad 932. I.e. the voltage on each set of wires is detected by a first capacitor and a second capacitor connected in parallel.
The multilayer printed circuit board structure can increase the electric field induction strength between the measuring head induction electrode and the measured lead electrode under the condition of not increasing the occupied area (only increasing the thickness) of the alternating voltage detection device, thereby improving the width and the precision of voltage testing.
Similarly, in order to improve the interference immunity, a first copper-clad layer may be disposed on the upper surface of the first substrate 91, a second copper-clad layer may be disposed on the lower surface of the third substrate 93, and the first copper-clad layer and the second copper-clad layer are electrically connected through the pad via hole to form a shielding layer.
Accordingly, the first probe sensing electrode 911 is located in the orthographic projection area of the first copper-clad layer and the second copper-clad layer on the lower surface of the first substrate 91, the first tested lead electrode 921 and the second tested lead electrode 922 are located in the orthographic projection area of the first copper-clad layer and the second copper-clad layer on the upper surface and the lower surface of the second substrate 92, respectively, and the second probe sensing electrode 931 is located in the orthographic projection area of the first copper-clad layer and the second copper-clad layer on the upper surface of the third substrate 93.
The sum of the area of the region where the orthographic projection of each first probe sensing electrode 911 and the corresponding first lead electrode to be measured 921 on the first substrate 91 or the second substrate 92 overlaps and the area of the region where the orthographic projection of the second probe sensing electrode 931 and the corresponding second lead electrode to be measured 922 connected to the same first pad 912 overlap on the second substrate 92 or the third substrate 93 is not less than 0.1 square centimeter.
In another embodiment of the present invention, two ac voltage detecting devices shown in fig. 2 may be stacked to form a structure similar to the ac voltage detecting device shown in fig. 9, that is, the ac voltage detecting device includes two first substrates, two second substrates and two first insulating isolation layers, and each first substrate is disposed in parallel with one second substrate and is insulated and isolated by one first insulating isolation layer to form a probe assembly; each first bonding pad on the first substrate of one probe assembly is electrically connected with one first bonding pad on the first substrate of the other probe assembly, and each second bonding pad on the second substrate of one probe assembly is electrically connected with one second bonding pad on the second substrate of the other probe assembly. This structure also reduces the area occupied by the ac voltage detection device.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (4)
1. An alternating current voltage detection device is characterized by comprising a first substrate, a second substrate, a third substrate, a first insulation isolation layer and a second insulation isolation layer, wherein the first substrate, the second substrate and the third substrate are arranged in parallel, the lower surface of the first substrate is opposite to the upper surface of the second substrate, the upper surface of the third substrate is opposite to the lower surface of the second substrate, the first insulation isolation layer is located between the first substrate and the second substrate, and the second insulation isolation layer is located between the second substrate and the third substrate;
the first substrate is provided with at least one first bonding pad used for being connected with a radio frequency connector, and the third substrate is provided with at least one second bonding pad used for being connected with a tested lead;
the lower surface of the first substrate is provided with at least one first measuring head sensing electrode, and each first measuring head sensing electrode is electrically connected with one first bonding pad; the upper surface of the second substrate is provided with at least one first tested lead electrode, and each first tested lead electrode is electrically connected with one second bonding pad; each first measuring head induction electrode and one first measured lead electrode are insulated and isolated through the first insulation isolation layer to form a first capacitor;
the upper surface of the third substrate is provided with at least one second measuring head sensing electrode, and each second measuring head sensing electrode is electrically connected with one first bonding pad; the lower surface of the second substrate is provided with at least one second tested lead electrode, and each second tested lead electrode is electrically connected with one second bonding pad; each second measuring head induction electrode and one second measured lead electrode are insulated and isolated through the second insulation isolation layer to form a second capacitor, and the first measuring head induction electrode and the second measuring head induction electrode which are connected to the same first bonding pad are respectively opposite to the first measured lead electrode and the second measured lead electrode which are connected to the same second bonding pad.
2. The ac voltage detecting device according to claim 1, wherein the first substrate has a first copper-clad layer on an upper surface thereof, the third substrate has a second copper-clad layer on a lower surface thereof, and the first copper-clad layer and the second copper-clad layer are electrically connected to each other through a pad via hole to form a shield layer.
3. The ac voltage detecting device according to claim 2, wherein the first probe sensing electrode is located in an orthographic projection region of the first copper-clad layer and the second copper-clad layer on the lower surface of the first substrate, the first measured lead electrode and the second measured lead electrode are located in an orthographic projection region of the first copper-clad layer and the second copper-clad layer on the upper surface and the lower surface of the second substrate, respectively, and the second probe sensing electrode is located in an orthographic projection region of the first copper-clad layer and the second copper-clad layer on the upper surface of the third substrate.
4. The ac voltage detecting apparatus according to claim 1, wherein a sum of an area of a region where each of the first probe sensing electrodes overlaps with an orthogonal projection of the corresponding first lead electrode to be measured on the first substrate or the second substrate and an area of a region where a second probe sensing electrode connected to the same first pad overlaps with an orthogonal projection of the corresponding second lead electrode to be measured on the second substrate or the third substrate is not less than 0.1 square centimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010939114.8A CN112180142B (en) | 2020-09-08 | 2020-09-08 | Alternating voltage detection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010939114.8A CN112180142B (en) | 2020-09-08 | 2020-09-08 | Alternating voltage detection device |
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| Publication Number | Publication Date |
|---|---|
| CN112180142A CN112180142A (en) | 2021-01-05 |
| CN112180142B true CN112180142B (en) | 2021-05-11 |
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| CN202010939114.8A Active CN112180142B (en) | 2020-09-08 | 2020-09-08 | Alternating voltage detection device |
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