CN112151556B - Display panel, display device and preparation method of display panel - Google Patents
Display panel, display device and preparation method of display panel Download PDFInfo
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- CN112151556B CN112151556B CN202011041420.6A CN202011041420A CN112151556B CN 112151556 B CN112151556 B CN 112151556B CN 202011041420 A CN202011041420 A CN 202011041420A CN 112151556 B CN112151556 B CN 112151556B
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- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 149
- 229910052751 metal Inorganic materials 0.000 claims abstract description 149
- 238000005452 bending Methods 0.000 claims abstract description 80
- 239000012530 fluid Substances 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000010410 layer Substances 0.000 claims description 293
- 239000011241 protective layer Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 208000010392 Bone Fractures Diseases 0.000 abstract description 9
- 206010017076 Fracture Diseases 0.000 abstract description 9
- 239000010408 film Substances 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the invention provides a display panel, a display device and a preparation method of the display panel. The display panel includes: a substrate; a driving device layer provided with a substrate and located in the display region, the driving device layer including a driving circuit; the metal wiring layer is positioned in the bending area and comprises a metal wire, and the metal wire and the driving circuit are electrically connected with each other; and the non-Newtonian fluid layer is positioned in the bending region and is arranged between the metal wiring layer and the substrate. The embodiment of the invention can improve the stress concentration of the bending part of the metal wire, reduce the fracture risk of the metal wire and improve the yield of the display panel.
Description
Technical Field
The invention relates to the technical field of display equipment, in particular to a display panel, a display device and a preparation method of the display panel.
Background
Along with the continuous update of display module technology, small-size panels are gradually developing towards light and thin, high screen occupation ratio, ultra-narrow frame and even frame-free. The display panel of the conventional structure generally includes a display area and a non-display area located at a peripheral side of the display area, the non-display area being used for arranging and binding the flexible circuit. The non-display area needs to be folded to the back of the display panel, and when the metal film layer in the non-display area is folded, the stress is concentrated in the folding area, so that the metal wires are broken, and the yield of the display panel is reduced.
Therefore, a new display panel, a display device and a method for manufacturing the display panel are needed.
Disclosure of Invention
The embodiment of the invention provides a display panel, a display device and a preparation method of the display panel, aiming at solving the problem that the frame of the display panel is too wide.
In one aspect, an embodiment of the present invention provides a display panel having a display area and a bending area located at least one side of the display area, the display panel including: the substrate is arranged in the display area and the bending area; a driving device layer provided with a substrate and located in the display region, the driving device layer including a driving circuit; the metal wiring layer is positioned in the bending area and comprises a metal wire, and the metal wire and the driving circuit are electrically connected with each other; and the non-Newtonian fluid layer is positioned in the bending region and is arranged between the metal wiring layer and the substrate.
According to an embodiment of the first aspect of the present invention, the buffer layer is located in the display area, the buffer layer is disposed between the driving circuit and the substrate, and the buffer layer and at least part of the non-newtonian fluid layer are disposed in parallel;
alternatively, the buffer layer is located in the display region and the bending region, a portion of the buffer layer is located between the drive circuit and the substrate, and another portion of the buffer layer is located between the non-Newtonian fluid layer and the substrate.
According to an embodiment of the first aspect of the present invention, the metal wiring layer includes a connection end connected to the driving device layer and a free end disposed opposite to the connection end, the metal wiring layer extends along an arc path and forms a bending vertex between the connection end and the free end;
the non-Newtonian fluid layer comprises a thickness variation section, the thickness variation section is arranged on at least one side of the bending vertex, the thickness variation section comprises a first section and a second section, the first section is located on one side, away from the bending vertex, of the second section, and the thickness of the first section is larger than that of the second section.
According to an embodiment of the first aspect of the present invention, the gold thickness variation sections are two, one of the two thickness variation sections is located at a side of the bending vertex toward the connecting end, and the other is located at a side of the bending vertex toward the free end.
According to an embodiment of the first aspect of the present invention, the metal wiring layer further includes a second protection layer located at the bending region, and the second protection layer is located at a side of the metal wiring layer facing away from the non-newtonian fluid layer, and the hardness of the second protection layer is greater than that of the non-newtonian fluid layer.
According to an embodiment of the first aspect of the present invention, a metal wiring layer includes:
a first metal layer;
the second metal layer is positioned on one side of the first metal layer, which is away from the substrate;
the non-Newtonian fluid layer is located between the first metal layer and the substrate.
According to an embodiment of the first aspect of the present invention, the display panel further includes: and the first protection layer is positioned between the first metal layer and the second metal layer, and the hardness of the first protection layer is higher than that of the non-Newtonian fluid layer.
According to an embodiment of the first aspect of the invention, the hardness of the first protective layer is greater than the hardness of the first metal layer and/or the second metal layer.
According to an embodiment of the first aspect of the present invention, the first protective layer is an inorganic film layer.
According to an embodiment of the first aspect of the present invention, the material of the first protective layer comprises at least one of silicon oxide and silicon nitride.
According to an embodiment of the first aspect of the invention, the hardness of the second protective layer is smaller than the hardness of the first protective layer.
According to an embodiment of the first aspect of the present invention, the second protection layer is an organic film layer.
According to an embodiment of the first aspect of the present invention, the material of the second protective layer includes, but is not limited to, a flexible material such as polyimide.
According to an embodiment of the first aspect of the invention, the material of the non-newtonian fluid layer comprises liquid silicone rubber.
According to an embodiment of the first aspect of the invention, the non-newtonian fluid layer has a thickness in the range 800nm to 1200nm.
An embodiment of a second aspect of the present invention provides a display device including the display panel described above.
An embodiment of a third aspect of the present invention provides a method for manufacturing a display panel, the display panel having a display area and a bending area located at least one side of the display area, the method including:
forming a buffer layer on a substrate;
forming a non-Newtonian fluid layer on the substrate, the non-Newtonian fluid layer being located in the bending region;
and forming a driving circuit and a metal wire which are connected with each other on the buffer layer and the non-Newtonian fluid layer, wherein the driving circuit is positioned in the display region, and the metal wire bending region is positioned on one side of the non-Newtonian fluid layer away from the substrate.
In the display panel of the embodiment of the invention, the display panel comprises a substrate, a driving device layer, a metal wiring layer and a non-Newtonian fluid layer. The driving device layer comprises a driving circuit positioned in the display area, and the display area can be driven to display through the driving circuit. The metal wiring layer comprises metal wires positioned in the bending area, and the metal wires and the driving circuit are connected with each other, so that the driving circuit can be electrically connected with the outside through the metal wires to receive external driving signals. The non-Newtonian fluid layer is located in the bending region and disposed between the metal wiring layer and the substrate, the non-Newtonian fluid layer being capable of providing support protection to the metal wiring layer. And when the metal wiring layer is bent to the back of the display panel, the stress concentration of the bent part of the metal wire can be improved due to the physical characteristics of the non-Newtonian fluid layer, the fracture risk of the metal wire can be reduced, and the yield of the display panel is improved.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading the following detailed description of non-limiting embodiments thereof, taken in conjunction with the accompanying drawings in which like or similar reference characters designate the same or similar features.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the first aspect of the present invention;
fig. 2 is a schematic structural diagram of a display panel according to another embodiment of the first aspect of the present invention;
fig. 3 is a partial cross-sectional view of a display panel according to an embodiment of the first aspect of the present invention;
fig. 4 is a partial cross-sectional view of a display panel according to another embodiment of the first aspect of the present invention;
fig. 5 is a partial cross-sectional view of a display panel according to still another embodiment of the first aspect of the present invention;
fig. 6 is a schematic flow chart of a method for manufacturing a display panel according to a second embodiment of the invention.
Reference numerals illustrate:
100. a substrate;
200. a driving device layer; 210. a buffer layer; 220. a driving circuit;
300. a metal wiring layer; 310. bending the vertex; 320. a free end; 330. a first metal layer; 340. a second metal layer; 350. a connection end;
400. a layer of non-newtonian fluid; 410. a thickness variation section;
500. a first protective layer;
600. a second protective layer;
AA. A display area; NA, bending region.
Detailed Description
Features and exemplary embodiments of various aspects of the invention are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by showing examples of the invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order not to unnecessarily obscure the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In the description of the present invention, it is to be noted that, unless otherwise indicated, the meaning of "plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like are merely used for convenience in describing the present invention and to simplify the description, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The directional terms appearing in the following description are all directions shown in the drawings and do not limit the specific structure of the embodiment of the present invention. In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.
In order to better understand the present invention, a display panel, a display device, and a method of manufacturing a display panel according to embodiments of the present invention are described in detail below with reference to fig. 1 to 5.
Referring to fig. 1 together, fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the invention. The display panel has a display area AA and a bending area NA located at least one side of the display area AA. In fig. 1, the boundary between the display area AA and the bending area NA is shown by a dot-dash line, which does not limit the structure of the display panel.
According to the display panel provided by the embodiment of the invention, the bending area NA and the display area AA can be positioned on the same plane.
Referring to fig. 2 together, fig. 2 is a schematic structural diagram of a display panel according to another embodiment of the invention.
According to the display panel provided by the embodiment of the invention, at least part of the bending area NA is bent to the non-display side of the display panel. The area occupation ratio of the display area AA on the display side of the display panel can be improved, and the screen occupation ratio of the display panel is further improved.
In other embodiments, the bending area NA may be plural, and the plural bending areas NA are located at the periphery of the display area AA.
Referring to fig. 3, fig. 3 is a cross-sectional view of a portion of a layer structure of a display panel according to an embodiment of the invention.
According to the display panel provided by the embodiment of the invention, the display panel comprises: a substrate 100; a driving device layer 200 disposed on the substrate 100 and located in the display area AA, the driving device layer 200 including a driving circuit 220; a metal wiring layer 300 located at the bending area NA, the metal wiring layer 300 including metal wires, the metal wires being electrically connected to the driving circuit 220 to enable the driving circuit 220 to be electrically connected to the outside through the metal wires; the non-newtonian fluid layer 400 is located at the bending region NA and is disposed between the metal wiring layer 300 and the substrate 100.
In the display panel of the embodiment of the present invention, the display panel includes a substrate 100, a driving device layer 200, a metal wiring layer 300, and a non-newtonian fluid layer 400. The driving device layer 200 includes a driving circuit 220 located in the display area AA, and the driving circuit 220 can drive the display area AA to display. The metal wiring layer 300 includes metal wires at the bending region, and the metal wires and the driving circuit 220 are connected to each other such that the driving circuit 220 can be electrically connected to the outside through the metal wires to receive the external driving signal. non-Newtonian fluid layer 400 is located at bending region NA and is disposed between metal wiring layer 300 and substrate 100, and non-Newtonian fluid layer 400 is capable of providing support protection to metal wiring layer 300. And when the metal wiring layer 300 is bent to the back of the display panel, the stress concentration of the bent part of the metal wire can be improved due to the physical characteristics of the non-newton fluid layer 400, the fracture risk of the metal wire can be reduced, and the yield of the display panel can be improved.
In the display panel provided by the embodiment of the invention, the substrate 100 may be made of a light-transmitting material such as glass, polyimide (PI) or the like. When the display panel needs to bend the bending area NA to the back surface, the substrate 100 may be made of flexible material such as Polyimide (PI).
In some alternative embodiments, the display panel further includes a buffer layer 210. There are various positions where the buffer layer 210 is disposed.
With continued reference to FIG. 3, in some alternative embodiments, the buffer layer 210 is disposed in the display area AA, the buffer layer 210 is disposed between the driving circuit 220 and the substrate 100, and the buffer layer 210 and at least a portion of the non-Newtonian fluid layer 400 are disposed in parallel.
For example, in the manufacturing molding process of the display panel, after the substrate 100 is coated with the inorganic material, the inorganic material located in the non-display area NA is etched away to form the buffer layer 210 located in the display area AA. The non-display area NA is not provided with the buffer layer 210, so that the flexibility of the non-display area NA can be improved, the thickness of the non-Newtonian fluid layer 400 is increased, the stress concentration is better improved, the fracture risk of the metal wires is reduced, and the yield of the display panel is improved.
Referring to fig. 4 together, fig. 4 is a schematic structural diagram of a display panel according to another embodiment of the invention.
In some alternative embodiments, buffer layer 210 is located between display area AA and flex area NA, a portion of buffer layer 210 is located between drive circuit 220 and substrate 100, and another portion of buffer layer 210 is located between non-newtonian fluid layer 400 and substrate 100. In these alternative embodiments, the structure of the display panel is simpler, and in the forming process of the display panel, the inorganic material layer does not need to be etched, so that the forming efficiency of the display panel can be improved.
The buffer layer 210 is, for example, an inorganic material layer, so as to improve the structural rigidity of the display panel in the display area AA. In some alternative embodiments, the material of buffer layer 210 includes at least one of silicon nitride and silicon oxide, for example. In other alternative embodiments, the buffer layer 210 is, for example, a multi-layer film structure, and the materials of the multi-layer film structure may be the same or different. For example, one of the multilayer film structures is a silicon nitride layer, the other is a silicon oxide layer, and the like.
The driving circuit 220 includes, for example, a thin film transistor, a driving capacitor, a data line, a scanning line, and the like. The driving circuit 220 is further provided with a planarization layer, a pixel electrode layer, a pixel definition layer, a light emitting structure layer, a common electrode layer, and a packaging layer, for example, on a side facing away from the buffer layer 210.
The material selection of the non-newtonian fluid layer 400 is varied so long as the non-newtonian fluid layer 400 is formed to meet the non-newtonian fluid mechanics requirements. The material in the non-newtonian fluid layer 400 does not satisfy newtonian viscosity experimental law, and the shear stress and the shear strain rate of the non-newtonian fluid layer 400 are not linearly related, so that the material of the non-newtonian fluid layer 400 flows when the non-newtonian fluid layer 400 is bent.
The material of non-Newtonian fluid layer 400 includes, for example, liquid silicone rubber, which may be formed on substrate 100 using ink-jet printing or the like. The thickness of the non-Newtonian fluid layer 400 is 800nm to 1200nm. Such as a thickness 1000nm of non-newtonian fluid layer 400.
There are various ways to provide the metal wiring layer 300, and the metal wiring layer 300 is, for example, a COF circuit.
Referring to fig. 5, fig. 5 is a partial cross-sectional view of a display panel according to another embodiment of the first aspect of the invention. For a clearer illustration of the invention, only a partial section through the bending region NA is shown in fig. 5.
According to the display panel provided by the embodiment of the invention, the metal wiring layer 300 comprises the connecting end 350 connected with the driving device layer 200 and the free end 320 opposite to the connecting end 350, and the metal wiring layer 300 extends along an arc path and forms the bending vertex 310 between the connecting end 350 and the free end 320.
The metal wiring layer 300 is bent from the display side of the display device to the non-display side of the display device, for example. That is, the free end 320 is bent to the non-display side, and the screen ratio of the display side can be increased.
The non-newtonian fluid layer 400 includes a thickness variation section 410, where the thickness variation section 410 is disposed on at least one side of the bending vertex 310, the thickness variation section 410 includes a first section and a second section, the first section is located on a side of the second section away from the bending vertex 310, and the thickness of the first section is greater than the thickness of the second section.
Alternatively, the first section is tapered to the second section, i.e., the thickness of the tapered section 410 increases gradually in a direction away from the bending apex 310.
In these alternative embodiments, the metal wiring layer 300 includes a bending apex 310, and stress concentration of the metal wire in the vicinity of the bending apex 310 is extremely likely to occur. non-Newtonian fluid layer 400 includes a thickness variation section 410, thickness variation section 410 includes a first section and a second section, the first section is located on a side of the second section away from bending apex 310, and a thickness of the first section is greater than a thickness of the second section. That is, the thickness of the thickness variation section 410 near the bending vertex 310 is minimized, so that the stress concentration near the bending vertex 310 can be improved, the risk of breaking the metal wire can be reduced, and the yield of the display panel can be further improved.
The metal wiring layer 300 has a bending apex 310 thereon, and the extending directions of the metal wiring layer 300 are different on both sides of the bending apex 310. The metal wiring layer 300 extends in a direction away from the driving device layer 200 in a direction from the driving device layer 200 to the bending apex 310, and the metal wiring layer 300 extends toward the driving device layer 200 in a direction from the bending apex 310 to the free end 320.
The number of the thickness variation sections 410 is not limited, and the thickness variation sections 410 may be one or two.
In some alternative embodiments, the thickness variation sections 410 are two, one of the two thickness variation sections 410 being located on a side of the bending apex 310 toward the connecting end 350 and the other being located on a side of the bending apex 310 toward the free end 320.
The stress of the metal wire near the bending vertex 310 is more balanced, the fracture risk of the metal wire is further reduced, and the yield of the display panel is improved.
In some alternative embodiments, the display panel further includes a second protective layer 600 located at the bending area NA, the second protective layer 600 being located at a side of the metal wiring layer 300 facing away from the non-newtonian fluid layer 400, and the second protective layer 600 having a hardness greater than that of the non-newtonian fluid layer 400. Protection can be provided to the metal wiring layer 300 by the second protection layer 600.
The number of layers of metal wiring layer 300 may be varied, for example, metal wiring layer 300 may include a metal layer with non-Newtonian fluid layer 400 between the metal layer and substrate 100.
In other alternative embodiments, metal wiring layer 300 includes a first metal layer 330 and a second metal layer 340, second metal layer 340 being located on a side of first metal layer 330 facing away from substrate 100; non-Newtonian fluid layer 400 is located between first metal layer 330 and substrate 100.
In these alternative embodiments, non-Newtonian fluid layer 400 is located between first metal layer 330 and substrate 100, i.e., when the display panel is bent, non-Newtonian fluid layer 400 is located within the bending space formed by first metal layer 330. The method not only can provide good support for the first metal layer 330, but also can better improve stress concentration formed on the first metal layer 330, further reduce fracture risk of metal wires, and improve yield of the display panel.
In some alternative embodiments, the display panel further includes: first protective layer 500 is positioned between first metal layer 330 and second metal layer 340, and the hardness of first protective layer 500 is greater than the hardness of non-Newtonian fluid layer 400.
In these alternative embodiments, the hardness of the first protective layer 500 is greater than that of the non-newtonian fluid layer 400, which can increase the hardness of the bending area NA of the display panel. And the first protection layer 500 can provide better protection for the metal wiring layer 300, further reduce the fracture risk of the metal wires, and improve the yield of the display panel.
In some alternative embodiments, the hardness of first protective layer 500 is greater than the hardness of first metal layer 330 and/or second metal layer 340. In these alternative embodiments, when the bending area NA of the display panel is bent, the hardness of the first protective layer 500 is greater, so that the first metal layer 330 and/or the second metal layer 340 can be prevented from being bent excessively, the deformation of the first metal layer 330 and/or the second metal layer 340 is reduced, the breaking risk of the metal wires is further reduced, and the yield of the display panel is improved.
The first protection layer 500 is, for example, an inorganic film layer, which can not only meet the insulation requirement, but also have a higher hardness. Optionally, the material of the first protection layer 500 includes at least one of silicon oxide and silicon nitride.
In some alternative embodiments, the hardness of the second protective layer 600 is less than the hardness of the first protective layer 500.
In these alternative embodiments, the second protective layer 600 has a smaller hardness, which can improve the flexibility of the bending area NA of the display panel, and avoid the bending area NA of the display panel from breaking during bending.
The second protection layer 600 is, for example, an organic film layer, which has good flexibility and can meet insulation requirements. Alternatively, the material of the second protective layer 600 includes polyimide, for example.
An embodiment of the second aspect of the present invention further provides a display device, including the display panel described above. Since the display device of the embodiment of the present invention includes the above-mentioned display panel, the display device of the embodiment of the present invention has the beneficial effects of the above-mentioned display panel, and is not described herein again.
The display device according to the second aspect of the present invention includes, but is not limited to, a mobile phone, a personal digital assistant (Personal Digital Assistant, abbreviated as PDA), a tablet computer, an electronic book, a television, an access control, a smart phone, a console, and the like having a display function.
Referring to fig. 6, fig. 6 is a flowchart of a method for manufacturing a display panel according to a second embodiment of the invention. The display panel may be the display panel of any one of the embodiments of the first aspect described above.
According to an embodiment of the second aspect of the present invention, there is provided a method for manufacturing a display panel, including:
step S501: a buffer layer 210 is formed on the substrate 100.
The buffer layer 210 is located in, for example, a display area AA and a non-display area.
Alternatively, the buffer layer 210 is located in the display area AA. Step S501 includes: a buffer material layer is coated on the substrate 100 and etched to form a buffer layer 210 located in the display area AA.
The buffer layer 210, for example, includes a multi-layered film, which may be formed on the substrate 100, and then patterned such that the film extending to the bending area NA is removed. Buffer layer 210 is, for example, an inorganic film layer that is fully etched in inflection region NA to form a filled region of non-newtonian fluid layer 400.
Step S502: a non-newtonian fluid layer 400 is formed on the substrate 100, the non-newtonian fluid layer 400 being located at the inflection region NA.
A non-newtonian fluid layer 400 is formed in the inflection region NA at one side of the buffer layer 210. For example, non-newtonian fluid layer 400 may be formed by ink-jet printing.
The thickness of non-Newtonian fluid layer 400 may or may not be uniform with buffer layer 210. Or according to design requirements, the thickness of the non-newtonian fluid layer 400 is greater than that of the buffer layer 210, so that the subsequently formed metal film layer can be better extended and overlapped on the non-newtonian fluid layer 400.
Step S503: the driving circuit 220 and the metal wire are formed on the buffer layer 210 and the non-newtonian fluid layer 400 to be connected to each other, the driving circuit 220 is located in the display area AA, and the metal wire is located in the bending area NA and on a side of the non-newtonian fluid layer 400 facing away from the substrate 100.
In the display panel manufactured by the embodiment of the invention, the non-newtonian fluid layer 400 is located at the bending area NA and is disposed between the metal wiring layer 300 and the substrate 100, and the non-newtonian fluid layer 400 can provide support protection for the metal wiring layer 300. And when the metal wiring layer 300 is bent to the back of the display panel, the stress concentration of the bent part of the metal wire can be improved due to the physical characteristics of the non-newton fluid layer 400, the fracture risk of the metal wire can be reduced, and the yield of the display panel can be improved.
The driving circuit 220 includes, for example, a thin film transistor, a driving capacitor, a data line, and a scan line. The metal lines of at least two of the thin film transistor, the driving capacitor, the data line, and the scan line may be disposed at the same metal layer. For example, the grid electrode of the thin film transistor and one electrode plate of the driving capacitor are arranged on the same metal layer, and the data line and the other electrode plate of the driving capacitor are arranged on the same metal layer.
Alternatively, at least one of the data line and the scan line and the metal wire are located at the same layer, and one of the data line and the scan line, which is disposed at the same layer as the metal wire, may be formed at the same layer as the metal wire.
Optionally, the metal wire includes a first metal layer 330 and a second metal layer 340, the second metal layer 340 is located on a side of the first metal layer 330 facing away from the substrate 100, and a first protection layer 500 is further disposed between the first metal layer 330 and the second metal layer 340. The first metal layer 330 is disposed in the same layer as the data lines, and the second metal layer 340 is disposed in the same layer as the scan lines. In other embodiments, the first metal layer 330 may be disposed in the same layer as the scan lines, and the second metal layer 340 may be disposed in the same layer as the data lines.
In the method for manufacturing a display panel, step S503 further includes: a first metal material layer is formed on one side of the buffer layer 210 and the non-newtonian fluid layer 400, and the first metal material is etched to form a first metal layer 330 and a data line. A first protective layer 500 is formed on a side of the first metal material layer facing away from the substrate 100, the first protective layer 500 is located in the bending area NA, a second metal material layer is formed on a side of the first protective layer 500 facing away from the substrate 100, and patterning is performed on the second metal material layer to form a second metal layer 340 and scan lines.
In some alternative embodiments, following step S503, for example, further comprising: a planarization layer, a pixel electrode, a pixel definition layer, a light emitting structure layer, a common electrode, and the like are formed on a side of the driving circuit 220 facing away from the substrate 100, a second protection layer 600, a portion of the pixel definition layer, and the like are formed on a side of the second metal layer 340 facing away from the substrate 100, and finally, a packaging layer is formed to package other layer structures of the display panel.
After forming the encapsulation layer, for example, it further comprises: the bending area NA of the display panel is bent, so that at least part of the bending area NA is bent to the back surface of the display panel, i.e. the side of the driving circuit 220 facing away from the light emitting structure.
In the process of bending the display panel, due to the physical characteristics of the non-newton fluid layer 400, material flow can occur in the non-newton fluid layer 400, namely bending is facilitated, stress concentration on the metal wiring layer 300 can be improved, the fracture risk of metal wires is reduced, and the yield of the display panel is improved.
The present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. For example, the algorithms described in particular embodiments may be modified without departing from the basic spirit of the invention. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (16)
1. A display panel having a display area and a bending area on at least one side of the display area, the display panel comprising:
a substrate disposed in the display region and the bending region;
the driving device layer is arranged on the substrate and positioned in the display area, and comprises a driving circuit;
the metal wiring layer is positioned in the bending area and comprises a metal wire, and the metal wire and the driving circuit are electrically connected with each other;
a non-Newtonian fluid layer located in the bending region and disposed between the metal wiring layer and the substrate,
the metal wiring layer comprises a connecting end connected with the driving device layer and a free end arranged opposite to the connecting end, and extends along an arc-shaped path and forms a bending vertex between the connecting end and the free end;
the non-Newtonian fluid layer comprises a thickness variation section, the thickness variation section is arranged on at least one side of the bending vertex, the thickness variation section comprises a first section and a second section, the first section is positioned on one side of the second section away from the bending vertex, and the thickness of the first section is larger than that of the second section.
2. The display panel of claim 1, further comprising a buffer layer,
the buffer layer is positioned in the display area, the buffer layer is arranged between the driving circuit and the substrate, and the buffer layer and at least part of the non-Newtonian fluid layer are arranged in parallel;
alternatively, the buffer layer is located in the display region and the bending region, a portion of the buffer layer is located between the driving circuit and the substrate, and another portion of the buffer layer is located between the non-newtonian fluid layer and the substrate.
3. The display panel of claim 1, wherein the display panel comprises,
the thickness variation sections are two, one of the two thickness variation sections is positioned at one side of the bending vertex towards the connecting end, and the other thickness variation section is positioned at one side of the bending vertex towards the free end.
4. The display panel of claim 1, further comprising a second protective layer at the bend region on a side of the metal wiring layer facing away from the non-newtonian fluid layer, the second protective layer having a hardness greater than a hardness of the non-newtonian fluid layer.
5. The display panel according to claim 4, wherein the metal wiring layer comprises:
a first metal layer;
the second metal layer is positioned on one side of the first metal layer, which is away from the substrate;
the non-Newtonian fluid layer is located between the first metal layer and the substrate.
6. The display panel of claim 5, further comprising: and a first protective layer positioned between the first metal layer and the second metal layer, wherein the hardness of the first protective layer is greater than that of the non-Newtonian fluid layer.
7. The display panel according to claim 6, wherein the first protective layer has a hardness greater than that of the first metal layer and/or the second metal layer.
8. The display panel of claim 6, wherein the first protective layer is an inorganic film layer.
9. The display panel of claim 6, wherein the material of the first protective layer comprises at least one of silicon oxide and silicon nitride.
10. The display panel of claim 6, wherein the second protective layer has a hardness less than a hardness of the first protective layer.
11. The display panel of claim 10, wherein the second protective layer is an organic film layer.
12. The display panel of claim 10, wherein the material of the second protective layer comprises polyimide.
13. The display panel of claim 1, wherein the material of the non-newtonian fluid layer comprises liquid silicone rubber.
14. The display panel of claim 13, wherein the non-newtonian fluid layer has a thickness of 800nm to 1200nm.
15. A display device comprising the display panel according to any one of claims 1 to 14.
16. A method for manufacturing a display panel according to any one of claims 1 to 14, wherein the display panel has a display area and a bending area located on at least one side of the display area, the method comprising:
forming a buffer layer on a substrate;
forming a non-Newtonian fluid layer on the substrate, the non-Newtonian fluid layer being located in the bending region;
forming a driving circuit and a metal wire which are connected with each other on the buffer layer and the non-Newtonian fluid layer, wherein the driving circuit is positioned in the display area, the metal wire is positioned in the bending area and positioned at one side of the non-Newtonian fluid layer, which is away from the substrate, the metal wiring layer comprises a connecting end connected with the driving device layer and a free end arranged opposite to the connecting end, and the metal wiring layer extends along an arc path and forms a bending vertex between the connecting end and the free end; the non-Newtonian fluid layer comprises a thickness variation section, the thickness variation section is arranged on at least one side of the bending vertex, the thickness variation section comprises a first section and a second section, the first section is positioned on one side of the second section away from the bending vertex, and the thickness of the first section is larger than that of the second section.
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CN108922981A (en) * | 2018-07-19 | 2018-11-30 | 上海天马微电子有限公司 | Display panel and display device |
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CN107894681A (en) * | 2017-12-15 | 2018-04-10 | 京东方科技集团股份有限公司 | A kind of array base palte, its preparation method and display panel |
CN108922981A (en) * | 2018-07-19 | 2018-11-30 | 上海天马微电子有限公司 | Display panel and display device |
CN111048566A (en) * | 2019-12-20 | 2020-04-21 | 厦门天马微电子有限公司 | Organic light-emitting display panel and display device |
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