CN112147925A - Sensor modularization device and method - Google Patents
Sensor modularization device and method Download PDFInfo
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- CN112147925A CN112147925A CN202010938550.3A CN202010938550A CN112147925A CN 112147925 A CN112147925 A CN 112147925A CN 202010938550 A CN202010938550 A CN 202010938550A CN 112147925 A CN112147925 A CN 112147925A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
Abstract
The application discloses sensor modularization device and method belongs to thing networking sensor design field, the device includes: the system comprises a main control module, a sensor module and a communication module which are respectively and electrically connected with the main control module; the sensor module is used for measuring equipment and generating measurement data; the main control module is used for processing the measurement data output by the sensor module; and the communication module outputs the measurement data processed by the main control module. The method comprises the following steps: measuring equipment by using a sensor module, generating measurement data, and transmitting the measurement data to a main control module; processing the measurement data output by the sensor module by using a main control module; and outputting the measurement data processed by the main control module by using a communication module. According to the method and the device, the design and improvement of a new sensor can be realized only by adjusting the functional module, the development period of the sensor is shortened, and the adaptability of the sensor is improved.
Description
Technical Field
The application relates to the field of sensor design of the Internet of things, in particular to a sensor modularization device and method.
Background
At present, in equipment state monitoring, monitoring data is used for analyzing equipment faults, predicting what faults may occur to equipment, performing maintenance treatment in advance, and ensuring safe operation of the equipment in a production process, so that a measurement sensor needs to be rapidly deployed on the equipment. However, different environmental requirements are different, the measurement sensors used in some places are different in types, wiring is not allowed in some places, data transmission is inconvenient in some places, power supply cannot be provided in some places, and the like.
Aiming at the requirement that the sensors can be flexibly combined, no good sensor design scheme exists at present.
Disclosure of Invention
The application mainly aims to provide a sensor modularization device and a sensor modularization method, so that flexible collocation of different application scenes is achieved, and sensor data are collected and transmitted.
To achieve the above object, according to one aspect of the present application, there is provided a sensor modular device.
A sensor modular device according to the present application comprises: the system comprises a main control module, a sensor module and a communication module which are respectively and electrically connected with the main control module;
the sensor module is used for measuring equipment and generating measurement data;
the main control module is used for processing the measurement data output by the sensor module;
and the communication module outputs the measurement data processed by the main control module.
Further, as for the sensor modularization device, the main control module includes a main control chip circuit, a power management circuit, and a first interface circuit. The main control chip circuit consists of an MCU microprocessor and peripheral components; the power management circuit can select a battery to supply power or a direct current power supply to supply power; the first interface circuit leads out a power supply and a main control chip function pin and provides a circuit connected with the sensor module and the communication module.
Further, as for the sensor modular device, the sensor module comprises a sensor driving circuit, a sensor filtering circuit and a second interface circuit. The sensor driving circuit can be a built-in sensor driving circuit or an external sensor signal conversion circuit; the sensor filter circuit is a hardware filter circuit formed by filter components and is used for performing hardware filtering on data transmitted by the sensor; the second interface circuit provides a circuit connected with the master control module.
Further, the sensor module device as aforementioned, the communication module includes a communication chip circuit and a third interface circuit. The communication chip circuit can be in wireless communication modes such as Zigbee, LoRa, NB-IoT, wifi and the like according to different application scenes, and can also be in wired transmission of 232, 485, 4-20mA and the like; the third interface circuit provides a circuit for connecting with the main control module.
Peripheral components of the main control chip circuit are provided for ensuring the MCU microprocessor to work normally.
The built-in sensor driving circuit provides a driving circuit for the sensor.
The external sensor signal conversion circuit converts the signals collected by the sensor into signals which can be read by the MCU microprocessor.
The sensor module circuit board adopts a 2-layer PCB design, electronic components are placed on the top layer, and electronic components are not placed on the bottom layer.
The sensor module circuit board is fixedly supported by a soldering tin nut, and the contact pin is electrically connected with the main control module.
A sensor modularization method is realized by adopting the sensor modularization device, and the method comprises the following steps:
measuring equipment by using a sensor module, generating measurement data, and transmitting the measurement data to a main control module;
processing the measurement data output by the sensor module by using a main control module;
and outputting the measurement data processed by the main control module by using a communication module.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:
FIG. 1 is a schematic block diagram of a sensor modular device according to an embodiment of the present application;
fig. 2 is a schematic circuit diagram of a microprocessor and peripheral components of a main control module according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a structural layout of a host module according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a sensor module configuration according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a communication module configuration according to an embodiment of the present application;
FIG. 6 is a flow chart of a sensor modularizing method according to the present application.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1, according to an embodiment of the present application, there is provided a sensor modular device including: the system comprises a main control module 1, a sensor module 2 and a communication module 3;
the main control module 1 is electrically connected with the sensor module 2 and is used for analyzing and processing the measurement data transmitted by the sensor module 2; the main control module 1 is also electrically connected with the communication module 3 and is used for transmitting the measurement data transmitted by the analysis processing sensor module 2 through the communication module 3.
The design principle is as follows: the functions are divided according to regions in advance, and the modular design is realized. The main control module 1 comprises a main control chip circuit, a power management circuit and an interface circuit. The main control chip circuit consists of an MCU microprocessor and peripheral components, and the MCU microprocessor is responsible for sampling and coding the measurement data transmitted by the sensor module 2; the power management circuit can select a battery to supply power or a direct current power supply to supply power; the interface circuit leads out the power supply and the functional pins of the main control chip and provides a circuit for connecting the sensor module 2 and the communication module 3. The sensor module 2 comprises a sensor driving circuit, a sensor filter circuit and an interface circuit. The sensor driving circuit can be a built-in sensor driving circuit and an external sensor signal conversion circuit; the sensor filter circuit is a hardware filter circuit formed by filter components and is used for hardware filtering of data transmitted by the sensor; the interface circuit provides a circuit connected with the main control module. The communication module 3 includes a communication chip circuit and an interface circuit. The communication chip circuit can be in wireless communication modes such as Zigbee, LoRa, NB-IoT, wifi and the like according to different application scenes, and can also be in wired transmission of 232, 485, 4-20mA and the like; the interface circuit provides a connection circuit with the main control module 1.
From the above description, it can be seen that the present invention achieves the following technical effects: the design and improvement of a new sensor can be realized only by adjusting the functional module, and the development period of the sensor is shortened. The functional module is replaced to realize the functional combination of the sensor and improve the adaptability of the sensor.
Aiming at the requirements of the monitoring sensor, the whole circuit needs to be redesigned, even the appearance of a product is designed, the development period is long, and the implementation difficulty is high. The application provides a sensor module device and a method, according to different monitoring demand sensor types, a sensor module is adjusted or replaced, and the support of diversified sensors can be completed by adjusting according to the requirements of a main control module interface circuit; the flexible change of the data transmission mode can be realized by selecting the data transmission mode according to the field condition, adjusting the design of the communication module or replacing different communication modules; the whole sensor can share the same appearance, so that the period of data acquisition in a system is greatly shortened, and the implementation difficulty is reduced.
In some embodiments, as shown in fig. 2 and 3, in the sensor modular apparatus as described above, the MCU master chip in the master control module 1 has model number STM32L432KBKCU 6. The processing chip of STM32L432KBKCU6 model has the advantages of strong processing capacity, high stability, low power consumption and low price, and is suitable for the application scene of battery power supply. The circuit board of the main control module 1 adopts a 4-layer PCB design, the module volume is reduced, and two sides of components are arranged. The sensor module is fixedly supported by an M2.0 soldering nut, and a 1.27mm contact pin is electrically connected with the sensor module 2 and the communication module 3.
In some embodiments, as shown in fig. 4, in the sensor modular device as described above, the sensor module 2 integrates spatial stereo XYZ three-dimensional vibration signal measurement and 2-way Pt100 temperature measurement signals, and the sensor is electrically connected to the main control module 1 through a driving circuit and a filtering circuit. The circuit board of the sensor module 2 adopts a 2-layer PCB design, electronic components are placed on the top layer, electronic components are not placed on the bottom layer, and the attaching tightness of the sensor module 2 and the shell is improved. The support is fixed by an M2.0 soldering tin nut, and a 1.27mm contact pin is electrically connected with the main control module 1.
In some embodiments, as shown in fig. 5, in the sensor modular device as described above, the communication module 3 uses ZigBee wireless communication, and the wireless communication module is electrically connected to the main control module 1 through a SPI serial bus by a 1.27mm pin.
A sensor modularization method is realized by adopting the sensor modularization device, as shown in FIG. 6, the method comprises the following steps:
step S1: measuring equipment by using the sensor module 2, generating measurement data, and transmitting the measurement data to the main control module 1;
step S2: processing the measurement data output by the sensor module 2 by using a main control module 1;
step S3: and outputting the measurement data processed by the main control module 1 by using a communication module 3.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A sensor modular apparatus, comprising: the device comprises a main control module (1), and a sensor module (2) and a communication module (3) which are respectively and electrically connected with the main control module (1);
the sensor module (2) is used for measuring equipment and generating measurement data;
the main control module (1) is used for processing the measurement data output by the sensor module (2);
and the communication module (3) outputs the measurement data processed by the main control module (1).
2. A sensor modular arrangement as claimed in claim 1, characterized in that the master control module (1) comprises: the power supply comprises a main control chip circuit, a power supply management circuit and a first interface circuit;
the main control chip circuit consists of an MCU microprocessor and peripheral components;
the power management circuit can select battery power supply or direct current power supply;
the first interface circuit provides a circuit connected with the sensor module (2) and the communication module (3).
3. A sensor modular arrangement according to claim 1, characterized in that the sensor module (2) comprises: the sensor comprises a sensor driving circuit, a sensor filter circuit and a second interface circuit;
the sensor driving circuit is a built-in sensor driving circuit or an external sensor signal conversion circuit;
the sensor filter circuit is provided with a filter element to form a hardware filter circuit, and performs hardware filtering on data transmitted by the sensor;
the second interface circuit provides a circuit connected with the main control module (1).
4. A sensor modular device according to claim 1, characterized in that said communication module (3) comprises: a communication chip circuit and a third interface circuit;
the communication chip circuit can select a wireless communication mode according to different application scenes, and the wireless communication mode comprises the following steps: zigbee, LoRa, NB-IoT, wifi, or select a wired transmission method, including: 232. 485, 4-20 mA;
the third interface circuit provides a circuit connected with the main control module (1).
5. The sensor modularization device of claim 2, wherein peripheral components of the main control chip circuit are provided to ensure normal operation of the MCU microprocessor.
6. A sensor modular arrangement as claimed in claim 3, characterised in that the built-in sensor driver circuit provides a driver circuit for the sensor.
7. The sensor module device as claimed in claim 3, wherein the external sensor signal conversion circuit converts the signal collected by the sensor into a signal readable by the MCU microprocessor.
8. A sensor modular arrangement as claimed in claim 1, characterized in that the sensor module (2) circuit board is of 2-layer PCB design, with the top layer having electronic components placed thereon and the bottom layer having no electronic components placed thereon.
9. The sensor modularization device as claimed in claim 1, wherein the sensor module (2) circuit board is fixedly supported by a solder nut, and the pin is electrically connected with the main control module (1).
10. A sensor modularization method implemented by the sensor modularization apparatus of claims 1-9, wherein the method steps are as follows:
measuring equipment by using a sensor module (2), generating measurement data, and transmitting the measurement data to a main control module;
processing the measurement data output by the sensor module (2) by using a main control module (1);
and outputting the measurement data processed by the main control module (1) by using a communication module (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010938550.3A CN112147925A (en) | 2020-09-08 | 2020-09-08 | Sensor modularization device and method |
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| CN202010938550.3A CN112147925A (en) | 2020-09-08 | 2020-09-08 | Sensor modularization device and method |
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| CN112147925A true CN112147925A (en) | 2020-12-29 |
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Citations (7)
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| EP2921919A1 (en) * | 2014-03-20 | 2015-09-23 | Yissum Research Development Company of the Hebrew University of Jerusalem Ltd. | Apparatus for controlling microfluidic components |
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| CN108333998A (en) * | 2018-03-19 | 2018-07-27 | 广东智科电子股份有限公司 | A kind of frequency conversion heat pump wireless sensing control device |
| CN108981826A (en) * | 2018-09-12 | 2018-12-11 | 成都安尔法智控科技有限公司 | Three shaft vibrations and temperature monitoring sensor |
| CN109274775A (en) * | 2018-11-16 | 2019-01-25 | 华东理工大学 | A kind of modular status intelligence sensing terminal with internet of things functional |
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2020
- 2020-09-08 CN CN202010938550.3A patent/CN112147925A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2921919A1 (en) * | 2014-03-20 | 2015-09-23 | Yissum Research Development Company of the Hebrew University of Jerusalem Ltd. | Apparatus for controlling microfluidic components |
| CN205247135U (en) * | 2015-12-14 | 2016-05-18 | 四川信息职业技术学院 | Integrated observing and controlling system of multiple signal intelligence |
| US20170343987A1 (en) * | 2016-01-03 | 2017-11-30 | Purdue Research Foundation | Microcontroller energy management system |
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| CN108333998A (en) * | 2018-03-19 | 2018-07-27 | 广东智科电子股份有限公司 | A kind of frequency conversion heat pump wireless sensing control device |
| CN108981826A (en) * | 2018-09-12 | 2018-12-11 | 成都安尔法智控科技有限公司 | Three shaft vibrations and temperature monitoring sensor |
| CN109274775A (en) * | 2018-11-16 | 2019-01-25 | 华东理工大学 | A kind of modular status intelligence sensing terminal with internet of things functional |
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