CN112147639A - MEMS one-dimensional laser radar and digital camera surveying and mapping device and method - Google Patents
MEMS one-dimensional laser radar and digital camera surveying and mapping device and method Download PDFInfo
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- G—PHYSICS
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- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
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Abstract
The invention discloses a device and a method for surveying and mapping MEMS (micro-electromechanical systems) one-dimensional laser radar and a digital camera, wherein the surveying and mapping device comprises a scanning view field realization device and an echo receiving and processing device which are integrally arranged; the device for realizing the scanning field of view comprises a near-infrared laser, a light beam collimating lens group and a one-dimensional MEMS galvanometer; the echo receiving and processing device comprises a receiving mirror mounting cylinder and a receiving mirror mounted in the receiving mirror mounting cylinder; in the light path design of near-infrared laser and visible light in the receiving mirror, the near-infrared laser and the visible light are automatically separated through the trap reflecting plane mirror, so that a set of receiving mirror can be shared when measuring the space coordinate information of a ground object target and acquiring the image data of the ground object target; in other words, the integration of the one-dimensional laser radar and the digital camera is realized through the notch reflection plane mirror.
Description
Technical Field
The invention relates to the technical field of laser radar surveying and mapping, in particular to a device and a method for surveying and mapping an MEMS (micro-electromechanical system) one-dimensional laser radar and a digital camera.
Background
Laser radar unmanned aerial vehicle survey and drawing or patrol line, often need still need acquire ground object texture data when acquiring the three-dimensional space information of ground object target for data products such as production DOM and DEM.
The integration of present laser radar and camera carries out structure and control integration through digital camera module and the laser scanning range finding module that contains the camera lens and realizes for laser emission and receipt need respective lens to realize, finally increase the cost, also increased weight and volume simultaneously, need the unmanned aerial vehicle platform that the load capacity is stronger to carry on.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the existing problems, the MEMS-based one-dimensional laser radar and digital camera surveying and mapping device and method are provided, and the integrated design of the large-view-field laser radar and the digital camera is realized by the requirement that the large-view-field scanning angle of the one-dimensional MEMS is matched with the view angle of the digital camera and by utilizing the characteristic that the digital camera receives lens focusing and the characteristic that the trap reflector transmits near-infrared laser but transmits visible light.
The invention provides an MEMS one-dimensional laser radar and digital camera surveying and mapping device, which comprises a scanning view field realizing device and an echo receiving and processing device which are arranged integrally;
the device for realizing the scanning field of view comprises a near-infrared laser, a light beam collimating lens group and a one-dimensional MEMS galvanometer; the optical axis of a light beam emitted by the near-infrared laser is coaxial with the axis of the emitted light beam collimating lens group, the emergent angle of the emitted light beam collimating lens group forms a certain included angle with the mounting reference surface of the one-dimensional MEMS vibrating mirror, and the one-dimensional MEMS vibrating mirror also forms a certain included angle with the mounting reference surface of the one-dimensional MEMS vibrating mirror at the position of 0 degree.
The echo receiving and processing device comprises a receiving mirror mounting cylinder and a receiving mirror mounted in the receiving mirror mounting cylinder; the receiving mirror comprises a visible light and near-infrared laser view field focusing lens, a visible light and near-infrared laser view field amplifying lens, a visible light and near-infrared laser view field collimating lens group, a visible light view field amplifying lens group and a visible light planar array photosensitive device which are coaxial and sequentially arranged, and the plane of the optical axis of the receiving mirror is parallel to the plane of the optical axis of the emitted light beam; a notch reflection plane mirror forming an angle of 45 degrees with the optical axis of the receiving mirror is arranged between the visible light and near infrared laser view field collimation lens group and the visible light view field amplification lens group; a near-infrared laser echo focusing lens group is arranged on a reflection light path of the trap reflecting plane mirror, and a laser echo photosensitive device avalanche diode is arranged on an emergent focus of the near-infrared laser echo focusing lens group; meanwhile, the laser echo photosensitive device avalanche diode is electrically connected with a laser echo amplification and analysis processing module, and the visible light planar array photosensitive device is electrically connected with a visible light image processing module.
Furthermore, the emission beam collimating lens group comprises an emission collimating lens and an emission beam collimating lens barrel, the near-infrared laser and the emission collimating lens are fixedly connected through the emission beam collimating lens barrel, and then are fixedly connected with the one-dimensional MEMS vibrating mirror and the echo receiving and processing device through an emission beam collimating lens mounting seat; the controller of the one-dimensional MEMS galvanometer is arranged in the echo receiving and processing device and used for controlling the one-dimensional MEMS galvanometer to rotate according to a required mode.
Furthermore, the rotation modes of the one-dimensional MEMS galvanometer comprise a swing scanning mode, a plane scanning mode and an ellipse scanning mode.
Furthermore, the receiving mirror mounting cylinder is matched with and fixedly connected with the appearance structures of the laser echo amplification and analysis processing module and the visible light image processing module.
Preferably, the visible light area array photosensitive device is a CCD or a CMOS.
Preferably, the visible light image processing module is an infrared image processing module or a hyperspectral imaging image processing module.
The invention also provides a mapping method based on the MEMS one-dimensional laser radar and the digital camera, which is realized by utilizing the MEMS one-dimensional laser radar and the digital camera mapping device, and the mapping method comprises the following steps:
s1, measuring the space coordinate information of the ground object target by utilizing the cooperation of the scanning view field realization device and the echo receiving and processing device;
and S2, acquiring the ground object target image data by using the echo receiving and processing device.
Further, step S1 includes the following sub-steps:
s11, the near infrared laser beam reaches the one-dimensional MEMS vibrating mirror after being collimated by the beam collimating mirror group, and irradiates the ground object target after being reflected by the one-dimensional MEMS vibrating mirror;
s12, enabling the laser echo reflected by the ground object target to enter a receiving mirror of the echo receiving and processing device, and forming the laser echo parallel to the optical axis of the receiving mirror after passing through a visible light and near infrared laser view field focusing lens, a visible light and near infrared laser view field amplifying lens and a visible light and near infrared laser view field collimating lens group;
s13, after the laser echo parallel to the optical axis of the receiving mirror and the laser echo reflected by the trap reflector plane mirror, the laser echo is focused on the laser echo photosensitive device avalanche diode by the near infrared laser echo focusing lens group, so that the laser echo photosensitive device avalanche diode generates an electric signal;
s14, processing the electric signal generated by the avalanche diode of the laser echo photosensitive device through the laser echo amplifying and analyzing processing module to obtain the ground object target ranging information;
and S15, controlling the one-dimensional MEMS galvanometer to swing a certain angle around a rotating shaft perpendicular to the plane of the optical axis of the emitted light beam, repeating the steps S11-S14, and calculating the space coordinate information of the ground object target by the laser echo amplification and analysis processing module according to the distance measurement information of all the ground object targets in the obtained laser scanning view field.
Preferably, the divergence angle of the near-infrared laser emission beam after being collimated by the emission beam collimating lens group is less than 0.5mrad, and the diameter of a light spot formed on the one-dimensional MEMS galvanometer is less than 2 mm.
Further, step S2 includes the following sub-steps:
s21, allowing the visible light to enter a receiving mirror of the echo receiving and processing device, and forming a visible light beam parallel to the optical axis of the receiving mirror after passing through a visible light and near-infrared laser view field focusing lens, a visible light and near-infrared laser view field amplifying lens and a visible light and near-infrared laser view field collimating lens group;
s22, the visible light beam parallel to the optical axis of the receiving mirror penetrates through the trap reflecting plane mirror, is amplified by the visible light field amplifying lens group and reaches the visible light array photosensitive device, and a visible light spot formed on the visible light array photosensitive device can cover the visible light array photosensitive device at the outer ring, so that the visible light array photosensitive device generates an electric signal;
and S23, processing the electric signal generated by the visible light array photosensitive device through the visible light image processing module to obtain ground object target image data.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
in the light path design of near-infrared laser and visible light in the receiving mirror, the near-infrared laser and the visible light are automatically separated through the trap reflecting plane mirror, so that a set of receiving mirror can be shared when measuring the space coordinate information of a ground object target and acquiring the image data of the ground object target; in other words, the integration of the one-dimensional laser radar and the digital camera is realized through the notch reflection plane mirror.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of the MEMS one-dimensional lidar and digital camera mapping apparatus of the present invention.
Fig. 2 is a schematic diagram of a principle of a swing mirror scanning mode of the device for realizing the scanning field of view.
Fig. 3 is a schematic diagram of the parallel scanning mode or the elliptical scanning mode of the scan field of view realization apparatus of the present invention.
Reference numerals:
1-near infrared laser, 2-emission beam collimation lens cone, 3-one-dimensional MEMS galvanometer; 4-a receiving mirror mounting cylinder, 5-a visible light and near infrared laser view field focusing lens, 6-a visible light and near infrared laser view field amplifying lens, 7-a visible light and near infrared laser view field collimating lens group, 8-a visible light view field amplifying lens group, 9-a visible light surface array photosensitive device, 10-a notch reflecting plane mirror, 11-a near infrared laser echo focusing lens group, 12-a laser echo photosensitive device avalanche diode, 13-a laser echo amplifying and analyzing processing module and 14-a visible light image processing module;
21. 22, 23, 24-visible light path;
31-a mounting seat of a light beam collimating mirror and 32-a transmitting collimating mirror;
100-laser scanning plane, 200-swing rotating shaft of one-dimensional MEMS galvanometer;
101-the position where the reflected light beam of the emission beam passing through the one-dimensional MEMS galvanometer deflects by-30 degrees, 102-the position where the reflected light beam of the emission beam passing through the one-dimensional MEMS galvanometer deflects by 0 degrees, and 103-the position where the reflected light beam of the emission beam passing through the one-dimensional MEMS galvanometer deflects by +30 degrees; 201-corresponding to the near infrared echo optical path when the reflected beam is deflected by-30 °, 202-corresponding to the near infrared echo optical path when the reflected beam is deflected by 0 °, 203-corresponding to the near infrared echo optical path when the reflected beam is deflected by +30 °.
Detailed Description
The basic implementation mode is as follows:
as shown in FIG. 1, the MEMS one-dimensional lidar and digital camera surveying and mapping device of the invention comprises a scanning view field realization device and an echo receiving and processing device which are arranged integrally;
(1) scanning visual field realizing device
The device for realizing the scanning field of view comprises a near-infrared laser 1, a light beam collimating lens group and a one-dimensional MEMS galvanometer 3; the optical axis of the emission beam of the near-infrared laser 1 is coaxial with the axis of the emission beam collimating lens group, the exit angle of the emission beam collimating lens group forms a certain included angle with the installation reference surface of the one-dimensional MEMS vibrating mirror 3, and the one-dimensional MEMS vibrating mirror 3 also forms a certain included angle with the installation reference surface when in the 0-degree position;
the design principle of the scanning view field realizing device for realizing the laser scanning view field is as follows: the optical axis of the emitted light beam of the near-infrared laser 1 is coaxial with the axis of the emitted light beam collimating lens group, and the plane where the optical axis of the emitted light beam is located is the laser scanning plane 100; because the optical axis of the emitted light beam and the installation reference surface of the one-dimensional MEMS galvanometer 3 form a certain included angle, and the one-dimensional MEMS galvanometer 3 also forms a certain included angle with the installation reference surface when in a 0-degree position, when the one-dimensional MEMS galvanometer 3 swings around a rotating shaft 200 which is vertical to a laser scanning plane 100 (a rotating shaft which is vertical to the plane of the optical axis of the emitted light beam), the angle of the emitted light beam reflected by the one-dimensional MEMS galvanometer 3 can be changed, so that a laser scanning view field is realized, and when the swinging angle of the one-dimensional MEMS galvanometer 3 reaches a certain value, a large-angle laser scanning view field can be realized.
The emission beam collimating lens group comprises an emission collimating lens 32 and an emission beam collimating lens barrel 2, the near-infrared laser 1 and the emission collimating lens are fixedly connected through the emission beam collimating lens barrel 2, and then are fixedly connected with the one-dimensional MEMS vibrating mirror 3 and the echo receiving and processing device through an emission beam collimating lens mounting seat 31, so that integration of the scanning view field realizing device and the echo receiving and processing device is realized. The controller 33 of the one-dimensional MEMS galvanometer 3 is installed in the echo receiving and processing device, and is configured to control the one-dimensional MEMS galvanometer 3 to rotate in a required manner, such as the above-mentioned swinging scanning manner. It should be noted that the one-dimensional MEMS galvanometer 3 may be not only the above-mentioned oscillating mirror scanning method, but also a parallel scanning method or an elliptical scanning method.
(1) Parallel scanning mode: the near-infrared laser 1 and the emission collimating mirror 32 are horizontally installed after being fixedly connected through the emission beam collimating lens barrel 2, as shown in fig. 3, the controller 33 of the one-dimensional MEMS galvanometer 3 sends a 360-degree continuous rotation instruction to the one-dimensional MEMS galvanometer 3, and controls the one-dimensional MEMS galvanometer 3 to continuously rotate 360 degrees around an axis perpendicular to an installation reference plane of the one-dimensional MEMS galvanometer 3, so that a laser emission angle emitted by the near-infrared laser 1 is deflected to form parallel scanning, and a large-angle laser scanning view field is realized.
(2) An ellipse scanning mode: the near-infrared laser 1 and the emission collimating mirror 32 are horizontally installed after being fixedly connected through the emission beam collimating lens barrel 2, as shown in fig. 3, a controller 33 of the one-dimensional MEMS galvanometer 3 sends a 360-degree continuous rotation instruction to the one-dimensional MEMS galvanometer 3, and controls the one-dimensional MEMS galvanometer 3 to continuously rotate 360 degrees around an axis parallel to an installation reference plane of the one-dimensional MEMS galvanometer 3, so that a laser emission angle emitted by the near-infrared laser 1 is deflected to form elliptical scanning, thereby realizing a large-angle laser scanning view field.
(2) Echo receiving and processing device
The echo receiving and processing device comprises a receiving mirror mounting cylinder 4 and a receiving mirror mounted in the receiving mirror mounting cylinder 4; the receiving mirror comprises a visible light and near-infrared laser view field focusing lens 5, a visible light and near-infrared laser view field amplifying lens 6, a visible light and near-infrared laser view field collimating lens group 7, a visible light view field amplifying lens group 8 and a visible light planar array photosensitive device 9 which are coaxially and sequentially arranged, and the plane of the optical axis of the receiving mirror is parallel to the plane of the optical axis of the emitted light beam; a notch reflection plane mirror 10 forming an angle of 45 degrees with the optical axis of the receiving mirror is arranged between the visible light and near infrared laser view field collimation lens group 7 and the visible light view field amplification lens group 8; a near-infrared laser echo focusing lens group 11 is arranged on a reflection light path of the trap reflecting plane mirror 10, and a laser echo photosensitive device avalanche diode 12 is arranged on an emergent focus of the near-infrared laser echo focusing lens group 11; meanwhile, the laser echo photosensitive device avalanche diode 12 is electrically connected with a laser echo amplification and analysis processing module 13, and the visible light planar array photosensitive device 9 is electrically connected with a visible light image processing module 14.
The design principle of the echo receiving and processing device is as follows: in the light path design of near-infrared laser and visible light, the near-infrared laser and the visible light are automatically separated through the notch reflecting plane mirror 10, so that one set of receiving mirror can be shared when ground object target space coordinate information measurement and ground object target image data acquisition are carried out, in other words, the integration of a one-dimensional laser radar and a digital camera is realized through the notch reflecting plane mirror 10.
In order to achieve integration better, the receiving mirror mounting cylinder 4 is matched with and fixedly connected with the appearance structures of the laser echo amplification and analysis processing module 13 and the visible light image processing module 14.
In one embodiment, the visible light array photosensor 9 is a CCD or CMOS.
In one embodiment, the visible light image processing module 14 is an infrared image processing module or a hyperspectral imaging image processing module.
Based on the design principle, the mapping method realized by the MEMS one-dimensional laser radar and the digital camera mapping device comprises the following steps:
s1, measuring the space coordinate information of the ground object target by utilizing the cooperation of the scanning view field realization device and the echo receiving and processing device;
and S2, acquiring the ground object target image data by using the echo receiving and processing device.
Wherein, step S1 includes the following substeps:
s11, the near infrared laser 1 emits a light beam which is collimated by the light beam collimating lens group to reach the one-dimensional MEMS vibrating mirror 3, and the light beam is reflected by the one-dimensional MEMS vibrating mirror 3 to irradiate the ground object target;
s12, the laser echo reflected by the ground object target enters a receiving mirror of the echo receiving and processing device, and forms a laser echo parallel to the optical axis of the receiving mirror after passing through the visible light and near infrared laser view field focusing lens 5, the visible light and near infrared laser view field amplifying lens 6 and the visible light and near infrared laser view field collimating lens group 7;
s13, after the laser echo parallel to the optical axis of the receiving mirror and the laser echo reflected by the trap reflecting plane mirror 10 are focused on the laser echo photosensitive device avalanche diode 12 by the near infrared laser echo focusing lens group 11, so that the laser echo photosensitive device avalanche diode 12 generates an electric signal;
s14, processing the electric signal generated by the avalanche diode 12 through the laser echo amplifying and analyzing processing module 13 to obtain the ground object target ranging information;
and S15, controlling the one-dimensional MEMS galvanometer 3 to swing for a certain angle around a rotating shaft perpendicular to the plane of the optical axis of the emitted light beam, repeating the steps S11-S14, and calculating the space coordinate information of the ground object target by the laser echo amplification and analysis processing module 13 according to the distance measurement information of all the ground object targets in the obtained laser scanning view field.
Wherein, step S2 includes the following substeps:
s21, allowing the visible light to enter a receiving mirror of the echo receiving and processing device, and forming a visible light beam parallel to the optical axis of the receiving mirror after passing through the visible light and near-infrared laser view field focusing lens 5, the visible light and near-infrared laser view field amplifying lens 6 and the visible light and near-infrared laser view field collimating lens group 7;
s22, the visible light beam parallel to the optical axis of the receiving mirror penetrates through the trap reflecting plane mirror 10, is amplified by the visible light field amplifying lens group 8 and reaches the visible light array photosensitive device 9, and a visible light spot formed on the visible light array photosensitive device 9 can cover the visible light array photosensitive device 9 at the outer ring, so that the visible light array photosensitive device 9 generates an electric signal;
and S23, processing the electric signal generated by the visible light array photosensitive device 9 by the visible light image processing module 14 to obtain ground object target image data.
Specific examples are as follows:
the features and properties of the present invention are described in further detail below in connection with specific examples. This example takes as an example a 60 ° (-30 ° +30 °) laser scan field of view and a 56 ° visible light field of view (parallel to the plane of the laser scan field of view).
As shown in fig. 2, the optical axis of the emitted light beam in the surveying apparatus of this example forms an angle of 30 ° with the mounting reference surface of the one-dimensional MEMS galvanometer 3, and the one-dimensional MEMS galvanometer 3 forms an angle of 30 ° with the mounting reference surface thereof at 0 ° position, and at this time, the reflected light beam of the emitted light beam passing through the one-dimensional MEMS galvanometer 3 also forms a position of 0 ° as shown by 102 in fig. 2.
When the one-dimensional MEMS galvanometer 3 swings clockwise by 15 degrees (-15 degrees), the reflected light beam of the emitted light beam passing through the one-dimensional MEMS galvanometer 3 deflects by-30 degrees and is positioned at the position as 101 in figure 2;
when the one-dimensional MEMS galvanometer 3 swings 15 degrees in a counterclockwise direction (+15 degrees), the reflected light beam of the emitted light beam passing through the one-dimensional MEMS galvanometer 3 deflects +30 degrees and is positioned at 103 degrees in FIG. 2;
in summary, when the one-dimensional MEMS galvanometer 3 swings from-15 ° to +15 °, the near-infrared laser 1 continuously emits high-frequency laser pulses (e.g., with a frequency of 100kHz or more), so as to perform point-by-point laser irradiation on the ground object target within the laser scanning field of 60 ° (-30 ° - +30 °), thereby completing the measurement of the spatial coordinate information of the ground object target.
The laser scanning field of view achieved by the surveying device according to the above example, i.e. the surveying, can be carried out, in particular:
s1, measuring the spatial coordinate information of the ground object target by utilizing the cooperation of the scanning view field realization device and the echo receiving and processing device:
(1) when the one-dimensional MEMS mirror 3 swings clockwise by 15 ° (-15 °), the reflected beam of the emitted beam passing through the one-dimensional MEMS mirror 3 is deflected by-30 °, at the position 101 as in fig. 2:
s11, the near infrared laser 1 emits a light beam which is collimated by the light beam collimating lens group to reach the one-dimensional MEMS vibrating mirror 3, and the light beam is reflected by the one-dimensional MEMS vibrating mirror 3 to irradiate the ground object target;
s12, the laser echo reflected by the ground object target enters a receiving mirror of the echo receiving and processing device, and forms a laser echo parallel to the optical axis of the receiving mirror after passing through the visible light and near infrared laser view field focusing lens 5, the visible light and near infrared laser view field amplifying lens 6 and the visible light and near infrared laser view field collimating lens group 7;
s13, after the laser echo parallel to the optical axis of the receiving mirror and the reflected light from the notch mirror 10 are focused on the laser echo photo-sensitive device avalanche diode 12 by the near-infrared laser echo focusing lens assembly 11, forming a near-infrared echo optical path at the position of 201 in fig. 1, so that the laser echo photo-sensitive device avalanche diode 12 generates an electrical signal;
s14, processing the electric signal generated by the avalanche diode 12 through the laser echo amplifying and analyzing processing module 13 to obtain the ground object target ranging information;
(2) when the one-dimensional MEMS mirror 3 is at the 0 ° position, and the reflected light beam of the transmitted light beam passing through the one-dimensional MEMS mirror 3 is also at the 0 ° position, as shown at 102 in fig. 2:
s11, the near infrared laser 1 emits a light beam which is collimated by the light beam collimating lens group to reach the one-dimensional MEMS vibrating mirror 3, and the light beam is reflected by the one-dimensional MEMS vibrating mirror 3 to irradiate the ground object target;
s12, the laser echo reflected by the ground object target enters a receiving mirror of the echo receiving and processing device, and forms a laser echo parallel to the optical axis of the receiving mirror after passing through the visible light and near infrared laser view field focusing lens 5, the visible light and near infrared laser view field amplifying lens 6 and the visible light and near infrared laser view field collimating lens group 7;
s13, after the laser echo parallel to the optical axis of the receiving mirror and the reflected light from the notch mirror 10 are focused on the laser echo photo-sensitive device avalanche diode 12 by the near-infrared laser echo focusing lens assembly 11, forming a near-infrared echo optical path such as 202 in fig. 1, so that the laser echo photo-sensitive device avalanche diode 12 generates an electrical signal;
s14, processing the electric signal generated by the avalanche diode 12 through the laser echo amplifying and analyzing processing module 13 to obtain the ground object target ranging information;
(1) when the one-dimensional MEMS mirror 3 swings 15 ° (+15 °) counterclockwise, the reflected beam of the emitted beam passing through the one-dimensional MEMS mirror 3 deflects +30 °, at a position 103 as in fig. 2:
s11, the near infrared laser 1 emits a light beam which is collimated by the light beam collimating lens group to reach the one-dimensional MEMS vibrating mirror 3, and the light beam is reflected by the one-dimensional MEMS vibrating mirror 3 to irradiate the ground object target;
s12, the laser echo reflected by the ground object target enters a receiving mirror of the echo receiving and processing device, and forms a laser echo parallel to the optical axis of the receiving mirror after passing through the visible light and near infrared laser view field focusing lens 5, the visible light and near infrared laser view field amplifying lens 6 and the visible light and near infrared laser view field collimating lens group 7;
s13, after the laser echo parallel to the optical axis of the receiving mirror and the reflected light from the notch mirror 10 are focused on the laser echo photo-sensitive device avalanche diode 12 by the near-infrared laser echo focusing lens assembly 11, forming a near-infrared echo optical path such as 203 in fig. 1, so that the laser echo photo-sensitive device avalanche diode 12 generates an electrical signal;
and S14, processing the electric signal generated by the avalanche diode 12 through the laser echo amplifying and analyzing processing module 13 to obtain the ground object target ranging information.
Through the above process, the laser echo amplification and analysis processing module 13 calculates the spatial coordinate information of the ground object targets according to the obtained distance measurement information of all the ground object targets in the laser scanning view field. It can be seen from the process that the invention realizes that only one laser echo photosensitive device avalanche diode 12 is adopted to receive the near infrared echo light path, and the realization is not realized by an area array or a linear array, thereby reducing the realization difficulty and the cost.
S2, acquiring the ground object target image data by using the echo receiving and processing device:
s21, allowing the visible light to enter a receiving mirror of the echo receiving and processing device, and forming a visible light beam parallel to the optical axis of the receiving mirror after passing through the visible light and near-infrared laser view field focusing lens 5, the visible light and near-infrared laser view field amplifying lens 6 and the visible light and near-infrared laser view field collimating lens group 7;
s22, the visible light beam parallel to the optical axis of the receiving mirror penetrates through the notch reflecting plane mirror 10, is amplified by the visible light field amplifying lens group 8 and then reaches the visible light array photosensitive device 9, the formed visible light path is as the position of 24, 23, 22 and 21 in the figure 1, and the visible light spot formed on the visible light array photosensitive device 9 can cover the visible light array photosensitive device 9 at the outer ring, so that the visible light array photosensitive device 9 generates an electric signal;
and S23, processing the electric signal generated by the visible light array photosensitive device 9 by the visible light image processing module 14 to obtain ground object target image data.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. An MEMS one-dimensional laser radar and digital camera surveying and mapping device is characterized by comprising a scanning view field realizing device and an echo receiving and processing device which are integrally arranged;
the device for realizing the scanning field of view comprises a near-infrared laser, a light beam collimating lens group and a one-dimensional MEMS galvanometer; the optical axis of a light beam emitted by the near-infrared laser is coaxial with the axis of a light beam collimating lens group, the emergent angle of the light beam collimating lens group forms a certain included angle with the installation reference surface of the one-dimensional MEMS vibrating mirror, and the one-dimensional MEMS vibrating mirror also forms a certain included angle with the installation reference surface when in a 0-degree position;
the echo receiving and processing device comprises a receiving mirror mounting cylinder and a receiving mirror mounted in the receiving mirror mounting cylinder; the receiving mirror comprises a visible light and near-infrared laser view field focusing lens, a visible light and near-infrared laser view field amplifying lens, a visible light and near-infrared laser view field collimating lens group, a visible light view field amplifying lens group and a visible light planar array photosensitive device which are coaxial and sequentially arranged, and the plane of the optical axis of the receiving mirror is parallel to the plane of the optical axis of the emitted light beam; a notch reflection plane mirror forming an angle of 45 degrees with the optical axis of the receiving mirror is arranged between the visible light and near infrared laser view field collimation lens group and the visible light view field amplification lens group; a near-infrared laser echo focusing lens group is arranged on a reflection light path of the trap reflecting plane mirror, and a laser echo photosensitive device avalanche diode is arranged on an emergent focus of the near-infrared laser echo focusing lens group; meanwhile, the laser echo photosensitive device avalanche diode is electrically connected with a laser echo amplification and analysis processing module, and the visible light planar array photosensitive device is electrically connected with a visible light image processing module.
2. The MEMS one-dimensional lidar and digital camera surveying and mapping device of claim 1, wherein the emission beam collimating lens group comprises an emission collimating lens and an emission beam collimating lens barrel, the near-infrared laser and the emission collimating lens are fixedly connected through the emission beam collimating lens barrel, and then are fixedly connected with the one-dimensional MEMS galvanometer and the echo receiving and processing device through an emission beam collimating lens mounting base; the controller of the one-dimensional MEMS galvanometer is arranged in the echo receiving and processing device and used for controlling the one-dimensional MEMS galvanometer to rotate according to a required mode.
3. The MEMS one-dimensional lidar and digital camera mapping apparatus of claim 1, wherein the one-dimensional MEMS galvanometer rotation comprises an oscillatory scanning mode, a planar scanning mode, and an elliptical scanning mode.
4. The MEMS lidar and digital camera apparatus of claim 1, wherein the receiving mirror mounting cylinder is matched and fixedly connected with the external structures of the laser echo amplifying and analyzing module and the visible light image processing module.
5. The MEMS one-dimensional lidar and digital camera mapping apparatus of claim 1, wherein the visible area array photosensor is a CCD or CMOS.
6. The MEMS one-dimensional lidar and digital camera mapping apparatus of claim 1, wherein the visible light image processing module is an infrared image processing module or a hyperspectral imaging image processing module.
7. A MEMS-based one-dimensional lidar and digital camera mapping method implemented using the MEMS one-dimensional lidar and digital camera mapping apparatus of any one of claims 1-6, the mapping method comprising:
s1, measuring the space coordinate information of the ground object target by utilizing the cooperation of the scanning view field realization device and the echo receiving and processing device;
and S2, acquiring the ground object target image data by using the echo receiving and processing device.
8. The MEMS-based one-dimensional lidar and digital camera mapping method of claim 7, wherein the step S1 comprises the following sub-steps:
s11, the near infrared laser beam reaches the one-dimensional MEMS vibrating mirror after being collimated by the beam collimating mirror group, and irradiates the ground object target after being reflected by the one-dimensional MEMS vibrating mirror;
s12, enabling the laser echo reflected by the ground object target to enter a receiving mirror of the echo receiving and processing device, and forming the laser echo parallel to the optical axis of the receiving mirror after passing through a visible light and near infrared laser view field focusing lens, a visible light and near infrared laser view field amplifying lens and a visible light and near infrared laser view field collimating lens group;
s13, after the laser echo parallel to the optical axis of the receiving mirror and the laser echo reflected by the trap reflector plane mirror, the laser echo is focused on the laser echo photosensitive device avalanche diode by the near infrared laser echo focusing lens group, so that the laser echo photosensitive device avalanche diode generates an electric signal;
s14, processing the electric signal generated by the avalanche diode of the laser echo photosensitive device through the laser echo amplifying and analyzing processing module to obtain the ground object target ranging information;
and S15, controlling the one-dimensional MEMS galvanometer to swing a certain angle around a rotating shaft perpendicular to the plane of the optical axis of the emitted light beam, repeating the steps S11-S14, and calculating the space coordinate information of the ground object target by the laser echo amplification and analysis processing module according to the distance measurement information of all the ground object targets in the obtained laser scanning view field.
9. The MEMS-based one-dimensional lidar and digital camera mapping method of claim 8, wherein the divergence angle of the near-infrared laser beam after being collimated by the beam collimator set is less than 0.5mrad and the diameter of the spot formed on the one-dimensional MEMS galvanometer is less than 2 mm.
10. The MEMS-based one-dimensional lidar and digital camera mapping method of claim 7, wherein the step S2 comprises the following sub-steps:
s21, allowing the visible light to enter a receiving mirror of the echo receiving and processing device, and forming a visible light beam parallel to the optical axis of the receiving mirror after passing through a visible light and near-infrared laser view field focusing lens, a visible light and near-infrared laser view field amplifying lens and a visible light and near-infrared laser view field collimating lens group;
s22, the visible light beam parallel to the optical axis of the receiving mirror penetrates through the trap reflecting plane mirror, is amplified by the visible light field amplifying lens group and reaches the visible light array photosensitive device, and a visible light spot formed on the visible light array photosensitive device can cover the visible light array photosensitive device at the outer ring, so that the visible light array photosensitive device generates an electric signal;
and S23, processing the electric signal generated by the visible light array photosensitive device through the visible light image processing module to obtain ground object target image data.
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