CN112163392A - Automatic generation method, medium and equipment for packaging substrate processing file - Google Patents
Automatic generation method, medium and equipment for packaging substrate processing file Download PDFInfo
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- CN112163392A CN112163392A CN202010853694.9A CN202010853694A CN112163392A CN 112163392 A CN112163392 A CN 112163392A CN 202010853694 A CN202010853694 A CN 202010853694A CN 112163392 A CN112163392 A CN 112163392A
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Abstract
The invention relates to the technical field of packaging substrates, and discloses an automatic generation method, a medium and equipment for a microwave assembly packaging substrate processing file, wherein the method provided by the invention comprises the following steps: step 1: loading a design file of the packaging substrate; step 2: identifying design elements in the design file to obtain entity elements corresponding to the substrate type; and step 3: analyzing the obtained entity element information; and 4, step 4: and writing entity element information according to the type of the packaging substrate and generating a processing file. Based on the method, a complete processing file can be obtained; the method is compatible with the current substrate process flow, can obviously improve the efficiency and the accuracy of generating the processing file, and reduces the dependence on the manual experience.
Description
Technical Field
The invention relates to the technical field of packaging substrates, in particular to an automatic generation method, medium and equipment for a microwave assembly packaging substrate processing file.
Background
In the packaging substrate processing industry, a general process for generating a processing file is to complete the manufacturing of a design file in circuit board drawing software such as protein, aluminum Designer, Allegro and the like, then manually classify, package and manufacture a required optical drawing gerber file and a drl file for drilling, create a folder to obtain the processing file, and further revise and format-adjust the processing file by a process builder before processing so as to meet the requirements of processing equipment. The processing file generation has large workload and high error rate, and cannot meet the processing and application requirements of the high-density packaging substrate. The prior art can not extract the whole element information of the microwave assembly packaging substrate processing and automatically generate the processing file, or has the problem of still depending on manual secondary revision after the processing file is generated.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the existing problems, the automatic generation method, medium and equipment for the microwave assembly packaging substrate processing file are provided, so that the integrated packaging and automatic generation of all-element information required by substrate processing are realized, and a complete processing file can be obtained based on the method; the method is compatible with the current substrate process flow, can obviously improve the efficiency and the accuracy of generating the processing file, and reduces the dependence on the manual experience.
The technical scheme adopted by the invention is as follows: an automatic generation method of a microwave assembly packaging substrate processing file comprises the following steps:
step 1: loading a design file of the packaging substrate;
step 2: identifying design elements in the design file to obtain entity elements corresponding to the substrate type;
and step 3: analyzing the obtained entity element information;
and 4, step 4: and writing entity element information according to the type of the packaging substrate and generating a processing file.
Further, the design file includes substrate layout information required for processing corresponding to the substrate type; the design file is designed and generated by adopting general computer aided design software, and the manufactured rule of the design file is checked to be in accordance with the processing and manufacturing process specification.
Further, the design elements include conductor patterns, dielectrics, holes, cavities and pads.
Further, the step 2 further comprises: and naming and defining the entity elements obtained after identification by adopting a specified code, and taking the code as a main basis for identifying the processed entity elements.
Further, the step 3 comprises:
analyzing the entity elements in the design file to form a layer information data block, a graph information data block, a processing method data block and other required data blocks according to the entity element codes in the step 2;
the information of the entity elements which can be directly obtained in the design file is directly read, and the information which can not be directly obtained is obtained from the name of the code of the entity element.
Further, the step 4 comprises:
storing the layer information, the graphic information, the processing method and other required data blocks obtained by analyzing in the step 3 into a processing file in a structured mode;
the storage process adopts a configuration file to carry out screening, if the screening conditions are met, the layer information, the graphic information, the processing method and other required data blocks obtained by analysis are written into a processing file, and if the layer information, the graphic information, the processing method and other required data blocks are not met, abnormal information is prompted;
and (3) confirming and correcting abnormal information in the entity element information, returning to the step (2) to modify and supplement the entity element information, and repeating the step (3) after modifying and supplementing according to the substrate type requirement.
Further, the abnormality information includes information that is required when the document is processed but an entity element is missing in the design document.
Further, the configuration file is obtained according to the type of the packaging substrate, and is used for screening data to be written into the processing file and restricting the integrity and the compliance of the data written into the processing file, and the configuration file contents of different substrate types are different.
The invention also provides a readable storage medium, on which a computer program is stored, which, when executed by a processor, implements a microwave component package substrate processing file and an automatic generation method as claimed in any one of claims 1 to 8.
The present invention also provides an automatic generation apparatus for a microwave assembly package substrate processing document, comprising:
a memory for storing a computer program;
a processor for implementing the microwave component package substrate processing file and the automatic generation method as claimed in any one of claims 1 to 8 when executing the computer program.
Compared with the prior art, the beneficial effects of adopting the technical scheme are as follows: the invention relates to an automatic generation method, medium and equipment of a microwave assembly packaging substrate processing file, which can automatically generate a complete processing file which contains element information required by substrate processing and meets the identification requirement of processing elements. The automatic generation method of the processing file has good flexibility and compatibility, can realize the identification of the processing elements corresponding to various substrates in a file configuration mode, and can automatically generate the processing file with complete elements by analyzing the design file.
Drawings
Fig. 1 is a schematic flow chart of an automatic generation method of a microwave package substrate processing file according to an embodiment of the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The embodiment of the invention provides an automatic generation method of a package substrate processing file, as shown in fig. 1, comprising the following steps: loading a design file of a packaging substrate, obtaining the design in the design file, analyzing entity element information, writing the entity information in a matching way according to a configuration file, generating a processing file and other main links, wherein the main implementation steps are as follows:
s1, loading the design file of the packaging substrate:
the design file is a Package substrate design data packet based on EDA software, the EDA software for Package substrate design comprises Cadence SiP Layout, Mentor xprediation, and Sigrity Unified Package Designer, and the design file contains substrate Layout information corresponding to the substrate type, and comprises substrate, conductor, medium, hole and other entity elements and necessary design information required by processing.
The substrate type may be one of a substrate based on a sintering process (e.g., a low temperature co-fired ceramic substrate, a high temperature co-fired ceramic substrate), a substrate based on a sputtering process (e.g., a thin film ceramic substrate), a substrate based on a printing sintering process (e.g., a thick film substrate), and a substrate based on a lamination process (e.g., a microwave printed substrate).
Wherein the processing requirements for the holes and substrate in the design file are indicated by a name code. Machining requirements for the holes, with suffixes in the respective hole codes, adding a suffix _ RF ' to the radio shield hole, a suffix _ CE ' to the electrical connection hole, a suffix _ TE ' to the thermal conduction via, a suffix _ Metal ' to the metalized hole, a suffix _ nonim ' to the unmetallized hole, a suffix _ screen ' to the Screw hole, and a suffix _ Metal s ' to the solid plated hole; for the substrate processing requirements, suffixes are provided on the codes of the corresponding substrate stacks, and numerical control processing adds suffix 'CNC', and Laser processing adds suffix 'Laser'.
S2, acquiring design elements in the design file:
identifying all design elements of the design file loaded in the EDA software to acquire entity elements corresponding to the substrate type; the identified design elements include: conductor patterns, dielectrics, holes, cavities and pads.
And renaming and mapping each identified design element by adopting a specified code, and taking the code as a main basis for identifying the entity elements of the processing file, wherein the naming code mapping rule of each substrate entity element is as follows:
s3, analyzing the entity element information:
and analyzing the entity elements in the design file according to the entity elements and the codes acquired in the step S2 to acquire a layer information data block, a graphic information data block, a processing method data block and other required data blocks. The entity elements needing to be analyzed comprise: substrate stack, conductor, dielectric, resistor, pad, hole.
The layer information data block comprises z-direction relative position information of an entity element;
wherein the z-direction is normal to the plane of the package substrate.
The graphic information data block comprises the relative coordinate position of the entity element of each layer on the substrate plane and the parameter attribute information of the entity element;
the parameter attribute of each entity element should be completely contained according to the requirement of the self condition, and the possible parameter attributes of the entity elements are as follows: shape, line width, spacing, type, aperture, metallization requirements, plane size, font size, square resistance, accuracy requirements, legend representation, and the like;
the processing method data block comprises edge metallization requirements related to the edge of the substrate, optional processing modes related to the surface of the substrate, processing modes related to the shape of the substrate and processing modes related to hole forming;
the other requirement data block has the storage characteristic of variable size and is used for storing special requirements of different substrate types on processing, such as substrate back processing requirements, pad on-off testing requirements, substrate surface processing requirements and other processing requirements unique to different types of substrates.
S4, writing the entity information in a matching way according to the substrate type, and generating a processing file:
storing the layer information, the graphic information, the processing method and other required data blocks analyzed by the S3 into a processing file in a structured mode;
the storage process carries out screening according to the configuration files, different substrate types have corresponding configuration files, the information is written into the processing file when the screening conditions are met, otherwise abnormal information is prompted, and the abnormal information comprises information which is needed by the processing file but is lost by entity element objects in the design file, such as the processing mode of holes is lost or the type of the holes is not matched with the type of the substrate; the processing mode of the plate shape is lost, and the processing mode is not matched with the type of the substrate.
And confirming and correcting abnormal information in the acquired entity element information, returning to the step two to modify and complement the entity element information, and repeating the step three.
The configuration file is an array sequence which is composed of 0 and 1 digits and has a fixed digit length, wherein 1 represents that the entity element information of the data bit is selected and the entity element information matching of the corresponding data bit is executed, if the matching is successful, the data bit is written into the data block corresponding to the processing file, and 0 represents that the data content is not written.
Screening data to be written into a processing file according to a configuration file to ensure the integrity and compliance of the data written into the processing file, for example, the low-temperature co-fired ceramic substrate does not comprise pad layer data, encapsulation layer data and through hole layer data, the thick film substrate does not comprise lead data and upper and lower surface solder mask layer data, the thin film ceramic substrate does not comprise leads, pads, upper and lower surface solder mask layers and upper and lower surface character layer data, and the microwave printed substrate does not comprise resistors, a back stratum, a pad layer, an encapsulation layer and a through hole layer;
this step can be implemented by performing a secondary development or additional development process on the EDA software for implementing S3 through S4-4.
In addition, the present embodiment further provides a readable storage medium, where a computer program is stored, and when the computer program is executed by a processor, the microwave component package substrate processing file and the automatic generation method in the present embodiment are implemented.
In addition, this embodiment also provides an automatic generation device for microwave component package substrate processing files, and the device includes: a memory for storing a computer program; the processor is configured to implement the microwave device package substrate processing file and the automatic generation method in the embodiment when executing the computer program.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed. Those skilled in the art to which the invention pertains will appreciate that insubstantial changes or modifications can be made without departing from the spirit of the invention as defined by the appended claims.
Claims (10)
1. An automatic generation method for a microwave assembly packaging substrate processing file is characterized by comprising the following steps:
step 1: loading a design file of the packaging substrate;
step 2: identifying design elements in the design file to obtain entity elements corresponding to the substrate type;
and step 3: analyzing the obtained entity element information;
and 4, step 4: and writing entity element information according to the type of the packaging substrate and generating a processing file.
2. The method according to claim 1, wherein the design file includes layout information of a substrate required for processing corresponding to a type of the substrate; the design file is designed and generated by adopting general computer aided design software, and the manufactured rule of the design file is checked to be in accordance with the processing and manufacturing process specification.
3. The method of claim 1, wherein the design elements comprise conductor patterns, dielectrics, holes, cavities and pads.
4. The method of claim 1, wherein the step 2 further comprises: and naming and defining the entity elements obtained after identification by adopting a specified code, and taking the code as a main basis for identifying the processed entity elements.
5. The method of claim 1, wherein the step 3 comprises:
analyzing the entity elements in the design file to form a layer information data block, a graph information data block, a processing method data block and other required data blocks according to the entity element codes in the step 2;
and directly reading the entity element information which can be directly acquired in the design file, and acquiring the information which cannot be directly acquired from the code of the entity element.
6. The method of claim 5, wherein the step 4 comprises:
storing the layer information, the graphic information, the processing method and other required data blocks obtained by analyzing in the step 3 into a processing file in a structured mode;
the storage process adopts a configuration file to carry out screening, if the screening conditions are met, the layer information, the graphic information, the processing method and other required data blocks obtained by analysis are written into a processing file, and if the layer information, the graphic information, the processing method and other required data blocks are not met, abnormal information is prompted;
and (3) confirming and correcting abnormal information in the entity element information, returning to the step (2) to modify and supplement the entity element information, and repeating the step (3) after modifying and supplementing according to the substrate type requirement.
7. The method as claimed in claim 6, wherein the anomaly information includes information required for processing the document but missing physical elements in the design document.
8. The method as claimed in claim 6, wherein the configuration file is obtained according to the type of the package substrate, and the configuration file is used for screening the data to be written into the processing file and restricting the integrity and compliance of the data written into the processing file, and the configuration file contents of different substrate types are different.
9. A readable storage medium having stored thereon a computer program which, when executed by a processor, implements a microwave component package substrate processing file and an automatic generation method as claimed in any one of claims 1 to 8.
10. An automatic generation device for a microwave assembly packaging substrate processing file is characterized by comprising:
a memory for storing a computer program;
a processor for implementing the microwave component package substrate processing file and the automatic generation method as claimed in any one of claims 1 to 8 when executing the computer program.
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