CN112176280A - Mask for deposition and method for manufacturing the same - Google Patents
Mask for deposition and method for manufacturing the same Download PDFInfo
- Publication number
- CN112176280A CN112176280A CN202010243216.6A CN202010243216A CN112176280A CN 112176280 A CN112176280 A CN 112176280A CN 202010243216 A CN202010243216 A CN 202010243216A CN 112176280 A CN112176280 A CN 112176280A
- Authority
- CN
- China
- Prior art keywords
- blocking member
- opening
- auxiliary
- mask
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008021 deposition Effects 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 230000000903 blocking effect Effects 0.000 claims abstract description 332
- 230000001154 acute effect Effects 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims description 52
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 238000007747 plating Methods 0.000 claims description 30
- 230000008569 process Effects 0.000 claims description 17
- 238000000151 deposition Methods 0.000 description 107
- 238000003825 pressing Methods 0.000 description 55
- 239000000758 substrate Substances 0.000 description 23
- 239000010410 layer Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000008439 repair process Effects 0.000 description 6
- 239000000470 constituent Substances 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a mask for deposition and a method for manufacturing the same. The mask for deposition includes: a blocking part including a main blocking member and an auxiliary blocking member; and a plurality of opening portions disposed inside the blocking portion and including a first opening portion and a second opening portion; wherein the blocking portion includes: one side; the other surface is opposite to the one surface; an inner surface exposed to the opening; a lateral end portion located at an intersection of the face and the medial face and comprising an acute pointed shape; and the other end portion located at an intersection of the other surface and the inner surface, wherein the one end portion of the blocking portion around the first opening includes a first end portion including the auxiliary blocking member.
Description
Technical Field
The present invention relates to a deposition mask and a method for manufacturing the same.
Background
Among display devices, an organic light-emitting display device has attracted attention as a next-generation display device because it has not only a wide viewing angle and excellent contrast but also a high response speed as a self-light-emitting display element.
Such an organic light emitting display device includes an intermediate layer such as a light emitting layer between electrodes facing each other. The electrodes and intermediate layers may be formed in a variety of ways, one of which is a deposition method.
In order to manufacture an organic light emitting display device using a deposition method, a deposition mask (e.g., a Fine metal mask) having the same pattern opening as a pattern of a thin film to be formed on a substrate is closely attached to the substrate, and then a deposition substance is deposited on the substrate through the deposition mask to form a thin film of a desired pattern.
The deposition mask may be generally manufactured by forming a pattern opening in a metal base material by a wet etching method, or may be manufactured by forming a pattern opening in a metal base material by a laser irradiation method.
Disclosure of Invention
When the manufactured deposition mask is used in a deposition process or during cleaning, a ramp portion may be damaged, and a Shadow Effect (Shadow Effect) may occur in the damaged portion to cause poor deposition. Therefore, in general, in case the ramp is damaged, the corresponding deposition mask may be discarded.
An object of the present invention is to provide a deposition mask that can Repair (Repair) a damaged portion of a ramp, prevent a Shadow Effect (Shadow Effect), and recover the damaged portion to be reusable.
Another object of the present invention is to provide a method for manufacturing a deposition mask, which can Repair (Repair) a damaged portion of a ramp, prevent a Shadow Effect (Shadow Effect), and recover the damaged portion to be reusable.
The problem of the present invention is not limited to the above-mentioned problem, and other technical problems not mentioned can be clearly understood by those skilled in the art from the following description.
A deposition mask according to an embodiment for solving the problem includes: a blocking part which comprises a main blocking component and an auxiliary blocking component; and a plurality of opening portions arranged inside the blocking portion, including a first opening portion and a second opening portion; wherein the blocking portion includes: one side; the other surface is opposite to the one surface; an inner surface exposed to the opening; a lateral end portion located at an intersection of the face and the medial face and comprising an acute pointed shape; and the other end portion located at an intersection of the other surface and the inner surface, wherein the one end portion of the blocking portion around the first opening includes a first end portion including the auxiliary blocking member.
The auxiliary blocking member of the first end portion may be disposed on the main blocking member.
The one-side end portion of the blocking portion around the second opening portion may include a second end portion configured to include the main blocking member without the auxiliary blocking member.
The shape of the primary blocking member of the first end portion may be different from the shape of the primary blocking member of the second end portion.
The shape of the auxiliary blocking member and the main blocking member of the first end portion may be the same as the shape of the main blocking member of the second end portion.
The auxiliary blocking member and the main blocking member of the first end portion are in direct contact with each other, and may form an interface at a contact surface.
The auxiliary blocking member and the main blocking member may be composed of the same substance.
The auxiliary blocking member of the first end portion may include a plurality of sub-auxiliary blocking members distinguished by an interface.
The sub auxiliary blocking members may be made of the same substance.
The inner side surface may have a shape recessed toward the other surface.
The inner side surface of the blocking portion may be composed of an auxiliary inner side surface of the auxiliary blocking member and a main inner side surface of the main blocking member.
In order to solve the problem, a method of manufacturing a deposition mask according to an embodiment includes: supplying a mask member including a main blocking member and a plurality of opening portions arranged inside the main blocking member; and forming an auxiliary blocking member on the main blocking member around at least a part of the opening.
The opening part may include a normal opening part and a damaged opening part, and the step of forming the auxiliary blocking member may be a step of forming the auxiliary blocking member on the main blocking member around the damaged opening part.
The step of forming the auxiliary blocking member may be a step of forming a shape of the damaged opening portion in the same manner as a shape of the normal opening portion.
The step of forming the auxiliary blocking member may include a step of disposing the mask member on a support table and supplying ink including a substance for an auxiliary blocking member into the damaged opening portion.
The step of forming the auxiliary blocking member may further include: a step of pressurizing the opening portion to which the ink is supplied, with a pressurizing structure having a three-dimensional shape of the opening portion and including an elastic substance, after the step of supplying the ink; and a step of curing the auxiliary blocking member with a substance.
The substance for auxiliary blocking member may include a metal, and the step of curing the substance for auxiliary blocking member may be performed through a metal plating process.
Before the step of forming the auxiliary blocking member, a step of classifying the opening portion of the mask member into the normal opening portion and the damaged opening portion may be further included.
The step of classifying the damaged opening portion may include a step of detecting a missing position and a missing amount of the damaged opening portion.
The step of forming the auxiliary blocking member on the main blocking member around the damaged opening may include a step of determining an amount and a feeding position of the substance for the auxiliary blocking member based on the missing position and the missing amount of the damaged opening.
Additional embodiments are specifically included in the detailed description and the accompanying drawings.
According to the deposition mask of an embodiment, it is possible to provide a deposition mask in which a Shadow Effect (Shadow Effect) is suppressed by repairing (Repair) a damaged deposition mask by forming an auxiliary blocking member and an interface at a damaged ramp portion. Therefore, since the damaged deposition mask can be reused, manufacturing time and cost can be saved.
Effects according to the embodiments are not limited to those exemplified above, and more various effects are included in the present specification.
Drawings
Fig. 1 is a configuration diagram of a deposition apparatus for illustrating a deposition process using a mask for deposition according to an embodiment.
Fig. 2 is a plan view of a display device according to an embodiment.
Fig. 3 is a plan view illustrating a portion of a mask for deposition according to an embodiment.
Fig. 4 is a sectional view taken along line IV-IV' of fig. 3.
Fig. 5 is an enlarged view of a region a of fig. 3.
Fig. 6 is a sectional view taken along line VI-VI' of fig. 5.
FIG. 7 is a plan view illustrating a portion of a mask component according to an embodiment.
Fig. 8 is a cross-sectional view taken along line VIII-VIII' of fig. 7 in order to explain a method of manufacturing a deposition mask according to an embodiment.
Fig. 9 is a plan view of the region B of fig. 7.
Fig. 10 is a sectional view for explaining a method of manufacturing a mask for deposition according to an embodiment.
Fig. 11 is a plan view enlarging a region B of fig. 7 after the solution is poured.
Fig. 12 is a sectional view for explaining a method of manufacturing a mask for deposition according to an embodiment.
Fig. 13 to 15 are sectional views sequentially showing a state in which the solution moves from the region C to the missing portion of fig. 12.
Fig. 16 is a sectional view for explaining a method of manufacturing a mask for deposition according to an embodiment.
Fig. 17 to 19 are enlarged views of a region D in fig. 16.
Fig. 20 is a sectional view for explaining a method of manufacturing a mask for deposition according to an embodiment.
Fig. 21 to 24 are sectional views of a mask member according to other embodiments and enlarged sectional views around a missing portion.
Fig. 25 to 27 are sectional views of mask members according to still another embodiment.
Description of the symbols
100: deposition mask 100R: mask member
130: main blocking component
140: opening 150: interface (I)
160: auxiliary blocking member 200: target substrate
300: solution 400: pressurization structure
BL: blocking portion S1: one side of
S2: other surface S3: inner side surface
Detailed Description
The advantages and features of the present invention, and the methods of accomplishing the same, will become apparent with reference to the drawings and the detailed description of the embodiments which follow. However, the present invention may be embodied in various forms different from each other, and is not limited to the embodiments disclosed below, but the present embodiments are only for complete disclosure of the present invention and are provided to fully inform the scope of the present invention to those having ordinary knowledge in the art to which the present invention pertains, and the present invention is defined only by the scope of the claims.
When an element (element) or a layer is referred to as being "on" other element or layer, the case of being immediately above the other element or the case of being sandwiched with the other layer or the other element is all included. Throughout the specification, the same reference numerals denote the same constituent elements.
Although the terms first, second, etc. are used to describe various constituent elements, it is obvious that these constituent elements are not limited to these terms. These terms are only used to distinguish one constituent element from other constituent elements. Therefore, the first component mentioned below may obviously be the second component within the technical idea of the present invention.
Hereinafter, specific embodiments are described with reference to the drawings.
Fig. 1 is a configuration diagram of a deposition apparatus for illustrating a deposition process using a mask for deposition according to an embodiment.
The first direction DR1 in the drawing indicates a lateral direction of the deposition mask 100 in plan view, and the second direction DR2 indicates a longitudinal direction of the deposition mask 100 in plan view. Also, the third direction DR3 represents the thickness direction of the deposition mask 100. The first direction DR1 and the second direction DR2 perpendicularly intersect each other, and the third direction DR3 perpendicularly intersects both the first direction DR1 and the second direction DR2 as a direction intersecting a plane in which the first direction DR1 and the second direction DR2 are located. However, the directions mentioned in the embodiments should be understood as referring to opposite directions, and the embodiments are not limited to the mentioned directions.
Referring to fig. 1, a deposition apparatus for a deposition process may include a crucible 3, a support member 1, a mask frame 5, a deposition mask 100, and a magnet unit 2. The crucible 3 may internally house deposition substances for deposition on the substrate, and may heat the respective deposition substances. The heated deposition substance can be sublimated to pass through the exhaust port of the crucible 3 toward the outside.
The deposition mask 100 includes a blocking portion BL and a plurality of openings 140 formed inside the blocking portion BL. The blocking portion BL may function to block the travel of the deposition substance. The blocking portion BL may be constituted by a blocking member. The blocking member may be formed of a metal such as nickel (Ni), a nickel alloy, or a nickel-cobalt alloy. The blocking member may be made of a metal thin film, but is not limited thereto. The opening 140 is formed inside the blocking portion BL, and has a shape penetrating the blocking member in the thickness direction. The opening 140 may allow the deposition substance to pass therethrough to form a pattern corresponding to the shape of the opening 140 on the target substrate 200. Specifically, the deposition substance supplied from the crucible 3 may be deposited on the target substrate 200 through the opening 140 of the deposition mask 100, and a thin film of a desired pattern may be formed on the target substrate 200 according to the shape of the opening 140 of the deposition mask 100.
The deposition mask 100 may be formed of a plurality of split masks, but is not limited thereto, and may be formed of one mask having a size obtained by combining a plurality of split masks.
The deposition mask 100 (i.e., the blocking portion BL) may include one surface S1 and the other surface S2. The one surface S1 may be a surface facing the substrate, and the other surface S2 may be a surface facing the crucible 3, which is opposite thereto. In a case where the deposition mask 100 is closely attached to the target substrate 200, the one surface S1 may be in physical contact with the target substrate 200. In the case where the deposition mask 100 is positioned on the mask frame 5, the other side S2 of the deposition mask 100 may be in physical contact with the mask frame 5.
The mask frame 5 may function to support the deposition mask 100, and may be coupled with the deposition mask 100 by welding. The combined deposition mask 100 and mask frame 5 may be disposed on the support member 1. The support member 1 may function to support the combined deposition mask 100 and mask frame 5.
The magnet unit 2 may be disposed at an upper portion of the deposition mask 100. The object substrate 200 may be disposed between the deposition mask 100 and the magnet unit 2. The magnet unit 2 can function to bring the target substrate 200 and the deposition mask 100 into close contact with each other.
The deposition mask 100 may be used when forming an organic light emitting layer pattern of an organic light emitting display device. Fig. 2 shows a display device including an organic light emitting layer formed using a deposition mask 100.
Fig. 2 is a plan view of a display device according to an embodiment.
Referring to fig. 2, the display device may include a plurality of pixels 201, 202, 203. The plurality of pixels may include a first color pixel 201, a second color pixel 202, and a third color pixel 203. The first color pixel 201 may be a red pixel including a red organic emission layer, the second color pixel 202 may be a blue pixel including a blue organic emission layer, and the third color pixel 203 may be a green pixel including a green organic emission layer.
In an embodiment, although not limited thereto, the first color pixel 201 and the second color pixel 202 may have substantially the same shape and size, and the third color pixel 203 may have a smaller size than the first color pixel 201 and the second color pixel 202.
The pixels may be arranged in an array shape. The direction of travel of the rows 220 may be a first direction DR1 and the direction of travel of the columns 210 may be a second direction DR 2. Each pixel 201, 202, 203 may be diamond-shaped (shown by way of example), hexagonal, octagonal, circular, etc. In the case where each pixel has a diamond shape, the edges of each pixel 201, 202, 203 are arranged in directions inclined with respect to the first direction DR1 and the second direction DR 2.
The pixel row 220 may include rows 221, 223 in which the first color pixels 201 and the second color pixels 202 are alternately arranged, and rows 222, 224 in which the third color pixels 203 are arranged. For example, the odd-numbered rows 221 and 223 may be rows in which the first color pixels 201 and the second color pixels 202 are alternately arranged, and the even-numbered rows 222 and 224 may be rows in which the third color pixels 203 are arranged. The pixels belonging to the odd rows 221, 223 and the even rows 222, 224 may be arranged alternately. That is, the third color pixels 203 may be arranged to be arranged in the middle of the first color pixels 201 and the second color pixels 202 of the adjacent rows. Similarly, the first color pixels 201 and the second color pixels 202 may be arranged as spaces arranged between the third color pixels 203 of adjacent rows.
Fig. 3 is a plan view illustrating a portion of a mask for deposition according to an embodiment. The deposition mask 100 of fig. 3 shows a planar shape of the deposition mask 100 for forming the red organic light emitting layer of fig. 2.
Referring to fig. 2 and 3, the blocking portion BL of the deposition mask 100 may be defined as a portion filled with a substance constituting the deposition mask 100, and the opening portion 140 may be defined as a portion vacated by the substance. The opening portion 140 may be disposed inside the blocking portion BL in a plan view. The opening portion 140 may be surrounded by the blocking portion BL, and the opening portion 140 may have an island shape in a plan view. The opening 140 may have a shape that penetrates a material layer (e.g., a mask substrate) constituting the blocking portion BL in the thickness direction.
The opening part 140 may have a planar shape and an arrangement corresponding to a pattern shape as a deposition object. In the case where the deposition target is a red organic light emitting layer of the display device, the opening 140 of the deposition mask 100 may have substantially the same shape and arrangement as those of a red pixel of the display device of fig. 2 that is desired to be formed. The opening portion 140 may have a substantially rhombic planar shape. Each side of the opening part 140 may extend in a direction inclined with respect to the first and second directions DR1 and DR2 in a plan view. In the deposition mask 100, the opening 140 may not be formed in the region corresponding to the blue pixel and the green pixel of the display device of fig. 2, but may be blocked by the blocking portion BL.
Fig. 4 is a sectional view taken along line IV-IV' of fig. 3. Fig. 4 shows a cross-sectional structure of the deposition mask around the opening. The overall shape of the blocking portion BL in the area around the opening 140 will be described with reference to fig. 3 and 4.
The surrounding area of the opening portion 140 of the blocking portion BL is an area where the blocking portion BL is disposed relatively adjacent to the opening portion 140, and may be, for example, an area located within 3 times the horizontal distance from the edge of the opening portion 140 to the one-side end portion 131 and the other-side end portion 132.
The blocking portion BL may include an inner side surface S3 disposed around each opening portion 140 and one side end portion 131 and the other side end portion 132 as corners facing each opening portion 140. The inner surface S3 may be a surface facing the opening 140 from the blocking portion BL. One side end 131 may be a boundary where the medial side S3 and the one side S1 intersect, and the other side end 132 may be a boundary where the medial side S3 and the other side S2 intersect. The one-side end portion 131 may include a first end portion (refer to '131 _ 1' of fig. 6) and a second end portion (refer to '131 _ 2' of fig. 6). As will be described later.
The opening part 140 may include: a first surface opening 140a, which is a portion located on the side of the one surface S1 of the blocking portion BL (i.e., a portion surrounded by the one-side end portion 131); the second front surface opening 140b is a portion located on the other surface S2 side of the blocking portion BL (i.e., a portion surrounded by the other-side end portion 132).
The size of the first surface opening 140a and the size of the second surface opening 140b may be different. For example, the size of the second surface opening 140b may be larger than the size of the first surface opening 140 a. In the deposition apparatus shown in fig. 1, since the first surface opening 140a is disposed at the upper portion of the deposition mask 100 and the second surface opening 140b is disposed at the lower portion of the deposition mask 100, the deposition substance supplied from the crucible 3 may pass through the second surface opening 140b earlier than the first surface opening 140a in the process of depositing on the objective substrate 200. Accordingly, it is possible to prevent a mask shadow phenomenon by making the size of the second surface opening 140b relatively large, whereby the deposition substance can be uniformly deposited on the object substrate 200.
The one end 131 may protrude toward the center of the opening 140 than the other end 132. The inner surface S3 connecting the one end 131 and the other end 132 may have a shape inclined with respect to the surface S1 in a cross-sectional view. The shape of the inner side surface S3 in the sectional view may be a shape entirely recessed downward, but is not limited to this, and may be variously deformed, such as an upward protruding shape, a linear shape, or the like.
The thickness of the blocking portion BL has a substantially uniform thickness in the region other than the periphery of the opening portion 140, but the thickness thereof may decrease toward the one side end portion 131 side in the section between the other side end portion 132 and the one side end portion 131. In the cross-sectional view, the angle formed by the one surface S1 and the inner surface S3 may be an acute angle at the one end 131, and the angle formed by the other surface S2 and the inner surface S3 may be 90 ° or an obtuse angle at the other end 132. Accordingly, the one-side end portion 131 may have a Tip (Tip) shape. However, not limited thereto, each of the one side end portion 131 and the other side end portion 132 may have an acute angle or an obtuse angle at a boundary intersecting the inner side surface S3.
Fig. 5 is an enlarged view of a region a of fig. 3. Fig. 6 is a sectional view taken along line VI-VI' of fig. 5.
The blocking member constituting the blocking part BL may include a main blocking member 130 and an auxiliary blocking member 160. The main blocking member 130 occupies most of the blocking portion BL. The blocking portion BL in the area around the several openings 140 may be formed only by the main blocking member 130 without the auxiliary blocking member 160. In the peripheral areas of the other opening portions 140, the main blocking member 130 may have a shape in which the tip shape of the one-side end portion 131 is missing. The auxiliary blocking member 160 is disposed on the main blocking member 130 in which the tip shape is missing, so that the tip shape of one side end 131 of the blocking portion BL can be presented together with the main blocking member 130.
The one-side end portion 131 may include a first end portion 131_1 and a second end portion 131_ 2. The first end 131_1 indicates some of the one-side ends 131 of the one-side end 131 of the area around the opening 140, which are formed of the auxiliary blocking member 160, and the second end 131_2 indicates the remaining some of the one-side ends 131 of the area around the opening 140, which are formed of only the main blocking member 130. The tip shape of the first end portion 131_1 may be substantially the same as the tip shape of the second end portion 131_2, but is not limited thereto.
The opening 140 may be divided into a first opening 141 and a second opening 142 according to the type of the blocking member constituting the blocking portion BL in the peripheral region. The first opening portion 141 refers to the opening portion 140 in which the tip shape of the one-side end portion 131 around the corresponding opening portion 140 is configured by the auxiliary blocking member 160 and/or the main blocking member 130, and the second opening portion 142 refers to the opening portion 140 in which the tip shape of the one-side end portion 131 around the corresponding opening portion 140 is configured only by the main blocking member 130 without the auxiliary blocking member 160.
The one-side end 131 of the first opening 141 may be a first end 131_1 formed at least partially including the auxiliary blocking member 160. The remaining portion of the one-side end portion 131 of the first opening portion 141 may be constituted by the main blocking member 130. The one-side end 131 of the second opening 142 may be a second end 131_2 formed only by the main blocking member 130 without the auxiliary blocking member 160.
The auxiliary blocking member 160 in the area around the first opening 141 is in contact with the main blocking member 130. An interface 150 may be formed at a contact surface of the auxiliary blocking member 160 and the main blocking member 130. In the case where the auxiliary blocking member 160 is formed of a different substance from the main blocking member 130, the contact surfaces of the two members may form the interface 150 between the different substances. In several embodiments, the auxiliary blocking member 160 may be composed of the same substance as the main blocking member 130, and in this case, the interface 150 between the same substances may also be observed at the contact surface of the two members according to the difference in the process of forming the two members. However, without being limited thereto, the interface 150 may be formed at the contact surface between the sub auxiliary blocking member 160a, 160b, 160c and the auxiliary blocking member 160 or the contact surface between the plurality of sub auxiliary blocking members 160a, 160b, 160 c. The detailed description thereof will be described later.
In an embodiment, the auxiliary blocking member 160 may be formed in a use of recovering a portion where a tip portion of the deposition mask 100 is damaged during use of the deposition mask 100. For example, if the deposition process is performed using the deposition mask 100 in which the blocking portion BL is composed of only the main blocking member 130, a tip portion around the opening 140 having a relatively thin thickness may be missing due to collision or the like between the deposition mask 100 and the object substrate 200. As such, if the tip portion is missing, the opening shape of the opening portion 140 may be changed to change the shape of the deposition pattern. If the auxiliary blocking member 160 having substantially the same shape as the missing shape is formed on the missing main blocking member 130 of the conventional deposition mask 100 to restore the original tip image of the blocking portion BL, the above-described deposition pattern failure can be prevented. A method of forming the auxiliary blocking member 160 on the missing main blocking member 130 will be described later.
Referring to fig. 5 to 6, the blocking portion BL around the second opening 142 may have the shape of the blocking portion BL described above and be substantially composed of only the main blocking member 130 without including the auxiliary blocking member 160. The blocking portion BL around the first opening 141 may have the shape of the blocking portion BL as a whole. However, the blocking part BL around the first opening part 141 may include not only the main blocking member 130 but also the auxiliary blocking member 160 disposed to contact the main blocking member 130 at a partial area around the opening part 140. The auxiliary blocking member 160 may be disposed around at least a portion of the opening portion 140.
As shown in fig. 3, a plurality of opening portions 140 may be disposed in the deposition mask 100 according to an embodiment. The auxiliary blocking member 160 may be formed around a part of the plurality of openings 140, and the auxiliary blocking member 160 may not be formed around the remaining openings 140. The position and shape of the auxiliary blocking member 160 formed around each opening 140 including the auxiliary blocking member 160 may be varied. For example, the auxiliary blocking member 160 may be formed only in a part of the blocking portion BL around the opening 140, the auxiliary blocking member 160 may be formed in the entire area of the blocking portion BL around the opening 140, and the auxiliary blocking member 160 may be formed at a plurality of positions of the blocking portion BL around one opening 140. Also, the position, shape, size, etc. of the auxiliary blocking member 160 may be formed differently. Also, even if the auxiliary blocking member 160 is the same, the shape of the auxiliary blocking member 160 in a cross-sectional view may be different according to the position and direction of a line taken on a plan view.
The shape of the blocking portion BL around the opening 140 including the auxiliary blocking member 160 and the shape of the blocking portion BL around the opening 140 not including the auxiliary blocking member 160 may be substantially the same regardless of the shape and size of the auxiliary blocking member 160. In one embodiment, the shape of the blocking portion BL around the first opening 141 and the shape of the blocking portion BL around the second opening 142 may be substantially the same.
The auxiliary blocking member 160 according to an embodiment may be an area formed at a tip (or one-side end 131) portion of the blocking part BL, and may include a shape of the tip. The auxiliary blocking member 160 may entirely overlap or partially overlap the inner surface S3 and the surface S1 in the thickness direction. The auxiliary blocking member 160 according to an embodiment may include a face S1 and a one-side end 131 contacting the inner side face S3, and be formed around the one-side end 131.
The auxiliary blocking member 160 may include an auxiliary face 160a, an auxiliary inner side face 160b, and an auxiliary facing face (not shown). The auxiliary face 160a may be a portion of the auxiliary blocking member 160 that faces the substrate in the deposition apparatus of fig. 1 and is in physical contact with the substrate in a state where the substrate and the deposition mask 100 are closely attached. The auxiliary inner side surface 160b may be a portion of the auxiliary blocking member 160 defining a part of the opening 140. Auxiliary medial side 160b and auxiliary face 160a may contact each other and may have an acute angle at the boundary where auxiliary medial side 160b and auxiliary face 160a meet. The auxiliary facing surface (not shown) is located between the auxiliary blocking member 160 and the main blocking member 130, and may be a portion of the auxiliary blocking member 160 that is in physical contact with the main blocking member 130. Accordingly, the auxiliary blocking member 160 may be surrounded by the auxiliary inner side surface 160b, the auxiliary face 160a, and the auxiliary facing surface (not shown).
The main blocking member 130 may include a main face 130a, a main other face S2, a main inner side face 130b, and a main facing face (not shown). The main surface 130a may be a portion of the main blocking member 130 that faces the substrate in the deposition apparatus of fig. 1 and physically contacts the substrate with the substrate and the deposition mask 100 in close contact. The main inner side surface 130b may be a portion of the main blocking member 130 facing the opening 140. The main other surface S2 may be substantially the same as the other surface S2 of the deposition mask 100. A primary facing surface (not shown) is located between the primary blocking member 130 and the secondary blocking member 160, and may be a portion of the primary blocking member 130 that is in physical contact with the secondary blocking member 160.
In the case where the blocking portion BL includes the auxiliary blocking member 160 around the opening 140, the inner side surface S3 may include the auxiliary inner side surface 160b of the auxiliary blocking member 160 and the main inner side surface 130b of the main blocking member 130, and the surface S1 may include the auxiliary surface 160a of the auxiliary blocking member 160 and the main surface 130a of the main blocking member 130. Since the main blocking member 130 may occupy most of the blocking portion BL, the main inner side surface 130b may occupy most of the inner side surface S3 other than the auxiliary inner side surface 160b at the inner side surface S3, and the main surface 130a may occupy most of the surface S1 other than the auxiliary surface 160a at the surface S1. However, since the auxiliary inner side surface 160b may be formed in various shapes, the ratio of the auxiliary inner side surface 160b to the main inner side surface 130b and the ratio of the auxiliary surface 160a to the main surface 130a may be varied in the peripheral region of each opening 140.
In the case where the blocking portion BL does not include the auxiliary blocking member 160 around the opening 140, the surface S1 may be substantially the same as the main surface 130a, and the inner surface S3 may be substantially the same as the main inner surface 130 b.
As described above, the shapes of the blocking portion BL including the auxiliary blocking member 160 and the blocking portion BL not including the auxiliary blocking member 160 may be substantially the same regardless of the presence or absence of the auxiliary blocking member 160 and the shape of the auxiliary blocking member 160 around the opening 140. Therefore, the shape of the face S1 including the auxiliary face 160a and the shape of the face S1 not including the auxiliary face 160a may be substantially the same around all the openings 140. The shape of the inner surface S3 including the auxiliary inner surface 160b and the shape of the inner surface S3 not including the auxiliary inner surface 160b may be substantially the same around all the openings 140. However, without being limited thereto, a step difference may be provided between the auxiliary medial surface 160b and the main medial surface 130b at the boundary where the auxiliary medial surface 160b and the main medial surface 130b meet. In addition, a step may be formed between the auxiliary surface 160a and the main surface 130a at a boundary where the auxiliary surface 160a and the main surface 130a intersect.
In the deposition mask 100, the auxiliary blocking member 160 and the main blocking member 130 may be distinguished from each other in appearance. As shown in fig. 5, when the other surface S2 of the deposition mask 100 is observed above the other surface S2 of the deposition mask 100, the second boundary 150b of the interface 150 can be observed on the inner side surface S3. Therefore, even if the auxiliary blocking member 160 is formed of the same composition as the main blocking member 130 to have the same property, the portion surrounded by the second boundary 150b may be distinguished as the auxiliary blocking member 160. In the case where the auxiliary blocking member 160 is formed of a different composition from the main blocking member 130, since the auxiliary blocking member 160 has different properties of surface roughness, color, etc. from those of the main blocking member 130, it is possible to distinguish the auxiliary blocking member 160 from the main blocking member 130. Also, in the case where the auxiliary blocking member 160 is formed of a different composition from the main blocking member 130, the interface 150 may also exist between the main blocking member 130 and the auxiliary blocking member 160, and the second boundary 150b of the interface 150 may be observed in a plan view, and thus a portion surrounded by the second boundary 150b may be distinguished as the auxiliary blocking member 160.
As described above, in the case where the auxiliary blocking member 160 is formed, the interface 150 may be disposed between the auxiliary facing surface (not shown) of the auxiliary blocking member 160 and the main facing surface (not shown) of the main blocking member 130. The auxiliary facing surface (not shown) of the auxiliary blocking member 160 may be in physical contact with the main blocking member 130, and the auxiliary facing surface (not shown) of the main blocking member 130 may be in physical contact with the auxiliary blocking member 160, and thus the auxiliary facing surface (not shown), the main facing surface (not shown), and the interface 150 may have substantially the same shape, size, and position as each other.
The interface 150 according to an embodiment may overlap the major inner side surface 130b in the thickness direction. However, without being limited thereto, the interface 150 may overlap the auxiliary inner side surface 160b of the auxiliary blocking member 160 in the thickness direction while overlapping the main inner side surface 130b of the main blocking member 130 in the thickness direction, or overlap the auxiliary inner side surface 160b of the auxiliary blocking member 160 in the thickness direction while not overlapping the main inner side surface 130b of the main blocking member 130, a part of the interface 150 may overlap the main inner side surface 130b in the thickness direction, and the remaining part may overlap the auxiliary inner side surface 160b in the thickness direction. Also, in the case where the interface 150 is formed perpendicularly in the thickness direction, it may not overlap with both the main inner side surface 130b and the auxiliary inner side surface 160b in the thickness direction. According to the method of forming the auxiliary blocking member 160, more than two interfaces 150 may be formed at one auxiliary blocking member 160 in a case where it is necessary to repeatedly perform more than two times.
The interface 150 according to an embodiment may be formed in a shape of a curve that is upwardly convex in a sectional view, but is not limited thereto, and the shape of the interface 150 in a sectional view may be various. For example, the curved line may be a straight line, a curve that is concave downward in a cross-sectional view, or a curve having one or more inflection points. Also, in the case where two or more interfaces 150 are formed, the shapes of the interfaces 150 may be different from each other or partially or entirely the same.
Referring to fig. 5 and 6, first boundary 150a may be a portion where interface 150 meets one side S1, and second boundary 150b may be a portion where interface 150 meets inner side S3. In the blocking part BL according to an embodiment, the first boundary 150a may be disposed farther from the center side of the opening part 140 than the second boundary 150b, and the first boundary 150a and the second boundary 150b may be connected. Also, the first boundary 150a may be disposed closer to the center side of the opening portion 140 than the other-side end portion 132. However, it is not limited thereto. Hereinafter, a case where the first boundary 150a is disposed farther from the center side of the opening portion 140 than the second boundary 150b is explained.
A method of manufacturing the deposition mask 100 of fig. 1 to 6 is described below with reference to fig. 7 to 20. Fig. 7 to 20 show a step of supplying the mask member 100R and a step of forming the auxiliary blocking member.
FIG. 7 is a plan view illustrating a portion of a mask component according to an embodiment. Fig. 8 is a cross-sectional view taken along line VIII-VIII' of fig. 7 in order to explain a method of manufacturing a deposition mask according to an embodiment. Fig. 9 is a plan view of the region B of fig. 7. Fig. 7 shows a step of supplying a mask member 100R including a main blocking member and a plurality of opening portions arranged inside the main blocking member. Fig. 8 and 9 illustrate a procedure of classifying the damaged opening 141R and the normal opening 142R.
Referring to fig. 7 to 9, although the mask member 100R is similar to the deposition mask 100 of fig. 1 to 6, the auxiliary blocking member 160 is not included and is composed of only the main blocking member 130, and may include damaged portions in the surrounding regions of several opening portions 140R.
The mask member 100R may include a blocking portion BL (or, a main blocking member 130) and a plurality of opening portions 140R surrounded by the main blocking member 130. The main blocking member 130 of the mask member 100R may include a missing portion 160R, which is not the auxiliary blocking member 160, a main facing surface (not shown), the first and second boundaries 150a and 150b, a missing end surface 150R, a third boundary 150Ra, and a fourth boundary 150 Rb. However, the damaged portion of the mask member 100R may be filled with the auxiliary blocking member 160, in which case the shape of the mask member 100R may be substantially the same as that of the deposition mask 100 of fig. 1 to 6.
The opening 140R may be divided into a damaged opening 141R and a normal opening 142R according to the presence or absence of a missing portion in the peripheral region thereof. The damaged opening portion 141R refers to the opening portion 140R including a missing portion in a peripheral region of the corresponding opening portion 140R, and the normal opening portion 142 refers to the opening portion 140R not including a missing portion in a peripheral region of the corresponding opening portion 140R.
The missing portion 160R may be a portion missing when the main blocking member 130 of the deposition mask 100 is damaged. As described above, the thickness of the deposition mask 100 may decrease from the other side end surface toward the one side end surface in the section between the one side end surface and the other side end surface, and the more the thickness decreases, the more likely it is to be damaged by an external force. Therefore, the missing portion 160R may be formed at a portion where the inner side surface S3 and the one surface S1 overlap in the thickness direction (i.e., a section between the one side end portion 131 and the other side end portion 132), and may be formed mainly around the one side end portion 131 in the section. The auxiliary blocking member 160 may be formed at the missing portion 160R, and the shape, size, and position of the auxiliary blocking member 160 may be substantially the same as those of the missing portion 160R.
The missing end surface 150R may be formed at a portion having the missing portion 160R. The missing end surface 150R may be an end surface formed as a result of a portion of the tip portion of the main blocking member 130 being damaged and falling off. Accordingly, the missing end face 150R may be substantially identical to the main opposing face (not shown) of fig. 1-6. The missing end surface 150R may connect the main inner side surface 130b of the main blocking member 130 and the surface S1. Accordingly, the missing end face 150R may be substantially the same shape, size, and location as the primary facing surface (not shown) (or the interface 150).
The third boundary 150Ra may be a portion where the face S1 meets the missing end face 150R, and the fourth boundary 150Rb may be a portion where the main inner side face 130b meets the missing end face 150R. As described above, since the shapes, sizes, and positions of the missing portion 160R and the missing end surface 150R are substantially the same as those of the auxiliary blocking member 160 and the interface 150 of the deposition mask 100 shown in fig. 1 to 6, the shape and size of the third boundary 150Ra of the mask member 100R may be substantially the same as those of the first boundary 150a of the deposition mask 100. Also, the shape and size of the fourth boundary 150Rb of the mask member 100R may be substantially the same as the shape and size of the second boundary 150b of the deposition mask 100.
Hereinafter, a method of measuring the position and the missing amount of the missing portion 160R for each opening 140R will be described with reference to fig. 8 and 9.
As shown in fig. 8, the mask component 100R may be disposed on a support table, which may be, for example, a magnetic chuck MC. Hereinafter, the support table will be described as a magnetic chuck, but is not limited thereto. The state in which the mask member 100R is disposed on the magnetic chuck MC may be maintained during the process of forming the auxiliary blocking member 160.
The magnetic chuck MC may fix the mask member 100R between the pressing structure 400 and the magnetic chuck MC and support the mask member 100R when performing pressing with the pressing structure 400. The magnetic chuck MC according to an embodiment may be a non-conductive body, but is not limited thereto and may be a conductive body.
Referring to fig. 8 and 9, the position and the amount of defect of the damaged absent portion 160R may be measured using the first detector DT1 and the second detector DT 2. The first detector DT1 may be disposed spaced apart above the other surface S2, and the second detector DT2 may be disposed spaced apart below the one surface S1.
In several embodiments, the first and second detectors DT1 and DT2 may include an image acquisition section. Illustratively, the image acquisition section may include a CCD camera or the like. The first detector DT1 may detect the missing portion 160R by: an image of the mask member 100R is acquired, and data is generated based on the acquired image, and the generated data is compared with reference data that has been stored, or the acquired image is compared with reference images that have been stored, or the like. However, it is not limited thereto.
If detailed, the shape on the plan view of the opening portion 140R including the absent portion 160R sensed by the first detector DT1 may be a different shape from the opening portion 140R not including the absent portion 160R. Not only the other-side end portion 132 and the one-side end portion 131 but also the fourth boundary 150Rb can be observed for the shape on the plan view of the opening portion 140R including the missing portion 160R, but only the other-side end portion 132 and the one-side end portion 131 can be observed for the shape on the plan view of the case of the opening portion 140R not including the missing portion 160R. Therefore, if the shape of the opening portion 140R including the absent portion 160R and the shape of the opening portion 140R not including the absent portion 160R in plan view are compared, the shapes thereof are different from each other, and thus the opening portion 140R including the absent portion 160R can be found.
The first detector DT1 may emit light such as laser light to the mask part 100R during movement in the first direction DR1 and the second direction DR 2. The light emitted from the first detector DT1 may be reflected back to the first detector DT1, and the other surface S2, the main inner side surface 130b, or the magnetic chuck MC may be sensed by measuring the amount of the reflected light. Since the other surface S2 may be relatively flat, the amount of reflected light sensed by the first detector DT1 may be relatively larger than the amount of reflected light that can be sensed from the main inner side surface 130b described later. In contrast, the main inner surface 130b of the blocking portion BL may be formed to be convex downward from the other end 132 to the fourth boundary 150Rb, and when the first detector DT1 emits light toward the main inner surface 130b on the main inner surface 130b, the amount of reflected light that can be sensed by the first detector DT1 may be relatively smaller than the amount of reflected light that can be sensed on the other surface S2. The magnetic chuck MC attached to the lower portion of the mask member 100R may be partially exposed through the opening 140R. Since the exposed surface of the magnetic chuck MC may be relatively flat, in the case where light is emitted toward the magnetic chuck MC from the upper portion of the magnetic chuck MC exposed through the opening portion 140R, the amount of reflected light reflected at the magnetic chuck MC and sensed by the first detector DT1 may be more than the amount of reflected light sensed at the main inner side surface 130 b. Therefore, according to the amount of reflected light sensed by the first detector DT1, the major inner side surface 130b and the magnetic chuck MC can be distinguished, and the horizontal distance of the region being sensed can be measured according to the moving distance of the first detector DT 1.
In one embodiment, by the above method, the horizontal distance from the other-side end 132 to the one-side end 131 may be measured at a portion without the missing portion 160R, and the horizontal distance from the other-side end 132 to the fourth boundary 150Rb may be measured at a portion with the missing portion 160R. However, the horizontal distance from the other end 132 to the fourth boundary 150Rb or the third boundary 150Ra may be measured at a portion where the missing portion 160R exists, depending on the shape of the missing portion 160R.
By comparing the horizontal distance from the other end 132 to the one end 131 with the horizontal distance from the other end 132 to the fourth boundary 150Rb measured by the first detector DT1, the horizontal distance of the missing portion can be calculated from the difference in distance, and the thickness of the blocking portion BL in the vicinity of the opening 140R is substantially the same for each opening 140R, so that the volume of the missing portion can be measured using the measured horizontal distance and the thickness of the blocking portion BL.
However, in the case where the missing portion 160R is measured with only one probe, the amount actually broken and missing and the measured amount of the missing portion 160R may be different from each other. For example, as shown in fig. 8 and 9, in the case where the missing end face 150R overlaps the main inner side face 130b in the thickness direction of the mask member 100R, the portion that the first detector DT1 can sense may only be from the other-side end portion 132 to the fourth boundary 150Rb, and may not be sensed from the fourth boundary 150Rb to the third boundary 150 Ra. Therefore, the second detector DT2 arranged spaced apart below the face S1 is further used, whereby the sensing from the fourth boundary 150Rb to the third boundary 150Ra is also possible. However, in this case, the magnetic chuck MC may be made of a material having good light transmittance, and the light emitted from the second detector DT2 may be reflected from the fourth boundary 150Rb to the third boundary 150Ra, that is, reflected by the missing end surface 150R and sensed again by the second detector DT 2. Also, in the case where the second detector DT2 horizontally moves from the third boundary 150Ra toward the fourth boundary 150Rb, since there is no configuration to reflect light emitted from the second detector DT2 outside the fourth boundary 150Rb, the reflected light may not be sensed by the second detector DT2 outside the fourth boundary 150 Rb. Accordingly, the second detector DT2 may distinguish the sensed region using the amount of reflected light, like the first detector DT 1. The thickness direction distance between the one surface and the missing end surface 150R may be calculated by measuring the distance between the second detector DT2 and the one surface or the missing end surface 150R, and the volume of the missing portion 160R may be calculated using the calculated thickness direction distance and the horizontal distance of the missing end surface 150R. However, the method of calculating the volume of the missing portion 160R is not limited thereto.
Fig. 10 is a sectional view for explaining a method of manufacturing a mask for deposition according to an embodiment. Fig. 11 is a plan view showing an enlarged view of a region B of fig. 7 after the solution is poured (or applied). Fig. 10 and 11 show a step of supplying a solution 300 (or ink) including a substance for an auxiliary blocking member in a region around the damaged opening portion 141R. The position and the appropriate amount of the solution 300 to be put into the auxiliary blocking member 160 will be described with reference to fig. 10 and 11.
In fig. 10 and 11, a solution 300 may be poured into the opening 140R including the absent portion 160R sensed by the method of fig. 8 and 9. The solution 300 being plunged may be on a magnetic chuck MC. The solution 300 may be poured only into the opening portion 140R including the missing portion 160R (i.e., the damaged opening portion 141R) using the dispenser DP, which may move in the horizontal direction in fig. 10. However, the present invention is not limited to this, and other components capable of feeding the solution 300 at different positions may be used in addition to the dispenser DP.
The solution 300 to be charged may include a substance for auxiliary blocking member for forming the auxiliary blocking member 160 of fig. 1 to 6. As will be described later, the method of forming the auxiliary blocking member 160 may be varied, and the type of the auxiliary blocking member substance included in the solution 300 may be varied according to the method of forming the auxiliary blocking member 160. The solution 300 may be, for example, a metal plating solution 310, an electroless metal plating solution 320, a thermosetting solution 330, or a UV curable solution 340.
The amount of the solution 300 to be charged in fig. 10 and 11 may be different depending on the size of the deletion portion 160R. The size of the missing portion 160R may be measured according to the method described above, and an appropriate amount of the solution 300 to be charged into each opening portion 140R may be calculated according to the measured size. Therefore, the larger the size of the missing portion 160R, the more the amount of the solution 300 to be charged into the opening 140R including the corresponding missing portion 160R may be increased.
The position where the solution 300 is put may be adjacent to the portion where the damaged missing portion 160R exists in the opening 140R. That is, the solution 300 may be introduced into the opening 140R including the missing portion 160R at a position biased toward the missing portion 160R with reference to the center line CT passing through the center of the opening 140R. When the solution 300 is introduced adjacent to the damaged absent portion 160R, the solution 300 can easily move to the absent portion 160R in the step of closely adhering the pressing structure 400 and the mask member 100R, which will be described later, and thus the auxiliary blocking member 160 can be more easily formed. However, the solution 300 is not limited to this, and may be put into any position on the magnetic chuck MC in the opening 140R including the damaged absent portion 160R, even if it is not adjacent to the damaged absent portion 160R. Further, the missing portions 160R may be formed at a plurality of positions within one opening 140R, or one missing portion 160R may be formed across the sides of two or more openings 140R, in which case the solution 300 may be fed into the region adjacent to each missing portion 160R or the region adjacent to each side where the missing portion 160R is formed, or the solution 300 may be fed into the center of the opening 140R in an amount corresponding to the entire volume of the missing portion 160R.
Fig. 12 is a sectional view for explaining a method of manufacturing a mask for deposition according to an embodiment. Fig. 13 to 15 are sectional views sequentially showing a state in which the solution moves from the region C to the missing portion of fig. 12. Fig. 12 to 15 illustrate a step of pressurizing the opening portion supplied with the solution 300 by the pressurizing structure. A method of moving the solution 300 charged into the opening 140R to the lacking portion 160R will be described in detail with reference to fig. 12 to 15.
In fig. 12, the upper portions of the mask members 100R may be spaced apart to dispose the pressing structures 400. The pressurization structure 400 according to an embodiment may include a body portion 410 and a protrusion portion 420. A part or the whole of the pressurization structure 400 may be composed of an elastic substance. The pressing structure 400 may have a size to the extent that it can cover all the openings 140R of the mask member 100R. However, the mask member 100R is not limited to this, and may have a size enough to cover only a part of the opening 140R of the mask member 100R. In this case, two or more pressing structures 400 are arranged so as to cover all the openings 140R of the mask member 100R, so that the process described in detail below is not repeated, or is repeated with one pressing member, whereby all the missing portions 160R of the mask member 100R can be recovered.
With the pressurization structure 400 according to an embodiment, the body portion 410 and the protrusion portion 420 may be integrally formed of the same substance as each other, but is not limited thereto, and the body portion 410 and the protrusion portion 420 may be formed of substances having different properties from each other. The pressurization structure 400 according to an embodiment may be an electric conductor, but is not limited thereto and may be a non-electric conductor. Also, without being limited thereto, in the case where the body portion 410 and the protrusion portion 420 are composed of substances having different properties from each other, the body portion 410 may be a non-conductive body and the protrusion portion 420 may be a conductive body.
The body portion 410 may be a portion having a substantially uniform thickness in the pressing structure 400 and to which the protrusion 420 is attached. An upper surface of the body portion 410, which is a surface opposite to the surface facing the mask member 100R, may be flat, and a protrusion portion 420 may be disposed on a lower surface of the body portion 410, which is a surface facing the mask member 100R.
The protrusion 420 is disposed on the lower surface of the body portion 410 of the pressing structure 400, and may be a portion protruding in the thickness direction toward the opening 140R of the mask member 100R. The protrusion part 420 according to an embodiment may be composed of an elastic substance, and may have elasticity. The shape of the protrusion 420 according to an embodiment may correspond to the shape of the opening 140R of the mask member 100R, and the size of the protrusion 420 may be slightly larger than the size of the opening 140R of the mask member 100R. For example, if the shape of the opening portion 140R of the mask member 100R is a shape that is convex downward as a whole and has a curvature, the protruding portion 420 of the pressing structure 400 may also be a shape that is convex downward and has a curvature.
In detail, when the mask member 100R and the magnetic chuck MC are coupled, the opening 140R may include a straight line at a lower portion of the opening 140R. Even if the lower portion of the opening portion 140R includes a straight line shape, the protrusion portion 420 according to an embodiment may not have such a straight line shape, but may have a shape in which the lower portion of the protrusion portion 420 is most protruded toward the opening portion 140R and is entirely protruded downward. In this case, although the portion of the protrusion 420 contacting the major inner side surface 130b of the mask member 100R may have a shape corresponding to the major inner side surface 130b of the mask member 100R, the first direction DR1 and the second direction DR2 of the protrusion 420 may have a size slightly larger than or substantially the same as the radius of the opening 140R. Also, the length of the protrusion 420 extending in the thickness direction of the mask member 100R may be longer than the thickness of the mask member 100R. However, the shape of the protrusion 420 of the pressing structure 400 is not limited thereto. As described above, in the case where the pressing structure 400 has stretchability, the shape of the protrusion 420 may not correspond to the shape of the opening 140R of the mask member 100R.
Referring to fig. 13 to 15, a process of moving the solution 300 to the missing portion 160R as the pressurizing structure 400 pressurizes the mask member 100R will be described in detail.
In fig. 13 to 15, as the pressing structure 400 moves toward the mask member 100R, the protrusion 420 of the pressing structure 400 can be inserted into the opening 140R of the mask member 100R. In this case, since the pressurization structure 400 according to an embodiment may be composed of a substance having elasticity, a shape and a size of a part or the whole of the protrusion 420 inserted into the opening 140R may be deformed to be the same as the shape of the opening 140R. Therefore, in the opening 140R without the missing portion 160R, the protruding portion 420 of the pressing structure 400 and the opening 140R can be in close contact with each other without a floating space. However, even if the pressing structure 400 has elasticity, the opening 140R including the missing portion 160R may not be in close contact with the pressing structure 400 and the mask member 100R in the missing portion 160R and may have a space. The empty space may be surrounded by the protrusion 420, the mask member 100R, and the magnetic chuck MC. When the solution 300 is introduced into the opening 140R including the missing portion 160R, the solution 300 may move to the empty space of the missing portion 160R and fill the empty space while the pressing structure 400 and the mask member 100R are pressed and adhered to each other.
In fig. 14, as the protrusion 420 having elasticity according to an embodiment is inserted into the inside of the opening 140R and the pressurizing structure 400 is continuously pressurized, the lower portion of the protrusion 420 having a curved shape starts to contact the magnetic chuck MC, and the protrusion 420 contacting the magnetic chuck MC may be deformed into a flat shape like the shape of the flat magnetic chuck MC. Therefore, the lower portion of the protrusion 420 and the magnetic chuck MC can be closely attached to each other without a space to be lifted at the portion where they are in contact with each other.
As the protrusion 420 and the magnetic chuck MC are closely attached, the solution 300 put on the magnetic chuck MC may move from the position of putting. Since there is no space for floating at the portion where the protrusion 420 and the magnetic chuck MC are in close contact with each other, the solution 300 put into the portion where the protrusion 420 and the magnetic chuck MC are in close contact with each other can move to the portion where the protrusion 420 and the magnetic chuck MC are not in close contact with each other. Since the protrusion 420 of the pressing structure 400 according to an embodiment is a shape that is convex downward and has a curvature, the middle portions of the first and second directions DR1 and DR2 of the pressing structure 400 may be protruded most downward. Therefore, the protrusion 420 and the magnetic chuck MC can come into contact with and closely contact with the magnetic chuck MC in the vicinity of the center of the opening 140R, and the solution 300 thus introduced can move from the center of the opening 140R to the outside of the opening 140R.
In fig. 15, as the pressing structure 400 and the magnetic chuck MC are continuously pressed, the protrusion 420 of the pressing structure 400 and the magnetic chuck MC in the opening 140R can be completely adhered to each other. At this time, since the size of the protrusion 420 according to an embodiment may be slightly larger than or the same as the size of the opening 140R of the mask member 100R and the protrusion 420 may have elasticity, not only the protrusion 420 and the magnetic chuck MC but also the protrusion 420 and the inner side surface S3 of the mask member 100R are completely in close contact with each other, and thus a vacant space may not exist between the protrusion 420 and the inner side surface S3. Accordingly, as described above, the solution 300 put into the opening 140R moves to the outside of the opening 140R and can move to the missing portion 160R of the mask member 100R. In fig. 15, when the protrusion 420 is completely in close contact with the magnetic chuck MC and the inner surface S3 of the mask member 100R, the missing portion 160R can be filled with the solution 300 to be introduced.
In fig. 15, even in the case where the pressing structure 400 and the mask member 100R are completely pressed and cannot be pressed further, the main body portion 410 of the pressing structure 400 and the other surface S2 of the mask member 100R may be spaced apart from each other according to an embodiment, but not limited thereto, and as the pressing structure 400 and the mask member 100R are pressed, the main body portion 410 of the pressing structure 400 and the other surface S2 of the mask member 100R may physically abut each other.
Fig. 16 is a sectional view for explaining a method of manufacturing a mask for deposition according to an embodiment. Fig. 17 to 19 are enlarged sectional views of a D region in fig. 16. Fig. 16 to 19 show a step of curing the auxiliary blocking member with a substance. Referring to fig. 16 to 19, a process and a method of forming the auxiliary blocking member 160 according to an embodiment are explained in detail.
In fig. 16, the pressing structure 400, the mask member 100R, and the magnetic chuck MC may be maintained in a pressed state by being pressed. As described above, in the case where the protrusion 420 having a shape corresponding to the opening 140R is inserted into the opening 140R including the absent portion 160R and an appropriate amount of the solution 300 is poured into the corresponding opening 140R, the solution 300 may move to the space of the absent portion 160R to fill the corresponding space in a state where the pressing structure 400, the mask member 100R, and the magnetic chuck MC are completely pressed. The solution 300 filling the absent portion 160R may form the auxiliary blocking member 160 by the above-described auxiliary blocking member 160 forming method in a state where the pressing structure 400, the mask member 100R, and the magnetic chuck MC are pressed, and the formed auxiliary blocking member 160 may have the same shape and size as the absent portion 160R. Therefore, the opening 140R including the formed auxiliary blocking member 160 may be the same shape as the opening 140R not including the missing portion 160R. As the solution 300 that is put in is formed as the auxiliary blocking member 160, the interface 150 may be located between the missing end surface 150R and an auxiliary facing surface (not shown) of the auxiliary blocking member 160. Hereinafter, a method of forming the auxiliary blocking member 160 will be described in detail.
Fig. 16 to 19 illustrate a method of forming the auxiliary blocking member 160 by plating according to an embodiment. In one embodiment, the solution 300 to be fed into the opening 140R including the missing portion 160R is a metal plating solution 310, which may be a liquid including metal particles or a resin (resin). The metal particles included in the metal plating solution 310 may be, for example, gold, silver, chromium, zinc, tin, cadmium, nickel, or the like. The magnetic chuck MC according to an embodiment may be a non-conductive body and the pressing structure 400 may be a conductive body. Also, in an embodiment, a portion where the pressing structure 400 as a conductive body and the mask member 100R are in physical contact may be coated with a non-conductive substance. A coating layer CL coated with a non-conductive substance according to an embodiment may be located on the protrusion 420. In this case, even if a voltage is applied to the pressing structure 400 and the mask member 100R for metal plating, a short circuit can be prevented from occurring at a portion where the pressing structure 400 and the mask member 100R are in physical contact.
In an embodiment, a metal plating voltage may be applied to the mask member 100R and the pressurization structure 400. In this case, around the absent portion 160R filled with the metal plating liquid 310, a (-) voltage may be applied to the mask member 100R, and a (+) voltage may be applied to the pressurized structure 400. Accordingly, a current can flow between the mask member 100R and the pressing structure body 400. Since the metal particles included in the metal plating liquid 310 have a (+) voltage, they can move in the direction of the mask part 100R to which the (-) voltage is applied. The metal particles moving in the direction of the mask member 100R may obtain electrons from the mask member 100R to metal-plate the missing end surface 150R of the mask member 100R to form the auxiliary blocking member 160.
Referring to fig. 18 and 19, in the case where the auxiliary blocking member 160 is formed by the plating method according to an embodiment, the auxiliary blocking member 160 may include a plurality of sub-auxiliary blocking members 160a, 160b, 160 c. The auxiliary blocking member 160 according to an embodiment may include a first sub-auxiliary blocking member 160a, a second sub-auxiliary blocking member 160b, and a third sub-auxiliary blocking member 160 c. However, not limited thereto, the sub auxiliary blocking member may be two or more. Although each sub auxiliary blocking member 160a, 160b, 160c is formed in the missing portion 160R, it may be smaller than the size of the auxiliary blocking member 160. Also, the shape of each sub auxiliary blocking member 160a, 160b, 160c may be different from the shape of the auxiliary blocking member 160. Therefore, in order to form the auxiliary dam member 160 having the same size and shape as the absent portion 160R, the metal plating process may be performed two or more times. After the metal plating process is performed twice or more, the missing portion 160R may be completely filled with the plurality of sub auxiliary blocking members 160a, 160b, and 160 c. In this case, the overall shape of the plurality of sub auxiliary blocking members 160a, 160b, 160c may be substantially the same as the shape of the auxiliary blocking member 160. In the metal plating performed after the initial metal plating, the metal plating may be performed using the new metal plating solution 310 without using the metal plating solution 310 used in the initial metal plating, and in the case of using the new metal plating solution 310, the processes of fig. 8 to 15 may be repeated.
The material and composition of the metal plating liquid 310 used in the metal plating of a plurality of times may be different from each other, and the substances forming the sub auxiliary blocking members 160a, 160b, 160c may be different from each other. In the case where a plurality of sub auxiliary blocking members 160a, 160b, 160c are formed, a part or all of the respective sub auxiliary blocking members 160a, 160b, 160c may be formed of the same substance as each other. Also, since the auxiliary blocking member 160 may be formed of the same substance as the main blocking member 130, a part or all of the plurality of sub-auxiliary blocking members 160a, 160b, 160c may be formed of the same substance as the main blocking member 130. However, it is not limited thereto.
When a plurality of sub auxiliary blocking members 160a, 160b, and 160c are formed in the missing portion 160R, two or more interfaces 150 included in the opening 140R may be provided. The plurality of interfaces 150, 150a, 150b may be formed not only between the mask member 100R and the sub auxiliary blocking members 160a, 160b, 160c but also between the sub auxiliary blocking members 160a, 160b, 160c adjacent to each other.
Fig. 20 is a sectional view for explaining a method of manufacturing a mask for deposition according to an embodiment. A process of separating the deposition mask 100, in which the auxiliary blocking member 160 is formed and the missing portion 160R is restored, from the magnetic chuck MC and the pressing structure 400 and subsequent steps will be described with reference to fig. 20.
Fig. 20 shows the mask member 100R in which the missing portions 160R included in the openings 140R in fig. 8 are all restored by the auxiliary blocking member 160. In the case where the absent portion 160R is all restored with the auxiliary blocking member 160 through the processes of fig. 8 to 19, the pressing structure 400 pressed against the mask member 100R and the magnetic chuck MC may be separated.
Cleaning may be performed if desired. Although not shown, in the process of moving the solution 300 in fig. 13 to 15, the solution 300 may be moved to other portions than the missing portion 160R, and metal plating may be performed on other portions than the missing portion 160R through the process of forming the auxiliary blocking member 160 in fig. 16 to 19. In the case where the other portion than the absent portion 160R is subjected to metal plating, it may be removed by laser or the like.
Other embodiments related to the deposition mask 100 and the method of manufacturing the deposition mask 100 will be described below. In the following embodiments, the description of the same configurations as those of the previously described embodiments is omitted or simplified, and the differences are mainly described.
Fig. 21 to 24 are sectional views of a mask member according to other embodiments and enlarged sectional views around a missing portion. Fig. 21 to 24 show, for example, that the magnetic chucks MC _21 and MC _23 may be electrically conductive, and the pressing structure 400 may be electrically conductive or non-conductive.
Fig. 21 and 22 show an example in which the magnetic chuck MC _21 coupled to the mask member 100R may be a conductive body, and the pressing structure 400 may be a conductive body. That is, unlike an embodiment, the magnetic chuck MC _21 according to another embodiment may be a conductive body, according to which the configuration of applying a voltage and the coated region may be changed.
In another embodiment, a metal plating voltage may be applied between the pressing structure 400 and the mask part 100R, and between the mask part 100R and the magnetic chuck MC _ 21. Between the pressurization structure 400 and the mask member 100R, a (+) voltage may be applied to the pressurization structure 400, and a (-) voltage may be applied to the mask member 100R. Further, between mask component 100R and magnetic chuck MC _21, a (+) voltage may be applied to magnetic chuck MC, and a (-) voltage may be applied to mask component 100R.
In another embodiment, since the pressing structure 400, the mask part 100R, and the magnetic chuck MC _21 are all electrically conductive, the portions of the pressing structure 400 and the mask part 100R, the mask part 100R and the magnetic chuck MC _21, and the pressing structure 400 and the magnetic chuck MC _21, which are in physical contact, may be coated with a non-conductive substance. The overcoat layer CL _21 may be on the protrusion 420 and the magnetic chuck MC _ 21. In this case, it is possible to prevent a short circuit caused by physical contact between the pressing structure body 400 and the mask member 100R, the mask member 100R and the magnetic chuck MC _21, and the pressing structure body 400 and the magnetic chuck MC _ 21.
Fig. 23 and 24 illustrate that the magnetic chuck MC _23 coupled to the mask member 100R may be an electrically conductive body, and the pressing structure body 400_23 may be an electrically non-conductive body. That is, unlike an embodiment, the magnetic chuck MC _23 may be an electric conductor, and the pressing structure 400_23 may be an electric non-conductor. Accordingly, the location of the applied voltage and the area to be coated can be varied.
In yet another embodiment, a voltage may be applied between mask component 100R and magnetic chuck MC _ 23. In this case, of the voltages applied between mask component 100R and magnetic chuck MC _23, a (+) voltage is applied to magnetic chuck MC _23 and a (-) voltage is applied to mask component 100R.
In yet another embodiment, because mask component 100R and magnetic chuck MC _23 are electrically conductive, the portions of mask component 100R and magnetic chuck MC _23 that are in physical contact can be coated with a non-conductive substance. The overcoat layer CL _21 may be on the magnetic chuck MC _ 23. In this case, a short circuit due to physical contact between mask component 100R and magnetic chuck MC _23 can be prevented.
Fig. 25 to 27 are sectional views of mask members according to still another embodiment. The embodiments of fig. 25 to 27 show an example in which the solution 300 to be put into the opening 140R may not be the metal plating solution 310 containing metal particles.
Fig. 25 illustrates that the solution 300 to be put into the opening 140R may be an electroless metal plating solution 320. Unlike an embodiment, nickel, copper, etc. may be included in the electroless metal plating solution 320. The electroless metal plating solution 320 to be fed may contain a reducing agent such as formaldehyde or hydrazine. In this case, no voltage may be applied between the pressing structure 400, the mask member 100R, and the magnetic chuck MC, and the reducing agent may supply electrons to reduce metal ions into metal molecules, and this reaction may occur at the absent end surface 150R of the mask member 100R. Although not limited thereto, in the case where the auxiliary blocking member 160 is formed through an electroless plating process, a plurality of sub-auxiliary blocking members may be formed. Since this is already described in detail, redundant description is omitted.
Fig. 26 and 27 show that the solution 300 to be put into the opening 140R may be a thermosetting solution 330 or a UV curable solution 340, for example. The thermosetting solution 330 or the UV curable solution 340 may include a thermosetting substance and a UV curable substance, respectively. Unlike the embodiment, in the case where the thermosetting solution 330 or the UV curable solution 340 is injected, no voltage may be applied between the pressing structure 400, the mask member 100R, and the magnetic chuck MC. Therefore, the mask member 100R, the pressurization structure 400, and the magnetic chuck MC according to still another embodiment may not include a coating for preventing a short circuit. Also, in the case of forming the auxiliary blocking member 160 using the thermosetting solution 330 or the UV curable solution 340, it may be formed through a single process without being repeatedly performed.
In fig. 26, heating may be performed in a state where the pressing structure body 400 and the mask member 100R are pressed as one embodiment. Since the thermosetting solution 330 is surrounded by the pressurized structure 400, the mask member 100R, and the magnetic chuck MC, direct heating may not be possible. Therefore, the magnetic chuck MC may be a substance having high thermal conductivity. In this case, heat supplied from the outside may be transferred to the thermosetting solution 330 through the magnetic chuck MC, and the thermosetting solution 330 may be cured in the same state as the size and shape of the absent portion 160R. And in the case where the pressurization structure body 400, the magnetic chuck MC, and the mask member 100R are heated, if the shapes thereof are changed, the auxiliary blocking member 160 may not be formed to be the same as the shape of the absent portion 160. Therefore, the pressing structure 400, the magnetic chuck MC, and the mask member 100R may be a substance whose shape is not changed by heat. In this case, the thermosetting substance may be cured in the same state as the size and shape of the absent portion 160R to form the auxiliary blocking member 160 and repair the absent portion 160R.
In fig. 27, as an example, UV light may be irradiated to the UV curable solution 340 in a state where the pressing structure 400 and the mask member 100R are pressed. Since the UV curable solution 340 is surrounded by the pressing structure 400, the magnetic chuck MC, and the mask member 100R, the magnetic chuck MC and/or the pressing structure 400 may be a light transmissive substance in the case of irradiating UV light. When the magnetic chuck MC and/or the pressing structure 400 is a translucent material, UV light can reach the UV curable solution 340 located in the missing portion 160R. Accordingly, the UV curable solution 340 may be cured in the same state as the size and shape of the absent portion 160R to form the auxiliary blocking member 160, thereby repairing the absent portion 160R.
Although the embodiments of the present invention have been described with reference to the drawings, those having ordinary skill in the art to which the present invention pertains will appreciate that the present invention may be embodied in other specific forms without changing the technical spirit or essential characteristics of the present invention. The embodiments described above are therefore to be considered in all respects as illustrative and not restrictive.
Claims (10)
1. A mask for deposition, comprising:
a blocking part including a main blocking member and an auxiliary blocking member; and
a plurality of opening portions disposed inside the blocking portion and including a first opening portion and a second opening portion;
wherein the blocking portion includes: one side; the other surface is opposite to the one surface; an inner surface exposed to the opening; a lateral end portion located at an intersection of the face and the medial face and comprising an acute pointed shape; and another side end portion located at an intersection of the other side and the inner side surface,
the one-side end portion of the blocking portion around the first opening includes a first end portion including the auxiliary blocking member.
2. The deposition mask according to claim 1,
the auxiliary blocking member of the first end portion is disposed on the main blocking member.
3. The deposition mask according to claim 2,
the one-side end portion of the blocking portion around the second opening portion includes a second end portion configured to include the main blocking member without the auxiliary blocking member,
the shape of the primary blocking member of the first end portion is different from the shape of the primary blocking member of the second end portion,
the shape of the auxiliary blocking member and the main blocking member of the first end portion combined is the same as the shape of the main blocking member of the second end portion.
4. The deposition mask according to claim 2,
the auxiliary blocking member and the main blocking member of the first end portion are in direct contact with each other, and an interface is formed at a contact surface.
5. The deposition mask according to claim 2,
the auxiliary blocking member of the first end portion includes a plurality of sub-auxiliary blocking members distinguished by an interface.
6. The deposition mask according to claim 1,
the inner side surface of the blocking portion is constituted by an auxiliary inner side surface of the auxiliary blocking member and a main inner side surface of the main blocking member.
7. A method of manufacturing a deposition mask, comprising the steps of:
supplying a mask member including a main blocking member and a plurality of opening portions arranged inside the main blocking member; and
an auxiliary blocking member is formed on the main blocking member around at least a part of the opening.
8. The manufacturing method of a mask for deposition according to claim 7, wherein,
the opening portion includes a normal opening portion and a damaged opening portion, the step of forming the auxiliary blocking member is a step of forming the auxiliary blocking member on the main blocking member around the damaged opening portion,
the step of forming the auxiliary blocking member is a step of forming a shape of the damaged opening portion in the same manner as a shape of the normal opening portion.
9. The manufacturing method of a deposition mask according to claim 8, wherein,
the step of forming the auxiliary blocking member includes the steps of:
a step of disposing the mask member on a support table and supplying ink including a substance for auxiliary blocking member into the damaged opening portion;
pressurizing the opening portion to which the ink is supplied by a pressurizing structure having a three-dimensional shape of the opening portion and including an elastic substance; and
curing the auxiliary blocking member with a substance.
10. The manufacturing method of a deposition mask according to claim 9,
the substance for the auxiliary blocking member includes a metal,
the step of curing the substance for auxiliary blocking member is performed through a metal plating process.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190079080A KR20210003969A (en) | 2019-07-02 | 2019-07-02 | Mask for deposition and method of fabricating the same |
| KR10-2019-0079080 | 2019-07-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112176280A true CN112176280A (en) | 2021-01-05 |
Family
ID=73919845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010243216.6A Pending CN112176280A (en) | 2019-07-02 | 2020-03-31 | Mask for deposition and method for manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20210003969A (en) |
| CN (1) | CN112176280A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230016733A (en) | 2021-07-26 | 2023-02-03 | 삼성디스플레이 주식회사 | Mask and deposition apparatus including the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017088936A (en) * | 2015-11-05 | 2017-05-25 | 凸版印刷株式会社 | Vapor deposition mask, repairing method for mask base material, and repairing apparatus for mask base material |
| JP2018044219A (en) * | 2016-09-15 | 2018-03-22 | 凸版印刷株式会社 | Repair apparatus for metal mask for vapor deposition and repair method for metal mask for vapor deposition |
| CN108779550A (en) * | 2016-03-29 | 2018-11-09 | 株式会社V技术 | The restorative procedure of film formation mask, its manufacturing method and film formation mask |
-
2019
- 2019-07-02 KR KR1020190079080A patent/KR20210003969A/en active Search and Examination
-
2020
- 2020-03-31 CN CN202010243216.6A patent/CN112176280A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017088936A (en) * | 2015-11-05 | 2017-05-25 | 凸版印刷株式会社 | Vapor deposition mask, repairing method for mask base material, and repairing apparatus for mask base material |
| CN108779550A (en) * | 2016-03-29 | 2018-11-09 | 株式会社V技术 | The restorative procedure of film formation mask, its manufacturing method and film formation mask |
| JP2018044219A (en) * | 2016-09-15 | 2018-03-22 | 凸版印刷株式会社 | Repair apparatus for metal mask for vapor deposition and repair method for metal mask for vapor deposition |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210003969A (en) | 2021-01-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11502269B2 (en) | Light-emitting device with auxiliary electrode and adjacent insular conductive portions | |
| CN100489637C (en) | Component and method for an electro-optic display | |
| CN108118289B (en) | Mask for deposition and method of manufacturing the same | |
| US10858726B2 (en) | Vapor deposition mask, vapor deposition mask manufacturing method , and organic semiconductor element manufacturing method | |
| EP3346499B1 (en) | Lighting apparatus using organic light emitting diode and method of fabricating the same | |
| JP2019078685A (en) | Led chip inspection method, inspection device therefor, and led display manufacturing method | |
| KR102691002B1 (en) | Mask for deposition, manufacturing method of the same | |
| JP6681739B2 (en) | Method for manufacturing shadow mask and method for manufacturing display device | |
| US20120227260A1 (en) | Radiation detector using gas amplification and method for manufacturing the same | |
| KR102688092B1 (en) | Detection device and method for micro light emitting diode | |
| JP2011086413A (en) | Transparent conductive film for display electrode | |
| CN112176280A (en) | Mask for deposition and method for manufacturing the same | |
| CN217230904U (en) | Vapor deposition mask, vapor deposition mask device, and vapor deposition device | |
| KR20160145607A (en) | Deposition mask, method for producing deposition mask, and method for producing touch panel | |
| CN102790011A (en) | Method of repairing organic el display | |
| US20150301240A1 (en) | Method for repairing display substrate, display substrate and display apparatus | |
| TW451599B (en) | Organic electro luminescent display panel and manufacturing method thereof | |
| TW200537977A (en) | Display device and method and apparatus of manufacturing the same | |
| US4516053A (en) | Flat panel display apparatus | |
| US20120138352A1 (en) | Substrate for electrical component and method | |
| JP2020026553A (en) | Vapor deposition mask, and vapor deposition mask manufacturing method | |
| EP2555595B1 (en) | Organic el panel and method for manufacturing same | |
| CN111668205A (en) | Display device and method for manufacturing display device | |
| TW201718275A (en) | Screen plate and method of manufacturing the same | |
| CN111192980A (en) | Mask and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |