CN112147850B - Temperature measuring device and immersion device for photoetching machine - Google Patents
Temperature measuring device and immersion device for photoetching machine Download PDFInfo
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- CN112147850B CN112147850B CN201910578848.5A CN201910578848A CN112147850B CN 112147850 B CN112147850 B CN 112147850B CN 201910578848 A CN201910578848 A CN 201910578848A CN 112147850 B CN112147850 B CN 112147850B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
Abstract
The invention relates to a temperature measuring device and an immersion device for a photoetching machine, which are used for measuring the temperature of fluid in a fluid conveying piece, and comprise: a temperature measurement unit for being inserted into the fluid conveyance member to contact the fluid in the fluid conveyance member and perform temperature measurement; and the temperature insulation sealing unit is sleeved at one end of the temperature measuring unit inserted into the fluid conveying piece so as to isolate the fluid conveying piece from the temperature measuring unit. The temperature measuring device can ensure that the temperature measuring unit does not influence a flow field in the testing process, reduce the temperature fluctuation of the peripheral structure of the temperature measuring unit, reduce the adverse effect of the fluid conveying piece on the temperature measurement and improve the temperature testing and identifying precision. Furthermore, temperature distribution and temperature gradient can be obtained by measuring the temperature at different positions.
Description
Technical Field
The invention relates to the technical field of temperature detection, in particular to a temperature measuring device and an immersion device for a photoetching machine.
Background
The existing temperature sensor comprises a sensor chip and a protective heat-conducting shell coated on the outer layer of the sensor chip, and when the existing temperature sensor is used for measuring the temperature of fluid in a pipeline, the temperature sensor needs to directly extend into the pipeline by a certain depth to obtain the temperature of the fluid when the accurate temperature is required to be obtained. However, for a pipeline with a narrow space, after the temperature sensor is inserted, if the immersion depth of the sensor is met, the flow field in the pipeline is seriously affected, the flowing state of fluid in the pipeline is inevitably interfered, and the accuracy of measuring flow data in the pipeline is affected, so that the temperature obtained by testing is not the temperature of the original flow field; meanwhile, after the temperature sensor is inserted, the sealing problem of the inserted part is not easy to guarantee. Therefore, a temperature sensor with a low immersion depth requirement is selected in this case.
Secondly, the temperature sensor itself and the lead are fragile and protected by a coating material. For temperature testing with general precision, the influence of the thermal diffusivity of the sensor cladding material on the testing result is small. However, the thermal diffusion properties of the cladding material have a great influence on the high-precision temperature measurement. When a high-precision temperature test is performed, a measurement error caused by the clad material needs to be considered.
Aiming at the field of immersion lithography, the immersion liquid supplied by an immersion device needs to be precisely measured and controlled in temperature and is limited by an assembly space, a supply end and a recovery end of the immersion device are arranged on the periphery above a workpiece table, and the size of an immersion liquid flow channel is small. The existing temperature measuring device is complex in structure or overlarge in size, and high-precision temperature monitoring cannot be achieved at the immersion liquid supply end and the immersion liquid recovery end.
Disclosure of Invention
The invention aims to provide a temperature measuring device and an immersion device for a photoetching machine, which can avoid the influence on a flow field in a narrow pipeline and improve the temperature measuring precision.
In order to achieve the above object, the present invention provides a temperature measuring apparatus for measuring a temperature of a fluid in a fluid transport member, comprising:
a temperature measurement unit for being inserted into the fluid conveyance member to contact the fluid in the fluid conveyance member and perform temperature measurement;
and the temperature insulation sealing unit is sleeved at one end of the temperature measuring unit inserted into the fluid conveying piece so as to isolate the fluid conveying piece from the temperature measuring unit.
Optionally, the heat-insulating sealing unit includes a heat-insulating layer, and a near-field end sealing element and a far-field end sealing element located at two ends of the heat-insulating layer, where the near-field end sealing element is closer to the fluid than the far-field end sealing element.
Optionally, the thermal insulation layer is a gas layer or a solid layer.
Optionally, the width of the annulus of the thermal insulation layer along the fluid flowing direction is between 0.5mm and 1.5 mm.
Optionally, the thermal conductivity of the thermal insulation layer is less than or equal to 1.5W/m.K.
Optionally, the heat capacities of the near-field end seal and the far-field end seal are both less than or equal to 1.2 × 106J/m3·K。
Optionally, the thermal conductivity of the near-field end seal is greater than or equal to 3.0W/m-K.
Optionally, the temperature measuring device includes at least two temperature measuring units and at least two temperature-insulating sealing units, and one temperature measuring unit corresponds to one temperature-insulating sealing unit.
Optionally, the distance between two adjacent temperature measurement units is greater than 5 mm.
Optionally, the width dimension of the fluid transport member in a direction perpendicular to the fluid flow direction is less than 10 mm.
The invention also provides an immersion device for the photoetching machine, which comprises the temperature measuring device, wherein the temperature measuring device is arranged at the water inlet end and/or the water outlet end of the immersion device.
According to the invention, the temperature measuring unit is inserted into the fluid conveying member to contact with the fluid in the fluid conveying member and carry out temperature measurement, and the temperature isolating sealing unit is sleeved at one end of the temperature measuring unit inserted into the fluid conveying member to isolate the fluid conveying member from the temperature measuring unit, so that the temperature measuring unit does not influence a flow field in the testing process, the temperature fluctuation of the peripheral structure of the temperature measuring unit is reduced, the adverse effect of the fluid conveying member on the temperature measurement is reduced, and the temperature testing identification precision is improved. Further, temperature distribution and temperature gradient can be obtained by temperature measurement at different positions.
Drawings
FIG. 1 is a schematic diagram of a contact temperature sensor;
FIG. 2a is a first schematic view of the direction of heat flow;
FIG. 2b is a schematic view showing the direction of heat flow;
FIG. 3 is a schematic structural diagram of a temperature measuring device according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a temperature measuring device according to another embodiment of the present invention;
FIG. 5a is a schematic view of a temperature measuring device according to an embodiment of the present invention;
FIG. 5b is a schematic top view of FIG. 5 a;
6a-6c are graphs of temperature fluctuations for three sets of tests;
in the figure: 101-a thermistor; 102-a coating layer; 103-lead;
100-a temperature measuring unit; 201-tube wall; 202-a flow field; 203-test area; 300-a thermal insulation sealing unit; 301-thermal insulation layer; 302-near field end seal; 303-far field end seal;
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
As shown in fig. 1, it is a schematic structural diagram of a contact temperature sensor, which includes a thermistor 101, a lead 103 connected to the thermistor 101, and a coating layer 102 coating the thermistor 101 and part of the lead 103, wherein the resistance value of the thermistor 101 changes with the temperature change and is a key element for testing the temperature, and the lead 103 connects the thermistor 101 to a circuit for data transmission; the coating layer 102 is mainly used for protecting the thermistor 101 and the lead wire 103, so as to ensure the service life of the thermistor 101 and the lead wire 103. As shown in fig. 2 a-2 b, the contact temperature sensor is used to measure the temperature of the flow field 202 in a pipeline with a narrow space, and if the contact temperature sensor is immersed in the flow field 202, the flow field 202 itself is seriously affected. Meanwhile, when the temperature is measured with high accuracy, the thermal diffusion property of the clad layer 102 also affects the measurement accuracy.
When measuring the temperature of the flow field 202, it is generally necessary to completely immerse the temperature sensing portion (portion including the thermistor) of the contact temperature sensor in the flow field 202. For a pipeline with a narrow space, if the temperature of the flow field 202 is to be measured without affecting the flow field 202, only a portion of the temperature is immersed in the flow field 202, or even a few portions of the temperature are in contact with the flow field 202 (the immersion height is less than or equal to 10% of the height or the pipe diameter of the pipeline), which causes an error in temperature measurement.
It can be seen that since the contact area of the temperature sensor and the measured flow field 202 is small, the measurement result must be biased, and therefore, the influence of the sidewall on the temperature measurement needs to be reduced. Considering the situation that the temperature of the flow field 202 is increased, a certain time is required for heat transfer, a certain distance is reserved between the thermistor 101 in the temperature sensor and the contact surface of the flow field 202, the temperature at the position of the thermistor 101 is lower than the temperature of the flow field 202, and the temperature at the same position in the pipe wall 201 is also lower than the temperature of the flow field 202. In the case of a constant temperature change in the flow field 202, the measurement deviation can be reduced by increasing the temperature at the position of the thermistor 101. Since the material of the thermistor 101 is different from that of the pipe wall 201, the flow field 202 causes the temperature change of the position of the thermistor 101 to be different from that of the pipe wall 201.
When the temperature change of the thermistor 101 is larger than the temperature change of the pipe wall 201, the heat flow flows from the temperature sensor to the pipe wall 201, and the direction of the heat flow is shown by the arrow in fig. 2 a; when the temperature change of the temperature sensor is smaller than the temperature change of the pipe wall 201, heat flows from the pipe wall 201 to the temperature sensor, the direction of the heat flow being indicated by the arrow in fig. 2 b.
In the vicinity of the solid-liquid interface, the heat from the fluid 202 is uniform, and the smaller the heat capacity of the pipe wall 201, the faster the temperature change. And the position far away from the solid-liquid interface, the larger the thermal conductivity of the material is, the more heat is transferred to the inside from the surface of the pipe wall 201, and the faster the temperature change is. Therefore, when the material of the pipe wall 201 is a low heat capacity, high thermal conductivity material, the faster the temperature change of the pipe wall 201, the more beneficial the measurement of the temperature sensor. However, in a commonly used material, the lower the thermal capacity of the material, the lower the thermal conductivity, and correspondingly, the higher the thermal capacity of the material, the higher the thermal conductivity. Through analysis, the temperature change of the high heat capacity material is small, which is not beneficial to temperature measurement, and the high heat conductivity property is useless, so that the low heat capacity material is much better.
Based on this, as shown in fig. 3, the present invention provides a temperature measuring device for measuring the temperature of a fluid in a fluid transport member, comprising:
a temperature measurement unit 100 for inserting into the fluid conveyance member to contact the fluid therein and perform temperature measurement;
and a thermal insulation sealing unit 300 sleeved at one end of the temperature measuring unit 100 inserted into the fluid transport member to isolate the fluid transport member from the temperature measuring unit 100.
In this embodiment, the temperature measuring unit 100 includes a temperature sensor. The fluid conveying member is a pipeline, the temperature measuring unit 100 penetrates through a pipe wall 201 of the pipeline and is in contact with the surface of the fluid, and the thermal insulation sealing unit 300 is arranged between the temperature measuring unit 100 and the pipe wall 201 in a surrounding mode.
Further, the thermal insulation sealing unit 300 includes a thermal insulation layer 301, and a near-field end sealing member 302 and a far-field end sealing member 303 located at two ends of the thermal insulation layer 301, wherein the near-field end sealing member 302 is closer to the fluid 202 than the far-field end sealing member 303.
Preferably, the thermal insulation layer 301 is a gas layer or a solid layer. When the thermal insulation layer 301 is a gas layer, preferably an air layer, air is a typical extremely low heat capacity material, and after the temperature measurement unit 100 is separated from the pipe wall 201 of the fluid transport member by the air layer, the influence of the material of the pipe wall 201 of the fluid transport member on the temperature measurement can be greatly reduced, and the material of the pipe wall 201 does not need to be changed for the temperature measurement.
Referring to fig. 3, only the ends of the temperature sensor are in contact with the measured flow field 202. The temperature sensor is separated from the pipe wall 201 by an air layer. In order to prevent the surface characteristics of the air layer when the air layer contacts the flow field 202 from affecting the flow field 202 or the evaporation and condensation processes from affecting the temperature change, the two ends of the air layer are separated by the near-field end seal 302 and the far-field end seal 303.
Further, the heat capacities of the near-field end seal 302 and the far-field end seal 303 are both less than or equal to 1.2 × 106J/m3K. The heat insulation layer 301 can be replaced by other gases or solids with low heat capacity by utilizing the characteristic of extremely low heat capacity of air for heat insulation. When the thermal insulation layer 301 is insulated with gas, the near-field end seal 302 and the far-field end seal 303 should be made of low heat capacity materials, i.e. the heat capacity is less than or equal to 1.2 × 106J/m3K, a sealing ring meeting the requirement can be selected; with solid insulation, the far field end seal 303 is not required.
Further, the thermal conductivity of the near-field end sealing member 302 is greater than or equal to 3.0W/m-K, and the thermal conductivity of the thermal insulation layer 301 is less than or equal to 1.5W/m-K. Referring to FIG. 4, the near field end seal 302 near the flow field 202 is made of a low heat capacity, high thermal conductivity material, i.e., heatVolume is less than or equal to 1.2 multiplied by 106J/m3K, the thermal conductivity is more than or equal to 3.0W/m.K, so that the temperature fluctuation of the isolation material is as close as possible to the temperature fluctuation of the flow field 202, for example, a carbon fiber material is selected. The heat insulation layer 301 far away from the flow field 202 is made of low heat capacity and low heat conductivity material, i.e. the heat capacity is less than or equal to 1.2 multiplied by 106J/m3 & K, thermal conductivity is less than or equal to 1.5W/m & K, and the pipe wall 201 with small temperature fluctuation is prevented from influencing the measurement of the temperature sensor, such as various gases, silicone, silicate, glass wool felt and the like, when the thermal insulation layer 301 adopts gas for thermal insulation, a far-field end sealing piece 303 (such as a sealing ring) is needed for sealing the thermal insulation layer, and when the thermal insulation layer adopts solid thermal insulation, the far-field end sealing piece 303 is not needed.
The inventor has performed three sets of tests on the temperature fluctuation conditions of the center of the flow field 202 and the thermistor when the temperature of the flow field 202 fluctuates according to a sinusoidal law, as shown in fig. 6a, 6b and 6c, which are respectively temperature fluctuation graphs of the three sets of tests, wherein the first set is a condition that the temperature sensor is directly contacted with the pipe wall 201 (fig. 6a), the second set is a condition that the temperature sensor is separated from the pipe wall 201 by an air layer (fig. 6b), the third set is a condition that the temperature sensor is separated from the pipe wall 201 and the vicinity of the flow field 202 by a low heat capacity and high heat conductivity material (carbon fiber), and the rest is separated by an air layer (fig. 6 c); the result shows that when the temperature sensor is directly contacted with the pipe wall 201 and the precision of the temperature sensor reaches 2.62mK, the temperature fluctuation of the flow field 202 of 4.80mK can be identified; when the air or the air + the carbon fiber are separated, the flow field 202 temperature fluctuation of 4.80mK can be identified when the accuracy of the temperature sensor reaches 3.33mK or 3.83 mK. For a temperature sensor, a difference of 1mK may determine whether a fluctuation in the temperature of the flow field 202 can be identified.
Further, the temperature measuring device includes at least two temperature measuring units 100 and at least two temperature-insulating sealing units 300, and one temperature measuring unit 100 corresponds to one temperature-insulating sealing unit 300. Specifically, one temperature measurement unit 100 and one temperature-isolating sealing unit 300 are a group, and a plurality of groups may be arranged in any number and form, and are used to measure the distribution of the temperature field in a certain area and the temperature uniformity. As shown in fig. 5a and 5b, the temperature measurement unit 100 and the thermal insulation sealing unit 300 can be arranged more densely, the temperature gradient in the temperature field is generally small, and the area ratio of the measured area needs to be reduced in order to reduce the influence of the flow field 202.
Preferably, the annulus width of the thermal insulation layer 301 along the fluid flowing direction is between 0.5mm and 1.5mm, that is, the thickness (t in fig. 3) of the thermal insulation layer 301 is between 0.5mm and 1.5 mm. The distance between two adjacent temperature measuring units 100 is greater than 5 mm. In this embodiment, the diameter of the probe at the end of the temperature sensor is selected to be less than 3mm, and if the thickness of the thermal insulation layer 301 is about 1mm, a single temperature sensor only occupies a space of about 5mm, and can measure the temperature at a position with a distance of less than tens of mm, even tens of mm. Typically, the temperature difference between closely spaced points within the flow field 202 is also very small, such as: tens of mK, and even less. The invention can be applied to the measurement of the temperature of mK level or the measurement of the temperature field with small temperature difference. With continuing reference to fig. 5a and 5b, the temperature field and the temperature gradient in the dotted area in the flow field 202 are measured, and the temperatures at 3 × 3 positions are measured, i.e. the temperature field distribution and the temperature gradient in the test area 203 are obtained. The temperature sensor occupies a small space, so that the measurement of a temperature field in a small space can be realized. For any shape of temperature field area, multiple sets of temperature measurement units 100 and temperature-isolating sealing units 300 in different numbers and different distribution forms can be arranged as required to complete temperature field measurement of small temperature fluctuation and temperature difference.
Further, a width dimension of the fluid transport member in a direction perpendicular to the fluid flow direction is less than 10 mm. The temperature measuring device is particularly suitable for measuring the temperature of the fluid in the fluid conveying member with a narrow space.
For the measurement of the tiny temperature fluctuation, a certain deviation always exists, the corresponding relation between the reading of the sensor and the actual flow field temperature can be obtained through methods such as sensor calibration, experiments, simulation and the like according to actual conditions, and the temperature measurement precision is further improved.
Furthermore, the invention also provides an immersion device for the lithography machine, which comprises the temperature measuring device, wherein the temperature measuring device is arranged at the water inlet end and/or the water outlet end of the immersion device, so that the immersion liquid supplied by the immersion device can be precisely measured and controlled.
In summary, in the temperature measuring device and the immersion device for the lithography machine provided by the embodiments of the present invention, the temperature measuring unit is inserted into the fluid conveying member to contact the fluid in the fluid conveying member and perform temperature measurement, and the temperature isolating sealing unit is sleeved at one end of the temperature measuring unit inserted into the fluid conveying member to isolate the fluid conveying member from the temperature measuring unit, so that the temperature measuring unit does not affect a flow field during a test process, temperature fluctuation of a peripheral structure of the temperature measuring unit is reduced, adverse effect of the fluid conveying member on temperature measurement is reduced, and identification accuracy of the temperature test is improved. Further, temperature distribution and temperature gradient can be obtained by temperature measurement at different positions.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A temperature measuring device for measuring the temperature of a fluid in a fluid transport member, comprising:
a temperature measurement unit for being inserted into the fluid conveyance member to contact the fluid in the fluid conveyance member and perform temperature measurement;
the temperature insulation sealing unit is sleeved at one end of the temperature measuring unit inserted into the fluid conveying piece so as to isolate the fluid conveying piece from the temperature measuring unit; the heat insulation sealing unit comprises a heat insulation layer and a near field end sealing element positioned at one end of the heat insulation layer, and the near field end sealing element is closer to the fluid than the heat insulation layer; the thermal conductivity of the thermal insulation layer is less than or equal to 1.5W/m.K,the thermal conductivity of the near field end sealing element is more than or equal to 3.0W/m.K, and the heat capacities of the near field end sealing element and the heat insulation layer are less than or equal to 1.2 multiplied by 106J/m3·K。
2. The temperature measurement device of claim 1, wherein the temperature-insulating seal unit further comprises a far-field end seal at another end of the temperature-insulating layer, the near-field end seal being closer to the fluid than the far-field end seal.
3. The temperature measurement device of claim 2, wherein the thermal barrier is a gas layer or a solid layer.
4. A temperature measuring apparatus according to claim 3, wherein the annular width of the thermal barrier in the direction of fluid flow is between 0.5mm and 1.5 mm.
5. The temperature measurement device of claim 2, wherein the heat capacity of the distal seal is less than or equal to 1.2 x 106J/m3·K。
6. The temperature measuring device according to claim 1, wherein the temperature measuring device comprises at least two temperature measuring units and at least two temperature-insulating sealing units, and one temperature measuring unit corresponds to one temperature-insulating sealing unit.
7. The temperature measuring device of claim 6, wherein the distance between two adjacent temperature measuring units is greater than 5 mm.
8. The temperature measurement device of any one of claims 1-7, wherein a width dimension of the fluid conveyance member in a direction perpendicular to the fluid flow direction is less than 10 mm.
9. An immersion device for a lithography machine, comprising a temperature measuring device according to any one of claims 1 to 8, the temperature measuring device being arranged at the water inlet end and/or the water outlet end of the immersion device.
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| CN201910578848.5A CN112147850B (en) | 2019-06-28 | 2019-06-28 | Temperature measuring device and immersion device for photoetching machine |
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| CN201910578848.5A CN112147850B (en) | 2019-06-28 | 2019-06-28 | Temperature measuring device and immersion device for photoetching machine |
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| CN112147850B true CN112147850B (en) | 2021-11-12 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0692704A1 (en) * | 1994-07-11 | 1996-01-17 | Ranco Incorporated of Delaware | Temperature transducer assembly |
| CN201926867U (en) * | 2010-11-08 | 2011-08-10 | 上海微电子装备有限公司 | Immersion liquid temperature controlling and measuring device of immersion lithography machine |
| CN102628714A (en) * | 2011-02-04 | 2012-08-08 | 霍尼韦尔国际公司 | Thermally isolated temperature sensor |
| CN202853793U (en) * | 2012-08-21 | 2013-04-03 | 清华大学 | Apparatus for measuring temperature inside pipeline |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4016627B2 (en) * | 2000-11-22 | 2007-12-05 | 株式会社デンソー | Temperature sensor |
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2019
- 2019-06-28 CN CN201910578848.5A patent/CN112147850B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0692704A1 (en) * | 1994-07-11 | 1996-01-17 | Ranco Incorporated of Delaware | Temperature transducer assembly |
| CN201926867U (en) * | 2010-11-08 | 2011-08-10 | 上海微电子装备有限公司 | Immersion liquid temperature controlling and measuring device of immersion lithography machine |
| CN102628714A (en) * | 2011-02-04 | 2012-08-08 | 霍尼韦尔国际公司 | Thermally isolated temperature sensor |
| CN202853793U (en) * | 2012-08-21 | 2013-04-03 | 清华大学 | Apparatus for measuring temperature inside pipeline |
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